CN210986615U - Wave-soldering plug-in components fixing device - Google Patents
Wave-soldering plug-in components fixing device Download PDFInfo
- Publication number
- CN210986615U CN210986615U CN201921941321.6U CN201921941321U CN210986615U CN 210986615 U CN210986615 U CN 210986615U CN 201921941321 U CN201921941321 U CN 201921941321U CN 210986615 U CN210986615 U CN 210986615U
- Authority
- CN
- China
- Prior art keywords
- electronic component
- type electronic
- fixing device
- heat dissipation
- needle type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a wave-soldering plug-in components fixing device, at least, including printed circuit board, the last needle type electronic component group that is provided with of printed circuit board, needle type electronic component group includes a plurality of needle type electronic component, needle type electronic component includes base and contact pin, needle type electronic component group's top is detained and is equipped with the fixing device body, the fixing device body is at least including netted heat dissipation frame, it is equipped with the fin to glue on the heat dissipation frame, the inside of heat dissipation frame is provided with the length that first fixed slot and first fixed slot are less than the length of base, the top of first fixed slot is provided with a plurality ofly and the contact pin is less than the length of second fixed slot for the second fixed slot of. The utility model discloses a fixing device body with netted heat dissipation frame to be provided with the fin on the heat dissipation frame, thereby the effectual heat that conducts for the contact pin that has reduced is provided with the second fixed slot for the cooperation structure with the contact pin simultaneously, thereby further avoid the contact pin phenomenons such as floating height, crooked to appear.
Description
Technical Field
The utility model relates to an insert fixing device specifically is wave-soldering insert fixing device.
Background
Wave soldering is the soldering process in which the soldering surface of a plug-in board is directly contacted with high-temperature liquid tin to achieve the purpose of soldering, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device, so the wave soldering is called as wave soldering, and the main material of the wave soldering is a soldering tin bar.
As known to those skilled in the art, pin electronics generally include two parts, an insulator base and a pin. The base is overmolded or otherwise secured to the pins leaving longer functional portions and shorter solder portions on the pins, the functional portions being connected to the corresponding socket members and the shorter solder portions being soldered to the printed circuit board assembly. Typically, pin electronics are arranged in rows, each row including, for example, 1-4 or more pins, which are connected together by an integral base but are insulated from each other.
Before wave soldering, a row of pin-type electronic component soldering parts are inserted into corresponding pad holes on the printed circuit board assembly, a part of the soldering parts are exposed from the opposite side of the printed circuit board assembly, and after wave soldering, the soldering parts are soldered with pads on the printed circuit board assembly. Since the base of the pin-type electronic component is generally made of a plastic or resin material, high temperature resistance is relatively poor. In the wave soldering process, the contact pin conducts the heat of the soldering tin pool and is heated, so that the contact pin is easy to have the defects of floating height, deflection and the like. Aiming at the problems, the invention designs a wave-soldering plug-in fixing device for preventing a contact pin from being inclined in the wave-soldering process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wave-soldering plug-in components fixing device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the wave-soldering plug-in fixing device at least comprises a printed circuit board, a needle type electronic component group and a fixing device body with a hat-shaped cross section, the printed circuit board is provided with a needle type electronic component group which comprises a plurality of needle type electronic components arranged side by side, the pin type electronic element comprises a base fixed on a printed circuit board and a pin positioned on the base, the top of the needle type electronic component set is buckled with a fixing device body which has a matching structure with the needle type electronic component set, the fixing device body at least comprises a reticular heat dissipation frame, the heat dissipation frame is adhered with heat dissipation fins, the inside of the heat dissipation frame is provided with a first fixing groove for fixing the needle type electronic component group, the length of the first fixing groove is smaller than that of the base, the top of first fixed slot is provided with a plurality ofly and the contact pin be the length that the second fixed slot of cooperation structure and contact pin is less than the second fixed slot.
As a further aspect of the present invention: and an anti-deformation plate is fixed on the outer side of the heat dissipation frame.
As a further aspect of the present invention: the number of the anti-deformation plates is six.
As a further aspect of the present invention: the number of the radiating fins is two.
As a further aspect of the present invention: and a heat insulation pad is adhered to the inner wall of the second fixing groove.
As a further aspect of the present invention: the heat insulation pad is made of felt sheets.
Compared with the prior art, the beneficial effects of the utility model are that: according to the above technical scheme, the utility model designs a fixing device body with netted heat dissipation frame to be provided with the fin on the heat dissipation frame, thereby the effectual wave-soldering in-process heat of conduction for the contact pin that has reduced, the top of fixing device body is provided with the second fixed slot for cooperating the structure with the contact pin simultaneously, thereby further avoid the contact pin phenomenons such as rise, crooked to appear floating.
On this basis, the outside of heat dissipation frame is provided with 6 and prevents the shape board to avoided the heat dissipation frame to take place to warp in the wave-soldering process.
Drawings
Fig. 1 is a schematic front view of a wave-soldering insert fixing device.
Fig. 2 is a schematic view of the main structure of the middle fixing device of the present invention.
Fig. 3 is an enlarged schematic structural diagram of a point a in fig. 2 according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 2, in an embodiment of the present invention, a wave-soldering interposer fixing device at least includes a printed circuit board 10, a needle electronic component group 20, and a fixing device body 30 having a hat-shaped cross section, the printed circuit board 10 is provided with the needle electronic component group 20, the needle electronic component group 20 includes a plurality of needle electronic components 21 arranged side by side, the needle electronic components 21 include a base 22 fixed on the printed circuit board 10 and a contact pin 23 located on the base 22, the fixing device body 30 having a structure matching with the needle electronic component group 20 is buckled at the top of the needle electronic component group 20, the fixing device body 30 at least includes a mesh-shaped heat dissipation frame 31, heat dissipation fins 32 are adhered to the heat dissipation frame 31, and the number of the heat dissipation fins 32 is 6.
The inside of the heat dissipation frame 31 is provided with a first fixing groove 311 for fixing the needle electronic component group 20, and the length of the first fixing groove 311 is smaller than that of the base 22, the top of the first fixing groove 311 is provided with a plurality of second fixing grooves 312 which are in a matching structure with the pins 23, and the length of the pins 23 is smaller than that of the second fixing grooves 312.
In order to avoid the deformation of the heat dissipation frame in the wave soldering process, the deformation preventing plates 40 are fixed on the outer side of the heat dissipation frame 31, and the number of the deformation preventing plates 40 is six.
As shown in fig. 3, a heat insulation pad 313 for further dissipating heat of the contact pin 23 is adhered to an inner wall of the second fixing groove 312, and the heat insulation pad 313 is made of a felt sheet.
To sum up, the utility model designs a fixing device body 30 with netted heat dissipation frame 31 to be provided with fin 32 on the heat dissipation frame 31, thereby the effectual wave-soldering in-process heat of conduction for contact pin 23 that has reduced, fixing device body 30's top is provided with the second fixed slot 312 that is the cooperation structure with contact pin 23 simultaneously, thereby further avoids contact pin 23 to appear phenomenons such as floating height, crooked.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. Wave-soldering plug-in components fixing device, its characterized in that: the fixing device at least comprises a printed circuit board (10), a needle type electronic component group (20) and a fixing device body (30) with a hat-shaped cross section, wherein the needle type electronic component group (20) is arranged on the printed circuit board (10), the needle type electronic component group (20) comprises a plurality of needle type electronic components (21) which are arranged side by side, each needle type electronic component (21) comprises a base (22) fixed on the printed circuit board (10) and a contact pin (23) located on the base (22), the fixing device body (30) which is in a matched structure with the needle type electronic component group (20) is buckled at the top of the needle type electronic component group (20), the fixing device body (30) at least comprises a net-shaped heat dissipation frame (31), heat dissipation fins (32) are adhered on the heat dissipation frame (31), a first fixing groove (311) for fixing the needle type electronic component group (20) is formed in the heat dissipation frame (31), and the length of the first fixing (22) The top of the first fixing groove (311) is provided with a plurality of second fixing grooves (312) which are matched with the pins (23), and the length of the pins (23) is smaller than that of the second fixing grooves (312).
2. The wave solder insert fixture of claim 1, wherein: and an anti-deformation plate (40) is fixed on the outer side of the heat dissipation frame (31).
3. The wave solder insert fixture of claim 2, wherein: the number of the deformation preventing plates (40) is six.
4. The wave solder insert fixture of claim 1, wherein: the number of the radiating fins (32) is 6.
5. The wave solder insert fixture of claim 1, wherein: and a heat insulation pad (313) is adhered to the inner wall of the second fixing groove (312).
6. The wave solder insert holder of claim 5, wherein: the material of the heat insulation pad (313) is felt sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921941321.6U CN210986615U (en) | 2019-11-11 | 2019-11-11 | Wave-soldering plug-in components fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921941321.6U CN210986615U (en) | 2019-11-11 | 2019-11-11 | Wave-soldering plug-in components fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986615U true CN210986615U (en) | 2020-07-10 |
Family
ID=71458229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921941321.6U Expired - Fee Related CN210986615U (en) | 2019-11-11 | 2019-11-11 | Wave-soldering plug-in components fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986615U (en) |
-
2019
- 2019-11-11 CN CN201921941321.6U patent/CN210986615U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |