CN215464453U

CN215464453U - Reaction device

Info

Publication number: CN215464453U
Application number: CN202121879639.3U
Authority: CN
Inventors: 谭大喜; 孙磊林; 李开金; 李青峰; 林文祥
Original assignee: MGI Tech Co Ltd
Current assignee: MGI Tech Co Ltd
Priority date: 2021-08-10
Filing date: 2021-08-10
Publication date: 2022-01-11
Anticipated expiration: 2031-08-10

Abstract

The present invention provides a reaction apparatus comprising: a reaction part including a reaction cup containing a reactant; the thermoelectric device is arranged below the reaction part and comprises an upper metal conductor, a lower metal conductor and a PN junction arranged between the upper metal conductor and the lower metal conductor, and the reaction part is in contact with the upper metal conductor; a heat exchanger disposed below the thermoelectric device, the heat exchanger being in contact with the lower metal conductor. The technical scheme of the application can effectively solve the problem that the semiconductor refrigerator in the related technology can not meet the requirement of high-speed temperature change and possibly causes the sample to deteriorate.

Description

Reaction device

Technical Field

The utility model relates to the field of reaction devices, in particular to a reaction device.

Background

In the related art, biochemical reactions generally need to be performed at a specific temperature. Taking PCR (Polymerase Chain Reaction) Reaction and quantitative fluorescence PCR Reaction as examples, TEC (Thermo Electric Cooler) is generally used for cooling when the Reaction is performed.

However, the existing TEC in the market at present has a heat conduction limitation, and it is difficult to greatly increase the temperature increase and decrease speed. The high-speed temperature change in the reaction process in the related technology has higher requirements, and the conventional semiconductor refrigerator cannot meet the requirement of high-speed temperature change, so that the sample is possibly deteriorated, and the accuracy of the reaction result is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a reaction device to solve the problem that a semiconductor refrigerator in the related art cannot meet the requirement of high-speed temperature change, and a sample is possibly deteriorated.

In order to achieve the above object, the present invention provides a reaction apparatus comprising: a reaction part including a reaction cup containing a reactant; the thermoelectric device is arranged below the reaction part and comprises an upper metal conductor, a lower metal conductor and a PN junction arranged between the upper metal conductor and the lower metal conductor, and the reaction part is in contact with the upper metal conductor; a heat exchanger disposed below the thermoelectric device, the heat exchanger being in contact with the lower metal conductor.

By applying the technical scheme of the utility model, the reaction device comprises a reaction part, a thermoelectric device and a heat exchanger which are sequentially arranged from top to bottom. Wherein the reaction part comprises a reaction cup for accommodating reactants to be reacted. The thermoelectric device is positioned below the reaction part and can refrigerate or heat the reaction part to provide proper reaction temperature for reactants in the reaction cup. Specifically, the thermoelectric device comprises an upper metal conductor, a lower metal conductor and a PN junction arranged between the upper metal conductor and the lower metal conductor, wherein the PN junction is electrically connected with the upper metal conductor and the lower metal conductor, and the Peltier effect can be generated after the thermoelectric device is electrified, so that one end of the thermoelectric device absorbs heat and the other end of the thermoelectric device releases heat (namely, one end where the upper metal conductor is located absorbs heat, one end where the lower metal conductor is located releases heat, or one end where the upper metal conductor is located releases heat and one end where the lower metal conductor is located absorbs heat). Go up metallic conductor and reaction portion direct contact, heat-conduction efficiency is high like this, can make reaction portion reach the temperature of predetermineeing fast, can effectively avoid being located the reactant deterioration in the reaction cup, guarantees reaction quality. The heat exchanger is arranged below the thermoelectric device and is in direct contact with the lower metal conductor, so that heat generated at one end of the lower metal conductor can be rapidly transferred, and the heat can be transferred with the outside or other equipment. Therefore, the technical scheme of the application can effectively solve the problem that the semiconductor refrigerator in the related art cannot meet the requirement of high-speed temperature change and possibly causes sample deterioration.

Further, the number of PN junctions is plural.

Furthermore, the number of the upper metal conductors and the number of the lower metal conductors are multiple, and the multiple PN junctions are connected in series through the multiple upper metal conductors and the multiple lower metal conductors.

Furthermore, the reaction part comprises a plurality of reaction cups, and the reaction part also comprises a first connecting seat, and the plurality of reaction cups are arranged on the first connecting seat.

Further, the reaction part also comprises a connecting sheet connected between two adjacent reaction cups.

Further, the heat exchanger includes a base and a flow channel extending through the base.

Furthermore, the heat exchanger also comprises a heating pipe mounting hole arranged on the base body.

Further, the heat exchanger includes a second connection seat and a plurality of fins disposed below the second connection seat and arranged in parallel.

Furthermore, the material of the upper metal conductor and/or the lower metal conductor is copper.

Further, the thermoelectric device further comprises a first conductive column and a second conductive column, wherein one of the first conductive column and the second conductive column is connected with the positive pole of the power supply, and the other one of the first conductive column and the second conductive column is connected with the negative pole of the power supply.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 shows a schematic perspective view of a first embodiment of a reaction apparatus according to the present invention;

FIG. 2 shows a schematic side view of the reaction apparatus of FIG. 1;

FIG. 3 shows an enlarged schematic view of the reaction apparatus of FIG. 2 at A;

FIG. 4 shows a schematic perspective view of a second embodiment of a reaction apparatus according to the present invention; and

fig. 5 shows a schematic cross-sectional view of the reaction apparatus of fig. 4.

Wherein the figures include the following reference numerals:

10. a reaction section; 11. a reaction cup; 12. a first connecting seat; 13. connecting sheets; 20. a thermoelectric device; 21. an upper metal conductor; 22. a lower metal conductor; 23. a PN junction; 24. a first conductive post; 25. a second conductive post; 30. a heat exchanger; 31. a substrate; 321. a flow channel; 322. a heating pipe mounting hole; 33. a second connecting seat; 34. and a fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Fig. 1 to 3 show schematic structural diagrams of a first embodiment of the present application, and a reaction apparatus of the present embodiment includes: a reaction part 10, a thermoelectric device 20, and a heat exchanger 30. Wherein, the reaction part 10 comprises a reaction cup 11 for accommodating reactants; the thermoelectric device 20 is disposed under the reaction part 10, the thermoelectric device 20 includes an upper metal conductor 21, a lower metal conductor 22, and a PN junction 23 disposed between the upper metal conductor 21 and the lower metal conductor 22, the reaction part 10 is in contact with the upper metal conductor 21; the heat exchanger 30 is disposed below the thermoelectric device 20, the heat exchanger 30 being in contact with the lower metal conductor 22.

By applying the technical solution of the present embodiment, the reaction device includes a reaction portion 10, a thermoelectric device 20, and a heat exchanger 30 sequentially arranged from top to bottom. Wherein the reaction part 10 includes a reaction cup 11 for accommodating a reactant to be reacted. The thermoelectric device 20 is located below the reaction part 10, and can cool or heat the reaction part 10 to provide a suitable reaction temperature for the reactant in the reaction cup 11. Specifically, the thermoelectric device 20 includes an upper metal conductor 21, a lower metal conductor 22, and a PN junction 23 disposed between the upper metal conductor 21 and the lower metal conductor 22, the PN junction 23 is electrically connected between the upper metal conductor 21 and the lower metal conductor 22, and a peltier effect can be generated after the thermoelectric device 20 is powered on, so that one end of the thermoelectric device 20 absorbs heat and the other end emits heat (i.e., one end where the upper metal conductor 21 is located absorbs heat, one end where the lower metal conductor 22 is located emits heat, or one end where the upper metal conductor 21 is located emits heat and one end where the lower metal conductor 22 is located absorbs heat). Go up metallic conductor 21 and reaction portion 10 direct contact, heat-conduction efficiency is high like this, can make reaction portion 10 reach the temperature of predetermineeing fast, can effectively avoid being located the reactant deterioration in reaction cup 11, guarantees reaction quality. The heat exchanger 30 is disposed under the thermoelectric device 20, and the heat exchanger 30 is in contact with the lower metal conductor 22, so that heat generated at one end of the lower metal conductor 22 can be rapidly transferred to and from the outside or other devices. Therefore, the technical scheme of the application can effectively solve the problem that the semiconductor refrigerator in the related art cannot meet the requirement of high-speed temperature change and possibly causes sample deterioration.

As shown in fig. 2 and 3, in the present embodiment, the number of PN junctions 23 is plural. The number of the upper metal conductors 21 and the number of the lower metal conductors 22 are plural, and the plurality of PN junctions 23 are connected in series by the plurality of upper metal conductors 21 and the plurality of lower metal conductors 22. As shown in fig. 3, one P-type semiconductor and one N-type semiconductor form one PN junction, and the thermoelectric device 20 internally includes a plurality of PN junctions and a plurality of upper and

lower metal conductors

21 and 22. The upper and

lower metal conductors

21 and 22 are alternately arranged, and a plurality of PN junctions 23 are connected in series, so that the peltier effect can be generated after the thermoelectric device 20 is powered on, so that the reaction part 10 can rapidly reach a preset temperature.

As shown in fig. 1 to 3, the reaction part 10 further includes a plurality of reaction cups 11, and the plurality of reaction cups 11 are disposed on the first coupling seat 12. In this embodiment, the reaction cup 11 is a cylindrical cup. Of course, the reaction cup may be an inverted cone-shaped cup with a gradually decreasing diameter from top to bottom according to the reaction requirement. In other possible embodiments, the reaction part may also directly purchase existing products on the market, such as 384-well PCR plates and the like.

As shown in fig. 1 to 3, the reaction part 10 further includes a connecting piece 13 connected between two adjacent reaction cups 11. The connecting piece 13 is provided to increase the strength of the reaction part 10 and to simplify the structure.

As shown in fig. 1 and 2, the heat exchanger 30 includes a second connection seat 33 and a plurality of fins 34 disposed below the second connection seat 33 and arranged in parallel. The reaction apparatus of the present embodiment is suitable for a scenario where heat exchange at the heat exchanger 30 side is performed using gas, and the heat exchange gas flows through gaps between the plurality of fins 34 to carry away heat generated at the heat exchanger 30 side or to neutralize cold generated at the heat exchanger 30 side.

In the present embodiment, the material of the upper metal conductor 21 and the lower metal conductor 22 is copper. Copper has good conductive performance and is a commonly used conductive material, and the upper metal conductor 21 and the lower metal conductor 22 made of copper can connect a plurality of PN junctions 23 in series, and can generate a peltier effect after the thermoelectric device 20 is powered on, so that the reaction part 10 can quickly reach a preset temperature.

In the present embodiment, the reaction portion 10 and the heat exchanger 30 are made of a material having high heat conduction efficiency, such as metal, heat conductive ceramic, or heat conductive polymer material, so that a good heat transfer effect can be achieved. When the reaction part 10 and the heat exchanger 30 are made of a conductive material such as aluminum, an insulating layer such as an alumina thin film is required to be provided on the surface thereof.

As shown in fig. 1 and 2, the thermoelectric device 20 further includes a first conductive pillar 24 and a second conductive pillar 25, one of the first conductive pillar 24 and the second conductive pillar 25 is connected to a positive electrode of a power supply, and the other is connected to a negative electrode of the power supply. The thermoelectric device 20 is connected to a power source through the first conductive pillar 24 and the second conductive pillar 25, and power is supplied to the thermoelectric device 20 so that the thermoelectric device 20 can cool or heat the end where the reaction part 10 is located. The first conductive posts 24 and the second conductive posts 25 are respectively connected to the positive and negative poles of the power supply, and the heat transfer direction in the entire thermoelectric device 20 can be changed by reversing the polarity of the power supply to which the first conductive posts 24 and the second conductive posts 25 are connected. For example, if the first conductive pillar 24 is connected to the positive power supply and the second conductive pillar 25 is connected to the negative power supply, and the end where the upper metal conductor 21 is located is a heat sink, when the first conductive pillar 24 is connected to the negative power supply and the second conductive pillar 25 is connected to the positive power supply, the end where the upper metal conductor 21 is located becomes a heat sink.

Fig. 4 and 5 show schematic structural views of a second embodiment of the reaction apparatus of the present application. The reaction apparatus of the second embodiment is different from the reaction apparatus of the first embodiment mainly in that the reaction apparatus of the second embodiment is suitable for a situation where heat exchange is performed at the heat exchanger 30 side by using a liquid.

As shown in fig. 4 and 5, the heat exchanger 30 includes a base 31 and a flow passage 321 that penetrates the base 31. The heat-exchanged liquid flows through the flow passage 321, and may take away heat generated from the heat exchanger 30 or neutralize cold generated from the heat exchanger 30.

As shown in fig. 4 and 5, the heat exchanger 30 further includes a heating pipe installation hole 322 provided in the base 31. Specifically, in the second embodiment, the heating pipe installation holes 322 are a plurality of blind holes disposed around the flow passage 321, the external heating pipe can be connected to the reaction device through the heating pipe installation holes 322, when one end of the reaction portion 10 of the reaction device needs to be heated, one end of the heat exchanger 30 is cooled, and the heating pipe can neutralize the cold generated at the end of the heat exchanger 30.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A reaction apparatus, comprising:

a reaction section (10) including a reaction cup (11) for containing a reactant;

a thermoelectric device (20) disposed below the reaction part (10), the thermoelectric device (20) including an upper metal conductor (21), a lower metal conductor (22), and a PN junction (23) disposed between the upper metal conductor (21) and the lower metal conductor (22), the reaction part (10) being in contact with the upper metal conductor (21);

a heat exchanger (30) disposed below the thermoelectric device (20), the heat exchanger (30) in contact with the lower metal conductor (22).

2. The reactor device according to claim 1, wherein the number of the PN junction (23) is plural.

3. The reactor according to claim 2, wherein the number of the upper metal conductor (21) and the lower metal conductor (22) is plural, and a plurality of the PN junctions (23) are connected in series by a plurality of the upper metal conductors (21) and a plurality of the lower metal conductors (22).

4. The reaction apparatus according to claim 1, wherein the reaction cup (11) is plural, the reaction part (10) further comprises a first connection seat (12), and the plural reaction cups (11) are provided on the first connection seat (12).

5. A reaction device according to claim 4, wherein the reaction part (10) further comprises a connecting piece (13) connected between two adjacent reaction cups (11).

6. A reactor device according to claim 1, wherein the heat exchanger (30) comprises a base body (31) and a flow channel (321) extending through the base body (31).

7. The reactor device as claimed in claim 6, wherein the heat exchanger (30) further comprises a heating pipe mounting hole (322) provided to the base body (31).

8. The reaction device according to claim 1, wherein the heat exchanger (30) includes a second connection seat (33) and a plurality of fins (34) disposed below the second connection seat (33) and arranged in parallel.

9. The reactor device according to any one of claims 1 to 8, wherein the upper metal conductor (21) and/or the lower metal conductor (22) is/are made of copper.

10. The reactor device according to any one of claims 1 to 8, wherein the thermoelectric device (20) further comprises a first conductive pillar (24) and a second conductive pillar (25), one of the first conductive pillar (24) and the second conductive pillar (25) being connected to a positive power supply and the other being connected to a negative power supply.