CN217770468U - Circuit board with high heat dissipation performance - Google Patents
Circuit board with high heat dissipation performance Download PDFInfo
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- CN217770468U CN217770468U CN202221445073.8U CN202221445073U CN217770468U CN 217770468 U CN217770468 U CN 217770468U CN 202221445073 U CN202221445073 U CN 202221445073U CN 217770468 U CN217770468 U CN 217770468U
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- circuit board
- heat dissipation
- air suction
- layer
- high heat
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a circuit board with high heat dissipation performance, which comprises a circuit board layer and a heat dissipation layer; the heat dissipation layer is fixedly arranged right above the circuit board layer; the heat dissipation layer comprises a rectangular frame, a plurality of air suction pipes are uniformly arranged in the frame, one end of each air suction pipe is sealed, and the other end of each air suction pipe is connected with an air inlet of the air suction fan; the lower surfaces of the air suction pipes are provided with air suction holes facing the direction of the circuit board layer. The utility model relates to a high heat dissipating's circuit board can directly improve the air flow on circuit board surface, improves the heat dispersion of circuit board, meanwhile can directly carry out the heat dissipation that the fin contact is strengthened to the high radiating element of circuit board, has the installation convenient, the integrated level is high and can effectively reduce the characteristics of circuit board installation volume.
Description
Technical Field
The utility model belongs to the circuit board field especially relates to a circuit board of high heat dissipating ability.
Background
Along with the high-speed development of electronic technology, the types of electronic products are continuously increased, the performance of a circuit board required to carry elements is more and more strong, and the corresponding heat dissipation problem of the circuit board is more and more emphasized; under the prior art condition, common circuit board heat dissipation mode includes that the machine incasement of circuit board installation sets up the fan to accelerate the air on circuit board surface to flow, realize carrying out the purpose of cooling to the circuit board, nevertheless because the machine incasement structure is complicated, the part is more, therefore the circulation of air is obstructed easily, can not directly accelerate the air flow on circuit board surface, has the limited problem of radiating effect. Meanwhile, the mode of additionally arranging the radiating fins on the surface of the circuit board also has the problems of complex installation operation and improvement of the requirement of the circuit board on the installation space.
Disclosure of Invention
In view of this, the utility model aims at providing a high heat dissipating's circuit board, the air that can directly improve circuit board surface flows, improves the heat dispersion of circuit board, meanwhile, can directly carry out the heat dissipation piece contact to the high radiating element of circuit board and strengthen the heat dissipation, has that the installation is convenient, the integrated level is high and can effectively reduce the characteristics of circuit board installation volume.
In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:
a circuit board with high heat dissipation performance comprises a circuit board layer and a heat dissipation layer; the heat dissipation layer is fixedly arranged right above the circuit board layer; the heat dissipation layer comprises a rectangular frame, a plurality of air suction pipes are uniformly arranged in the frame, one end of each air suction pipe is sealed, and the other end of each air suction pipe is connected with an air inlet of the air suction fan; the lower surfaces of the air suction pipes are provided with air suction holes facing the direction of the circuit board layer; and a connecting plate is arranged between the side walls of the two adjacent air suction pipes, the bottom of the connecting plate is connected with the top of the radiating fin through a fixed column, and the bottom of the radiating fin is in contact with the surface of a high-heat-dissipation element on the circuit board layer in a fitting manner.
Furthermore, four corners of the frame are respectively and correspondingly fixedly connected with four corners of the circuit board layer through bolts.
Furthermore, the air suction fan is provided with two fan blades driven by a motor, and an air outlet is formed in the end, opposite to the air inlet, of the air suction fan.
Furthermore, the air suction fan is provided with a power supply interface for connecting an external power supply.
Further, the suction duct is in the shape of a hollow rectangle.
Further, the suction pipes are provided with five.
Compared with the prior art, the utility model relates to a circuit board of high heat dissipating ability has following advantage:
first, the utility model discloses a circuit board of high heat dissipating ability has a plurality of breathing pipes of suction hole through the cooperation of the fan of breathing in, can fully cover circuit board layer surface for circuit board layer surface air flow improves circuit board heat dissipating.
Second, the utility model discloses a high heat dissipating's circuit board owing to be equipped with the heat dissipation layer on circuit board layer surface, has also improved the holistic compressive structure intensity of circuit board.
Third, the utility model discloses a high heat dissipating's circuit board through the fin that the integration set up on the heat dissipation layer, can laminate the contact to the high radiating element on the circuit board layer and strengthen the heat dissipation, has the installation convenient, the integrated level is high and can effectively reduce circuit board installation volume's characteristics.
Drawings
The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation.
In the drawings:
fig. 1 is a schematic diagram of a circuit board structure with high heat dissipation performance according to an embodiment of the present invention;
fig. 2 is a schematic front view of a circuit board with high heat dissipation performance according to an embodiment of the present invention;
fig. 3 is a schematic view of a first structure of a heat dissipation layer of a circuit board with high heat dissipation performance according to an embodiment of the present invention;
fig. 4 is a second schematic structural view of a heat dissipation layer of a circuit board with high heat dissipation performance according to an embodiment of the present invention.
Description of reference numerals:
1-a circuit board layer; 2-a heat dissipation layer; 3-an air suction pipe; 31-a connecting plate; 32-bolt; 4-an air suction fan; 41-power interface; 5-heat sink.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features of the embodiments of the present invention may be combined with each other.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1-4, a circuit board with high heat dissipation performance comprises a circuit board layer 1 and a heat dissipation layer 2; the heat dissipation layer 2 is fixedly arranged right above the circuit board layer 1; the heat dissipation layer 2 comprises a rectangular frame, a plurality of air suction pipes 3 are uniformly arranged in the frame, one end of each air suction pipe 3 is sealed, and the other end of each air suction pipe 3 is connected with an air inlet of an air suction fan 4; the lower surfaces of the air suction pipes 3 are provided with air suction holes facing the direction of the circuit board layer 1; and a connecting plate 31 is arranged between the side walls of two adjacent air suction pipes 3, the bottom of the connecting plate 31 is connected with the top of the radiating fin 5 through a fixing column, and the bottom of the radiating fin 5 is in contact with the surface of a high-heat-dissipation element on the circuit board layer 1 in a fitting manner.
In this embodiment, when the suction fan 4 works, the hot air on the surface of the circuit board layer 1 is sucked into the suction pipe 3 through the suction holes of the suction pipes 3 and is finally discharged by the suction fan 4, and the suction pipes 3 are uniformly laid on the circuit board layer 1, so that the air flow can be comprehensively accelerated on the surface of the circuit board layer 1, and the heat dissipation effect of the circuit board is effectively improved.
In this embodiment, circuit board layer 1 and heat dissipation layer 2 are together fixed from top to bottom, and the fin 5 that connecting plate 31 is connected can the direct laminating contact high radiating element surface on circuit board layer 1, realizes supplementary enhancement heat dissipation, compares and installs the fin additional on traditional circuit board, not only has simple to operate's advantage, has also realized the better laminating effect of fin 5 simultaneously, compares the volume behind the traditional circuit board installation fin, has also realized effectual reduction.
As shown in fig. 1, four corners of the frame are fixedly connected to four corners of the circuit board layer 1 by bolts 32.
In this embodiment, the frame of the heat dissipation layer 2, the air intake pipe 3, the connection plate 31, and the fixing posts may be made of heat conductive metal materials.
As shown in fig. 3, the suction fan 4 has two blades driven by a motor, and an exhaust port is provided at an end of the suction fan 4 opposite to the intake port.
In this embodiment, two fan blades driven by the motor can ensure the working effect of the suction fan 4.
As shown in fig. 3, suction fan 4 is provided with a power supply port 41 for connection to an external power supply.
The power supply interface 41 is used for supplying power to the suction fan 4.
As shown in fig. 3, the suction pipe 3 is in the shape of a hollow rectangle.
As shown in fig. 4, the suction pipes 3 are provided with five.
In the present embodiment, the provision of five suction pipes 3 ensures coverage of the circuit board layer 1.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A circuit board with high heat dissipation performance is characterized in that: comprises a circuit board layer (1) and a heat dissipation layer (2); the heat dissipation layer (2) is fixedly arranged right above the circuit board layer (1); the heat dissipation layer (2) comprises a rectangular frame, a plurality of air suction pipes (3) are uniformly arranged in the frame, one ends of the air suction pipes (3) are sealed, and the other ends of the air suction pipes (3) are connected with an air inlet of an air suction fan (4); the lower surfaces of the air suction pipes (3) are provided with air suction holes facing the direction of the circuit board layer (1); and a connecting plate (31) is arranged between the side walls of two adjacent air suction pipes (3), the bottom of the connecting plate (31) is connected with the top of a radiating fin (5) through a fixing column, and the bottom of the radiating fin (5) is in contact with the surface of a high-heat-dissipation element on the circuit board layer (1) in an attaching manner.
2. The circuit board with high heat dissipation performance as claimed in claim 1, wherein: and four corners of the frame are correspondingly and fixedly connected with four corners of the circuit board layer (1) through bolts (32).
3. The circuit board with high heat dissipation performance as claimed in claim 1, wherein: the suction fan (4) is provided with two fan blades driven by a motor, and an exhaust port is formed in the end, opposite to the air inlet, of the suction fan (4).
4. A circuit board with high heat dissipation performance as defined in claim 3, wherein: and a power supply interface (41) for connecting an external power supply is arranged on the air suction fan (4).
5. The circuit board with high heat dissipation performance as claimed in claim 1, wherein: the air suction pipe (3) is in a hollow rectangular shape.
6. The circuit board with high heat dissipation performance as claimed in claim 1, wherein: the number of the air suction pipes (3) is five.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221445073.8U CN217770468U (en) | 2022-06-10 | 2022-06-10 | Circuit board with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221445073.8U CN217770468U (en) | 2022-06-10 | 2022-06-10 | Circuit board with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217770468U true CN217770468U (en) | 2022-11-08 |
Family
ID=83892137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221445073.8U Active CN217770468U (en) | 2022-06-10 | 2022-06-10 | Circuit board with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217770468U (en) |
-
2022
- 2022-06-10 CN CN202221445073.8U patent/CN217770468U/en active Active
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