CN215524828U

CN215524828U - Heat attenuation testing device for LED lamp beads

Info

Publication number: CN215524828U
Application number: CN202121505934.2U
Authority: CN
Inventors: 何刚; 沈健健
Original assignee: Zhejiang Zero Run Technology Co Ltd
Current assignee: Zhejiang Zero Run Technology Co Ltd
Priority date: 2021-07-02
Filing date: 2021-07-02
Publication date: 2022-01-14
Anticipated expiration: 2031-07-02

Abstract

The utility model discloses a heat attenuation testing device for an LED lamp bead, which comprises an integrating sphere and a heating plate, wherein the heating plate is arranged on the integrating sphere; a PCBA test board assembly is detachably fixed on the heating plate and comprises a PCBA test board, and an LED lamp bead to be tested, a driving chip and a temperature probe are mounted on the PCBA test board; a heating element is arranged near the PCBA test board assembly; the part of the heating plate, which is fixed with the PCBA test board assembly, is fixed in the inner cavity of the integrating sphere in a detachable mode. The utility model has the beneficial effects that: and the integrating sphere is used for realizing the rapid detection of the heat attenuation data of the LED lamp bead.

Description

Heat attenuation testing device for LED lamp beads

Technical Field

The utility model relates to the field of optical detection equipment, in particular to a heat attenuation testing device for an LED lamp bead.

Background

For the LED lamp bead, parameters such as luminous flux, color temperature and light effect can be tested by using the integrating sphere. Chinese patent document CN203274911U discloses "a narrow beam LED lamp luminous flux measuring device" in 2013, 11.6.2013, which includes a photometric integrating sphere, a calibration device, and a light measuring device; the photometric integrating sphere is formed by splicing a first hemisphere and a second hemisphere, and a first opening and a second opening are formed in the wall of the first hemisphere; the light measuring device is arranged on the first opening, and the calibration and calibration device is arranged on the second opening; the calibration device comprises a shell provided with a light-emitting aperture and a light-emitting device arranged in the shell, and an optical axis of the light-emitting device passes through the center of the light-emitting aperture and is perpendicular and orthogonal to the surface of the light-emitting aperture; the light output characteristic of the calibration device can be set according to the sample characteristic, and the measurement precision is high; the device can adopt various optical detection devices to measure at the same time, and has high measuring speed and high measuring precision. Because of the inherent characteristics of the LED lamp beads, when the temperature rises, the thermal attenuation of the existing LED lamp beads is serious, the overall brightness can be reduced, but the reduction degrees of different lamp beads are different, and therefore, the thermal attenuation test needs to be carried out on the LED lamp beads to be selected at the beginning of the model selection of the lighting product. If the corresponding heat decay value is checked and compared by only looking up the table by the specification, although the data is relatively simple, the data is rough and the deviation from the actual product is large. If the whole PCBA sample piece comes out and then is tested, if the condition of serious heat decay is met, the lamp bead needs to be replaced, the hardware design principle scheme needs to be replaced, and the redesign from the scheme level needs to take more time period to influence the project schedule. It is necessary to perform an advanced thermal decay test on a lamp bead to be selected at the initial stage of the model selection of the LED lamp bead so as to obtain accurate thermal decay data as early as possible and help determine the model selection result as early as possible.

SUMMERY OF THE UTILITY MODEL

Based on the above problems, the utility model provides a heat attenuation testing device for an LED lamp bead, which realizes rapid detection of heat attenuation data of the LED lamp bead by means of an integrating sphere.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme: a heat decay testing device for an LED lamp bead comprises an integrating sphere and a heating plate; a PCBA test board assembly is detachably fixed on the heating plate and comprises a PCBA test board, and an LED lamp bead to be tested, a driving chip and a temperature probe are mounted on the PCBA test board; a heating element is arranged near the PCBA test board assembly; the part of the heating plate, which is fixed with the PCBA test board assembly, is fixed in the inner cavity of the integrating sphere in a detachable mode.

Preferably, the heating element is a heating wire.

Preferably, the hot plate is the metal material, and the back at the PCBA test panel assembly position of hot plate is fixed to the heating wire.

Preferably, the inner side end of one side of the heating plate is provided with a concave test plate mounting groove, and the PCBA test plate assembly is embedded in the test plate mounting groove in a matching manner.

Preferably, a sliding guide rail is fixed in the integrating sphere, and two ends of the sliding guide rail are respectively positioned at the sphere center and the opening of the integrating sphere; the heating plate is fixed on the sliding guide rail and can slide.

Preferably, the heating wires are uniformly arranged on the heating plate.

The LED lamp pearl of this scheme design is with heat decay testing arrangement mainly includes two parts of integrating sphere and hot plate. The heating plate is generally of a proper size, the front end of the heating plate extends into a proper position of the center of the integrating sphere, and the rear end of the heating plate can be exposed out of the integrating sphere or integrally accommodated in the integrating sphere. The front end or the inboard end design of hot plate have recessed test panel mounting groove for dismantled and assembled fixed PCBA test panel assembly, and PCBA test panel assembly includes that PCBA tests essential components such as test panel, await measuring LED lamp pearl, driver chip, still installs temperature probe, is used for near the temperature of the LED lamp pearl of real-time perception awaiting measuring to acquire the ambient temperature parameter. Meanwhile, the heating wire is arranged near the PCBA test board assembly and used as a heating element, different temperature environments are simulated through heating of the heating wire, so that optical parameters of the LED lamp beads to be tested under different temperature rings are obtained, the obtained parameters and the temperature parameters obtained by the temperature probe can be correspondingly recorded by a tester, and the influence of the temperature on the LED lamp beads to be tested can be analyzed. In order to achieve a satisfactory heat conduction effect, the heating plate is made of a metal material, such as copper or aluminum, and the heating wires are fixed to the heating plate at positions corresponding to the back of the PCBA test board assembly. A sliding guide rail is designed in the integrating sphere, so that the space position of each test is fixed, and the influence of environment variables on the test result is reduced to the greatest extent.

In conclusion, the beneficial effects of the utility model are as follows: and the integrating sphere is used for realizing the rapid detection of the heat attenuation data of the LED lamp bead.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic view of the structure of the heating plate.

Fig. 3 is a schematic view of another perspective of the heating plate.

Wherein: 1 integrating sphere, 2 integrating sphere installing supports, 3 hot plates, 31 heating element, 32PCBA test board assembly, 321PCBA test board, 322 LED lamp pearls to be tested, 323 driver chip, 324 temperature probe, 33 test board mounting grooves, 34 handles, 4 bases.

Detailed Description

The utility model is further described with reference to the following detailed description and accompanying drawings.

The embodiment provides a heat decay testing device for an LED lamp bead, which is applied to the test operation of vehicle lamps of certain electric vehicle enterprises.

The overall structure of the present embodiment is shown in fig. 1, and includes four main components, i.e., a base 4, an integrating sphere mounting bracket 2, an integrating sphere 1, and a heating plate 3. Wherein, the base 4 is made of aluminum material, and is light and firm. The integrating sphere mounting brackets 2 are designed in pairs, are in inverted L shapes, are fixed on the base 4 at the lower ends, and extend laterally at the upper ends for fixing the integrating spheres 1. The integrating sphere 1 is provided with an opening, and the heating plate 3 is inserted into the integrating sphere 1 from the opening in a matching way.

The specific structure of the heating plate 3 is shown in fig. 2 and 3. The heating plate 3 of this example is also made of aluminum and has a rectangular shape. At the front end of the heating plate 3, one side surface is provided with a test board mounting groove 33, and the PCBA test board assembly 32 is detachably mounted on the test board mounting groove 33. PCBA test panel assembly 32 includes PCBA test panel 321, awaits measuring LED lamp pearl 322, driver chip 323 and temperature probe 324, and PCBA test panel 321's shape and size and the shape and size adaptation of testing panel mounting groove 33, both can realize the plug installation. The LED lamp bead 322 to be tested, the driving chip 323 and the temperature probe 324 are all fixed on the PCBA test board 321, and necessary electric connection is realized. On the other side of the front end of PCBA test board assembly 32, heating elements 31 are fixed, in this example heating elements 31 are heating wires, which are uniformly arranged in a serpentine winding manner, and the heating wires are electrically connected with a power supply as necessary. A sliding guide rail (not shown in the figure) is fixedly installed inside the integrating sphere 1, the inner side end of the sliding guide rail is located at the sphere center of the integrating sphere 1, the outer side of the sliding guide rail is located at the opening of the integrating sphere 1, the PCBA test board assembly 32 can be placed on the sliding guide rail, and the front end of the PCBA test board assembly 32 reciprocates between the sphere center and the opening of the integrating sphere 1. At the rear end of the PCBA test board assembly 32, a handle 34 is designed to facilitate the PCBA test board assembly 32 which completes the test to be pulled out from the opening of the integrating sphere 1.

When the heat attenuation testing device for the LED lamp beads is used, the PCBA testing board assembly 32 is embedded into the testing board mounting groove 33 to be fixed, then necessary electric connection is completed, the heating plate 3 is integrally fixed on the sliding guide rail, and then the front end of the heating plate 3 is pushed into the integrating sphere 1 until the front end reaches a set position, namely the sphere center in the example. At this moment, the circuit is switched on, the heating plate 3 and the surrounding environment are heated by the heating wire, the temperature probe 324 can record the ambient temperature around the LED lamp bead 322 to be tested, the integrating sphere 1 can record the optical parameters of the LED lamp bead 322 to be tested, the ambient temperature is increased and decreased along with the temperature increase and decrease of the heating wire, and the optical parameters of the LED lamp bead 322 to be tested are changed. After data collection, necessary analysis is carried out, and detection results can be made according to the analysis. After the detection is finished, the heating plate 3 is pulled out, the PCBA test board assembly 32 embedded and fixed at the front end is replaced, the same test operation is carried out by the same temperature rise and fall in the same step, and the same test can be carried out on the LED lamp beads to be tested which are not used.

Claims

1. A heat decay testing device for LED lamp beads comprises an integrating sphere (1) and is characterized by further comprising a heating plate (3); a PCBA test board assembly (32) is detachably fixed on the heating plate (3), the PCBA test board assembly (32) comprises a PCBA test board (321), and an LED lamp bead (322) to be tested, a driving chip (323) and a temperature probe (324) are mounted on the PCBA test board; a heating element (31) is arranged near the PCBA test board assembly (32); the part of the heating plate (3) fixed with the PCBA test board assembly is fixed in the inner cavity of the integrating sphere (1) in a detachable mode.

2. The heat decay testing device for the LED lamp bead as claimed in claim 1, wherein the heating element (31) is a heating wire.

3. The heat decay testing device for the LED lamp beads as claimed in claim 2, wherein the heating plate (3) is made of metal, and the heating wire is fixed on the back of the heating plate (3) where the PCBA testing board assembly (32) is located.

4. The heat decay testing device for the LED lamp beads as claimed in claim 1, 2 or 3, wherein a concave testing board mounting groove (33) is formed in the inner side end of one side of the heating plate (3), and the PCBA testing board assembly (32) is fittingly embedded in the testing board mounting groove (33).

5. The heat decay testing device for the LED lamp bead as claimed in claim 1, 2 or 3, wherein a sliding guide rail is fixed in the integrating sphere (1), and two ends of the sliding guide rail are respectively positioned at the sphere center and the opening of the integrating sphere (1); the heating plate (3) is fixed on the sliding guide rail and can slide.

6. The heat decay testing device for the LED lamp beads as claimed in claim 3, wherein the heating wires are uniformly arranged on the heating plate (3).