CN215529752U

CN215529752U - Wireless communication module heat dissipation shell

Info

Publication number: CN215529752U
Application number: CN202122125563.1U
Authority: CN
Inventors: 徐文杰
Original assignee: Shenzhen Yinerda Electronics Co ltd
Current assignee: Shenzhen Yinerda Electronics Co ltd
Priority date: 2021-09-04
Filing date: 2021-09-04
Publication date: 2022-01-14
Anticipated expiration: 2031-09-04

Abstract

The utility model relates to the technical field of wireless communication equipment, in particular to a heat dissipation shell of a wireless communication module, which comprises a heat dissipation shell assembly, wherein the heat dissipation shell assembly comprises a first shell, the inner wall of the first shell is connected with a second shell through a buffer plate, two ends of the first shell are both connected with baffles, and the front surface and the back surface of the first shell are both provided with heat dissipation holes; the water cooling assembly is arranged between the first shell and the second shell and comprises a water inlet, a water guide pipe is arranged below the water inlet, a shunt pipe is fixedly connected to the lower portion of the water guide pipe, and a water cooling pipe is connected to the lower portion of the shunt pipe. The cooling device can realize cooling treatment on the device in a water cooling mode, meanwhile, the heat dissipation efficiency of the device is accelerated through the arrangement of the fan, meanwhile, the buffering efficiency of the device is greatly improved through the buffering of the honeycomb plate, and the safety of the device is effectively improved.

Description

Wireless communication module heat dissipation shell

Technical Field

The utility model relates to the technical field of wireless communication equipment, in particular to a heat dissipation shell of a wireless communication module.

Background

The wireless communication module is widely applied to the fields of vehicle monitoring, remote control, remote measurement, small wireless networks, wireless meter reading, access control systems, cell paging, industrial data acquisition systems, wireless tags, identity recognition and the like, wherein a radiating shell is generally adopted for assembly in the production and processing process of the wireless communication module in order to ensure the use effect of the wireless communication module.

The heat dissipation shell of the existing wireless communication module is used, the heat dissipation treatment of the device is generally realized by adopting a heat dissipation hole mode, the heat dissipation effect is poor, the overall service life of the device is further influenced, the traditional heat dissipation shell is of a single-layer structure generally, and the effect of buffering protection cannot be achieved in the using process, so that the problem needs to be solved urgently by designing the heat dissipation shell of the wireless communication module.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation shell of a wireless communication module, which aims to solve the problems of poor heat dissipation effect and low buffering effect of the traditional heat dissipation shell with a single-layer structure in the use process in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: a wireless communication module heat dissipation housing, comprising:

the heat dissipation shell assembly comprises a first shell, the inner wall of the first shell is connected with a second shell through a buffer plate, two ends of the first shell are both connected with baffles, and the front surface and the back surface of the first shell are both provided with heat dissipation holes;

the water cooling assembly is arranged between the first shell and the second shell and comprises a water inlet, a water guide pipe is arranged below the water inlet, a shunt pipe is fixedly connected to the lower portion of the water guide pipe, and a water cooling pipe is connected to the lower portion of the shunt pipe.

Preferably, first casing and second casing all are "U" font structure, the bottom edge of second casing all fixedly connected with mounting panel, and the constant head tank has been seted up to the top of mounting panel.

Preferably, the buffer plate comprises a first bonding plate, one side of the first bonding plate is fixedly connected with a honeycomb plate, and the other side of the honeycomb plate is fixedly connected with a second bonding plate.

Preferably, the buffer plate is fixedly bonded between the first shell and the second shell, the first bonding plate is fixedly connected to the inner wall of the first shell, the second bonding plate is fixedly connected to the outer wall of the second shell, and the thickness of the buffer plate is equal to the distance between the first shell and the second shell.

Preferably, a fan is fixedly connected between the first shell and the second shell, a protective net is arranged outside the fan, and the protective net is fixedly connected to the outer wall of the first shell.

Preferably, the water inlet is fixedly connected to the top of the first shell, the water guide pipe is located in the middle of the flow dividing pipe, two ends of the water guide pipe are in a sealed state, and the water cooling pipes are distributed on the outer wall of the second shell in an S shape.

Compared with the prior art, the utility model has the beneficial effects that: this wireless communication module heat dissipation shell can realize handling the cooling of device through the water-cooling mode, and the radiating efficiency of device is accelerated in setting up through the fan simultaneously, has increaseed device buffer efficiency, the security of effectual improvement device simultaneously through the buffering of honeycomb panel greatly.

(1) According to the utility model, through the arrangement of the water cooling assembly, the inner shell can be rapidly cooled through the winding of the water cooling pipe, and meanwhile, through the arrangement of the fan, the wind power circulation in the device is further increased, and the heat dissipation effect of the device is further improved, so that the heat dissipation of the inner parts can be rapidly realized when the heat dissipation shell is used, and the service life of the device is prolonged.

(2) The double-layer structure arrangement improves the buffering effect of the shells, and the arrangement of the honeycomb plates is matched, so that the buffering effect between the two shells can be further improved, the use safety of the device is effectively improved, and the damage of internal parts of the device caused by collision and the like is avoided.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic illustration of an explosive structure according to the present invention;

FIG. 3 is a schematic view of a connection structure of the buffer plate according to the present invention;

fig. 4 is a schematic diagram of an exploded structure of a buffer plate according to the present invention.

In the figure: 1. a heat dissipation housing assembly; 11. a first housing; 12. a baffle plate; 13. heat dissipation holes; 14. a second housing; 15. a buffer plate; 151. a first adhesive sheet; 152. a honeycomb panel; 153. a second adhesive sheet; 2. a fan; 3. a water-cooling assembly; 31. a water inlet; 32. a water conduit; 33. a shunt tube; 34. a water-cooled tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, an embodiment of the present invention is shown: a wireless communication module heat dissipation housing, comprising:

the heat dissipation shell assembly 1 comprises a first shell 11, the inner wall of the first shell 11 is connected with a second shell 14 through a buffer plate 15, two ends of the first shell 11 are both connected with baffles 12, heat dissipation holes 13 are formed in the front surface and the back surface of the first shell 11, and the buffer plate 15 is used for realizing buffer protection between the first shell 11 and the second shell 14 and further realizing protection on internal parts;

water cooling unit 3, water cooling unit 3 set up between first casing 11 and second casing 14, and water cooling unit 3 includes water inlet 31, and the below of water inlet 31 is provided with aqueduct 32, and the below fixedly connected with shunt tubes 33 of aqueduct 32, the below of shunt tubes 33 are connected with water-cooling tube 34, through the setting of this structure, can accelerate the heat dissipation treatment to second casing 14 inside.

Further, first casing 11 and second casing 14 all are "U" font structure, and the bottom edge of second casing 14 all fixedly connected with mounting panel, and the constant head tank has been seted up to the top of mounting panel, and the installation of the device of being convenient for is fixed, and the constant head tank is the rectangle trough-shaped and is convenient for adjust the installation fixed.

Further, the buffer plate 15 includes a first bonding plate 151, a honeycomb plate 152 is fixedly connected to one side of the first bonding plate 151, and a second bonding plate 153 is fixedly connected to the other side of the honeycomb plate 152, so that the buffer between the first housing 11 and the second housing 14 is realized through the arrangement of the structure, and the safety of the device is improved.

Further, the buffer plate 15 is fixedly bonded between the first housing 11 and the second housing 14, the first bonding plate 151 is fixedly connected to the inner wall of the first housing 11, the second bonding plate 153 is fixedly connected to the outer wall of the second housing 14, the thickness of the buffer plate 15 is equal to the distance between the first housing 11 and the second housing 14, and the buffer plate is fixed between the first housing 11 and the second housing 14 to realize the support and protection of the first housing 11 and the second housing 14.

Further, fixedly connected with fan 2 between first casing 11 and the second casing 14, the outside of fan 2 is provided with the protection network, and protection network fixed connection is at the outer wall of first casing 11, avoids inside outside impurity winged insect entering device, further improves the protective effect of device, has reached ripe stage in the aspect of fan 2's technique and the performance completely to constantly there is new technology to appear, and the theory of operation is realized according to energy conversion, promptly: electric → electromagnetic → mechanical → kinetic energy, the circuit principle is generally divided into various types, and the performance of the fan will be different according to the different circuits.

Furthermore, the water inlet 31 is fixedly connected to the top of the first housing 11, the water guiding pipe 32 is located in the middle of the shunt pipe 33, two ends of the water guiding pipe 32 are in a sealed state, and the water cooling pipes 34 are distributed on the outer wall of the second housing 14 in an S shape, so that the contact area between the water cooling pipes and the second housing 14 is increased, and the cooling effect on the second housing 14 is increased.

The working principle is as follows: when the device is used, firstly, the device is assembled, a proper amount of water source is further added into the water inlet 31, when the device is used, heat generated by using internal parts of the device can be conveyed to the outside through the heat conduction pipe in the second shell 14, further, the heat can be absorbed through winding of the water cooling pipe 34, cooling treatment is realized, meanwhile, the work of the fan 2 is matched, the circulation of air in the second shell 14 is increased, the heat dissipation efficiency is improved, further, the rapid cooling treatment of the device is realized, and through the arrangement of the buffer plate 15, the connection buffer between the first shell 11 and the second shell 14 can be realized, so that the shock-resistant effect between the first shell 11 and the second shell is improved, and the use safety of the device is improved.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A wireless communication module heat dissipation shell, comprising:

the heat dissipation shell assembly (1) comprises a first shell (11), the inner wall of the first shell (11) is connected with a second shell (14) through a buffer plate (15), two ends of the first shell (11) are both connected with baffles (12), and heat dissipation holes (13) are formed in the front surface and the back surface of the first shell (11);

water-cooling subassembly (3), water-cooling subassembly (3) set up between first casing (11) and second casing (14), water-cooling subassembly (3) include water inlet (31), the below of water inlet (31) is provided with aqueduct (32), the below fixedly connected with shunt tubes (33) of aqueduct (32), the below of shunt tubes (33) is connected with water-cooling tube (34).

2. The heat dissipation housing of claim 1, wherein: first casing (11) and second casing (14) all are "U" font structure, the bottom edge of second casing (14) all fixedly connected with mounting panel, and the constant head tank has been seted up to the top of mounting panel.

3. The heat dissipation housing of claim 1, wherein: the buffer plate (15) comprises a first bonding plate (151), a honeycomb plate (152) is fixedly connected to one side of the first bonding plate (151), and a second bonding plate (153) is fixedly connected to the other side of the honeycomb plate (152).

4. The heat dissipation housing of claim 3, wherein: buffer board (15) fixed bonding is between first casing (11) and second casing (14), first bonding board (151) fixed connection is at the inner wall of first casing (11), second bonding board (153) fixed connection is at the outer wall of second casing (14), and the thickness of buffer board (15) equals the interval of first casing (11) and second casing (14).

5. The heat dissipation housing of claim 1, wherein: fixedly connected with fan (2) between first casing (11) and second casing (14), the outside of fan (2) is provided with the protection network, and protection network fixed connection is at the outer wall of first casing (11).

6. The heat dissipation housing of claim 1, wherein: the water inlet (31) is fixedly connected to the top of the first shell (11), the water guide pipe (32) is located in the middle of the shunt pipe (33), two ends of the water guide pipe (32) are in a sealed state, and the water cooling pipes (34) are distributed on the outer wall of the second shell (14) in an S shape.