CN209879443U

CN209879443U - Enhanced heat dissipation device of integrated circuit bottom plate

Info

Publication number: CN209879443U
Application number: CN201920870481.XU
Authority: CN
Inventors: 辛建平; 高克
Original assignee: WUXI TONGWEI TECHNOLOGY Co Ltd
Current assignee: WUXI TONGWEI TECHNOLOGY Co Ltd
Priority date: 2019-06-11
Filing date: 2019-06-11
Publication date: 2019-12-31
Anticipated expiration: 2029-06-11

Abstract

The utility model provides a reinforcing heat abstractor of integrated circuit bottom plate, it relates to the air-cooled heat dissipation field, aims at solving because fin and fan integration damage lead to the heat dissipation of high energy consumption chip on the whole big bottom plate problem that can not normally go on. The large-bottom-plate high-energy-consumption chip radiating fan is located above a large-bottom-plate high-energy-consumption chip, the fan fixing frame is located on the upper portion of the machine case, and the large-bottom-plate protective cover plate is fixed right above the large bottom plate through bolts.

Description

Enhanced heat dissipation device of integrated circuit bottom plate

Technical Field

The utility model relates to an air-cooled heat dissipation field, concretely relates to reinforcing heat abstractor of integrated circuit bottom plate.

Background

In the prior art, generally, air-cooled heat dissipation is used for heat dissipation of a server, namely, a heat dissipation sheet and a fan integrated module are installed on a high-energy-consumption chip, heat generated by continuous work of the high-energy-consumption chip is continuously increased, and due to the integrated design of the heat dissipation sheet and the fan, when one module fails, the whole module stops working so as to stop heat dissipation, and normal heat dissipation of the chip is influenced, so that a case cannot normally work.

SUMMERY OF THE UTILITY MODEL

The utility model provides a reinforcing heat abstractor of integrated circuit bottom plate to solve the problem that the heat dissipation that exists because fin and fan integration damage leads to high energy consumption chip on whole big bottom plate can not normally go on of prior art existence

In order to solve the technical problem, the utility model provides an integrated circuit bottom plate's reinforcing heat abstractor, including big bottom plate, fin, big bottom plate high energy consumption chip radiator fan, fan mount, fan, big bottom plate protection apron, big bottom plate is located chassis bottom position, the fin passes through the bolt fastening on big bottom plate, big bottom plate high energy consumption chip radiator fan is located the top of the high energy consumption chip on the big bottom plate, the fan mount is located quick-witted incasement position on the upper side, big bottom plate protection apron passes through the bolt fastening directly over big bottom plate.

Preferably, the number of the radiating fins is 3, and the radiating fins correspond to 3 fpga chips on the large bottom plate respectively, and the radiating fins are fixed right above the chips through bolts.

Preferably, the fan fixing frame is located on the upper portion of the inner side of the case and fixed to the bottom face of the case through bolts, an air inlet for air to enter the fan is formed in the fan fixing frame, and the number of the fans is 3, and the fans are fixed to the back face of the fan fixing frame through bolts.

Preferably, the large bottom plate protection cover plate is U-shaped, flanges are arranged on two sides of the large bottom plate protection cover plate, the cover plate is fixed to the bottom of the case through bolts, a rectangular hole and a kidney-shaped groove are formed in the surface of the large bottom plate protection cover plate, and one corner of the upper right corner of the large bottom plate protection cover plate is designed to be different from other three corners in missing.

Preferably, the back of the case is uniformly provided with heat dissipation holes.

The utility model discloses the beneficial effect who brings:

(1) the utility model can efficiently radiate the high-energy-consumption chip with higher reliability;

(2) the utility model discloses, easy maintenance has improved the work efficiency of quick-witted case and has reduced production machine case cost.

Drawings

FIG. 1 is a general view of the case according to the present invention without a large bottom plate protection cover plate installed therein;

FIG. 2 is a general view of the inside of the case according to the present invention with a large bottom plate protection cover plate installed;

the cooling structure comprises a large bottom plate 1, a cooling fin 2, a large bottom plate high-energy-consumption chip cooling fan 3, a fan support frame 4, a fan 5, a large bottom plate protective cover plate 6, a bolt 7, an air inlet 8, a rectangular hole 9, a kidney-shaped groove 10 and a cooling hole 11.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to specific embodiments.

As shown in fig. 1-2, the utility model provides an enhanced heat dissipation device for integrated circuit bottom board, comprising a large bottom board 1, a heat sink 2, a large bottom board high energy consumption chip heat dissipation fan 3, a fan fixing frame 4, a fan 5, and a large bottom board protective cover board 6, wherein the large bottom board 1 is located at the bottom of the case, the heat sink 2 is fixed on the large bottom board 1 by bolts 7, which is convenient for disassembly and later maintenance, the large bottom board high energy consumption chip heat dissipation fan 3 is located above the high energy consumption chip on the large bottom board 1, which is used for concentrated heat dissipation of the large bottom board high energy consumption chip, the heat dissipation efficiency is improved, the fan fixing frame 4 is located at the upper position in the case, which is convenient for installing the large bottom board first to remove other devices of the fan and finally installing the fan fixing frame 4, the large bottom board protective cover board 6 is fixed directly above the large bottom board 1 by bolts 7, the chip protection device is used for protecting the chip on the large bottom plate from being damaged due to falling of bolts or other parts.

Further, the number of the radiating fins 2 is 3, the radiating fins are respectively corresponding to 3 fpga chips on the large bottom plate, the radiating fins are fixed right above the chips through bolts 7, and the number of the radiating fins 2 is 3, the 3 fpga chips are respectively corresponding to one, targeted radiating is carried out one by one, and the later-stage maintenance of the radiating fins 2 is also facilitated.

Further, fan mount 4 is located quick-witted incasement and fixes on the bottom surface of quick-witted case through bolt 7 on the upper position, easy to assemble and later maintenance, be provided with the air intake 8 that supplies the fan air inlet on the fan mount 4, make things convenient for the wind that the fan produced to get into, fan quantity is 3 and fixes the back at fan mount 4 through bolt 7, 5 the 3 amount of wind of 3 productions of fan quantity are big evenly to be favorable to the heat dissipation.

Further, big bottom plate protection cover plate 6 is the U type, and both sides are provided with the flange and pass through bolt 7 and fix the bottom at the quick-witted case to the apron, be equipped with flange big bottom plate protection cover plate 6 of easy to assemble, big bottom plate protection cover plate 6 surface is equipped with rectangular hole 9 and kidney slot 10, makes things convenient for the heat that high energy consumption chip produced on the big bottom plate of inside to spill out, the design of big bottom plate protection cover plate 6 upper right corner is different from other three angles for the disappearance one angle, and the operating condition of conveniently observing inside fin and fan is favorable to the maintenance of later stage to the device.

Further, the heat dissipation holes 11 are uniformly distributed on the back of the case and used for dissipating heat generated in the case.

To sum up, the utility model discloses can the efficient to high power consumption chip radiating reliability higher, easy maintenance has improved the work efficiency of quick-witted case and has reduced the quick-witted case cost of production, fin and fan divide great improvement radiating efficiency to make high power consumption chip heat dissipation easier, have prolonged the practical life of big bottom plate.

It should be noted that, the utility model discloses the multiple standard component that uses all can be obtained from the market, and nonstandard component then can customize very much, the utility model discloses the connected mode that adopts such as bolted connection, welding etc. also are very common means in the mechanical field, and the inventor is no longer repeated here.

The above description is only an example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides an integrated circuit bottom plate's reinforcing heat abstractor, is including big bottom plate (1), fin (2), big bottom plate high energy consumption chip radiator fan (3), fan mount (4), fan (5), big bottom plate protection apron (6), its characterized in that, big bottom plate (1) is located chassis bottom position, fin (2) are fixed on big bottom plate (1) through bolt (7), big bottom plate high energy consumption chip radiator fan (3) are located the top of the high energy consumption chip on big bottom plate (1), fan mount (4) are located the machine incasement and are on the upper side the position, big bottom plate protection apron (6) are fixed directly over big bottom plate (1) through bolt (7).

2. The enhanced heat dissipation device of integrated circuit base plate according to claim 1, wherein the number of the heat dissipation fins (2) is 3, and the heat dissipation fins correspond to 3 fpga chips on the large base plate (1), and the heat dissipation fins are fixed on the top of the chips by bolts (7).

3. The enhanced heat dissipation device of the integrated circuit bottom plate as recited in claim 1, wherein the fan fixing frame (4) is located at an upper position in the chassis and fixed on the bottom surface of the chassis by bolts (7), the fan fixing frame (4) is provided with air inlets (8) for air to enter the fan, the number of the fans is 3, and the fans are fixed on the back surface of the fan fixing frame (4) by bolts (7).

4. The enhanced heat dissipation device of the integrated circuit bottom plate as set forth in claim 1, wherein the large bottom plate protective cover plate (6) is U-shaped, flanges are provided at both sides to fix the large bottom plate protective cover plate to the bottom of the case by bolts (7), the surface of the cover plate is provided with rectangular holes (9) and slots (10), and the upper right corner of the large bottom plate protective cover plate (6) is designed to be different from the other three corners by one missing corner.

5. The enhanced heat dissipation device of claim 1, wherein heat dissipation holes (11) are uniformly distributed on the back of the chassis.