CN215499766U

CN215499766U - Gold wire stamping carrier for circuit board

Info

Publication number: CN215499766U
Application number: CN202120968464.7U
Authority: CN
Inventors: 王一田; 顾慎皓; 汪明敏
Original assignee: Stark Hearing Technology Suzhou Co ltd
Current assignee: Stark Hearing Technology Suzhou Co ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2022-01-11
Anticipated expiration: 2031-05-08

Abstract

The utility model discloses a gold wire stamping carrier for a circuit board, which comprises a substrate and a bearing plate arranged in the substrate; the substrate is provided with a plurality of through holes; the loading board is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the through holes. The bearing plate has the advantages of smooth surface and high hardness, and the circuit board can be tightly and smoothly adsorbed on the bearing plate without bending deformation during gold thread bonding.

Description

Gold wire stamping carrier for circuit board

Technical Field

The utility model relates to the technical field of circuit board gold-plating wires, in particular to a circuit board gold-plating wire carrier.

Background

Before the gold thread is applied to the circuit board, the circuit board is fixed on a carrier, the carrier is placed in a wire bonding machine, and the gold thread is applied to the circuit board by the wire bonding machine.

The conventional carrier is a flat plate made of a resin material, and a circuit board is fixed on the flat plate by an adhesive tape. The carrier is made of resin materials, so that the carrier is not high in hardness and large in brittleness, and the carrier and the circuit board are easy to deform or break due to large impact force in the process of gold wire drilling; meanwhile, the resin carrier is easy to deform, the circuit board is not tightly attached to the carrier, dislocation is easy to occur during gold wire bonding, and the reject ratio is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit board gold wire bonding carrier aiming at the defects in the prior art, so that the hardness of a bearing plate is improved, and the circuit board and the carrier are attached smoothly.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:

a circuit board gold wire plating carrier comprises a substrate and a bearing plate arranged in the substrate; the substrate is provided with a plurality of through holes; the loading board is provided with a plurality of adsorption holes, and the adsorption holes are communicated with the through holes.

Further, the substrate is formed with a groove for accommodating the carrier plate.

Further, the through holes are distributed in the range of the groove.

Furthermore, the substrate is provided with connecting holes, and the connecting holes are distributed at corners of the substrate.

Further, the base plate is provided with a finger hole, and the finger hole is formed in the edge of the groove.

Further, the substrate is made of a resin material.

Further, the bearing plate is made of a ceramic material.

Compared with the prior art, the utility model has the advantages that: the circuit board gold wire bonding carrier comprises a substrate and a bearing plate, wherein the substrate is provided with a through hole, and the bearing plate is provided with an adsorption hole communicated with the through hole.

Drawings

FIG. 1 is a schematic view of a circuit board mounted on a carrier for bonding gold wires;

FIG. 2 is a schematic diagram of a substrate of the gold wire carrier for circuit board of the present invention;

FIG. 3 is a schematic view of a carrier plate of the gold wire bonding carrier for circuit boards according to the present invention.

Detailed Description

The following non-limiting detailed description of the present invention is provided in connection with the preferred embodiments and accompanying drawings. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length h", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

As shown in fig. 1, a carrier for bonding gold wires on a circuit board according to an embodiment of the present invention includes a substrate 1 and a carrier 2 disposed in the substrate 1.

As shown in fig. 2, the substrate 1 is a flat plate made of a resin material, a groove 10 for accommodating the carrier plate 2 is formed on one plane of the substrate 1, and the groove 10 is a depression of the one plane of the substrate 1 to the back surface thereof, which does not penetrate the substrate 1 in the thickness direction of the substrate 1. The recess 10 may be rectangular, circular or other shape. The substrate 1 is further provided with a plurality of through holes 11 distributed within the extent of the recess 10. The base plate 1 is provided with a finger hole 13, and the finger hole 13 is arranged at the edge of the groove 10 so as to facilitate the taking and placing of the bearing plate 2. Connection holes 12 are further formed at four corners of the substrate 1 to fix the substrate 1.

As shown in fig. 3, the carrier plate 2 is a flat plate made of a ceramic material and has a shape corresponding to the shape of the recess 10 of the substrate 1. The carrier plate 2 is configured with a plurality of adsorption holes 20, and the adsorption holes 20 penetrate through the carrier plate 2 in the thickness direction of the carrier plate 2. The adsorption holes 20 communicate with the through-holes 11 of the substrate 1 so that an adsorption air flow can pass through the through-holes 11 and the adsorption holes 20 to adsorb the circuit board 3 on the loading plate 2. In the process of gold wire punching of the circuit board 3, the bearing plate 2 is made of ceramic materials, so that the bearing plate 2 is high in rigidity and hardness and not easy to deform or break due to impact, meanwhile, the surface of the bearing plate 2 is flat, the circuit board 3 can be closely and flatly adsorbed on the bearing plate 2, the circuit board is not easy to deform in the process of gold wire punching, and the accurate position of a needle head can be ensured; and, ceramic loading board 2's heat conduction is effectual, can heat conduction fast, can effectively prevent the circuit board deformation that is heated.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a circuit board gold wire carrier which characterized in that:

comprises a substrate (1) and a bearing plate (2) arranged in the substrate (1);

the substrate (1) is provided with a plurality of through holes (11);

the bearing plate (2) is provided with a plurality of adsorption holes (20), and the adsorption holes (20) are communicated with the through holes (11).

2. The circuit board gold wire plating carrier of claim 1, characterized in that:

the base plate (1) is formed with a recess (10) that accommodates the carrier plate (2).

3. The circuit board gold wire plating carrier of claim 2, characterized in that:

the through holes (11) are distributed in the range of the groove (10).

4. The circuit board gold wire plating carrier of claim 1, characterized in that:

the base plate (1) is provided with connecting holes (12), and the connecting holes (12) are distributed at the corners of the base plate (1).

5. The circuit board gold wire plating carrier of claim 2, characterized in that:

the base plate (1) is provided with a finger hole (13), and the finger hole (13) is formed in the edge of the groove (10).

6. The circuit board gold wire plating carrier of claim 1, characterized in that:

the substrate (1) is made of a resin material.

7. The circuit board gold wire carrier of claim 1 or 6, characterized in that:

the bearing plate (2) is made of a ceramic material.