CN215500001U - Board card structure - Google Patents

Board card structure Download PDF

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Publication number
CN215500001U
CN215500001U CN202121988948.4U CN202121988948U CN215500001U CN 215500001 U CN215500001 U CN 215500001U CN 202121988948 U CN202121988948 U CN 202121988948U CN 215500001 U CN215500001 U CN 215500001U
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China
Prior art keywords
circuit board
radiator
fixing
bottom plate
heat sink
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Active
Application number
CN202121988948.4U
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Chinese (zh)
Inventor
樊小波
谢玥
李德冲
黄晨
奚立达
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Guangzhou Ximu Semiconductor Technology Co ltd
Original Assignee
Beijing Simm Computing Technology Co ltd
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Priority to CN202121988948.4U priority Critical patent/CN215500001U/en
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Publication of CN215500001U publication Critical patent/CN215500001U/en
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Abstract

The present disclosure provides a card structure. The board card structure comprises a bottom plate, a machine shell which covers the bottom plate and encloses an accommodating space, a circuit board, a radiator, a bottom plate support and at least one radiator fixing component which are contained in the accommodating space, wherein the radiator is positioned on one side of the bottom plate support, the circuit board is positioned on the other side of the bottom plate support, and the bottom plate support is connected with the radiator through the at least one radiator fixing component so as to relatively fix the radiator with the circuit board. The base plate support is arranged between the radiator and the circuit board, the base plate support is connected with the radiator through the radiator fixing assembly, so that the radiator is relatively fixed with the circuit board, the fixing mode is more stable, and the radiator has a good radiating effect.

Description

Board card structure
Technical Field
The utility model belongs to the technical field of computer equipment, concretely relates to board structure.
Background
At present, the mainboard is provided with a radiator, and the central processing unit, the circuit board and the like on the mainboard are radiated by the radiator, so that the relative fixing mode of the radiator and the circuit board is very important. At present, the mode that generally adopts in the trade is directly laminated fixedly with electron device and radiator, is about to compress tightly electron device on the radiator to in time discharge through the radiator with the produced heat of electron device, can make the radiator directly hug closely on the circuit board like this, and then lead to the beneath unable line of walking of radiator to and the radiating effect is relatively poor. Secondly, circuit board is relatively thin among present integrated circuit board structure, and is fragile can not stand the striking, but has avoided not receiving the striking or slight collision during the circuit board installation transportation, like this, through the fixed mode of other modes such as rivet or stitch with radiator and the direct laminating of circuit board, lead to radiator and the laminating of circuit board inseparable, drop easily to and the shock resistance of circuit board is relatively poor, lead to the circuit board to receive the impact very easily, can make the quality of circuit board receive the influence like this.
In view of the above problems, it is necessary to provide a new board card structure.
SUMMERY OF THE UTILITY MODEL
The present disclosure is directed to at least one of the problems of the prior art, and provides a card structure.
The utility model provides a board card structure, including the bottom plate, the lid is established just enclose into accommodating space's casing on the bottom plate, and accept in circuit board, radiator and bottom plate support and at least one radiator fixed component in accommodating space, the radiator is located one side of bottom plate support, the circuit board is located the opposite side of bottom plate support, and pass through at least one radiator fixed component will the bottom plate support with the radiator is connected, in order to incite somebody to action the radiator with circuit board relatively fixed.
In some embodiments, the bottom plate bracket, the circuit board and the bottom plate are provided at a first position with a heat sink fixing through hole corresponding to the heat sink fixing component, and the heat sink fixing component is inserted into the heat sink fixing through hole to fix the heat sink on the bottom plate bracket.
In some embodiments, the heat sink securing assembly includes a heat sink securing sleeve and a heat sink fastener; wherein the content of the first and second substances,
the first end of the radiator fixing sleeve is fixed on the radiator, the second end of the radiator fixing sleeve penetrates through the radiator fixing through hole, and the radiator fastener penetrates through the radiator fixing sleeve.
In some embodiments, the heat sink fixing assembly further comprises an elastic buffer member, the elastic buffer member is movably sleeved on the outer surface of the heat sink fastening member, one end of the elastic buffer member abuts against the top end of the heat sink fastening member, and the circuit board is clamped between the elastic buffer members.
In some embodiments, the bottom plate bracket is provided with two side walls along a length direction and two side walls along a length direction, the two side walls of the bottom plate bracket are respectively connected with the two side walls of the casing, so as to relatively fix the bottom plate bracket and the casing.
In some embodiments, a blocking piece is further disposed on one side of the bottom plate bracket, and the blocking piece and the bottom plate bracket are of an integral structure.
In some embodiments, an avoidance opening is formed in the bottom plate bracket at a position corresponding to the electronic component on the circuit board.
In some embodiments, the board structure further comprises a connector disposed on and electrically connected to the circuit board;
the side wall of the shell is provided with an avoiding socket allowing the connector to pass through.
In some embodiments, the board card structure further includes a housing bracket disposed on a side of the circuit board away from the bottom plate, and the housing bracket is connected to the bottom plate, the circuit board, and the housing, respectively.
In some embodiments, the chassis bracket includes a top wall abutting against the chassis, two bottom walls abutting against the circuit board and disposed at a distance, and two side walls connecting the two bottom walls and the top wall, respectively;
first fixing through holes are formed in the corresponding positions of the bottom wall, the circuit board and the bottom plate, so that the shell support is fixed with the circuit board and the bottom plate through first fixing pieces penetrating through the first fixing through holes; and the number of the first and second groups,
and second fixing through holes are formed in the corresponding positions of the side wall and the casing, so that the casing support is fixed with the casing through second fixing pieces penetrating through the second fixing through holes.
The base plate support is arranged between the radiator and the circuit board, the base plate support is connected with the radiator through the radiator fixing assembly, so that the radiator and the circuit board are relatively fixed, the fixing mode is more stable, and the radiator has a good radiating effect.
Drawings
Fig. 1 is an exploded view of a board card structure according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a base plate bracket, a housing bracket, and a circuit board according to another embodiment of the present disclosure;
FIG. 3 is a schematic view of a heat sink fixing assembly and a heat sink according to another embodiment of the disclosure;
fig. 4 is a cross-sectional view of a board card structure according to another embodiment of the present disclosure;
fig. 5 is a partial enlarged view of fig. 4 a of the present disclosure.
Detailed Description
For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of the disclosure.
In some descriptions of the present disclosure, unless otherwise expressly specified or limited, the terms "mounted," "connected," or "fixed" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect through an intermediate medium, whether internal to two elements or an interactive relationship between two elements. Also, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate an orientation or positional relationship based on that shown in the drawings, and are used only to indicate a relative positional relationship, which may also be changed accordingly when the absolute position of the object being described is changed.
As shown in fig. 1, the present disclosure provides a board card structure 100, which includes a bottom plate 110, a housing 120 covering the bottom plate 110 and enclosing an accommodation space, and a circuit board 130, a heat sink 140, a bottom plate bracket 150 and at least one heat sink fixing assembly 160 accommodated in the accommodation space, wherein the heat sink 140 is located on one side of the bottom plate bracket 150, the circuit board 130 is located on the other side of the bottom plate bracket 150, and the bottom plate bracket 150 is connected to the heat sink 140 through the at least one heat sink fixing assembly 160, so as to relatively fix the heat sink 140 and the circuit board 130.
The base plate support is arranged between the radiator and the circuit board, the base plate support is connected with the radiator through the radiator fixing assembly, so that the radiator and the circuit board are relatively fixed, the fixing mode is more stable, and the radiator has a good radiating effect.
It should be understood that the bottom plate bracket of this example is disposed between the circuit board and the heat sink, such that when at least one heat sink fixing component is used to connect the bottom plate bracket and the heat sink, at least one heat sink fixing through hole is disposed at a first position on the bottom plate bracket, the circuit board and the bottom plate, and the heat sink fixing component is inserted into the heat sink fixing through hole to relatively fixedly connect the heat sink, the bottom plate bracket, the circuit board and the bottom plate together.
It should be noted that, in this embodiment, the number and the positions of the heat sink fixing through holes and the heat sink fixing assemblies are not specifically limited, the number of the heat sink fixing through holes is plural, the plural heat sink fixing through holes are symmetrically arranged on the bottom plate, the circuit board and the bottom plate bracket, and correspondingly, the number of the heat sink fixing assemblies is plural and symmetrically distributed.
Illustratively, as shown in fig. 1, four heat sink fixing through holes 111 are provided at a first position of the base plate 110, four heat sink fixing through holes 131 are also provided at a corresponding first position of the circuit board 130, and four heat sink fixing through holes 151 are provided at a first position on the base plate holder 150. It should be understood that four heat sink fixing assemblies 160 are also disposed at the positions of the heat sink 140 corresponding to the heat sink fixing through holes, so as to fix the heat sink, the bottom plate bracket and the circuit board relatively by the heat sink fixing assemblies sequentially penetrating the heat sink fixing through holes.
Further, as shown in fig. 1 and fig. 2, the bottom plate bracket 150 is provided with two side walls along the length direction thereof on the side away from the circuit board 130, and two second fixing through holes 153 are further respectively provided on the two side walls of the bottom plate bracket 150. In addition, the two side walls of the housing 120 along the length direction thereof are respectively provided with the second fixing through holes 123, and the connecting assembly is inserted into the second fixing through holes 123 of the housing 120 and the second fixing through holes 153 of the bottom plate bracket 150, so that the two side walls of the bottom plate bracket 150 are respectively connected with the two side walls of the housing 120, so that the housing 120 is fixedly connected with the bottom plate bracket 150. In the main assembly process of the board card of this example, the base plate 110, the circuit board 130, the base plate bracket 150, and the heat sink 140 may be sequentially and fixedly assembled together by the heat sink fixing member 160 based on the corresponding relationship among the heat sink fixing through-holes 111 of the base plate 110, the heat sink fixing through-holes 131 of the circuit board 130, and the heat sink fixing through-holes 151 of the base plate bracket 150. The housing 120 is covered with the assembled structure, and both side walls of the housing 120 and both side walls of the bottom plate holder are fixed, respectively. By the structure, the bottom plate 110, the circuit board 130, the heat sink 140 and the casing 120 can be fixed with the bottom plate bracket 150, and the structure is simple and convenient for assembly.
Furthermore, as shown in fig. 2, at least one avoiding opening 154 is disposed on the bottom plate bracket 150 corresponding to the electronic component on the circuit board 130, and the avoiding opening 154 can allow the electronic component on the circuit board 130 to pass through and can also enable the heat sink to have a better heat dissipation effect on the electronic component on the circuit board.
In some embodiments, as shown in fig. 1-5, the heat sink securing assembly 160 includes a heat sink securing sleeve 161 and a heat sink fastener 162; the first end of the heat sink fixing sleeve 161 is welded in the mounting hole 141 of the heat sink 140, the second end of the heat sink fixing sleeve 161 is inserted into the heat sink fixing through hole 151 of the bottom plate bracket 150, the heat sink fixing through hole 131 of the circuit board 130, and the heat sink fixing through hole 111 of the bottom plate 110, and the heat sink fastener 162 is inserted into the heat sink fixing sleeve 161 to fix the heat sink 140 with the bottom plate bracket 150, the circuit board 130, and the bottom plate 110.
Further, in some embodiments, as shown in fig. 3 to 5, the heat sink fixing assembly 160 further includes an elastic buffer member 163, the elastic buffer member 163 is movably sleeved on an outer surface of the heat sink fastening member 162, when the heat sink 140 is fixed on the bottom plate bracket 150, one end of the elastic buffer member 163 abuts against a top end of the heat sink fastening member 162, the circuit board 130 is clamped between the elastic buffer members 163 to buffer a pressure applied to the circuit board 130, and the heat sink 140 can be fixed to the bottom plate bracket 150, the circuit board 130, and the bottom plate 110 more tightly based on an elastic force of the elastic buffer member 163.
It should be noted that the present embodiment is not limited to the type of the elastic buffer member, and the elastic buffer member may buffer the circuit board when the heat sink is fixed to the base bracket, for example, a spring, a sponge pad, or the like.
Specifically, the elastic buffer member of the embodiment adopts a spring, the radiator fixing sleeve adopts a stud, and the radiator fastener adopts a screw, so that the radiator is fixed by the screw and the stud in a threaded connection manner.
Specifically, as shown in fig. 1 to 5, when the heat sink, the bottom plate bracket, the circuit board, and the bottom plate are fixedly assembled, and the heat sink fastening member 162 is inserted into the threaded hole of the heat sink fixing sleeve 161, the elastic buffer member 163 gradually becomes a compression state, that is, deformation is generated based on pressing the elastic buffer member 163, and then a reaction force can be provided to the pressing force, so that the distance between the heat sink and the circuit board is closer, and the heat dissipation effect is better. When the heat sink 140 is completely fixed to the bottom bracket 150, that is, the bottom plate 110, the bottom bracket 150, the heat sink 140 and the circuit board 130 are relatively fixed, one end of the elastic buffer member 163 abuts against the top end of the heat sink fastening member 162, and the circuit board 130 is sandwiched between the elastic buffer members 163 to perform a pressure buffering function on the circuit board. That is to say, this example both can order about radiator and circuit board distance more closely through set up the elastic buffer piece at radiator fastener surface, can also guarantee the distance between radiator and the circuit board balanced to play fine cushioning effect when the circuit board receives pressure, avoid crushing the circuit board.
Further, in some embodiments, at least one bottom bracket fixing through hole is further disposed at the second position of the bottom plate, the circuit board and the bottom bracket, so as to fix the bottom bracket to the bottom plate through a bottom bracket fixing part penetrating through the bottom bracket fixing through hole.
It should be noted that, in this embodiment, the number and the positions of the bottom plate bracket fixing through holes are not specifically limited, the number of the bottom plate bracket fixing through holes is multiple, and the multiple bottom plate bracket fixing through holes are symmetrically arranged on the bottom plate, the circuit board and the bottom plate bracket.
Illustratively, as shown in fig. 1, four bottom plate bracket fixing through holes 112 are disposed at a second position of the bottom plate 110, four bottom plate bracket fixing through holes 132 are also disposed at a second position corresponding to the circuit board 130, and four bottom plate bracket fixing through holes 152 are disposed at a second position on the bottom plate bracket 150, so as to be sequentially inserted into the bottom plate bracket fixing through holes on the bottom plate, the bottom plate bracket and the circuit board for fixing through the bottom plate bracket fixing members.
It should be further noted that, in this embodiment, the first position and the second position are not specifically limited, for example, in some embodiments, the second position is located inside the first position. Of course, in other embodiments, the second position may be located outside of the first position.
In addition, in some embodiments, a side of the heat sink facing the circuit board is provided with a thermally conductive paste.
Further, as shown in fig. 1, the board card structure 100 further includes a connector 170, and the connector 170 is disposed on the circuit board 130 and electrically connected to the circuit board 130. Since the connector is fixed on the circuit board, the position of the plug is high, which results in difficult plugging, therefore, for the convenience of plugging the connector plug, the sidewall of the housing 120 is provided with an avoiding socket 121 for allowing the connector 170 to pass through.
Furthermore, as shown in fig. 1, the side wall of the housing 120 of the embodiment is further provided with at least one ventilation opening 122, and the partitions between the ventilation openings 122 are disposed in an inclined manner, so as to facilitate heat dissipation.
It should be noted that, because the chassis of this embodiment is provided with only one side wall along the width direction thereof for providing the avoidance socket and the vent on the side wall, as shown in fig. 1, a blocking piece 180 is further provided on one side of the bottom plate bracket, and the blocking piece 180 corresponds to the side wall of the chassis 120 provided with the vent 122, so as to form a complete board card structure when other components such as the bottom plate, the chassis and the like are encapsulated. Optionally, the blocking piece 180 is integrally formed with the base bracket 150.
In some embodiments, as shown in fig. 1, the board card structure 100 further includes a chassis support 190 disposed on a side of the circuit board 130 facing away from the base board, and the chassis support 190 is connected to the base board 110, the circuit board 130, and the chassis 120 respectively.
In some embodiments, as shown in fig. 1 and 2, the chassis bracket 190 includes a top wall abutting the chassis 120, two bottom walls abutting the circuit board 130 and disposed at a distance, and two side walls connecting the two bottom walls and the top wall, respectively. The corresponding positions of the bottom wall, the circuit board and the bottom plate are all provided with first fixing through holes to fix the casing bracket 190 with the circuit board 130 and the bottom plate 110 respectively through first fixing pieces arranged in the first fixing through holes in a penetrating manner.
Illustratively, as shown in fig. 1, two first fixing through holes 113 are symmetrically disposed at a third position of the bottom plate 110, two first fixing through holes 133 are also disposed at a corresponding third position of the circuit board 130, and two first fixing through holes 191 are respectively disposed on two bottom walls of the chassis bracket 190, so as to sequentially penetrate through the first fixing through holes through a first fixing member to fix the chassis bracket 190 with the circuit board 130 and the bottom plate 110, respectively.
In addition, the corresponding positions of the side wall of the casing bracket 190 and the casing 120 are both provided with second fixing through holes, so that the casing bracket 190 and the casing 120 are fixed by the second fixing pieces penetrating through the second fixing through holes.
For example, as shown in fig. 1, two side walls of the chassis bracket 190 are respectively provided with a second fixing through hole 192, and two side walls of the chassis 120 along the length direction thereof are respectively provided with a second fixing through hole 123, so that the second fixing member is inserted into each second fixing through hole to fixedly connect the chassis 120 and the chassis bracket 190.
It should be noted that, the bottom plate bracket and the casing bracket of this embodiment are both located between the circuit board and the casing, and play a certain supporting role for the circuit board and the casing, and fix one end of the heat sink, the circuit board and the bottom plate through the bottom plate bracket, and fix the other end of the bottom plate and the circuit board through the casing bracket, and further fixedly connect with the casing side wall through the side walls of the bottom plate bracket and the casing bracket, respectively.
It should be further noted that, in this embodiment, the types of the first fixing element, the second fixing element, and the bottom bracket fixing element are not specifically limited, and those skilled in the art can select the fixing elements according to actual needs, for example, fixing elements such as studs, screws, rivets, and the like.
It should be noted that, based on the above structure, the main assembly process of the board card of the present example is as follows, as shown in conjunction with fig. 1 to 5, through the heat sink fixing assembly 160 passing through the heat sink fixing through holes on the base plate bracket 150, the circuit board 130 and the base plate 110 at the first position, to relatively fix the heat sink 140, the board bracket 150, the circuit board 130, and the base plate 110, and thereafter, the bottom plate bracket fixing piece is arranged in the bottom plate bracket fixing through hole on the second position of the bottom plate 110, the bottom plate bracket 150 and the circuit board 130 in a penetrating way, so as to relatively fix the bottom plate bracket 150, the bottom plate 110 and the circuit board 130, and then cover the circuit board 130, the heat sink 140, the bottom plate bracket 150 and the bottom plate 110 on the housing 120, the circuit board 130 and the bottom plate 110 are relatively fixed by the chassis bracket 190, and the chassis bracket 190 and the bottom plate bracket 150 are also fixed to the chassis 120, respectively. Further, the base plate 110 and the housing 120 enclose an accommodating space in which the circuit board 130, the heat sink 140, the base plate bracket 150, and the at least one heat sink fixing member 160, etc. are disposed.
Compared with the prior art, the board card structure has the following beneficial effects:
first, be provided with the bottom plate support between radiator and circuit board, wear to establish the radiator through radiator fixed subassembly and fix the radiator on the bottom plate support with radiator fixed through-hole to relatively fixed radiator and circuit board, this fixed mode is more firm, has fine radiating effect.
Second, the fixed subassembly of radiator includes elastic buffer, can make circuit board and radiator distance more press close to through elastic buffer, and the radiating effect is better to and can guarantee that circuit board atress is balanced and avoid receiving the impact and crushing.
Thirdly, an avoiding socket is arranged on the shell so as to facilitate the plugging and unplugging of the connector.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.

Claims (10)

1. The utility model provides a board card structure, its characterized in that includes the bottom plate, covers to establish on the bottom plate and enclose into accommodating space's casing, and accept in circuit board, radiator, bottom plate support and at least one radiator fixed subassembly in accommodating space, the radiator is located one side of bottom plate support, the circuit board is located the opposite side of bottom plate support, through at least one radiator fixed subassembly will the bottom plate support with the radiator is connected, with will the radiator with circuit board relatively fixed.
2. The board card structure of claim 1, wherein the bottom board bracket, the circuit board and the bottom board are each provided at a first position with a heat sink fixing through hole corresponding to the heat sink fixing component, and the heat sink fixing component is inserted into the heat sink fixing through hole to fix the heat sink on the bottom board bracket.
3. The board structure of claim 2, wherein the heat sink securing assembly includes a heat sink securing sleeve and a heat sink fastener; wherein the content of the first and second substances,
the first end of the radiator fixing sleeve is fixed on the radiator, the second end of the radiator fixing sleeve penetrates through the radiator fixing through hole, and the radiator fastener penetrates through the radiator fixing sleeve.
4. A board card structure as claimed in claim 3, wherein the heat sink fixing assembly further comprises an elastic buffer member, the elastic buffer member is movably sleeved on the outer surface of the heat sink fastener, one end of the elastic buffer member abuts against the top end of the heat sink fastener, and the circuit board is clamped between the elastic buffer members.
5. A board card structure according to any one of claims 1 to 4, wherein the bottom board support is provided with two side walls along the length direction on a side facing away from the circuit board, and two side walls along the length direction of the housing, and the two side walls of the bottom board support are respectively connected with the two side walls of the housing so as to relatively fix the bottom board support and the housing.
6. A board card structure according to any one of claims 1 to 4, characterized in that a blocking piece is further provided on one side of the bottom board bracket, and the blocking piece and the bottom board bracket are of an integral structure.
7. A board card structure according to any one of claims 1 to 4, wherein an escape opening is provided in the bottom board support at a position corresponding to an electronic component on the circuit board.
8. The board structure according to any one of claims 1 to 4, characterized in that it further comprises a connector arranged on and electrically connected to the circuit board;
the side wall of the shell is provided with an avoiding socket allowing the connector to pass through.
9. A card construction according to any of claims 1-4, characterized in that the card construction further comprises a housing support arranged on a side of the circuit board facing away from the base plate, the housing support being connected to the base plate, the circuit board and the housing, respectively.
10. The board card structure according to claim 9, wherein the housing bracket includes a top wall abutting against the housing, two bottom walls abutting against the circuit board and disposed at a distance, and two side walls connecting the two bottom walls and the top wall, respectively;
first fixing through holes are formed in the corresponding positions of the bottom wall, the circuit board and the bottom plate, so that the shell support is fixed with the circuit board and the bottom plate through first fixing pieces penetrating through the first fixing through holes; and the number of the first and second groups,
and second fixing through holes are formed in the corresponding positions of the side wall and the casing, so that the casing support is fixed with the casing through second fixing pieces penetrating through the second fixing through holes.
CN202121988948.4U 2021-08-23 2021-08-23 Board card structure Active CN215500001U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121988948.4U CN215500001U (en) 2021-08-23 2021-08-23 Board card structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121988948.4U CN215500001U (en) 2021-08-23 2021-08-23 Board card structure

Publications (1)

Publication Number Publication Date
CN215500001U true CN215500001U (en) 2022-01-11

Family

ID=79764363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121988948.4U Active CN215500001U (en) 2021-08-23 2021-08-23 Board card structure

Country Status (1)

Country Link
CN (1) CN215500001U (en)

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Address after: Room 201, No. 6 Fengtong Heng Street, Huangpu District, Guangzhou City, Guangdong Province, 510799

Patentee after: Guangzhou Ximu Semiconductor Technology Co.,Ltd.

Country or region after: China

Address before: 100020 801, 802, 803, 808, 8th floor, building 5, courtyard 5, Laiguangying West Road, Chaoyang District, Beijing

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