CN215491232U

CN215491232U - Assembly and equipment for cooling hot plate

Info

Publication number: CN215491232U
Application number: CN202022901471.3U
Authority: CN
Inventors: 不公告发明人
Original assignee: Xuancheng Ruihui Xuansheng Enterprise Management Center Partnership LP
Current assignee: Xuancheng Ruihui Xuansheng Enterprise Management Center Partnership LP
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2022-01-11
Anticipated expiration: 2030-12-02

Abstract

The utility model discloses an assembly and equipment for cooling a hot plate. In the utility model, the component for cooling the hot plate can be movably laid on the working table of the hot plate and contacted with the working table, and comprises: at least one pipeline for the circulation of cooling liquid or inert gas; and the bases are made of heat conduction materials and are provided with through holes for the at least one pipeline to pass through, and the pipelines pass through the through holes and are arranged in the bases in a penetrating mode. The assembly and the equipment for cooling the hot plate provided by the utility model have the advantages of fast cooling, short time and adjustable cooling speed.

Description

Assembly and equipment for cooling hot plate

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a component and equipment for cooling a hot plate.

Background

The hot plate is a conventional universal device used for processing and heating the product process in the related industries such as semiconductors, solar cells and the like. At present, after the temperature of a hot plate is raised to a set temperature, the hot plate is mainly cooled naturally, the cooling is slow and long, the process rapid switching between products by using different temperatures is not facilitated, and the production efficiency is influenced.

Disclosure of Invention

In order to partially or fully solve the technical problems described above, the present invention seeks to provide an assembly and an apparatus for cooling a hot plate.

In one aspect of the present invention, there is provided an assembly for cooling a hot plate, capable of being movably laid on and in contact with a work top of the hot plate, comprising:

at least one pipeline for the circulation of cooling liquid or inert gas; and the number of the first and second groups,

the pipeline structure comprises a plurality of bases, wherein the bases are arranged along at least one pipeline, the bases are made of heat conduction materials and are provided with through holes through which the at least one pipeline can pass, and the pipelines pass through the through holes and are arranged in the bases in a penetrating mode.

In some examples, the at least one conduit includes a liquid conduit through which the cooling liquid may flow and/or a gas conduit through which the inert gas may flow.

In some examples, each of the bases has a first through hole through which the liquid conduit passes and/or a second through hole through which the gas conduit passes, and the first through hole is parallel to the second through hole.

In some examples, the base includes a first portion and a second portion that are detachably combined, the first portion defines a first recess, the second portion defines a second recess, and the first recess and the second recess can form the through hole when the first portion and the second portion are fastened together.

In some examples, the base is an integrally formed block-shaped solid structure, and the through hole is opened in the block-shaped solid structure.

In some examples, the base is made of the same material as a work top of the hot plate.

In some examples, the plurality of pedestals are uniformly arranged along the pipe with a gap between adjacent pedestals.

In some examples, the gas pipeline is provided with a gas blowing hole, and the gas blowing hole faces the work table.

In one aspect of the utility model, the equipment for cooling the hot plate comprises the component for cooling the hot plate and a circulating pump; at least one pipeline in the assembly for cooling the hot plate is communicated with the circulating pump respectively, and the circulating pump comprises a cooling liquid circulating pump and/or an inert gas circulating pump.

In some examples, the apparatus for cooling a hot plate further includes: the supporting plate is used for supporting the component for cooling the hot plate; a lifting device configured to move the component to be placed on and in contact with the table top of the hot plate at the start of cooling and to move the component from the table top of the hot plate to the support plate after cooling is completed.

According to the utility model, the base penetrating through the pipeline is uniformly placed on the workbench surface of the hot plate, and the cooling liquid and/or the inert gas is introduced into the pipeline to directly cool the hot plate, so that the cooling speed of the hot plate can be effectively improved, and the cooling time of the hot plate can be shortened. And, can adopt the mode of gas-liquid combination to cool down according to actual demand, the cooling rate is faster, and the cooling rate can be regulated and control.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the utility model are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

FIG. 1 is an exemplary block diagram of a thermal plate to which the present invention is applicable.

FIG. 2 is a schematic diagram of the structure and arrangement of components for cooling a hot plate according to an embodiment of the present invention.

FIG. 3 is an illustration of a component for cooling a hot plate placed on a hot plate countertop in an embodiment of the utility model.

FIG. 4a is a schematic view of a first portion of a base of an assembly for cooling a hot plate according to an embodiment of the present invention.

FIG. 4b is a schematic view of the structure and mounting of the second portion of the base of the assembly for cooling down the hot plate according to one embodiment of the present invention.

Description of reference numerals:

10. a hot plate; 11. a hot plate body; 12. a work table; 13. a pipeline; 14. a base; 15. adjusting a valve; 16. a power supply input terminal; 131. a liquid conduit; 132. a gas conduit; 1321. a gas blowing hole; 141. a first portion of the base; 142. a second portion of the base; 143. a through hole of the base; 1431. a first through hole; 1432. a second through hole; 151. a regulating valve of the liquid pipeline; 152. a regulating valve of the gas pipeline.

Detailed Description

The principles and spirit of the present invention will be described with reference to a number of exemplary embodiments. It is understood that these embodiments are given solely for the purpose of enabling those skilled in the art to better understand and to practice the utility model, and are not intended to limit the scope of the utility model in any way. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Reference will now be made in detail to exemplary implementations of the utility model.

FIG. 1 illustrates an exemplary configuration 10 of a thermal plate to which the present invention is applicable. The thermal plate 10 may include a thermal plate body 11, the thermal plate body 11 having a work surface 12 and a power input 16. In use, the power input 16 is externally connected to a power supply to heat the work surface 12 to a predetermined temperature, thereby heating an object (e.g., a tray carrying a substrate) placed on the work surface 12. Because the heating requirements of different processes are different, in the switching process of different processes, the hot plate 10 is often required to be cooled first and then heated to the set temperature required by the next process. It should be noted that fig. 1 is merely an example. In practical application, the assembly for cooling a hot plate provided by the utility model can be applied to the hot plate 10 shown in fig. 1, and can be applied to other hot plates with similar structures.

Figure 2 illustrates an exemplary configuration of the components for platen cooling provided by the present invention and an exemplary deployment thereof on platen 10. Fig. 3 shows a schematic layout of the components for cooling a hot plate provided by the present invention on a work table 12.

The assembly for cooling the hot plate, provided by the utility model, can be movably laid on the working table 12 of the hot plate 10 and is in contact with the working table 12, and the assembly can comprise: at least one pipe 13 through which a cooling liquid or an inert gas can flow, and a plurality of susceptors 14 disposed along the at least one pipe 13. The bases 14 are made of a heat conductive material and have through holes (not shown) through which at least one pipeline 13 can pass, and the pipelines 13 are arranged in the bases 14 through the through holes. In other words, each base 14 can be threaded onto the duct 13 through its through hole.

When the hot plate 10 needs to be cooled, the pipelines 13 are uniformly laid on the workbench 12 of the hot plate 10 through the base 14, the base 14 is in contact with the workbench 12, and cooling liquid and/or inert gas flows through at least one pipeline 13, so that heat on the workbench 12 is transferred to the cooling liquid and/or the inert gas through the base 14 and the pipelines 13, and is led out, and the cooling of the hot plate 10 is further realized. Specifically, heat from the work surface 12 is transferred to the base 14, from the base 14 through the walls of the duct 13 to the duct 13, and finally into the cooling fluid and/or inert gas, where it is carried away.

Referring to fig. 2 and 3, the pipe 13 is laid evenly on the work surface 12 and placed on the work surface 12 by the base 14. Each of the tubes 13 has its own inlet and outlet, and the cooling liquid and/or inert gas from the outside enters the corresponding tube 13 through the inlet of the corresponding tube 13 and flows out from the outlet of the corresponding tube 13, and the cooling plate 10 can be cooled by continuously circulating the cooling liquid and/or inert gas in the tube 13.

In the present invention, the pipeline 13 laid on the working platform 12 may include one, two or more pipelines. In at least some embodiments, multiple channels 13 may be provided for more rapid and efficient cooling of platens 10. Taking fig. 2 and fig. 3 as an example, at least one of the pipelines 13 in the present invention may include a liquid pipeline 131 through which a cooling liquid may flow and a gas pipeline 132 through which an inert gas may flow, so that either one or both of the liquid and the gas may be selectively introduced into the pipeline 13 to cool the hot plate 10, the cooling speed is controllable and safe, and the requirements of various application scenarios may be met. That is, the cooling liquid may be introduced into the liquid pipe 131 and the inert gas may be introduced into the gas pipe 132 to rapidly cool the work table 12. The cooling liquid may be selectively introduced into the liquid pipeline 131 or the inert gas may be selectively introduced into the gas pipeline 132 to cool the work table 12 according to actual needs and limitations of application scenarios (for example, under the condition that the objective process conditions are limited and the inert gas source or the cooling liquid source cannot be externally connected).

The laying mode or the trend of the at least one pipeline 13 can be designed according to different shapes of the working platform. In practical application, no matter whether the pipeline 13 comprises one path, two paths or more paths, the pipeline 13 can be laid by adopting various laying modes, as long as the pipeline is beneficial to quickly and uniformly cooling the whole working table 12, namely, the specific laying mode of the pipelines on the working table 12 is not limited. For example, the pipes 13 may be laid in a zigzag shape as shown in fig. 2 and 3, and the pipes 13 may be arranged in parallel. That is, the liquid conduit 131 and the gas conduit 13 are each arcuate and parallel to each other and are placed on the work surface 12 through the same set of pedestals 14. In addition, the conduit 13 may be laid in a manner such as a sine wave, zigzag, or other manner that facilitates faster and more uniform cooling of the work surface 12.

In the present invention, the material of the duct 13 may be any material through which a coolant or an inert gas can flow. Preferably, the material of the pipe 13 may be heat-resistant, cold-resistant, corrosion-resistant and high thermal conductivity. In some examples, the material of the pipe 13 may be, but is not limited to, stainless steel, such as stainless steel 304, stainless steel 316, and the like. If there is more than one pipe 13, each pipe 13 may be made of the same material or different materials, and may be determined by the type of liquid or gas introduced therein. For example, referring to fig. 2 and 3, the liquid pipe 131 and the gas pipe 132 may be made of stainless steel, such as stainless steel 304 and 316.

To facilitate the regulation of the pressure or flow in the pipes 13, a regulating valve 15 may be provided on each pipe 13. The type, material or category of the regulating valve 15 may be determined by the material of the pipe 13, the type of liquid or gas introduced into the pipe 13, the actual regulating requirement, and the like. In practical applications, a regulating valve 15 may be provided on each of the pipes 13, and a regulating valve 15 may be selectively provided on a part of the pipes 13.

The position of the regulating valve 15 on the pipe 13 is not limited. In some embodiments, the adjusting valve 15 may be disposed at the inlet of the duct 13, so as to conveniently adjust the flow rate or pressure of the cooling liquid or inert gas in the duct 13, and thus the cooling speed of the work table 12 can be adjusted. Taking fig. 2 and 3 as an example, the liquid pipe 131 is provided with a regulating valve 151, and the inlet of the gas pipe 132 is provided with a regulating valve 152.

Referring to fig. 2 and 3, the liquid pipe 131 has a liquid inlet for introducing the cooling liquid into the liquid pipe 131 and a liquid outlet for discharging the cooling liquid in the liquid pipe 131, and the liquid inlet is provided with an adjusting valve 15 of the liquid pipe for adjusting the liquid flow rate inside the liquid pipe 131. The cooling rate can be adjusted by adjusting the flow rate of the liquid in the liquid pipe 131. In the concrete application, the regulating valve 151 is controlled to increase the liquid flow in the liquid pipeline 131, and when the liquid flow in the liquid pipeline 131 is large, the heat on the working table 12 can be taken away more quickly, so that the hot plate 10 can be cooled more quickly.

Referring to fig. 2 and 3, the gas pipe 132 has a gas inlet for introducing inert gas into the gas pipe 132 and a gas outlet for discharging the inert gas from the gas pipe 131, and the gas inlet is provided with a regulating valve 152 for regulating the pressure inside the gas pipe 132. By adjusting the air pressure inside the air duct 132, the cooling rate can be adjusted. In specific application, the air pressure inside the gas pipeline 12 can be increased by controlling the regulating valve 152, and when the air pressure inside the gas pipeline 132 is larger, the heat on the working table 12 can be taken away more quickly, so that the temperature of the hot plate 10 can be reduced more quickly.

In some embodiments, the inlet and outlet of each conduit 13 may be disposed outside the thermal plate body 11, so as to prevent the liquid or gas leaked from the inlet or outlet from contaminating the work surface 12 or penetrating into the thermal plate body 11 to damage the internal components thereof. In general, the inlet and outlet of the respective pipes 13 may be provided at appropriate positions selected according to the configuration of the platen body 11, the size of the work table 12, the laying manner of the pipes 13, and the like. Referring to fig. 2 and 3, the liquid inlet and outlet of the liquid conduit 131, and the gas inlet and outlet of the gas conduit 132 are disposed outside the work table 12. It should be noted that, although the inlet and the outlet of each channel 13 are disposed on the left side of the hot plate body 11 in the above drawings, it is understood that the inlet and the outlet of each channel 13 may be disposed on two sides or other positions of the hot plate body 11, which is not limited herein.

In the utility model, the bases 14 are distributed along the pipeline 13 and penetrate through the through holes of the pipeline 13, the bases 14 are uniformly distributed along the pipeline 13, and gaps are reserved between the adjacent bases 14. When the hot plate 10 needs to be cooled, the components of the present invention can be placed on the working table 12 of the hot plate 10 by a robotic arm or other operation method, so that each base 14 can be in direct contact with the working table 12, and simultaneously, each channel of the pipeline 13 can cover the whole working table 12 through the base 14 and be laid uniformly.

Fig. 4a and 4b show an exemplary structure of the base 14. The base 14 may include a first portion 141 (shown in fig. 4 a) and a second portion 142 (shown in fig. 4 b) that are detachably combined, the first portion 141 is opened with a first notch, the second portion 142 is opened with a second notch, and the first notch and the second notch can form a through hole 143 when the first portion 141 and the second portion 142 are fastened together. When the pipe 13 is inserted, the first portion 141 and the second portion 142 of the base 14 can be fixedly connected by a fixing connector (not shown), such as a screw or other fixing connector. Referring to fig. 4a and 4b, the first and

second portions

141 and 142 of the base 14 have the same structure, i.e., the lower portion thereof is formed with arcuate recesses, and the recesses are formed with through holes 143 by inverting the second portion 142 and engaging with the first portion 142. Although fig. 4a and 4b illustrate examples in which the first and

second portions

141 and 142 of the base 14 are formed to have the through-holes 143 formed therein by being engaged with each other in an up-and-down manner. It is to be understood, however, that the specific construction of the base 14 in the present invention is not limited to this one implementation. For example, the through-hole 143 may be formed by engaging the first portion 141 and the second portion 142 of the base 14 in the left-right direction. For another example, the base 14 may be a solid block structure formed integrally, and the solid block structure is provided with a through hole 143.

In some embodiments, the inner diameter of the through-hole 143 matches the outer diameter of the pipe 13. The shape of the through hole 143 is not limited, and may be, for example, a circle, a square, or other various shapes. Generally, the through holes 143 are adapted to the shape of the pipes 13, which is more effective.

In some embodiments, the base 14 may be a solid structure, which is more conducive to rapid heat transfer. Taking fig. 4a and 4b as an example, the first portion 141 and the second portion 142 of the base 14 may each be a solid structure.

In some embodiments, each part of the base 14 may also be a hollow structure, and the air inside the hollow structure may also perform a heat dissipation function. The utility model is not limited with respect to the specific configuration of the base 14.

In the example of fig. 4a and 4b, each base 14 has a first through hole 1431 through which the liquid duct 131 passes and/or a second through hole 1432 through which the gas duct 132 passes, the first through hole 1431 being parallel to the second through hole 1432. In this way, two pipes 13 can be fixed by a set of bases 14, and it is ensured that these pipes 13 are laid evenly and in parallel on the work surface 12.

In the present invention, the material of the base 14 can be selected according to actual requirements. In some embodiments, the base 14 may be made of the same material as the work surface 12 to avoid scratching or scratching the work surface 12 due to differences in hardness between different materials.

In practice, the base 14 may be mounted on the surface of the countertop 12 in any manner suitable for a hot plate without affecting the heating function of the hot plate 10. In order to facilitate maintenance and assembly of the pipeline 13, each base 14 may be inserted through the pipeline 13 in advance, and then the base 14 may be directly placed on the working platform 12 or may be detachably mounted on the working platform (for example, by means of a clamp, an adhesive, or the like).

For more rapid cooling, the air pipe 132 is provided with an air blowing hole 1321, the air blowing hole 1321 faces the work table 12, and the surface of the work table 12 can be blown up and cooled through the air blowing hole 1321. In order to prevent the gas inside the susceptor 14 from being exhausted after the temperature of the gas is lowered, which may affect the heating function of the heat plate 10 or cause other damages, the gas blowing holes 1321 may be disposed in the gas pipe 132 at a portion outside the susceptor 14, i.e., the portion of the gas pipe 132 inside the susceptor 14 has no opening. For example, the air blowing holes 1321 may be opened on a portion between the adjacent susceptors 14 in the air duct 132. In practical applications, the number and the specific opening position of the air blowing holes 1321 may be set according to the actual size of the work table 12, the laying manner of the air pipes 132, the arrangement and specification of the base 14, and the actual cooling requirement.

The utility model also provides equipment for cooling the hot plate, which can comprise the assembly for cooling the hot plate and a circulating pump; wherein, at least one pipeline in the subassembly that is arranged in the hot plate cooling communicates with the circulating pump respectively, and this circulating pump can include coolant liquid circulating pump and/or inert gas circulating pump. Specifically, a coolant pipeline in the assembly is communicated with a coolant circulating pump, and an inert gas pipeline in the assembly is communicated with an inert gas circulating pump. Here, the communication means that the inlet of the pipe communicates with the outlet of the circulation pump and the outlet of the pipe communicates with the inlet of the circulation pump.

In at least some embodiments, the apparatus for platen cooling may further comprise a support plate and a lifting device, the support plate may be used to support the assembly for platen cooling; the lifting device may be configured to move the component for cooling the hot plate to be placed on and in contact with the table top of the hot plate at the start of cooling, and to move the component for cooling the hot plate from the table top of the hot plate to the support plate after cooling is completed. In some examples, a snap may be provided on the support plate, and the above-mentioned components may be fixed by the snap when placed on the support plate. In particular, these clips can fix part of the conduits of the above-mentioned assembly on the support plate, or can fix part of the bases in the above-mentioned assembly on the support plate, so as to achieve the fixation of the assembly for cooling the hot plate. In the present invention, the cooling liquid may be cooling water or other liquid having a relatively low temperature. Likewise, the inert gas may be nitrogen or other similar gas. The utility model is not limited thereto.

When the hot plate needs to be cooled, the base penetrating through the pipeline is uniformly placed on the workbench surface of the hot plate, and the cooling liquid and/or the inert gas is introduced into the pipeline, so that the hot plate can be directly cooled, the cooling speed of the hot plate can be effectively improved, and the cooling time of the hot plate can be shortened. And, can adopt the mode of gas-liquid combination to cool down according to actual demand, the cooling rate is faster, and the cooling rate can be regulated and control. Therefore, the assembly for cooling the hot plate provided by the utility model has the advantages of fast cooling, short time and adjustable cooling speed, is beneficial to fast switching use of the hot plate in processes with different temperatures, and can effectively improve the production efficiency.

The above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included therein.

Claims

1. An assembly for cooling a hot plate, capable of being removably laid on and in contact with a countertop of a hot plate, comprising:

2. Assembly for hotplate cooling according to claim 1, characterized in that the at least one duct comprises a liquid duct through which the cooling liquid can flow and/or a gas duct through which the inert gas can flow.

3. Assembly for hotplate cooling according to claim 2, characterized in that each base has a first through hole for the passage of the liquid duct and/or a second through hole for the passage of the gas duct, and in that the first through hole is parallel to the second through hole.

4. The assembly for reducing the temperature of a hot plate according to claim 1 or 3, wherein the base comprises a first portion and a second portion which are detachably combined, the first portion is provided with a first notch, the second portion is provided with a second notch, and the first notch and the second notch can form the through hole when the first portion and the second portion are buckled.

5. The assembly for reducing temperature of a hot plate as claimed in claim 1 or 3, wherein the base is an integrally formed block-shaped solid structure, and the through hole is formed in the block-shaped solid structure.

6. The assembly of claim 1, wherein the base is made of the same material as a countertop of the platen.

7. The assembly for hotplate cooling according to claim 1, wherein the plurality of pedestals are uniformly arranged along the tube with a gap between adjacent pedestals.

8. The assembly for cooling a hot plate as claimed in claim 2, wherein the at least one pipeline comprises a gas pipeline through which the inert gas can flow, and the gas pipeline is provided with a gas blowing hole facing the working table.

9. An apparatus for cooling a hot plate, comprising the assembly for cooling a hot plate according to any one of claims 1 to 8 and a circulation pump; at least one pipeline in the assembly for cooling the hot plate is communicated with the circulating pump respectively, and the circulating pump comprises a cooling liquid circulating pump and/or an inert gas circulating pump.

10. Apparatus for hotplate cooling according to claim 9, further comprising:

the supporting plate is used for supporting the component for cooling the hot plate;

a lifting device configured to move the component to be placed on and in contact with the table top of the hot plate at the start of cooling and to move the component from the table top of the hot plate to the support plate after cooling is completed.