CN102636441B - Test evaluation method of LED (light emitting diode) packaging adhesive - Google Patents
Test evaluation method of LED (light emitting diode) packaging adhesive Download PDFInfo
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- CN102636441B CN102636441B CN201210131398.3A CN201210131398A CN102636441B CN 102636441 B CN102636441 B CN 102636441B CN 201210131398 A CN201210131398 A CN 201210131398A CN 102636441 B CN102636441 B CN 102636441B
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Abstract
The invention relates to a test method and particularly a test method of materials. A test evaluation method of an LED (light emitting diode) packaging adhesive comprises the following steps of: step S1, dispensing and solidifying adhesive to form an LED packaging adhesive film, and preparing an LED packaging adhesive film to be tested; step S2, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film; step S3, irradiating the LED packaging adhesive film through a lighting emitting device for light energy shock; step S4, carrying out light transmittance performance test and other physical property tests on the LED packaging adhesive film which is subjected to the energy shock in the step S3; and step S5, comparing and analyzing the test result obtained by the step S2 and the test result obtained by the step S4. The test method provided by the invention can be used for performance test of the LED packaging adhesive.
Description
Technical field
The present invention relates to a kind of method of testing, particularly about the method for testing of material.
Background technology
LED packaging technology has material impact for LED product.Wherein, about what have the greatest impact in LED packaging technology, be mainly selection and the allotment of encapsulating structure and packaging plastic.LED encapsulation manufacturer all will carry out a large amount of performance tests to LED after a LED product process of exploitation or moulding.Because the wafer of LED is generally that buying comes, wafer manufacturer has completed the performance test of wafer, so the test that LED encapsulates manufacturer is generally the test for LED packaging technology aspect.In the prior art, to LED test, be all generally to take the LED sample of designing and developing to test.Although such test mode is very directly perceived, Shortcomings part is: after all needing to make sample, just can test at every turn, also need to arrange corresponding LED driving, assembling, heat abstractor etc. simultaneously, need to expend suitable time and cost.Main in addition, this mode also can only test out the whole structure of LED packaging technology.Because in test process, because other encapsulating materials such as LED chip, LED package support, LED fluorescent powder are also in experimental enviroment, also can agingly decay, therefore can only analyze the performance change of integral LED, and cannot test out the factor of encapsulating structure or the rise leading influence factor of the factor of packaging plastic to LED packaging technology.Like this, will cause R&D process veryer long.
In addition, some packaging plastic material production firms can carry out some tests for LED packaging plastic, to offer LED encapsulation manufacturer, use.But material manufacturer is generally the test for material self character about the test of LED packaging plastic, and encapsulation manufacturer is different to the curing mode of packaging plastic due to the different packaging technology of employing, test data of the LED packaging plastic that causes packaging plastic material production firm to provide can not be met completely for this or some aspect test data cannot be used.And packaging plastic material production firm is to test by special machine for the test of LED encapsulating material, testing cost is higher.
Summary of the invention
Applicant is for the deficiency of existing LED test, proposing a kind of method of testing tests the performance of LED packaging plastic, especially can be for adopting the performance of LED packaging plastic curing under specific LED packaging plastic condition of cure to test and evaluate in packaging technology, thereby can analyze LED packaging plastic factor in the impact of LED packaging technology, LED research and development of products is carried out to technical guidance.
The present invention adopts following technical scheme:
A test evaluation method for LED packaging plastic, comprises the steps:
Step S1, puts glue, solidify to form LED packaging plastic film, prepares LED packaging plastic film to be tested;
Step S2, carries out light transmittance properties test and other quantitative measurements to LED packaging plastic film;
Step S3, irradiates to carry out luminous energy impact by light-emitting device to LED packaging plastic film;
Step S4, carries out light transmittance properties test and other quantitative measurements again by the LED packaging plastic film after energy impact in step S3;
Step S5, compares the result through step S2 test and the result through step S4 test and analyze.
Wherein, in step S1 by a glue, solidify to form can making by usual manners such as spot gluing equipment, spraying equipment, machine cuts of LED packaging plastic film to be tested, also can be undertaken by a kind of auxiliary mould, in simple and quick mode, realize.
Wherein, in step S2, step S4, LED packaging plastic film being carried out to light transmittance properties test can complete by professional transmittance testing apparatus, also can be undertaken by a kind of test fixture, in simple mode, realizes.In step S2, step S4, LED packaging plastic film being carried out to other quantitative measurements can comprise: refraction index test, hardness test, pulling strengrth test, expansion coefficient test, etc.
Wherein, in step S3, by light-emitting device, LED packaging plastic film is irradiated to carry out luminous energy impact, can complete by professional luminous energy impact device, also can be undertaken by a kind of shock-testing case, in simple and reliable mode, realize.
Further, the luminous energy of described step S3 is impacted and can under varying environment, be carried out, the more approaching actual situation about using of simulation meeting of impacting for the environmental aging of LED packaging plastic film.
The test evaluation method of LED packaging plastic of the present invention is for adopting the performance of LED packaging plastic curing under specific LED packaging plastic condition of cure to test and evaluate in packaging technology, basically identical with the situation of actual packaging technology, thereby can reliable analysis go out LED packaging plastic factor in the impact of LED packaging technology, thereby LED research and development of products is carried out to technical guidance.In addition, the present invention is directed to the preparation of LED packaging plastic film, aging can also the realization by some simpler servicing units of energy impact of the test of the light transmittance properties of LED packaging plastic film, LED packaging plastic film, and without adopting the high professional equipment of price to carry out, also greatly saved the cost of test.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of auxiliary mould embodiment of the present invention.
Fig. 2 is the structural representation of a kind of test fixture embodiment of the present invention.
Fig. 3 is the structural representation of a kind of shock-testing case embodiment of the present invention.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
The test evaluation method of LED packaging plastic of the present invention, specifically comprises the steps:
Step S1: put glue, solidify to form LED packaging plastic film, prepare LED packaging plastic film to be tested.The condition of cure of the LED packaging plastic film here and the LED product condition of cure in encapsulation manufacturing process is in full accord, the test that just can realize LED packaging plastic film is equal to the performance that adopts the LED packaging plastic under this packaging technology, thereby makes the performance data of the LED packaging plastic that tests out have very high reference significance.
Wherein, in step S1 by a glue, solidify to form can making by usual manners such as spot gluing equipment, spraying equipment, machine cuts of LED packaging plastic film to be tested, also can be undertaken by a kind of auxiliary mould, in simple and quick mode, realize.Consult shown in Fig. 1, this auxiliary mould by patrix 101, in mould 102 and counterdie 103 superpose and form successively, and can lock by screw; Counterdie 103 is a flat board, middle mould 102 is provided with one or more die cavity holes 1021 that is used for forming film, patrix 101 is provided with hole for injecting glue 1011 corresponding to the position of the die cavity holes 1021 of middle mould 102, and each die cavity holes 1021 can be for 1 or 2 above hole for injecting glue 1011.Preferably, in order to prevent the use of temperatures involved patrix 101 and the counterdie 103 of LED packaging plastic, at patrix 101 and counterdie 103, be arranged on the face with mould 102 laminatings and be respectively provided with the high temperature resistant adhesive tape 1012,1032 of one deck.
Step S2: LED packaging plastic film is carried out to light transmittance properties test and other quantitative measurements.
Wherein, in step S2, LED packaging plastic film being carried out to light transmittance properties test can complete by professional transmittance testing apparatus, also can be undertaken by a kind of test fixture, in simple mode, realizes.Consult shown in Fig. 2, this test fixture consists of base plate 201 and light conducting cylinder 202, base plate 201 is provided with a light source 2011, light conducting cylinder 202 is socketed on the light source 2011 of base plate 201, described LED packaging plastic film 4 is placed in the upper port 2021 of light conducting cylinder 202 again, the upper port 2021 of light conducting cylinder 202 and the light source 2011 of base plate 201 have fixed range, and the opening shape of the upper port 2021 of light conducting cylinder 202 is identical with the shape of the LED packaging plastic film 4 making in step S1, Deng large, thickness is film thickness, light source 2011 can be incandescent lamp, LED, the light source that Halogen lamp LED etc. are continuous spectrum at visible light wave range bright dipping spectrum, and abundant at visible light wave range spectral energy.Test time point bright light source 2011, the spectrum of light source 2011 while being placed with LED packaging plastic film 4 with the test of spectrum testing tool, remove after the LED packaging plastic film 4 of upper port 2021 of light conducting cylinder 202, again use the spectrum of spectrum testing tool testing light source 2011, by the spectrum change of front and back 2 secondary light sources, thereby converse the transmittance σ 1 of these LED packaging plastic film 4 each wavelength.
In step S2, LED packaging plastic film being carried out to other quantitative measurements can comprise: refraction index test, hardness test, pulling strengrth test, expansion coefficient test etc., as the refractive index by refractometer test LED packaging plastic film, hardness by sclerometer test film, by tautness meter, measure pulling strengrth, length growth rate, by dilatometer, measure film expansion coefficient parameter etc.Certain, different LED encapsulation manufacturers can reduce corresponding test event or increase other test events according to the factor of the performance at which side face of required investigation LED packaging plastic.
Step S3: LED packaging plastic film is irradiated to carry out luminous energy impact by light-emitting device.
Wherein, in step S3, by light-emitting device, LED packaging plastic film is irradiated to carry out luminous energy and impact and can complete by professional luminous energy impact device, also can be undertaken by a kind of shock-testing case, in simple and reliable mode, realize.
Preferred, the luminous energy of described step S3 is impacted and can under varying environment, be carried out, the more approaching actual situation about using of simulation meeting of impacting for the environmental aging of LED packaging plastic film.Consult shown in Fig. 3, this shock-testing case is to be separated out an environmental test cavity 302 and light source cavity 301 between at least in a shading casing 3, in environmental test cavity 302, be provided with environment change device, LED packaging plastic film 4 is placed in environmental test cavity 302, light source cavity 301 is provided with a visible ray generating means 3011, and by a set of optical transmission system by the light leaded light of visible ray generating means 3011 to environmental test cavity 302, the LED packaging plastic film 5 in environmental test cavity 302 is carried out to luminous energy impact.Optical transmission system in embodiment illustrated in fig. 3 is one group of catoptron 5, in fact can also by light transmission modes such as reflection, refraction, total reflections, be realized the light leaded light of visible ray generating means 3011 to environmental test cavity 302 is carried out to luminous energy impact to LED packaging plastic film 5 by prism system or Transmission Fibers.Preferably, in environmental test cavity 302 and by optical lens, change the modes such as light path, coating scattering allows light be uniformly distributed in whole cavity body simultaneously.
Preferably, described visible ray generating means 3011 can carry out the color of visible light source and the adjusting of brightness, can simulate different luminous energies impact by change Different Light.Described environment change device can carry out the adjusting of temperature and humidity, as adopt humidifier and dehumidifier to change humidity, adopt well heater and refrigerator to change temperature, can simulate the test experiments of LED packaging plastic under high temperature, low temperature, high low-temperature circulating, high/low-temperature impact, the constant environment such as damp and hot.
Step S4: the LED packaging plastic film after energy impact in step S3 is carried out to light transmittance properties test and other quantitative measurements again.
Wherein, test converses the transmittance σ 2 of each wavelength that LED packaging plastic film 4 is new, and other physical parameter, as refractive index, hardness, pulling strengrth, length growth rate examination, expansion coefficient etc.The mode of test and step S2's is identical, in this no longer repeat specification.
Step S5: the result through step S2 test and the result through step S4 test are compared and analyzed.Appearance change, physical dimension that observation and comparison luminous energy is tested front and back LED packaging plastic film change, compare transmittance σ 1 and σ 2 variable quantities, simultaneously can be by the refractive index of refractometer test film, parameters such as the hardness of sclerometer test film, tautness meter measurement pulling strengrth, length growth rate, dilatometer measurement film expansion coefficient.Before and after contrast experiment, the variation of parameters can be passed judgment on this LED packaging plastic weather resistance quality.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but those skilled in the art should be understood that; within not departing from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (9)
- The test evaluation method of 1.LED packaging plastic, is characterized in that, comprises the steps:Step S1, puts glue, solidify to form LED packaging plastic film, prepares LED packaging plastic film to be tested;Step S2, carries out light transmittance properties test and other quantitative measurements to LED packaging plastic film;Step S3, irradiates to carry out luminous energy impact by light-emitting device to LED packaging plastic film;Step S4, carries out light transmittance properties test and other quantitative measurements again by the LED packaging plastic film after energy impact in step S3;Step S5, compares the result through step S2 test and the result through step S4 test and analyze;Wherein, other quantitative measurements in step S2 and S4 comprise: one or more in refraction index test, hardness test, pulling strengrth test, expansion coefficient test.
- 2. the test evaluation method of LED packaging plastic according to claim 1, it is characterized in that: the some glue in described step S1, to solidify to form LED packaging plastic film be to be undertaken by auxiliary mould, this auxiliary mould by patrix, in mould and counterdie superpose and form successively, counterdie is a flat board, middle mould is provided with one or more die cavity holes that is used for forming film, and patrix is provided with one or more hole for injecting glue corresponding to the position of the die cavity holes of middle mould.
- 3. the test evaluation method of LED packaging plastic according to claim 2, is characterized in that: described upper die and lower die are arranged on the face of fitting with mould and are respectively provided with the high temperature resistant adhesive tape of one deck.
- 4. the test evaluation method of LED packaging plastic according to claim 1 and 2, is characterized in that: in described step S1, the condition of cure of LED packaging plastic film and the LED product condition of cure in encapsulation manufacturing process is in full accord.
- 5. the test evaluation method of LED packaging plastic according to claim 1, it is characterized in that: described step S2 and the test of the light transmittance properties in S4 are to be undertaken by test fixture, this test fixture consists of base plate and light conducting cylinder, base plate is provided with a light source, light conducting cylinder is socketed on the light source of base plate, and described LED packaging plastic film is placed in the upper port of light conducting cylinder again; Test time point bright light source, the spectrum of light source while being placed with LED packaging plastic film with the test of spectrum testing tool, remove after the LED packaging plastic film of light conducting cylinder upper port, again use the spectrum of spectrum testing tool testing light source, by the spectrum change of front and back 2 secondary light sources, thereby converse the transmittance of this each wavelength of LED packaging plastic film.
- 6. the test evaluation method of LED packaging plastic according to claim 1, is characterized in that: the luminous energy of described step S3 is impacted and carried out under varying environment.
- 7. the test evaluation method of LED packaging plastic according to claim 6, it is characterized in that: described step S3 under varying environment, to carry out that luminous energy impacts be to be undertaken by shock-testing case, this shock-testing case is to be separated out an environmental test cavity and light source cavity between at least in a shading casing, in environmental test cavity, be provided with environment change device, LED packaging plastic film is placed in environmental test cavity, light source cavity is provided with a visible ray generating means, and by a set of optical transmission system by the light leaded light of visible ray generating means to environmental test cavity, LED packaging plastic film in environmental test cavity is carried out to luminous energy impact.
- 8. the test evaluation method of LED packaging plastic according to claim 7, is characterized in that: described visible ray generating means can carry out the color of visible light source and the adjusting of brightness.
- 9. the test evaluation method of LED packaging plastic according to claim 7, is characterized in that: described environment change device can carry out the adjusting of temperature and humidity.
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| CN104849677A (en) * | 2014-02-17 | 2015-08-19 | 浙江云时代光电科技有限公司 | Method for testing service life of LED lamp |
| CN104384068B (en) * | 2014-11-03 | 2016-08-31 | 温岭市秀恩五金工具有限公司 | A kind of LED glue dispensing and packaging equipment of band position sensor and alarm |
| CN106525391A (en) * | 2015-09-11 | 2017-03-22 | 常州市武进区半导体照明应用技术研究院 | Accelerated aging system and transmissivity test method for optical component |
| CN105575842A (en) * | 2015-12-20 | 2016-05-11 | 合肥艾斯克光电科技有限责任公司 | Testing method for LED packaging adhesive |
| CN105642508A (en) * | 2015-12-20 | 2016-06-08 | 合肥艾斯克光电科技有限责任公司 | LED glue injecting and testing all-in-one machine |
| CN105424614B (en) * | 2015-12-20 | 2018-02-23 | 合肥艾斯克光电科技有限责任公司 | A kind of performance test methods of LED packaging plastics |
| CN106784367A (en) * | 2016-12-20 | 2017-05-31 | 杭州市质量技术监督检测院 | Integrated watertight OLED flat-plate light sources and preparation method thereof |
| CN108645370B (en) * | 2018-04-27 | 2020-09-11 | 厦门多彩光电子科技有限公司 | Method and device for verifying expansion coefficient of packaging adhesive |
| CN109655432A (en) * | 2018-11-29 | 2019-04-19 | 江西省晶瑞光电有限公司 | Transparent silica gel performance test methods |
| CN109596320B (en) * | 2018-11-29 | 2021-06-29 | 江西省晶能半导体有限公司 | Fluorescent membrane performance testing method and method for determining raw material ratio in fluorescent membrane |
| CN113418837A (en) * | 2021-06-10 | 2021-09-21 | 厦门多彩光电子科技有限公司 | Method for evaluating quality of ultraviolet LED packaging adhesive |
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| US5518689A (en) * | 1995-09-05 | 1996-05-21 | Bayer Corporation | Diffused light reflectance readhead |
| DE102010022631A1 (en) * | 2010-06-04 | 2011-12-08 | Siemens Aktiengesellschaft | Measuring device for spectroscopy, has light emitting diode for generating light for executing spectroscopy and detection unit for receiving light |
| CN102175624A (en) * | 2011-03-16 | 2011-09-07 | 上海大学 | Method for testing water vapor transmittance |
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Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: Xiamen Hualian electronic Limited by Share Ltd Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: Xiamen Hualian Electronics Co., Ltd. |