CN215529404U - Electronic component mounting structure and electric tool - Google Patents
Electronic component mounting structure and electric tool Download PDFInfo
- Publication number
- CN215529404U CN215529404U CN202121317851.0U CN202121317851U CN215529404U CN 215529404 U CN215529404 U CN 215529404U CN 202121317851 U CN202121317851 U CN 202121317851U CN 215529404 U CN215529404 U CN 215529404U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- covered
- glue
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses an electronic component mounting structure and an electric tool, comprising: the circuit board comprises a circuit board shell, a circuit board arranged on the circuit board shell and an electronic element welded on the circuit board, wherein the electronic element comprises a main body and pins positioned on the same side of the main body, the main body comprises an upper surface, a lower surface and a peripheral surface, the area of the upper surface, the area of the lower surface and the area of the peripheral surface are the largest, the pins are bent towards the same side to set angles so as to be arranged on the circuit board, the upper surface and the lower surface, the area of the lower surface and the area of the circuit board are parallel, the circuit board is covered with glue, and at least one part of the peripheral surface of the electronic element is covered with glue. According to the utility model, the electronic element is bent and welded on the circuit board and is contacted with the potting adhesive, so that the radiating effect is good, and the service life of the electronic element can be prolonged.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to power tools, and particularly to a power tool for dissipating heat generated by an electronic component.
[ background of the utility model ]
At present, the alternating current brushless is rectified through a large capacitor, the peak current of the large capacitor impacts the large capacitor and a power plug connecting part, namely, the service life of the large capacitor and the service life of the power plug are influenced, therefore, a power type NTC thermistor is required to be added to inhibit the peak current generated by charging and discharging of the large capacitor, in the working process of a high-voltage brushless tool, the impact current of the large capacitor is very large due to the change of a load, the large current can enable the thermistor to generate heat, if the thermistor is not cooled, the service life of the thermistor is shortened due to high temperature, and the service life of the whole machine is shortened.
Therefore, it is necessary to design an electronic component mounting structure and an electric tool with good heat dissipation effect to solve the above problems.
[ Utility model ] content
In view of the deficiencies of the prior art, the present invention provides an electronic component mounting structure and an electric tool with good heat dissipation effect.
The utility model solves the problems of the prior art by adopting the following technical scheme: an electronic component mounting structure comprising: the electronic element comprises a main body and pins positioned on the same side of the main body, wherein the main body comprises an upper surface, a lower surface and a peripheral surface with the largest area, the pins are bent towards the same side to set angles so as to be installed on the circuit board, the upper surface and the lower surface with the largest area are arranged in parallel with the circuit board, the circuit board is covered with glue, and at least one part of the peripheral surface of the electronic element is covered with the glue.
The further improvement scheme is as follows: the set angle is 90OThe lower surface is abutted against the circuit board, and the upper surface is covered by the potting adhesive.
The further improvement scheme is as follows: the set angle is 90OThe lower surface is abutted to the circuit board, and the lower surface is covered by the potting adhesive.
The further improvement scheme is as follows: the electronic element is a thermistor.
The further improvement scheme is as follows: the thermal conductivity coefficient of the potting adhesive is not less than 0.7W/(m.K).
The utility model can also adopt the following technical scheme for solving the problems in the prior art: a power tool, comprising: the motor comprises a shell, a motor and a circuit board shell which are contained in the shell, wherein a circuit board is installed in the circuit board shell, an electronic element is welded on the circuit board and comprises a main body and a pin which is located on the same side of the main body, the main body comprises an upper surface, a lower surface and a peripheral surface which have the largest area, the pin is bent towards the same side to set an angle so as to be installed on the circuit board, the upper surface and the lower surface which have the largest area are parallel to the circuit board, the circuit board is covered with glue, and at least one part of the peripheral surface of the electronic element is covered with the glue.
The further improvement scheme is as follows: the circuit board shell comprises a bottom part and an opening part opposite to the bottom part, and when the circuit board is installed on the circuit board shell, the electronic element is arranged on one side of the opening part.
The further improvement scheme is as follows: the set angle is 90OThe lower surface abuts against the circuit board, the glue is filled from the bottom, and the upper surface is covered by the glue.
The further improvement scheme is as follows: the set angle is 90OThe lower surface abuts against the circuit board, the glue is filled from the bottom, and the lower surface is covered by the glue.
The further improvement scheme is as follows: the thermal conductivity coefficient of the potting adhesive is not less than 0.7W/(m.K).
Compared with the prior art, the utility model has the following beneficial effects: the pins of the electronic elements arranged on the circuit board are bent to the same side for setting angles, the circuit board is covered with the potting adhesive, at least one part of the electronic elements is covered with the potting adhesive, the contact area between the electronic elements and the potting adhesive is increased, effective heat dissipation can be carried out, and the service life of the electronic elements is prolonged.
[ description of the drawings ]
The following detailed description of embodiments of the utility model is provided in conjunction with the appended drawings:
FIG. 1 is a block diagram of the power tool of the present invention;
FIG. 2 is a diagram showing the construction of a circuit board of the electric power tool according to the first embodiment of the present invention;
FIG. 3 is a cross-sectional view of a circuit board of the power tool of the first embodiment of the present invention;
FIG. 4 is a diagram showing a circuit board structure of a power tool according to a second embodiment of the present invention;
fig. 5 is a cross-sectional view of a circuit board of a power tool according to a second embodiment of the present invention.
The meaning of the reference symbols in the figures:
100. electric circular saw 1, circuit board case 11, bottom 12, opening 2, circuit board 3, electronic component 31, main body 32, pin 33, upper surface 34, lower surface 4, and potting compound
[ detailed description ] embodiments
The present invention will be described in further detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1, the electric tool according to the present invention is an electric circular saw 100, where the electric circular saw 100 includes a housing, a motor accommodated in the housing, a transmission assembly (not shown) for transmitting power, a circuit board, and a cutting unit connected to the housing, the motor drives the transmission assembly to drive the cutting unit to operate, and the motor is an ac brushless motor.
Referring to fig. 2 and 3, which are schematic diagrams of a circuit board according to a first embodiment of the present invention, the electric tool includes a circuit board housing 1, the circuit board housing 1 includes a bottom portion 11 and an opening portion 12 opposite to the bottom portion 11, an electronic component 3 is welded on the circuit board 2, when the circuit board 2 is mounted in the circuit board housing 1, the electronic component 3 is located at one side of the opening portion 12, a gap exists between the circuit board 2 and the circuit board housing 1, and when the circuit board is subjected to glue filling, the gap can be filled, so that short circuit between pins of the electronic component can be reduced. The electronic component 3 is a thermistor and comprises a main body 31 and pins 32 located on the same side of the main body 31, the main body 31 is oblate and comprises a surface with the largest area and a peripheral surface, the surface with the largest area comprises an upper surface 33 and a lower surface 34 which are opposite and parallel, and the extending directions of the upper surface 33 and the lower surface 34 are the same as the extending direction of the pins 32. Since the area of the main body 31 of the electronic component 3 is large, the height of the circuit board 2 is increased when the electronic component is vertically mounted on the circuit board 2, and the volume of the circuit board 2 is increased, so that the electronic component can be used for the electronic componentWhen the sub-component 3 is mounted, the pins 32 are perpendicularly inserted into the circuit board 2 for soldering, and the pins 32 are bent to the same side for a predetermined angle, so that the upper surface 33 and the lower surface 34 are parallel to the circuit board 2. In the present embodiment, the set angle is 90 degreesOWhen the circuit board 2 is mounted on the circuit board, the upper surface 33 and the lower surface 34 are parallel to the circuit board 2, and the lower surface 34 abuts against the circuit board 2. Of course, due to the irregularity of the main body 31, the set angle thereof may be 90 degreesO±10OSo that the lower surface 34 of the body 31 can abut to the circuit board 2.
After the circuit board 2 is mounted on the circuit board housing 1, the circuit board housing 1 is filled with the potting adhesive 4 from the opening 12, the potting adhesive 4 is filled from the bottom 11 to the opening 12, at least a part of the peripheral surface of the electronic component 3 is covered by the potting adhesive 4, and the thermal conductivity coefficient of the potting adhesive 4 is not less than 0.7W/(m · K). In this embodiment, circuit board casing 1 is the aluminum hull, has fine heat conductivity and uses the silica gel of model HY-214, and its coefficient of heat conductivity is 0.8 to, as shown in fig. 2 dotted line, electronic component 3's upper surface 33 by encapsulating 4 covers completely, works as electronic component 3 generates heat, and its encapsulating 4 has fine heat conductivity, electronic component 3 transmits the heat to electric circuit board casing 1 through the encapsulating, is enough with in the heat gives off the air, realizes fine heat dissipation.
Referring to fig. 4 and 5, which are schematic diagrams of a circuit board according to a second embodiment of the present invention, a lower surface 34 of the electronic component 3 is covered by the potting compound 4, and the upper surface 33 is not completely covered by the potting compound 4, as shown in fig. 4, the upper surface 33 of the electronic component 3 is exposed out of the potting compound 4, but heat of the electronic component 3 can be dissipated due to the contact between the lower surface 34 and the potting compound 4 and the good thermal conductivity of the potting compound 4. In other embodiments, the main body 31 of the electronic component 3 may not contact the circuit board 2, but at least a portion of the peripheral surface of the electronic component 3 is covered by the potting compound, so that a good heat dissipation effect can be achieved. By bending 90OAnd glue is poured for 4 times, so that the volume of the circuit board is saved, and good scattering can be realizedAnd is heated and fixed by potting compound 4, stabilizing the performance of the electronic component 3.
According to the electric tool, the pins 32 of the electronic element 3 arranged on the circuit board 2 are bent towards the same side for setting the angle, the circuit board 2 is covered with the potting adhesive 4, at least one part of the electronic element 3 is covered with the potting adhesive 4, the contact area between the electronic element 3 and the potting adhesive 4 is increased, effective heat dissipation can be carried out, and the service life of the electronic element 3 is prolonged.
The present invention is not limited to the above-described embodiments. It will be readily appreciated by those skilled in the art that numerous other alternatives to the electronic component mounting structure and power tool of the present invention can be devised without departing from the spirit and scope of the utility model. The protection scope of the present invention is subject to the content of the claims.
Claims (10)
1. An electronic component mounting structure comprising: circuit board casing, install in the circuit board of circuit board casing and weld in the electronic component of circuit board, its characterized in that: the electronic element comprises a main body and pins positioned on the same side of the main body, the main body comprises an upper surface, a lower surface and a peripheral surface, the area of each pin is the largest, the pins are bent towards the same side to set angles so as to be installed on the circuit board, the upper surface and the lower surface, the area of each pin is the largest, the upper surface and the lower surface are parallel to the circuit board, the circuit board is covered with glue, and at least one part of the peripheral surface of the electronic element is covered with the glue.
2. The electronic component mounting structure according to claim 1, wherein: the set angle is 90 degrees, the lower surface is abutted to the circuit board, and the upper surface is covered by the potting adhesive.
3. The electronic component mounting structure according to claim 1, wherein: the set angle is 90 degrees, the lower surface is abutted to the circuit board, and the lower surface is covered by the potting adhesive.
4. The electronic component mounting structure according to claim 2 or 3, wherein: the electronic element is a thermistor.
5. The electronic component mounting structure according to claim 1, wherein: the thermal conductivity coefficient of the potting adhesive is not less than 0.7W/(m.K).
6. A power tool, comprising: the shell, accept in motor and circuit board casing in the shell, install the circuit board in the circuit board casing, the welding has electronic component, its characterized in that on the circuit board: the electronic element comprises a main body and pins positioned on the same side of the main body, the main body comprises an upper surface, a lower surface and a peripheral surface, the area of each pin is the largest, the pins are bent towards the same side to set angles so as to be installed on the circuit board, the upper surface and the lower surface, the area of each pin is the largest, the upper surface and the lower surface are parallel to the circuit board, the circuit board is covered with glue, and at least one part of the peripheral surface of the electronic element is covered with the glue.
7. The power tool of claim 6, wherein: the circuit board shell comprises a bottom part and an opening part opposite to the bottom part, and when the circuit board is installed on the circuit board shell, the electronic element is arranged on one side of the opening part.
8. The power tool of claim 7, wherein: the set angle is 90 degrees, the lower surface abuts against the circuit board, the glue is filled from the bottom, and the upper surface is covered by the glue.
9. The power tool of claim 7, wherein: the set angle is 90 degrees, the lower surface abuts against the circuit board, the glue is filled from the bottom, and the lower surface is covered by the glue.
10. The power tool of claim 6, wherein: the thermal conductivity coefficient of the potting adhesive is not less than 0.7W/(m.K).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317851.0U CN215529404U (en) | 2021-06-11 | 2021-06-11 | Electronic component mounting structure and electric tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121317851.0U CN215529404U (en) | 2021-06-11 | 2021-06-11 | Electronic component mounting structure and electric tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215529404U true CN215529404U (en) | 2022-01-14 |
Family
ID=79808045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121317851.0U Active CN215529404U (en) | 2021-06-11 | 2021-06-11 | Electronic component mounting structure and electric tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215529404U (en) |
-
2021
- 2021-06-11 CN CN202121317851.0U patent/CN215529404U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101187364B (en) | Inverter-integrated electric compressor | |
| US20030067748A1 (en) | Water cooled inverter | |
| CN103222176A (en) | Inverter module and inverter integrated motor-riven compressor | |
| CN215529404U (en) | Electronic component mounting structure and electric tool | |
| CN211182102U (en) | Sealed relay special for automobile | |
| CN208225802U (en) | A kind of compact solid state relay that heat sinking function is excellent | |
| CN217064199U (en) | Heat radiation structure of motor controller | |
| CN216849927U (en) | Packaging structure for improving reliability of GaN chip | |
| CN214708464U (en) | Controller | |
| CN102752994A (en) | Driver | |
| CN216250710U (en) | Power management chip packaging structure | |
| KR101413579B1 (en) | Fan motor assembly | |
| CN212086016U (en) | Motor controller of BSG system and integrated BSG system | |
| CN108925103A (en) | A kind of motor controller assemblies | |
| CN211650663U (en) | Electric control assembly and air conditioner | |
| CN209806324U (en) | Motor controller and electric vehicle | |
| CN211702829U (en) | Electric appliance structure with heat dissipation shielding function | |
| CN209805573U (en) | Motor for fan | |
| CN210133520U (en) | Circuit board with plastic package structure | |
| CN215421316U (en) | Electric tool | |
| CN112284560A (en) | Method for rapidly detecting temperature of power device | |
| CN220086030U (en) | Lead frame of rectifier | |
| CN200991805Y (en) | Air plasma cutting machine | |
| CN213343106U (en) | Heat dissipation type controller and electric tool | |
| CN111284331A (en) | Motor control device with built-in shunt resistor and power transistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |