CN213044005U

CN213044005U - Circuit system control device

Info

Publication number: CN213044005U
Application number: CN202021290782.4U
Authority: CN
Inventors: 李鹏; 程鹏; 赵德鹏
Original assignee: Nanjing Zhaofu Power Technology Co ltd
Current assignee: Nanjing Zhaofu Power Technology Co ltd
Priority date: 2020-07-03
Filing date: 2020-07-03
Publication date: 2021-04-23
Anticipated expiration: 2030-07-03

Abstract

The utility model relates to the technical field of circuit systems, and discloses a circuit system control device, which comprises a shell, wherein a circuit system board is arranged in the shell, a mounting frame body is arranged at the left side of the shell, a heat dissipation plate is fixedly arranged on the inner wall at the right side of the mounting frame body, a heat dissipation fan is arranged in the middle of the inner cavity of the mounting frame body, and the right side wall of the heat dissipation fan is fixedly connected with the heat dissipation plate, this the utility model discloses a structure sets up rationally, and the heat dissipation is even and high-efficient, and is dustproof effectual.

Description

Circuit system control device

Technical Field

The utility model relates to a circuit system technical field specifically is a circuit system controlling means.

Background

The power system protection and control device is generally composed of units such as an analog input unit, an output unit, a microprocessor system, a man-machine conversation unit, an external communication unit and the like, wherein the microprocessor system is the core of the device. Microprocessor systems are generally composed of a microprocessor/controller, peripheral devices and an interface expansion system. The microprocessor/controller and the peripheral interface circuit are generally arranged on the same module, so that the heat productivity is large, the existing module has a single structure, a heat dissipation function is not provided, the heat dissipation effect is general, and the normal use of a power system is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem lie in overcoming prior art's radiating effect poor, and the influence defect such as use provides a circuit system controlling means. The circuit system control device has the advantages of being good in heat dissipation function, even in heat dissipation and the like.

In order to achieve the above object, the utility model provides a following technical scheme: a circuit system control device comprises a shell, wherein a circuit system board is installed in the shell, an installation frame body is arranged on the left side of the shell, a heat dissipation plate is fixedly installed on the inner wall of the right side of the installation frame body, a heat dissipation fan is arranged in the middle of the inner cavity of the installation frame body, the right side wall of the heat dissipation fan is fixedly connected with the heat dissipation plate, installation plates are fixedly installed on the outer walls of the top and the bottom of the heat dissipation plate respectively, an opening is formed in each installation plate and provided with an installation bolt, the tail end of each installation bolt is connected with the side wall of the shell, a heat absorption plate is fixedly installed on the outer wall of the left side of the heat dissipation plate, a heat conduction plate is fixedly installed on the outer wall of the right side of the heat conduction plate, a heat conduction copper pipe is, the other end of the air inlet pipe extends to the outside of the shell, radiating holes are formed in the side outer wall of the installation frame body in an array mode, and a dust screen is fixedly installed on the left side outer wall of the installation frame body.

Preferably, the dust screen covers the heat dissipation holes.

Preferably, install S-shaped siphunculus on the heating panel, S-shaped siphunculus is formed by parallel tubes and return bend combination, S-shaped siphunculus wholly is the S-shaped setting, and is filled with cooling liquid in the S-shaped siphunculus.

Preferably, the side wall of the heat dissipation plate is provided with through pipes which are vertically and symmetrically arranged, the through pipes are transversely and horizontally arranged, the left ends of the through pipes are arranged outside the side wall of the heat absorption plate, and the other ends of the through pipes are arranged outside the heat absorption convex blocks.

Preferably, the heat absorption convex blocks are arranged on the side wall of the heat conduction copper pipe in an array manner.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a radiator fan' S rotation can conduct the heat of electric power system during operation, and the quick heat dissipation function that carries out the quick heat after absorbing is carried out to the heat that again, and the heat dissipation air current wind channel sets up rationally, and dustproof effect is good, simultaneously through the setting of S-shaped siphunculus isotructure on heat-conducting plate and the heating panel, thermal transmission efficiency of improvement that can be great is favorable to thermal high efficiency effluvium, can reduce the heat that its electric power system produced, to sum up, this the utility model discloses a structure sets up rationally, and the heat dissipation is even and high-efficient, and is dustproof effectual.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 in accordance with the present invention;

fig. 3 is an enlarged view of B of fig. 1 according to the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a housing; 2. installing a frame body; 3. a heat dissipation plate; 4. a heat radiation fan; 5. an air inlet pipe; 6. heat dissipation holes; 7. a dust screen; 8. mounting a plate; 9. a heat absorbing bump; 10. a heat conducting copper pipe; 11. a heat conducting plate; 12. installing a bolt; 13. a heat absorbing plate; 14. an S-shaped through pipe; 15. a pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a circuit system control device comprises a shell 1, a circuit system board is installed in the shell 1, an installation frame body 2 is arranged on the left side of the shell 1, a heat dissipation plate 3 is fixedly installed on the inner wall of the right side of the installation frame body 2, a heat dissipation fan 4 is arranged in the middle of the inner cavity of the installation frame body 2, the right side wall of the heat dissipation fan 4 is fixedly connected with the heat dissipation plate 3, installation plates 8 are fixedly installed on the outer walls of the top and the bottom of the heat dissipation plate 3, an installation bolt 12 is installed on each installation plate 8, the tail end of the installation bolt 12 is connected with the side wall of the shell 1, a heat absorption plate 13 is fixedly installed on the outer wall of the left side of the heat dissipation plate 3, a heat conduction plate 11 is fixedly installed on the outer wall of the right side of the heat conduction plate 11, a heat conduction copper pipe 10, the other end of the air inlet pipe 5 extends to the outside of the shell 1, radiating holes 6 are formed in the side wall of the installation frame body 2 in an array shape, a dustproof net 7 is fixedly installed on the outer wall of the left side of the installation frame body 2, the dustproof net 7 covers the radiating holes 6, the installation of the dustproof net 7 enables the installation frame body 2 and the shell 1 to have a good dustproof function, an S-shaped through pipe 14 is installed on the radiating plate 3, the S-shaped through pipe 14 is formed by combining parallel pipes and bent pipes, the S-shaped through pipe 14 is integrally arranged in an S shape, cooling liquid is filled in the S-shaped through pipe 14, the radiating effect of the power system module plate can be further improved through the arrangement of the cooling liquid in the S-shaped through pipe 14, through pipes 15 are symmetrically installed on the upper portion and the lower portion of the side wall of the radiating plate 3, the through pipes 15 are horizontally installed, the left end of the through pipes 15 is arranged outside the side wall of, the structure of siphunculus 15 sets up rationally, can be with the quick water conservancy diversion of the high-temperature gas in the casing 1 to radiator fan 4 department, and heat absorption protruding piece 9 is the array setting on the lateral wall of heat conduction copper pipe 10, and heat that heat absorption protruding piece 9 can the efficient absorption electric power system produce.

The working principle is that the utility model can generate a large amount of heat when the power system is in use, at the moment, the heat radiation fan 4 is opened through the external power supply and the switch, the heat during the power system working can be conducted through the rotation of the heat radiation fan 4, and the absorbed heat can be quickly radiated, the arrangement of the heat radiation airflow channel is reasonable, the dustproof net 7 has good dustproof effect, the S-shaped through pipe 14 is filled with cooling liquid, the heat radiation effect on the power system module plate can be further improved through the arrangement of the cooling liquid in the S-shaped through pipe 14, the heat transmission efficiency can be greatly improved, the high-efficiency radiation of the heat can be facilitated, and the heat generated by the power system can be reduced,

although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A circuit system control device comprising a case (1), a circuit system board being mounted in the case (1), characterized in that: the heat dissipation device is characterized in that an installation frame body (2) is arranged on the left side of the shell (1), a heat dissipation plate (3) is fixedly installed on the right inner wall of the installation frame body (2), a heat dissipation fan (4) is arranged in the inner cavity of the installation frame body (2) in the middle, the right side wall of the heat dissipation fan (4) is fixedly connected with the heat dissipation plate (3), mounting plates (8) are fixedly installed on the top and the bottom outer wall of the heat dissipation plate (3), mounting bolts (12) are installed on the mounting plates (8) in a hole mode, the tail ends of the mounting bolts (12) are connected with the side wall of the shell (1), a heat absorption plate (13) is fixedly installed on the left side outer wall of the heat dissipation plate (3), a heat conduction plate (11) is fixedly installed on the right side outer wall of the heat conduction plate (11), a heat conduction copper pipe (10) is fixedly installed, the top trompil fixed mounting of casing (1) has air-supply line (5), the other end of air-supply line (5) extends to the outside of casing (1), the lateral wall of installation framework (2) is array form and has seted up louvre (6), the left side outer wall fixed mounting of installation framework (2) has dust screen (7).

2. A circuit system control device according to claim 1, wherein: the dust screen (7) covers the heat dissipation holes (6).

3. A circuit system control device according to claim 1, wherein: install S-shaped siphunculus (14) on heating panel (3), S-shaped siphunculus (14) are formed by parallel tubes and return bend combination, S-shaped siphunculus (14) wholly are the S-shaped setting, and fill in S-shaped siphunculus (14) and have the cooling liquid.

4. A circuit system control device according to claim 1, wherein: the heat dissipation plate is characterized in that through pipes (15) are symmetrically arranged on the side wall of the heat dissipation plate (3) up and down, the through pipes (15) are horizontally arranged, the left ends of the through pipes (15) are arranged outside the side wall of the heat absorption plate (13), and the other ends of the through pipes (15) are arranged on the outer side of the heat absorption convex blocks (9).

5. A circuit system control device according to claim 1, wherein: the heat absorption convex blocks (9) are arranged on the side wall of the heat conduction copper pipe (10) in an array manner.