CN215499263U - Camera module and electronic equipment - Google Patents

Abstract

The application discloses module and electronic equipment make a video recording relates to communication equipment's technical field to the inconvenient problem of circuit board and the outside circuit board welding of module of making a video recording is solved. The module of making a video recording is connected with electronic equipment's second base plate, and wherein, the module of making a video recording includes: the first substrate is stacked on the second substrate, a first welding surface is arranged on the outer surface of the stacked first substrate, a second welding surface is arranged on the outer surface of the stacked second substrate, and the first welding surface is connected with the second welding surface in a welding mode so that the first substrate is connected with the second substrate. The first and second soldering surfaces are not covered by the shielding, and the first and second substrates can be connected by locally heating the first and second soldering surfaces. Therefore, the first substrate and the second substrate do not need to be arranged in reflow soldering equipment, and the purpose of simplifying the soldering process of the first substrate and the second substrate is achieved. Meanwhile, other parts of the camera module and the electronic equipment can be prevented from being damaged due to heating.

Description

Camera module and electronic equipment

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to a camera module and electronic equipment.

Background

With the development of electronic equipment, the requirements of users on miniaturization and lightness and thinness of the electronic equipment are higher and higher, and the electronic equipment which is light, thin and miniaturized can be conveniently carried by the users, so that the users have better experience when using the electronic equipment.

In the related art, the circuit board of the camera module is connected with the mainboard of the electronic device in a reflow soldering mode after being butted. The mode that adopts reflow soldering need be to the circuit board of the module of making a video recording and electronic equipment's mainboard whole place heat in reflow soldering equipment, and such welding mode is loaded down with trivial details inconvenient, can lead to the circuit board of the module of making a video recording and electronic equipment's mainboard assembly inefficiency.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide a camera module and electronic equipment so as to solve the problem that a circuit board of the existing camera module is inconvenient to weld with an external circuit board.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the application discloses a camera module, camera module and electronic equipment's second base plate are connected, camera module includes: a first substrate having a first surface and a second surface,

the first substrate is stacked on the second substrate, the outer surface of the stacked first substrate is provided with a first welding surface, the outer surface of the stacked second substrate is provided with a second welding surface, and the first welding surface is connected with the second welding surface so that the first substrate is connected with the second substrate.

In some embodiments, the first weld face is located on a sidewall of the first stage half.

In some embodiments, the second bonding side is disposed adjacent to the first substrate.

In some embodiments, the first bonding surface is perpendicular to the second bonding surface, and the plate surface of the first substrate is perpendicular to the first bonding surface.

In some embodiments, the first weld face and the second weld face are joined by a laser welding process.

In some embodiments, the camera module further includes a lens portion, the lens portion includes a lens and a photosensitive element, a bearing surface is disposed on a surface of the first substrate facing away from the second substrate, the photosensitive element is disposed on the bearing surface, and the lens and the photosensitive element are disposed opposite to each other.

In some embodiments, the lens portion further includes a bracket detachably connected to the first substrate, and the lens is mounted on the bracket.

In some embodiments, the bearing surface includes a photosensitive element connecting surface and a support supporting surface, the photosensitive element connecting surface is located in a middle portion of the bearing surface, the photosensitive element connecting surface and the lens portion are correspondingly disposed, the support supporting surface is located in an edge portion of the bearing surface, and the support supporting surface is connected to the support.

In some embodiments, a side of the light sensing element facing the lens includes a sensing region and a non-functional region, the sensing region is located in a middle portion of the light sensing element, the non-functional region is located in an edge portion of the light sensing element, and the bracket is connected to the non-functional region.

In a second aspect, the present application discloses an electronic device, including the camera module described above.

Compared with the prior art, in the camera module disclosed in the embodiment of the application, the first welding surface is arranged on the outer surface of the first substrate after being overlapped, and the second welding surface is arranged on the outer surface of the second substrate after being overlapped, so that the first welding surface and the second welding surface are not shielded and covered. The mode of accessible to the local heating of the welding part of first face of weld and second face of weld department makes the first end of welding part connect in first face of weld to make the second end of welding part connect in the second face of weld, thereby make first base plate and second base plate connect. Therefore, the first substrate and the second substrate are not required to be arranged in reflow soldering equipment, the first substrate and the second substrate can be improved, other parts of the camera module and other parts of the electronic equipment cannot be heated in the process of welding the first substrate and the second substrate through the welding mode, and the corresponding other parts are not required to be prepared by high-temperature-resistant materials, so that the preparation process difficulty and the preparation cost of the camera module are effectively reduced, and finally the preparation process difficulty and the preparation cost of the electronic equipment can be effectively reduced.

The first substrate is stacked on the second substrate, so that the second substrate can provide a mounting base for the first substrate, the first substrate is stable, and the camera module is compact in structure, and the size of the camera module is reduced.

Drawings

Fig. 1 is a schematic view of an overall structure of a camera module according to an embodiment of the present disclosure, in which a bracket is connected to a first substrate;

fig. 2 is a schematic cross-sectional view illustrating a bracket of the camera module according to the embodiment of the present disclosure connected to a first substrate;

fig. 3 is a schematic view of an overall structure of a bracket connected to a photosensitive element in the camera module disclosed in the embodiment of the present application;

fig. 4 is a schematic cross-sectional view illustrating a bracket connected to a photosensitive element in the camera module disclosed in the embodiment of the present application;

fig. 5 is a schematic top view of a light sensing element in the camera module disclosed in the embodiment of the present application;

fig. 6 is a schematic front view of a second substrate in the camera module disclosed in the embodiment of the present application;

fig. 7 is a schematic front view of a first substrate in the camera module disclosed in the embodiment of the present application.

Description of reference numerals:

100-lens part, 110-lens, 120-photosensitive element, 121-sensing area, 122-non-functional area, 130-bracket,

200-a first substrate, 210-a first bonding surface, 220-a carrying surface, 221-a photosensitive-element connecting surface, 222-a support supporting surface, 230-a first connecting surface,

300-second substrate, 310-second bonding side, 320-second bonding side,

400-weld.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

Example 1;

referring to fig. 1 to 4, an embodiment of the present application discloses a camera module, which is connected to a second substrate 300 of an electronic device, and thus can be applied to the electronic device. The camera module comprises a first substrate 200, wherein the first substrate 200 is a base member of the camera module, and the first substrate 200 can provide a mounting base for at least some other components of the camera module. The electronic device is provided with a second substrate 300, and the camera module can be connected with the second substrate 300 of the electronic device. The second substrate 300 is a base member of the electronic apparatus, and the second substrate 300 may provide a mounting base for at least some other components of the electronic apparatus. Specifically, the second substrate 300 may be a motherboard of an electronic device, and a CPU, a display chip, a power chip, and the like of the electronic device may be mounted on the second substrate 300.

The second substrate 300 also provides a mounting base for the first substrate 200, so that the first substrate 200 can be stacked on the second substrate 300, and specifically, the first substrate 200 and the second substrate 300 can be stacked along the thickness direction of the two, so that the first substrate 200 can be kept stable, and the volume of the overall structure formed after the first substrate 200 and the second substrate 300 are stacked is small, thereby being beneficial to the light weight and the miniaturization of the overall structure after the camera module is connected with the second substrate 300, and further being beneficial to the light weight and the miniaturization of the electronic device applying the camera module.

The first substrate 200 is provided with a first bonding surface 210, the second substrate 300 is provided with a second bonding surface 310, and the first bonding surface 210 and the second bonding surface 310 may be connected by soldering, so that the first substrate 200 may transmit an electrical signal to the second substrate 300. The first substrate 200 and the second substrate 300 are connected by soldering, so that the connection effect between the two substrates is stable and reliable.

Specifically, as shown in fig. 2 and 4, a soldering portion 400 may be disposed between the first soldering surface 210 and the second soldering surface 310, and the soldering portion 400 may be a solder ball or solder powder, and the specific type of the soldering portion 400 is not limited in the present application. The welding portion 400 has a first end and a second end, wherein the first end of the welding portion 400 is disposed on the first welding surface 210, and the second end of the welding portion 400 is disposed on the second welding surface 310. Specifically, in the case that the soldering portion 400 is a solder ball, the solder ball may be disposed between the first soldering surface 210 and the second soldering surface 310, the solder ball may be distributed on the first soldering surface 210 and the second soldering surface 310 after being melted by heat, and the solder ball in a melted state may be fixed on the first soldering surface 210 and the second soldering surface 310 after being cooled and solidified, so as to connect the first soldering surface 210 and the second soldering surface 310, thereby enabling the first substrate 200 to transmit the electrical signal to the second substrate 300.

The first substrate 200 and the second substrate 300 are connected by welding, and the first substrate 200 and the second substrate 300 can be connected without arranging other electric connecting pieces, such as flexible electric connecting pieces, between the first substrate 200 and the second substrate 300, so that the volume of the camera module and the electronic equipment using the camera module can be reduced, the internal space of the electronic equipment can be released, and the trend of thinning and miniaturization of the camera module and the electronic equipment is facilitated. Meanwhile, the parts of the camera module and the electronic equipment can be reduced, so that the reliability and the stability of the camera module and the electronic equipment are better.

As shown in fig. 6 and 7, after the first substrate 200 and the second substrate 300 are stacked, at least a portion of the outer surface of the first substrate 200 is butted against at least a portion of the outer surface of the second substrate 300. Specifically, the first substrate 200 may be provided with a first connection surface 230, the second substrate 300 may be provided with a second connection surface 320, and in a case where the first substrate 200 is stacked on the second substrate 300, the first connection surface 230 and the second connection surface 320 are both in a connected and non-exposed state. The first welding surface 210 is located on the outer surface of the first substrate 200 stacked on the second substrate 300, that is, the first welding surface 210 is in an exposed state, the second substrate 300 does not cover the first welding surface 210, so that after the first end of the welding portion 400 is in contact with the first welding surface 210, the first end of the welding portion 400 can be melted by locally heating the first end of the welding portion 400 and the first welding surface 210, the first end of the welded portion 400 after being melted can be attached to the first welding surface 210, and the first end of the welding portion 400 after being cooled can be fixed on the first welding surface 210.

The second welding surface 310 is located on the outer surface of the second substrate 300 stacked on the first substrate 200, that is, the second welding surface 310 is also in an exposed state, the first substrate 200 does not cover the second welding surface 310, so that after the second end of the welding portion 400 contacts the second welding surface 310, the second end of the welding portion 400 is melted by locally heating the second end of the welding portion 400 and the second welding surface 310, the second end of the melted welding portion 400 can be attached to the second welding surface 310, and the second end of the welding portion 400 can be fixed to the second welding surface 310 after being cooled.

The soldering method can avoid the need of heating the first substrate 200 and the second substrate 300 in a reflow soldering device during the process of soldering the first soldering surface 210 and the second soldering surface 310, thereby simplifying and facilitating the soldering process of the first soldering surface 210 and the second soldering surface 310. Simultaneously, such welding mode is lower to the high temperature resistance performance requirement of the other parts of the module of making a video recording and other parts of electronic equipment, and the other parts of the module of making a video recording and other parts of electronic equipment can not need to adopt high temperature resistant material to prepare to reduce the preparation technology degree of difficulty and the preparation cost of the module of making a video recording and electronic equipment.

It should be noted that, since the first substrate 200 is stacked on the second substrate 300, the weight of the first substrate 200 can be borne by the second substrate 300, so that the welding portion 400 does not need to bear the weight of the first substrate 200, and the pressure applied to the welding portion 400 can be reduced to prevent the welding portion 400 from being broken, and finally, the connection effect between the first substrate 200 and the second substrate 300 is more stable and reliable.

In the embodiment of the present application, the first substrate 200 is stacked on the second substrate 300, so that the second substrate 300 can provide a mounting base for the first substrate 200, thereby stabilizing the first substrate 200. The first bonding surface 210 is disposed on the outer surface of the first substrate 200 after being stacked, and the second bonding surface 310 is disposed on the outer surface of the second substrate 300 after being stacked, so that the first bonding surface 210 and the second bonding surface 310 are not covered by the shielding. The first end of the welding part 400 can be connected to the first welding surface 210 by locally heating the welding part 400 at the first welding surface 210 and the second welding surface 310, and the second end of the welding part 400 is connected to the second welding surface 310, so that the first substrate 200 and the second substrate 300 are connected, and the first substrate 200 can transmit the electric signal to the second substrate 300.

Meanwhile, in the process of soldering the first substrate 200 and the second substrate 300 by the above soldering method, the first substrate 200 and the second substrate 300 do not need to be integrally placed in a reflow soldering device, so that the soldering process is simple and convenient. And other parts of the camera module and other parts of the electronic equipment can not be heated, and correspondingly, other parts do not need to be prepared by adopting high-temperature-resistant materials, so that the preparation process difficulty and the preparation cost of the camera module can be reduced, and finally the preparation process difficulty and the preparation cost of the electronic equipment can be reduced.

Alternatively, as shown in fig. 1-4. The first substrate 200 has a carrying surface 220, the carrying surface 220 is located on the first substrate 200 opposite to the second substrate 300, and the carrying surface 220 can carry at least some other components of the camera module.

The normal of the carrying surface 220 intersects with the normal of the first welding surface 210, and specifically, in the case that the first substrate 200 is a plate-shaped structural member, the first welding surface 210 may be disposed on an outer sidewall of the first substrate 200. Under such an arrangement, the first bonding surface 210 and the carrying surface 220 are not located on the same plane of the first substrate 200, so as to fully utilize the available arrangement area of the surface of the first substrate 200. The area of the carrying surface 220 can be set to be larger, so that the effect of carrying at least part of the other components of the camera module by the carrying surface 220 is better, and the connection effect between the at least part of the other components of the camera module and the first substrate 200 is more stable and reliable. Accordingly, the area of the first bonding surface 210 can be set to be larger, so that the connection between the first substrate 200 and the second substrate 300 is more stable and reliable.

Meanwhile, the first welding surface 210 is disposed on the outer side wall of the first substrate 200 to reduce the size of the first substrate 200, so that the camera module is more compact in structure, and is favorable for the light, thin and small trend of the camera module and the electronic device using the camera module.

Of course, the first welding surface 210 and the carrying surface 220 may be disposed in a coplanar manner, and specifically, the first welding surface 210 and the carrying surface 220 may be disposed on a side plate surface of the first substrate 200, so as to reduce the difficulty of the processing technique of the first welding surface 210.

It should be noted that the normal line of the carrying surface 220 may be perpendicular to the normal line of the first bonding surface 210, in such an arrangement structure, the outer sidewall of the first substrate 200 is perpendicular to the surface of the first substrate 200 facing away from the second substrate 300, and the first substrate 200 is a plate body with a regular shape, so that the first substrate 200 can be prevented from having a special-shaped structure, thereby reducing the difficulty of the processing process of the first substrate 200 and facilitating the mass production of the first substrate 200.

Optionally, a normal of the second soldering surface 310 intersects with a normal of the first soldering surface 210. Specifically, the normal line of the second welding surface 310 and the normal line of the first welding surface 210 may be set to be perpendicular. The second bonding surface 310 is parallel to the carrying surface 220, and the second bonding surface 310 is coplanar with the second connecting surface 320 of the second substrate 300. Specifically, the area of the plate surface of the second substrate 300 facing the first substrate 200 may be set to be larger than the area of the plate surface of the first substrate 200 facing the second substrate 300, so that the plate surface of the second substrate 300 facing the first substrate 200 may further include the second bonding surface 310 in addition to the second connection surface 320.

Of course, the second soldering surface 310 may also be disposed opposite to the second connecting surface 320, specifically, the normal of the second soldering surface 310 may be disposed perpendicular to the normal of the second connecting surface 320, the second soldering surface 320 may be disposed on the outer sidewall of the second substrate 300, the second connecting surface 320 is disposed on a side plate surface of the second substrate 300, the first soldering surface 210 of the outer sidewall of the first substrate 200 is aligned with the second soldering surface 320 of the second substrate 300, so that the soldering portion 400 is disposed on the outer sidewalls of the first substrate 200 and the second substrate 300, and thus the first substrate 200 and the second substrate 300 may also be connected.

Alternatively, the first welding surface 210 and the second welding surface 310 may be connected by laser welding. Specifically, the first end of the welding portion 400 may be connected to the first welding surface 210 through a laser welding process, and the laser welding process may be performed by emitting a laser beam to the welding portion 400, so that the welding portion 400 is melted onto the first welding surface 210, and the welding portion 400 may be connected to the first welding surface 210 after being cooled and solidified. The second end of the welding part 400 is also connected to the second welding surface 310 through a laser welding process, which is performed by emitting a laser beam to the welding part 400 such that the welding part 400 is melted onto the second welding surface 310, and the welding part 400 is cooled and solidified to be connected to the second welding surface 310.

In a specific process, the welding part 400 may be melted by heating with a laser beam such that a portion of the welding part 400 is melted to the first welding surface 210 and a portion of the welding part 400 is melted to the second welding surface 310, and the first welding surface 210 and the second welding surface 310 may be connected after the portion 400 to be welded is cooled and solidified, thereby connecting the first substrate 200 and the second substrate 300.

The first welding surface 210 can be provided with a plurality of welding points, the second welding surface 310 can also be provided with a plurality of welding points, and the plurality of welding points on the first welding surface 210 and the plurality of welding points on the second welding surface 310 are arranged in a one-to-one correspondence manner. The welding target area, i.e., the welding part 400 at each welding point, can be heated more precisely by laser welding, so that the welding precision of the first welding surface 210 and the second welding surface 310 is higher. Meanwhile, the camera module and other parts of the electronic equipment can be prevented from being damaged due to heating.

Optionally, as shown in fig. 1 to 4, the embodiment of the present application further includes a lens portion 100, and the lens portion 100 may receive external light and convert an optical signal into an electrical signal to form an image. The lens portion 100 is fixed on the carrying surface 220, so that the lens portion 100 is connected to the first substrate 200, and the lens portion 100 can transmit the optical signal to the first substrate 200. Specifically, the carrying surface 220 has a circuit structure corresponding to the lens portion 100, and the lens portion 100 is connected to the circuit structure. Since the second substrate 300 is connected to the first substrate 200, the lens part 100 may transmit electrical signals to the second substrate 300 through the first substrate 200.

Specifically, the lens portion 100 includes a lens 110 and a light sensing element 120, external light can be transmitted to the light sensing element 120 through the lens 110, and the light sensing element 120 can convert an optical signal into an electrical signal. The photosensitive element 120 is stacked on the carrying surface 220, and specifically, the photosensitive element 120 can be connected with the carrying surface 220 by welding, so that the overall structure of the first substrate 200 and the photosensitive element 120 after connection is compact, which is beneficial to the trend of miniaturization and light weight of the camera module and the electronic device using the camera module. Of course, the photosensitive element 120 may also be connected to the first substrate 200 by other connection methods, for example, by a wire connection method, and the specific connection method between the photosensitive element 120 and the first substrate 200 is not limited in this application. The lens 110 is disposed on a side of the light sensing element 120 opposite to the first substrate 200, and a certain distance is formed between the side of the lens 110 facing the light sensing element and the light sensing element 120.

Optionally, in order to space the lens 110 from the light sensing element 120, the lens portion 100 further includes a bracket 130, and the bracket 130 provides a mounting base for the lens 110. The holder 130 is detachably connected to the first substrate 200, and the lens 110 is mounted on the holder 130. Specifically, the bracket 130 may be a frame structure, a cavity is provided in the bracket 130, and at least a portion of the lens 110 may be disposed in the cavity. The holder 130 may have a first opening and a second opening communicating with the cavity, and the first opening may allow at least a portion of the lens 110 to extend out of the holder 130, so that the lens 110 may receive external light. The second opening may be abutted to the first substrate 200, such that the first substrate 200 blocks the second opening, so that the support 130 and the first substrate 200 may enclose the light sensing element 120 and at least a portion of the lens 110 to protect the lens 110 and the light sensing element 120, and in particular, may reduce the impact on the lens 110 and the light sensing element 120 when the electronic device is impacted and collided.

In order to detachably connect the bracket 130 and the first substrate 200, the bracket 130 may be bonded to the first substrate 200 by an adhesive, so that there is no need to additionally provide a connecting structure on the bracket 130 and the first substrate 200, and the overall structure of the bracket 130 and the first substrate 200 after connection is more compact, which is beneficial to the miniaturization and light-weight trend of the camera module and the electronic device using the camera module. Meanwhile, the structures of the bracket 130 and the first substrate 200 can be simplified, and the difficulty in the processing of the bracket 130 and the first substrate 200 is reduced.

Of course, corresponding connection structures may be disposed on the bracket 130 and the first substrate 200, for example, a first connection member is disposed on the bracket 130, a second connection member is disposed on the first substrate 200, and the first connection member and the second connection member cooperate to fix the bracket 130 to the first substrate 200. Specifically, the first connecting piece and the second connecting piece can be connected in a snap connection mode.

In order to make the bracket 130 have better structural strength, the bracket 130 may be made of a metal material or a carbon fiber material, specifically, an aluminum alloy may be used, and the aluminum alloy has better structural strength and relatively smaller weight, and in the case that the bracket 130 is made of a metal material, the bracket 130 may be connected with the first substrate 200 in a welding manner, so that the connection effect between the bracket 130 and the first substrate 200 is stable and reliable.

Of course, the bracket 130 may also be a plastic structural member, which obviously reduces the overall weight and manufacturing cost of the bracket 130, and accordingly, reduces the overall weight and manufacturing cost of the camera module and the electronic device.

It should be noted that the material used for the bracket 130 and the connection manner of the bracket 130 and the first substrate 200 are not limited in this application.

Alternatively, as shown in fig. 4, the carrying surface 220 of the first substrate 200 includes a photosensitive element connecting surface 221 and a support supporting surface 222, the photosensitive element connecting surface 221 is located at a middle portion of the carrying surface 220, and the photosensitive element connecting surface 221 is disposed opposite to the photosensitive element 120. The photosensitive element 120 is connected to the first substrate 200 by abutting the photosensitive element connection surface 221, and therefore, a circuit structure corresponding to the photosensitive element 120 can be disposed on the photosensitive element connection surface 221. The supporting surface 222 is located at an edge portion of the supporting surface 220, the supporting frame 130 is connected to the supporting surface 222, and the supporting surface 222 supports the supporting frame 130 to provide an installation base for the supporting frame 130. The support supporting surface 222 may not be provided with a circuit structure, and the support 130 can be prevented from being pressed on the photosensitive element connecting surface 221 by the support supporting surface 222 to damage the circuit structure on the photosensitive element connecting surface 221, so that the photosensitive element 120 and the first substrate 200 have a more stable and reliable connecting effect.

The supporting surfaces 222 can be distributed around the supporting surface 220, so that the supporting surfaces 222 surround the photosensitive element connecting surface 221, which can make the supporting surfaces 222 have a larger area, thereby providing a better supporting effect for the supporting frame 130. Meanwhile, the supporting surface 222 of the bracket can enclose the protection supporting surface 220.

Optionally, as shown in fig. 2 and fig. 5, a side of the light sensing element 120 facing the lens 110 includes a sensing area 121 and a non-functional area 122, the sensing area 121 is located in a middle portion of the light sensing element 120, the sensing area 121 is a working area of the light sensing element 120, and light passing through the lens 110 is irradiated on the sensing area 121 and then converted into an electrical signal. The non-functional region 122 is located at an edge portion of the photosensitive element 120, no circuit structure is disposed on the non-functional region 122, and the sensing region 121 can be protected by the non-functional region 122. The bracket 130 is connected to the non-functional region 122, so that the non-functional region 122 can support the bracket 130, thereby preventing the bracket 130 from pressing the sensing region 121 to damage the photosensitive element 120.

The bracket 130 is directly disposed on the photosensitive element 120, so that the bracket 130 does not occupy the carrying surface 220 of the first substrate 200, the area of the carrying surface 220 available for the photosensitive element 120 is larger, and accordingly, the camera module can adopt the photosensitive element 120 with a larger area, and the camera module has a better shooting effect. The non-functional region 122 may be disposed around the photosensitive element 120, and the non-functional region 122 is disposed around the sensing region 121, so that the non-functional region 122 may protect the sensing region 121, and further, the non-functional region 122 may have a larger area, so that the non-functional region 122 may support the fixing bracket 130 more effectively.

As shown in fig. 2, a side of the photosensitive element 120 facing away from the first substrate 200 may be stacked with a cover plate 123, and the cover plate 123 may cover the photosensitive element 120 to protect the photosensitive element 120. The cover plate 123 can provide a mounting base for the support 130, and the support 130 is fixed on a side of the cover plate 123 facing away from the photosensitive element 120, so that the support 130 is not in direct contact with the photosensitive element 120, and the purpose of protecting the photosensitive element 120 and preventing the photosensitive element 120 from being damaged by the support 130 due to pressing is achieved. In order to transmit light to the photosensitive element 120 through the cover plate 123, the cover plate 123 may be a transparent sheet member, specifically, a glass material or a plastic material, or other transparent members may also be used, which is not limited in this application.

The cover plate 123 may also be a structural member with a light filtering function, so that the cover plate 123 can provide a mounting base for the bracket 130 and can enable the camera module to have various shooting effects.

Example 2:

based on the module of making a video recording in the above, this application embodiment still discloses an electronic equipment, and this electronic equipment includes the above module of making a video recording.

Optionally, the electronic device disclosed in the embodiment of the present application further includes a housing, where the housing is a base member of the electronic device, the housing may provide a mounting base for the first substrate 200 and the second substrate 300, the first substrate 200 and the second substrate 300 are disposed in the housing, and the housing may also play a role in protecting the first substrate 200 and the second substrate 300. The surface of the housing is opened opposite to the lens portion 100, so that at least part of the lens portion 100 is in the housing, and external light can enter the lens portion 100.

The electronic device disclosed by the embodiment of the application can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, which is not limited in this embodiment of the application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a camera module, its characterized in that, camera module is connected with electronic equipment's second base plate (300), camera module includes: a first substrate (200) having a first surface,

wherein the first substrate (200) is stacked on the second substrate (300), the outer surface of the stacked first substrate (200) has a first soldering surface (210), the outer surface of the stacked second substrate (300) has a second soldering surface (310), and the first soldering surface (210) is connected with the second soldering surface (310) to connect the first substrate (200) and the second substrate (300).

2. The camera module according to claim 1, wherein the first soldering surface (210) is located on a sidewall of the first substrate (200).

3. The camera module according to claim 2, characterized in that the second soldering surface (310) is arranged adjacent to the first substrate (200).

4. The camera module according to claim 3, wherein the first soldering surface (210) is perpendicular to the second soldering surface (310), and the plate surface of the first substrate (200) is perpendicular to the first soldering surface (210).

5. The camera module according to any of claims 1 to 4, characterized in that the first soldering surface (210) and the second soldering surface (310) are connected by a laser welding process.

6. The camera module according to claim 1, further comprising a lens portion (100), wherein the lens portion (100) comprises a lens (110) and a photosensitive element (120), a carrying surface (220) is disposed on a surface of the first substrate (200) facing away from the second substrate (300), the photosensitive element (120) is disposed on the carrying surface (220), and the lens (110) and the photosensitive element (120) are disposed opposite to each other.

7. The camera module of claim 6, wherein the lens portion (100) further comprises a bracket (130), the bracket (130) being detachably connected to the first substrate (200), the lens (110) being mounted to the bracket (130).

8. The camera module according to claim 7, wherein the carrying surface (220) comprises a photosensitive element connecting surface (221) and a bracket supporting surface (222), the photosensitive element connecting surface (221) is located at a middle portion of the carrying surface (220), the photosensitive element connecting surface (221) is disposed corresponding to the lens portion (100), the bracket supporting surface (222) is located at an edge portion of the carrying surface (220), and the bracket supporting surface (222) is connected to the bracket (130).

9. The camera module according to claim 7, wherein the side of the photosensitive element (120) facing the lens (110) comprises a sensing area (121) and a non-functional area (122), the sensing area (121) is located in a middle portion of the photosensitive element (120), the non-functional area (122) is located in an edge portion of the photosensitive element (120), and the bracket (130) is connected to the non-functional area (122).

10. An electronic device comprising the camera module of any one of claims 1-9.

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