CN220108151U - Mute sound equipment power amplifier equipment - Google Patents

Mute sound equipment power amplifier equipment Download PDF

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Publication number
CN220108151U
CN220108151U CN202321529209.8U CN202321529209U CN220108151U CN 220108151 U CN220108151 U CN 220108151U CN 202321529209 U CN202321529209 U CN 202321529209U CN 220108151 U CN220108151 U CN 220108151U
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side plate
array
power tube
radiator
heat
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CN202321529209.8U
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Chinese (zh)
Inventor
余成勇
马文烈
周踏兴
周小强
杜一宁
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Foshan Yinjian Electronic Technology Co ltd
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Foshan Yinjian Electronic Technology Co ltd
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Abstract

The utility model discloses a mute sound power amplifier device, which belongs to the technical field of sound equipment, and comprises: the power tube comprises a shell, a control panel, a first power tube plate, a second power tube plate, a first radiator, a second radiator and a supporting foot group. The power tube with larger heating value is independent, and the first power tube plate and the second power tube plate are formed. The installation space is divided into a left side area, a middle area and a right side area, and the first power tube plate is connected with the first radiator and arranged in the left side area, and the second power tube plate is connected with the second radiator and arranged in the right side area. The control board with less heat generation is arranged in the middle area. So that efficient heat dissipation channels are formed at both sides of the installation space. Through such layout structure for this stereo set power amplifier equipment still can carry out high-efficient heat dissipation under the prerequisite of not needing the wind speed, has realized the purpose of making an uproar, silence.

Description

Mute sound equipment power amplifier equipment
Technical Field
The utility model relates to the technical field of sound power amplification equipment, in particular to mute sound power amplification equipment.
Background
The sound power amplifier device is also called a power amplifier, and generally refers to one of the most basic devices in a sound system, commonly called a loudspeaker, and has the task of amplifying weak electric signals from a signal source (from a sound console in a professional sound system) to drive a loudspeaker to make sound.
The existing sound power amplifier equipment has higher heat dissipation requirement because of higher power. In order to better dissipate heat, a fan is generally arranged in the existing sound power amplifier equipment. The fan rotates to generate flowing wind so as to enhance the heat dissipation effect of the sound power amplifier device. However, in some special applications (such as a recording studio), noise is required to be managed, and noise generated by the fan through rotation is not allowable. Therefore, on the premise of ensuring heat dissipation of the audio power amplifier device, noise reduction is a technical problem to be solved in the industry.
Disclosure of Invention
The utility model aims to provide mute sound power amplifier equipment, which solves one or more technical problems in the prior art and at least provides a beneficial selection or creation condition.
The utility model solves the technical problems as follows: provided is a mute acoustic power amplification apparatus including: the device comprises a shell, a control panel, a first power tube plate, a second power tube plate, a first radiator, a second radiator and a supporting foot group;
the housing includes: the front side plate, the rear side plate, the left side plate, the right side plate, the upper side plate and the lower side plate enclose an installation space; the supporting leg group is arranged on the lower side plate;
the installation space is divided into a left side area, a middle area and a right side area from left to right, wherein the control board is arranged in the middle area, the first radiator and the first power tube plate are arranged in the left side area, and the second radiator and the second power tube plate are arranged in the right side area; the first power tube plate is in heat conduction connection with the first radiator; the second power tube plate is in heat conduction connection with the second radiator;
the upper side plate is provided with a first radiating hole array and a second radiating hole array, the lower side plate is provided with a third radiating hole array and a fourth radiating hole array, and vertical lines formed by the first radiating hole array and the third radiating hole array pass through the first radiator; the vertical lines formed by the second radiating hole array and the fourth radiating hole array pass through the second radiator.
Further, the rear side plate is provided with a fifth heat dissipating hole array, and the fifth heat dissipating hole array is close to the first heat sink.
Further, the rear side plate is provided with a sixth heat dissipating hole array, which is close to the second heat sink.
Further, the rear side plate is provided with a seventh array of heat dissipating holes, which is provided between the fifth array of heat dissipating holes and the sixth array of heat dissipating holes.
Further, the mute sound power amplifier device further comprises a first handle and a second handle, wherein the first handle is arranged at the left side of the front side plate, and the second handle is arranged at the right side of the front side plate.
Further, the support leg group includes: the first supporting leg, the second supporting leg, the third supporting leg and the fourth supporting leg, the even four corner positions that set up at the lower side board of first supporting leg, second supporting leg, third supporting leg and fourth supporting leg.
Further, the bottoms of the first supporting leg, the second supporting leg, the third supporting leg and the fourth supporting leg are all provided with anti-slip pads.
Further, the first heat sink includes: the heat-conducting fin comprises a first fin portion and a first connecting portion, wherein the first connecting portion is in heat-conducting connection with a first power tube plate, the first fin portion is provided with a plurality of first longitudinal grooves, and the first longitudinal grooves are communicated with a first radiating hole array and a third radiating hole array.
Further, the second heat sink includes: the second fin portion is connected with the second power tube plate in a heat conduction mode, a plurality of second longitudinal grooves are formed in the second fin portion, and the second longitudinal grooves are communicated with the second radiating hole array and the fourth radiating hole array.
Further, the first radiator and the second radiator are made of aluminum alloy materials.
The beneficial effects of the utility model are as follows: the power tube with larger heating value is independent, and the first power tube plate and the second power tube plate are formed. The installation space is divided into a left side area, a middle area and a right side area, and the first power tube plate is connected with the first radiator and arranged in the left side area, and the second power tube plate is connected with the second radiator and arranged in the right side area. The control board with less heat generation is arranged in the middle area. So that efficient heat dissipation channels are formed at both sides of the installation space. Through such layout structure for this stereo set power amplifier equipment still can carry out high-efficient heat dissipation under the prerequisite of not needing the wind speed, has realized the purpose of making an uproar, silence.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings described are only some embodiments of the utility model, but not all embodiments, and that other designs and drawings can be obtained from these drawings by a person skilled in the art without inventive effort.
Fig. 1 is a schematic diagram of the internal structure of a mute audio power amplifier device;
fig. 2 is a schematic diagram of a three-dimensional structure of a mute audio power amplifier device;
fig. 3 is a schematic perspective view of a second heat sink.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It should be noted that although functional block diagrams are depicted as block diagrams, and logical sequences are shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the block diagrams in the system. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Reference is made to fig. 1, 2 and 3. The main function of the sound power amplifier device is to provide a reasonable layout, so that the sound power amplifier device can perform efficient heat dissipation without additionally depending on wind speed. To this end, this embodiment provides a mute audio power amplifier device, including: the power module comprises a shell, a control board 100, a first power tube plate 211, a second power tube plate, a first radiator 201, a second radiator 202 and a support foot group.
Wherein, the casing comprises sheet metal component, and wherein, the casing includes: front side plate 101, rear side plate 102, left side plate 103, right side plate 104, upper side plate 105, and lower side plate. The front side plate 101, the rear side plate 102, the left side plate 103, the right side plate 104, the upper side plate 105 and the lower side plate enclose an installation space;
after the installation space is obtained, the installation space needs to be divided into areas. Wherein the installation space is divided into three areas from the area division. The three regions are a left region, a middle region, and a right region, respectively. The left side area is the left space position of the installation space, the middle area is the middle space position of the installation space, and the right side area is the right space position of the installation space.
Wherein the first heat sink 201 and the first power tube sheet 211 are disposed in the left region, the control board 100 is disposed in the middle region, and the second heat sink 202 and the second power tube sheet are disposed in the right region.
For the audio power amplifier, the main heating element is a power tube. Therefore, the power tubes of the audio power amplifier device are independently welded in the PCB to form the first power tube plate 211 and the second power tube plate. In order to allow efficient heat dissipation from the first power tubesheet 211 and the second power tubesheet, the first power tubesheet 211 is thermally conductively coupled to the first heat sink 201. The second power tube sheet is in thermally conductive connection with the second heat sink 202. Of course, the aluminum substrate is recommended for the substrate of the first power tube plate 211, and the aluminum substrate is recommended for the substrate of the second power tube plate. The first power tube sheet 211 may be thermally connected by contacting its base plate with the first heat sink 201. The second power tube sheet may be thermally conductively connected by contacting its base plate with the second heat sink 202.
In order to enhance the air flow of the first and second heat sinks 201 and 202 with the outside. Accordingly, the first heat dissipating hole array 110 and the second heat dissipating array are provided to the upper side plate 105. And a third radiating hole array and a fourth radiating hole array are arranged on the lower side plate.
The first heat dissipating hole array 110 and the second heat dissipating hole array 120 have the same structure, and the third heat dissipating hole array and the fourth heat dissipating hole array have the same structure.
The first heat dissipation hole array 110 is composed of first unit heat dissipation holes and extends in a transverse array. The third radiating hole array is composed of second unit radiating holes and extends in a transverse array.
The first heat dissipation control array is mounted in a position close to the first heat sink 201. The second array of heat dissipating apertures 120 is mounted adjacent to the second heat sink 202.
The third array of heat dissipating holes is mounted proximate to the first heat sink 201 and the fourth array of heat dissipating holes is mounted proximate to the second heat sink 202.
The first heat dissipating hole array 110 is opposite to the third heat dissipating hole array when viewed from the mounting position, such that a vertical line formed by the first heat dissipating hole array 110 and the third heat dissipating hole array passes through the first heat sink 201. The second array of louvers 120 is opposite the fourth array of louvers such that the vertical lines formed by the second array of louvers 120 and the fourth array of louvers pass through the second heat sink 202.
The supporting leg group is arranged on the lower side plate, and the supporting leg group is used for supporting the lower side plate and enabling a gap for air flow to be formed between the lower side plate and a plane contacted with the lower side plate.
When the acoustic power amplification apparatus is in operation, the first radiator 201 absorbs heat of the first power tube plate 211, and the air around the first radiator 201 forms hot air due to heat generation, expands and rises, and the hot air flows out of the first heat dissipating hole array 110. At this time, due to the rising of the hot air, the outside cold air can enter the installation space from the third heat dissipating hole array through the gap. The cold air exchanges heat with the first radiator 201, and absorbs heat from the first radiator 201. By this circulation, the first radiator 201 can radiate heat to the first power tube sheet 211.
Similarly, the second heat sink 202 absorbs heat from the second power tube sheet, and the air around the second heat sink 202 forms hot air due to heat generation, expands and rises, and the hot air flows out of the second heat dissipating hole array 120. At this time, due to the rising of the hot air, the outside cold air can enter the installation space from the fourth heat radiation hole array through the gap. The cold air exchanges heat with the second radiator 202, and absorbs heat from the second radiator 202. Through this circulation, the second radiator 202 is allowed to radiate heat from the second power tubesheet.
The utility model provides a first power tube plate 211 and a second power tube plate by independent power tubes with larger heating value. The installation space is divided into a left side region, a middle region, and a right side region, and the first power tube plate 211 is connected to the first radiator 201 and disposed in the left side region, and the second power tube plate is connected to the second radiator 202 and disposed in the right side region. The control board 100 having a small heat generation amount is provided in the middle area. So that efficient heat dissipation channels are formed at both sides of the installation space. Through such layout structure for this stereo set power amplifier equipment still can carry out high-efficient heat dissipation under the prerequisite of not needing the wind speed.
In order to enhance the heat dissipation efficiency, in some further embodiments, a fifth heat dissipation hole array 150 is disposed on the rear side plate 102, wherein the fifth heat dissipation hole array 150 is formed by longitudinally arranging unit heat dissipation holes. The fifth array of heat dissipating holes 150 is positioned adjacent to the first heat sink 201. In actual operation, external cool air also enters through the fifth array of heat dissipating holes 150 and acts in the first heat sink 201, effecting heat exchange with the first heat sink 201.
In order to enhance the heat dissipation efficiency, in some further embodiments, a sixth heat dissipation hole array 160 is disposed on the rear side plate 102, wherein the sixth heat dissipation hole array 160 is formed by longitudinally arranging unit heat dissipation holes. The sixth array of heat dissipating apertures 160 is positioned adjacent to the second heat sink 202. In actual operation, external cool air also enters through the sixth array of heat dissipating holes 160 and acts in the second heat sink 202 to effect heat exchange with the second heat sink 202.
In order to enhance the heat dissipation efficiency, in some further embodiments, a seventh heat dissipation hole array 170 is disposed on the rear side plate 102, wherein the seventh heat dissipation hole array 170 is formed by arranging unit heat dissipation holes laterally. The seventh array of louvers 170 is disposed between the fifth array of louvers 150 and the sixth array of louvers 160. In actual operation, external cool air is also introduced into the installation space through the seventh array of heat dissipating holes 170.
In order to facilitate lifting the audio power amplifier device, in some further embodiments, the audio power amplifier device further comprises a first handle 301 and a second handle 302. Wherein the first handle 301 and the second handle 302 may be connected to the front side panel 101 by bolts. Wherein the first handle 301 is mounted at a left side position of the front side plate 101, and the second handle 302 is mounted at a right side position of the front side plate 101. When a user needs to lift the audio power amplifier device, the audio power amplifier device can be lifted through the first lifting handle 301 and the second lifting handle 302.
In some further embodiments, the support foot set comprises: a first support leg, a second support leg 402, a third support leg 403 and a fourth support leg 404. Wherein, the first supporting leg, the second supporting leg 402, the third supporting leg 403 and the fourth supporting leg 404 are uniformly disposed at four corner positions of the lower side plate. When the lower side plate is viewed in the forward direction, the first supporting leg is located at the upper left corner of the lower side plate, the second supporting leg 402 is located at the lower left corner of the lower side plate, the third supporting leg 403 is located at the upper right corner of the lower side plate, and the fourth supporting leg 404 is located at the lower right corner of the lower side plate. Thus, a larger space is provided between the first support leg and the second support leg 402, a larger space is provided between the first support leg and the third support leg 403, a larger space is provided between the third support leg 403 and the fourth support leg 404, and a larger space is provided between the second support leg 402 and the fourth support leg 404.
In order to promote the frictional force between the first supporting legs and the contact plane, the bottoms of the first supporting legs are provided with anti-slip pads. In order to increase the friction between the second support leg 402 and the contact plane, a non-slip mat is provided at the bottom of the second support leg 402. In order to increase the friction between the third support leg 403 and the contact plane, a non-slip mat is provided at the bottom of the third support leg 403. In order to increase the friction between the fourth support leg 404 and the contact plane, a non-slip mat is provided at the bottom of the fourth support leg 404.
In some further embodiments, the structure of the first heat sink 201 includes: a first fin portion and a first connection portion. The first connection portion functions as a thermally conductive connection with the first power tubesheet 211. The first fin portion is provided with a plurality of first longitudinal slots, and the first longitudinal slots are communicated with the first heat dissipation hole array 110 and the third heat dissipation hole array. The heat dissipation efficiency is improved by communicating the first heat dissipation hole array 110 with the third heat dissipation hole array through the first longitudinal slot.
Referring to fig. 3, in some further embodiments, the structure of the second heat sink 202 includes: a second fin portion 212 and a second connection portion 222. The second connection 222 functions as a thermally conductive connection with the second power tubesheet. The second fin portion 212 is provided with a plurality of second longitudinal slots 232, and the second longitudinal slots 232 are communicated with the second heat dissipating hole array 120 and the fourth heat dissipating hole array. The heat dissipation efficiency is improved by communicating the second heat dissipation hole array 120 with the fourth heat dissipation hole array through the second longitudinal slot 232. The first heat sink 201 and the second heat sink 202 have the same structure.
In some further embodiments, the material of the first heat sink 201 and the second heat sink 202 is an aluminum alloy material. The material of the second heat sink 202 is an aluminum alloy material.
While the preferred embodiment of the present utility model has been described in detail, the utility model is not limited to the embodiments, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the utility model, and these equivalent modifications and substitutions are intended to be included in the scope of the present utility model as defined in the appended claims.

Claims (10)

1. A mute audio power amplifier device, comprising: the power tube comprises a shell, a control board (100), a first power tube plate (211), a second power tube plate, a first radiator (201), a second radiator (202) and a supporting foot group;
the housing includes: the support leg comprises a front side plate (101), a rear side plate (102), a left side plate (103), a right side plate (104), an upper side plate (105) and a lower side plate, wherein the front side plate (101), the rear side plate (102), the left side plate (103), the right side plate (104), the upper side plate (105) and the lower side plate enclose an installation space, and the support leg group is arranged on the lower side plate;
the installation space is divided into a left side area, a middle area and a right side area from left to right, wherein a control board (100) is arranged in the middle area, a first radiator (201) and a first power tube plate (211) are arranged in the left side area, and a second radiator (202) and a second power tube plate are arranged in the right side area; the first power tube plate (211) is in heat conduction connection with the first radiator (201); the second power tube plate is in heat conduction connection with a second radiator (202);
the upper side plate (105) is provided with a first radiating hole array (110) and a second radiating hole array (120), the lower side plate is provided with a third radiating hole array and a fourth radiating hole array, and a vertical line formed by the first radiating hole array (110) and the third radiating hole array passes through the first radiator (201); vertical lines formed by the second radiating hole array (120) and the fourth radiating hole array pass through the second radiator (202).
2. A mute sound power amplifier apparatus according to claim 1, characterized in that the rear side plate (102) is provided with a fifth array of heat dissipating holes (150), the fifth array of heat dissipating holes (150) being close to the first heat sink (201).
3. A mute sound power amplifier apparatus according to claim 1, characterized in that the rear side plate (102) is provided with a sixth array of heat dissipating holes (160), the sixth array of heat dissipating holes (160) being adjacent to the second heat sink (202).
4. A mute acoustic power amplifier device according to claim 1, wherein the rear side plate (102) is provided with a seventh array of heat dissipating holes (170), the seventh array of heat dissipating holes (170) being provided between the fifth array of heat dissipating holes (150) and the sixth array of heat dissipating holes (160).
5. A mute audio amplifier apparatus according to claim 1, further comprising a first handle (301) and a second handle (302), the first handle (301) being mounted at a left position of the front side plate (101), the second handle (302) being mounted at a right position of the front side plate (101).
6. The mute audio power amplifier apparatus of claim 1, wherein the support leg comprises: the novel support comprises a first support leg, a second support leg (402), a third support leg (403) and a fourth support leg (404), wherein the first support leg, the second support leg (402), the third support leg (403) and the fourth support leg (404) are uniformly arranged at four corner positions of a lower side plate.
7. The mute audio power amplifier apparatus according to claim 6, wherein the bottoms of the first supporting leg, the second supporting leg (402), the third supporting leg (403) and the fourth supporting leg (404) are respectively provided with an anti-slip pad.
8. A mute audio amplifier apparatus according to claim 1, wherein the first heat sink (201) comprises: the heat-conducting fin comprises a first fin part and a first connecting part, wherein the first connecting part is in heat-conducting connection with a first power tube plate (211), the first fin part is provided with a plurality of first longitudinal grooves, and the first longitudinal grooves are communicated with a first radiating hole array (110) and a third radiating hole array.
9. A mute audio amplifier apparatus according to claim 1, wherein the second heat sink (202) comprises: the second fin portion (212) and second connecting portion (222), second connecting portion (222) are connected with second power tube sheet heat conduction, second fin portion (212) are equipped with a plurality of second vertical fluting (232), second vertical fluting (232) intercommunication second louvre array (120) and fourth louvre array.
10. The mute audio power amplifier device according to claim 1, wherein the first heat sink (201) and the second heat sink (202) are both made of aluminum alloy.
CN202321529209.8U 2023-06-15 2023-06-15 Mute sound equipment power amplifier equipment Active CN220108151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321529209.8U CN220108151U (en) 2023-06-15 2023-06-15 Mute sound equipment power amplifier equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321529209.8U CN220108151U (en) 2023-06-15 2023-06-15 Mute sound equipment power amplifier equipment

Publications (1)

Publication Number Publication Date
CN220108151U true CN220108151U (en) 2023-11-28

Family

ID=88881510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321529209.8U Active CN220108151U (en) 2023-06-15 2023-06-15 Mute sound equipment power amplifier equipment

Country Status (1)

Country Link
CN (1) CN220108151U (en)

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