CN217787706U - Memory bank and BMC card reinforcing assembly - Google Patents

Abstract

The utility model provides a subassembly is consolidated with BMC card to memory bank, include and fix the mount on the mainboard through the connecting piece, have the insulation board through rivet connection on the mount, the one side of insulation board is equipped with the blotter, and the blotter can laminate on memory bank or BMC card when the equipment, when the equipment the mount centers on trilateral of memory bank or BMC card at least. The utility model realizes the reinforcement of the memory bank and the BMC, is easy to be disassembled and assembled, is convenient to maintain the memory bank and the BMC card, and has the damping function; the fixing frame is fixed on the mainboard through the connecting piece, and the fixing frame and the memory bank or the BMC card can be detached by detaching the connecting piece; the fixing frame is separated from the memory bank or the BMC card through the insulating plate, the buffer performance after reinforcement is enhanced under the action of the buffer cushion, and the memory bank or the BMC card is prevented from being damaged due to short circuit.

Description

Memory bank and BMC card reinforcing assembly

Technical Field

The utility model relates to a computer memory strip and BMC card equipment technical field, concretely relates to subassembly is consolidated to memory strip and BMC card.

Background

Nationwide production of servers is a requirement of the times, and is a necessary trend of the times, and the structure of reinforcing the servers is also produced and continuously updated. In many configurations of the ruggedized server, the memory bank and the BMC card are typically consolidated in a board-mounted customized manner, i.e., the memory bank and the BMC card are directly fixed to the motherboard. When BMC or memory bank are out of order, the mainboard needs to be removed for rework or replaced, so that the user can not maintain the mainboard by himself and needs to go to the original factory for maintenance after sale, and the BMC or memory bank is high in maintenance cost, troublesome to operate and inconvenient to maintain quickly. The memory and BMC cards are made of common materials, shock resistance and reinforcement are achieved, quick disassembly and assembly and maintenance are achieved, and the maintenance time is reduced, so that the memory and BMC cards are the goals pursued by designers.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: when the BMC or the memory bank has a fault, a user cannot maintain the memory bank, and the memory bank and the BMC card are high in maintenance cost and inconvenient to go to an original factory and go after sale. In order to solve the problems, the memory bank and BMC card reinforcing assembly is provided, and when the memory bank and the BMC card of a server are reinforced on a mainboard, the assembly and disassembly are convenient, and the maintenance is easy.

The utility model provides an above-mentioned technical problem's technical scheme as follows:

the utility model provides a subassembly is consolidated with BMC card to memory bank, include to fix the mount on the mainboard through the connecting piece, be connected with the insulation board on the mount, the one side of insulation board is equipped with the blotter, and the blotter can laminate on memory bank or BMC card when the equipment, when the equipment the mount centers on trilateral of memory bank or BMC card at least.

The beneficial effects of the utility model reside in that: the utility model realizes the reinforcement of the memory bank and the BMC, is easy to be disassembled and assembled, is convenient to maintain the memory bank and the BMC card, and has the damping function; the fixing frame is fixed on the mainboard through the connecting piece, and the fixing frame and the memory bank or the BMC card can be detached by detaching the connecting piece; the fixing frame is separated from the memory bank or the BMC card through the insulating plate, the buffer performance after reinforcement is enhanced under the action of the buffer cushion, and the memory bank or the BMC card is prevented from being damaged due to short circuit.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Furthermore, the fixing frame comprises a rectangular fixing plate, two short edges of the fixing plate are provided with side ear plates which extend towards the same direction and are perpendicular to the fixing plate, one long edge of the fixing plate is provided with a mounting plate which extends opposite to the side ear plates, the mounting plate is used for assembling a connecting piece, the other long edge of the fixing plate is provided with a back plate which extends towards the same direction as the side ear plates, and the back plate is connected with the insulating plate through rivets.

The beneficial effect of adopting this further scheme lies in: simple structure and convenient assembly and disassembly.

Furthermore, the two mounting plates are respectively close to one side ear plate.

The beneficial effect of adopting this further scheme lies in: reduce the area covered to the mainboard, and the atress of mount is even, and stability is good.

Further, the mounting plate is L-shaped.

The beneficial effect of adopting this further scheme lies in: a gap is formed between the two mounting plates, so that ventilation and heat dissipation of the space where the memory bank or the BMC card is located are facilitated.

Furthermore, two ends of the back plate respectively extend beyond the side ear plates, a gap for accommodating the insulating plate is formed between the back plate and the side ear plates, and the part of the back plate extending beyond the side ear plates is connected with the insulating plate through rivets.

The beneficial effect of adopting this further scheme lies in: the gap between the back plate and the side ear plate can assist in fixing the insulating plate, reliability is improved, and service life is long.

Furthermore, the extending end of the side ear plate is also provided with a bending part deviating from the direction of the fixed plate, and the bending part and the side ear plate form an obtuse angle.

The beneficial effect of adopting this further scheme lies in: the side ear plates are used for restricting the opening of the locking elastic sheet of the memory bank or the BMC card, and the bending parts are arranged for being easily transited to the locking elastic sheet of the memory bank or the BMC card during assembly without generating structural interference. The locking shell fragment is the inherent structure that is used for locking memory strip or BMC card on the connector, if the connector that actually adopts does not have the locking shell fragment structure, then this setting does not produce the effect, but does not cause harmful effects.

Furthermore, an extension part perpendicular to the insulating plate is further arranged on one long edge of the insulating plate, and the extension part and the insulating plate are integrated.

The beneficial effect of adopting this further scheme lies in: in one embodiment, the extension portion is located on a long side of the insulating plate close to the fixing plate, and the extension portion is attached to the fixing plate and used for limiting the memory bank or the BMC card to move towards the direction of pulling out the connector, so that static electricity can be avoided, and meanwhile, the connection reliability of the fixing frame and the insulating plate is enhanced.

Further, the insulating plate is a transparent PC plate.

The beneficial effect of adopting this further scheme lies in: the sense of conciseness is visually observed.

Further, the connector comprises a release screw.

The beneficial effect of adopting this further scheme lies in: the pressure to the mainboard is small, and the connection is reliable.

The memory bank is an SO-DIMM memory card.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an exploded view of the present invention.

Fig. 3 is a schematic structural diagram of the assembly of the present invention on the main board.

Fig. 4 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 3.

Fig. 5 is a detailed view of part B of fig. 3.

In the drawings, the technical features represented by the respective reference numerals are as follows:

1, fixing a frame; 2-an insulating plate; 3-a buffer pad; 4-riveting; 5-a connector; 6, a main board; 7-memory bank or BMC card; 8, fixing a plate; 9-side ear plate; 10-mounting a plate; 11-a back plate; 12-an extension; 13-a bending part.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

The utility model is shown in figures 1-5.

Embodiment one, as shown in fig. 1-4:

the utility model provides a subassembly is consolidated with BMC card to memory bank, include and fix mount 1 on mainboard 6 through connecting piece 5, be connected with insulation board 2 through rivet 4 on the mount 1, the one side of insulation board 2 is equipped with blotter 3, and blotter 3 can laminate on memory bank or BMC card 7 when the equipment, when the equipment mount 1 centers on trilateral of memory bank or BMC card 7 at least.

The principle is as follows: in order to ensure that the fixing frame 1 and the insulating plate 2 have reinforcement reliability, the fixing frame 1 and the insulating plate 2 need to be riveted mechanically; during assembly, the insulating plate 2 is arranged between the fixing frame 1 made of metal and the memory bar or BMC card 7, and the metal plate is prevented from directly contacting the memory bar or BMC card 7, so that the memory bar or BMC card 7 is prevented from being damaged due to short circuit. The assembly process includes the following steps (see cross-sectional view 4): (1) The front end of the fixing frame 1 restricts the memory bank or BMC card 7 to move forwards (the reverse direction of inserting the memory bank or BMC card 7 into the connector is the front direction). (2) The top shock absorbing bumper 3 restrains the memory stick or BMC card 7 from moving upward and effectively absorbs shock. (3) The left side and the right side of the fixing frame 1 surround the other two sides of the memory bank or the BMC card 7, and the locking elastic sheet of the memory bank or the BMC card 7 is effectively restrained from opening (see a locally enlarged view figure 5). The BMC card executes a server remote Management controller, and is a Baseboard Management controller. The shape and the insertion mode of the memory bank are the same as those of the memory bank.

Adopt the beneficial effects of the utility model reside in that: the utility model realizes the reinforcement of the memory bank and the BMC, is easy to be disassembled and assembled, is convenient to maintain the memory bank and the BMC card, and has the damping function; the fixed frame 1 is fixed on the mainboard 6 through the connecting piece 5, and the fixed frame 1 and the memory bank or BMC card 7 can be detached by detaching the connecting piece 5; the fixing frame 1 is separated from the memory bank or the BMC card 7 through the insulating plate 2, and the buffer cushion 3 has the advantages that the buffer resistance after reinforcement is enhanced, and the memory bank or the BMC card 7 is prevented from being damaged due to short circuit.

Example two, as shown in fig. 1-5:

in the above embodiment, further, the fixing frame 1 includes a rectangular fixing plate 8, two short sides of the fixing plate 8 are provided with side ear plates 9 extending in the same direction and perpendicular to the fixing plate 8, one long side of the fixing plate 8 is provided with a mounting plate 10 extending in the opposite direction to the side ear plates 9, the mounting plate 10 is used for assembling the connecting member 5, the other long side of the fixing plate 8 is provided with a back plate 11 extending in the same direction as the side ear plates 9, and the back plate 11 is connected with the insulating plate 2 through a rivet 4.

The principle is as follows: the insulating plate 2 is arranged on the inner side of the back plate 11 and is used for pressing the memory bank or the BMC card 7; the fixed plate 8 and the ear plates 9 on the two sides surround the three sides of the memory bank or the BMC card 7 and limit the memory bank or the BMC card to slide; the mounting plate 10 is intended to be fixed to the main board 6.

The beneficial effect of adopting this further scheme lies in: simple structure, easy dismounting.

Further, the mounting plates 10 are two and are respectively adjacent to one side ear plate 9.

The beneficial effect of adopting this further scheme lies in: reduce the area of coverage to mainboard 6, and the atress of mount 1 is even, and stability is good.

Further, the mounting plate 10 is L-shaped.

The beneficial effect of adopting this further scheme lies in: a gap is formed between the two mounting plates 10, so that ventilation and heat dissipation of the space where the memory bank or the BMC card 7 is located are facilitated.

Furthermore, two ends of the back plate 11 respectively extend beyond the side ear plates 9, a gap for accommodating the insulating plate 2 is formed between the back plate 11 and the side ear plates 9, and the part of the back plate 11 extending beyond the side ear plates 9 is connected with the insulating plate 2 through rivets 4.

The beneficial effect of adopting this further scheme lies in: the gap between the back plate 11 and the side ear plate 9 can assist in fixing the insulating plate 2, so that the reliability is improved, and the service life is long.

Furthermore, the protruding end of the side ear plate 9 is further provided with a bent part 13 deviating from the direction of the fixing plate 8, and the bent part 13 forms an obtuse angle with the side ear plate 9.

The beneficial effect of adopting this further scheme lies in: the side ear plates 9 are used for restricting the locking elastic sheet of the memory bank or the BMC card 7 to be opened, and the bending parts 13 are arranged for being easily transited to the locking elastic sheet of the memory bank or the BMC card 7 during assembly without generating structural interference. The locking shell fragment is the inherent structure that is used for locking memory strip or BMC card 7 on the connector, if the connector that actually adopts does not have the locking shell fragment structure, then this setting does not produce the effect, but does not cause harmful effects.

Furthermore, an extension part 12 perpendicular to the insulating plate 2 is further disposed on one long side of the insulating plate 2, and the extension part 12 and the insulating plate 2 are integrated.

The beneficial effect of adopting this further scheme lies in: in one embodiment, the extension portion 12 is located on a long side of the insulating plate 2 close to the fixing plate 8, and the extension portion 12 is attached to the fixing plate 8 for limiting the memory bank or the BMC card 7 from moving toward the direction of the unplugged connector, so as to avoid static electricity generation and enhance the connection reliability of the fixing frame 1 and the insulating plate 2.

Further, the insulating plate 2 is a transparent PC board.

The beneficial effect of adopting this further scheme lies in: the sense of conciseness is visually observed.

Further, the connecting member 5 is a captive screw.

The beneficial effect of adopting this further scheme lies in: the pressure to the mainboard 6 is small, and the connection is reliable.

Further, the memory bank is an SO-DIMM memory card.

In the description of the present invention, it is to be understood that if descriptive terms indicating orientation, direction, or positional relationship appear, for example: "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, the positional or positional relationships indicated in this specification are based on the positional or positional relationships shown in the drawings, and are only for convenience of understanding the invention and to simplify the description, and do not indicate or imply that the parts, elements, or the whole referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Additionally, if ordinal descriptive terms appear, for example: the use of "first", "second", etc. in this specification is for ease of understanding or to simplify the description, e.g., to distinguish between technical features of the same type or function and which have to be mentioned separately, where the specification may distinguish between terms in a prefix or suffix order. Therefore, it is not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

In the present invention, if structural relative action relation description terms are used, for example: "mounted," "connected," "secured," and the like are to be construed broadly unless expressly stated or limited otherwise. For example, "mounted," "connected," and the like, may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and can be communicated with each other inside the two components or in an interaction relationship of the two components; the fixation can be integrated fixation or can be detachably fixed by a fastener; the fixing can be direct or through an intermediate medium. The meaning of the above description terms in the present invention can be understood by those skilled in the art according to the specific situation, the present context, the text continuity before and after, and the like.

In the present application, if a descriptive phrase containing an attached or connected meaning is presented, for example, a first feature is "on" or "under" a second feature unless explicitly stated or limited otherwise, it should not be read restrictively, for example, "on" or "under" may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediate medium. The meaning of the above description terms in the present invention can be understood by those skilled in the art according to the specific situation, the present context, the text continuity before and after, and the like.

Further, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments, examples, and features of the various embodiments, examples described in this specification can be combined and combined by one skilled in the art without contradiction, and such combinations or combinations are intended to be included within the scope of the present disclosure.

While embodiments of the present invention have been shown and described, it is understood that they are exemplary and not intended to limit the invention, and that various changes, modifications, substitutions and alterations can be made herein by those skilled in the art, given the benefit of the teachings herein, without departing from the scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a subassembly is consolidated with BMC card to memory bank which characterized in that: including fixing mount (1) on mainboard (6) through connecting piece (5), be connected with insulation board (2) on mount (1), the one side of insulation board (2) is equipped with blotter (3), and blotter (3) can laminate on memory strip or BMC card (7) when the equipment, when the equipment mount (1) is at least around the trilateral of memory strip or BMC card (7).

2. The memory bank and BMC card reinforcement assembly of claim 1, wherein: the utility model discloses a fixing structure, including fixed plate (8) of rectangle, two minor faces of fixed plate (8) are equipped with to stretch out and with fixed plate (8) vertically side otic placode (9) in same direction, a long limit of fixed plate (8) is equipped with mounting panel (10) that stretch out with side otic placode (9) opposite direction, mounting panel (10) are used for assembly connecting piece (5), another long limit of fixed plate (8) is equipped with backplate (11) that stretch out with side otic placode (9) same direction, backplate (11) are connected with insulation board (2).

3. The memory bank and BMC card reinforcement assembly of claim 2, wherein: the number of the mounting plates (10) is two, and the mounting plates are respectively close to one side ear plate (9).

4. The memory bank and BMC card reinforcing assembly of claim 2, wherein: the mounting plate (10) is L-shaped.

5. The memory bank and BMC card reinforcement assembly of claim 2, wherein: the two ends of the back plate (11) extend beyond the side ear plates (9) respectively, a gap for accommodating the insulating plate (2) is formed between the back plate (11) and the side ear plates (9), and the part of the back plate (11) extending beyond the side ear plates (9) is connected with the insulating plate (2).

6. The memory bank and BMC card reinforcement assembly of claim 2, wherein: the extending end of the side ear plate (9) is also provided with a bending part (13) deviating from the direction of the fixing plate (8), and the bending part (13) and the side ear plate (9) form an obtuse angle.

7. The memory bank and BMC card reinforcement assembly of claim 1, wherein: an extension part (12) perpendicular to the insulating plate (2) is further arranged on one long edge of the insulating plate (2), and the extension part (12) and the insulating plate (2) are integrated.

8. The memory bank and BMC card reinforcement assembly of claim 1, wherein: the insulating plate (2) is a transparent PC plate.

9. The memory bank and BMC card reinforcement assembly of claim 1, wherein: the connecting piece (5) comprises a release screw.

10. The memory bank and BMC card reinforcement assembly of claim 1, wherein: the insulating plate (2) is connected to the fixing frame (1) through rivets.

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