CN215460025U

CN215460025U - Semiconductor massage instrument

Info

Publication number: CN215460025U
Application number: CN202120191846.3U
Authority: CN
Inventors: 符石军
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-17
Filing date: 2021-01-17
Publication date: 2022-01-11
Anticipated expiration: 2031-01-17

Abstract

The utility model provides a semiconductor massager, which comprises a conduction assembly and a heat dissipation assembly, wherein the conduction assembly is provided with a semiconductor, the semiconductor comprises a refrigerating surface and a heat conduction surface arranged opposite to the refrigerating surface, the refrigerating surface is used for cold compress on skin, the heat conduction surface is connected with the heat dissipation assembly, the heat dissipation assembly comprises a metal shell used for heat dissipation and a radiating fin arranged in the metal shell, the metal shell dissipates heat to the air outside the shell, the heat generated by the semiconductor can be rapidly transferred to the air, so that the semiconductor can be continuously refrigerated, the human body is subjected to cold compress, and the effects of shrinking pores and compacting skin can be achieved.

Description

Semiconductor massage instrument

Technical Field

The utility model relates to the field of massage instruments and equipment, in particular to a semiconductor massage instrument.

Background

The refrigerated massage appearance product that has ice compress function of semiconductor in market's heat dissipation part is because of the shell is bad conductor parcel such as plastic, rubber, silica gel, restricts the heat inside the casing, is difficult for dispelling away, leads to the high temperature in the casing, and the refrigeration effect of semiconductor is not good.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model provides a semiconductor massage instrument which can obtain good heat dissipation effect and aims at solving the problem that the existing massage instrument with an ice compress function of semiconductor refrigeration has poor heat dissipation.

The utility model is realized by the following technical scheme:

the utility model provides a semiconductor massager which comprises a conduction assembly and a heat dissipation assembly, wherein the conduction assembly is provided with a semiconductor, the semiconductor comprises a refrigeration surface and a heat conduction surface arranged opposite to the refrigeration surface, the refrigeration surface is used for cold compress of skin, the heat conduction surface is connected with the heat dissipation assembly, the heat dissipation assembly comprises a metal shell used for heat dissipation and a heat dissipation sheet arranged inside the metal shell, and the metal shell dissipates heat to the air outside the shell.

Furthermore, the semiconductor massager also comprises a head shell and a handle which are connected through the metal shell.

Further, the heat dissipation assembly further includes a heat pipe that transfers the generated heat to the heat sink.

Further, the metal shell is cylindrical.

Furthermore, a vibration motor is arranged inside the head shell.

Furthermore, a semiconductor switch, a vibration switch and a DC socket are arranged in the handle.

Furthermore, the polarities of the positive electrode and the negative electrode of the semiconductor are reversed, so that the skin can be warmed.

The utility model has the beneficial effects that:

1. according to the utility model, the metal shell is used for dissipating heat to the air outside the shell, so that heat generated by the semiconductor can be quickly transferred to the air, the semiconductor can be continuously cooled, the skin of a human body is subjected to cold compress, and the effects of shrinking pores and tightening the skin can be achieved.

2. The icing effect of the semiconductor is controlled by adjusting the lengths of the different metal shells, so that different refrigeration requirements are met.

3. The vibration motor is arranged in the head shell, so that vibration is generated when the head shell contacts the skin of a human body, and the massage and health care effects are achieved.

4. The skin can be warmed by reversing the polarity of the semiconductor anode and cathode.

Drawings

FIG. 1 is a schematic perspective view of the present invention

FIG. 2 is an exploded view of the present invention

FIG. 3 is a cross-sectional view of the present invention

FIG. 4 is a diagram of a semiconductor structure of the present invention

FIG. 5 is a schematic diagram of a semiconductor switch structure according to the present invention

The following are the part symbol designations of the utility model:

the heat dissipation device comprises a conduction assembly 1, a conduction block 11, a head shell 12, a protruding position 121, a semiconductor 13, a refrigerating surface 131, a heat conduction surface 132, a vibration motor 14, a waterproof rubber ring 15, a heat dissipation assembly 2, a heat conduction block 21, a heat conduction block hole 211, a heat pipe 22, a heat dissipation sheet 23, a metal shell 24, a handle assembly 3, a handle 31, a sleeving position 311, a semiconductor switch 32, a 0 gear 322, a 1 gear 323, a 2 gear 321, a vibration switch 33 and a DC socket 34

Detailed Description

In order to more clearly and completely explain the technical scheme of the utility model, the utility model is further explained with reference to the attached drawings.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it is to be understood that the terms "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "inner", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only used for the purpose of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated; thus, the definitions of "first", "second", "third", "fourth" are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly including one or more of such features.

Referring to fig. 1 to 3, the present invention provides a semiconductor massage device, which includes a head housing 12 and a handle 31, and is connected through a metal housing 24, wherein the head housing 12 and the metal housing 24 are connected in an insertion manner.

Specifically, the head shell 12 is provided with an extending position 121, a waterproof rubber ring 15 is installed on the extending position 121, the metal shell 24 is sleeved on the periphery of the extending position 121 of the head shell 12, and the inner wall of the metal shell 24 is in interference tight fit with the waterproof rubber ring 15, so that the head shell 12 and the metal shell 24 form a closed waterproof structure, and water is prevented in the using process. The inner hole of the handle 31 is provided with a nesting position 311, and the other end of the metal shell 24 is nested in the nesting position 311 of the handle 31, so that the metal shell 24 and the handle 31 form a whole. Thus, the head case 12, the metal shell 24 and the handle 31 constitute the overall external structure of the semiconductor massage device.

Referring to fig. 1 to 3, the semiconductor massage device includes a conduction assembly 1 and a heat dissipation assembly 2, the conduction assembly 1 includes a semiconductor 13 and a conduction block 11, the semiconductor 13 includes a cooling surface 131, the cooling surface 131 is attached to the conduction block 11, the conduction block 11 is exposed out of the head shell and contacts with the skin, and cold flow generated by the cooling surface 131 of the semiconductor 13 passes through the conduction block 11 to cool the skin. The semiconductor 13 generates a large amount of heat while generating a cold flow, and heat dissipation is required to continuously generate the cold flow. The surface of the semiconductor 13 opposite to the refrigerating surface 131 is a heat conducting surface 132, the heat conducting surface 132 is connected with the heat dissipation assembly 2, and heat generated by the semiconductor 13 is quickly conducted to the heat dissipation assembly 2, so that the semiconductor 13 can be effectively refrigerated.

The heat dissipation assembly 2 comprises a metal shell 24 for dissipating heat and a heat dissipation fin 23 arranged inside the metal shell 24, wherein the metal shell 24 dissipates heat to the air outside the shell.

In order to enable the semiconductor 13 to continuously generate cold flow to refrigerate the skin, the refrigeration surface 131 always keeps a low-temperature state of 5-15 degrees, the heat of the heat conduction surface 132 needs to be continuously dissipated, if the temperature of the heat conduction surface 132 exceeds more than 60 degrees, the refrigeration effect of the semiconductor 13 will be poor, the heat dissipation is poor, and the refrigeration effect of the semiconductor 13 will be poor, so that the semiconductor massage instrument provides the heat dissipation assembly 2 which can continuously dissipate heat and has stable heat dissipation.

Specifically, the heat dissipation assembly 2 is provided with a heat transfer block 21 and a heat pipe 22, the heat transfer block 21 is provided with a heat transfer block hole 211, the heat conduction surface 132 of the semiconductor 13 is well attached to the heat transfer block 21, the heat pipe 22 is inserted into the heat transfer block hole 211, and the heat pipe 22 is connected with the heat dissipation fin 23, so that heat generated by the semiconductor 13 passes through the heat transfer block 21 and the heat pipe 22 along the heat conduction surface 132 and then reaches the heat dissipation fin 23, and the heat dissipation fin 23 is a plurality of strip-shaped sheet bodies and can meet the heat dissipation requirement. The heat dissipation assembly 2 further comprises a metal shell 24 for heat dissipation, the metal shell 24 covers and wraps the heat dissipation fins 23, the metal shell 24 has a good heat dissipation effect, and the material of the metal shell can be aluminum, copper, silver, stainless steel, iron and the like. Aluminum and stainless steel are preferable from the viewpoint of cost, heat radiation effect, and practicality. The metal shell 24 is exposed in the air to perform heat exchange with the outside air, and since the metal shell 24 covers and wraps the heat dissipation fins 23, the heat received by the heat dissipation fins 23 from the semiconductor 13 can be transferred to the metal shell 24, and the heat is continuously transferred to the ambient air outside the shell through the metal shell 24. Therefore, the heat of the semiconductor 13 is transferred to the metal shell 24 through the heat conduction surface 132, the heat transfer block 21, the heat pipe 22 and the heat sink 23, and the heat of the metal shell 24 is transferred to the air outside the shell, so that the temperature of the heat conduction surface 132 is not too high and is kept below 45 ℃, the cooling surface 131 is also kept in a low-temperature state for a long time, and the semiconductor 13 is continuously cooled.

The metal shell 24 can continuously generate heat transfer with the air outside the shell, so that heat is dissipated from the inside of the shell, continuous refrigeration of the semiconductor 13 can be met, a fan is not needed to dissipate heat of the radiating fins 23, structural components of a product are reduced, and the structural cost is reduced.

Further, referring to fig. 2, the heat dissipation assembly 2 further includes a heat pipe 22, and the heat pipe 22 transfers the generated heat to the heat sink 23.

Specifically, the heat pipe 22 is a vacuum copper pipe with extremely high thermal conductivity, and has an effect of rapid heat transfer, the heat pipe 22 is inserted into the heat transfer block hole 211, the heat pipe 22 is connected with the heat sink 23, and the heat of the heat transfer block 21 of the semiconductor 13 can be rapidly transferred to the heat sink and then transferred to the metal shell 24, so that the semiconductor massager can be further ensured to stably dissipate heat, the heat dissipation efficiency is improved, and the semiconductor 13 can be ensured to continuously generate cold flow to refrigerate the skin.

Further, referring to fig. 1, the metal housing 24 is cylindrical.

Specifically, the shape of the tube may be a circular tube shape, a square tube shape, an elliptical tube shape, or a special tube shape. The length of the metal shell 24 can be conveniently set, when the shorter metal shell 24 is set, the heat dissipation effect is poorer, the refrigerating power of the semiconductor 13 can be adjusted to be lower, and the requirement of low refrigerating requirement is met; when the metal shell 24 is longer, the heat dissipation effect will be better, and the refrigeration power of the semiconductor 13 can be increased, so as to meet the requirement of high refrigeration requirement. Generally, the length of the metal shell 24 may be in the range of 100mm to 400 mm. The length of the metal shell 24 can be conveniently made according to the refrigeration requirement of the semiconductor 13 during production.

Further, referring to fig. 3, a vibration motor 14 is disposed inside the head housing 12. Specifically, in order to facilitate better experience when the massage apparatus with ice feeling is used by a consumer, the vibration motor 14 is arranged inside the head shell 12, and when the conduction block 11 on the head shell 12 slides on the skin surface, vibration is generated when the conduction block contacts the skin surface of a human body, so that the massage apparatus has the functions of massage and health care.

Further, referring to fig. 2 and 3, a semiconductor switch 32, a vibration switch 33, and a DC socket 34 are disposed in the handle 31. The handle can be plastic, rubber, silica gel and other materials with poor heat conductivity. In one embodiment, when an operator uses the semiconductor massage apparatus, the operator needs to hold the semiconductor massage apparatus by hand to perform cold compress on the skin, since the metal shell 24 is a heat dissipation body, the temperature is between 35 and 45 degrees, in order to isolate the heat of the metal shell 24 from being transferred to the hand, the sleeving position 311 of the handle 31 is sleeved in the metal shell 24, so that the metal shell 24 and the handle 31 form a whole, and the hand can hold the position of the handle 31 to operate the semiconductor massage apparatus to perform cold compress on the skin. The handle, the semiconductor switch 32, the vibration switch 33 and the DC socket 34 form a handle assembly 3 for operating the semiconductor massage apparatus.

Referring to fig. 1 to 3, in an embodiment, the handle 31 is grasped by a hand, a power supply is inserted into the DC socket 34, the semiconductor switch 32 is pulled from the 0 th gear 322 to the 1 st gear 323, the semiconductor 13 is connected to cool the semiconductor 13, the cooling surface 131 of the semiconductor generates cold flow, and the generated cold flow is transmitted to the skin of a human body through the conductive block 11 to cool the skin, so as to achieve the effects of shrinking pores and tightening the skin. Because the heat dissipation assembly 2 dissipates heat to the air outside the shell through the metal shell 24, the semiconductor 13 can be kept to refrigerate continuously, and the conduction block 11 can continuously release cold flow to refrigerate the skin when moving back and forth on the skin. The vibration switch 33 is turned on to start the vibration motor 14, so as to play a vibration health care massage role on the skin of the human body when the conduction block 11 moves back and forth on the skin.

Further, referring to fig. 4 and 5, the power source is inserted into the DC socket 34, the semiconductor switch 32 is pulled from the 0 th position 322 to the 2 nd position 321, the polarities of the positive electrode and the negative electrode of the semiconductor 13 are switched by the switching control of the circuit, the cooling surface 131 generates heat flow, and the heat flow is transmitted by the conductive block 11 to warm the skin, so as to increase the local skin temperature, expand the capillary vessels, promote the local blood circulation, and have a good effect on poor blood circulation and muscle spasm. The heat sink assembly 2 likewise becomes an assembly which delivers a cold flow.

The semiconductor massage instrument provided by the utility model has the following advantages:

according to the utility model, the metal shell in the heat dissipation assembly exchanges heat with the external air and dissipates heat to the air outside the shell, so that heat generated by the semiconductor can be dissipated into the air quickly, the semiconductor can be cooled continuously, the human body is subjected to cold compress, and the effects of shrinking pores and tightening skin can be achieved.

Because the metal shell dissipates heat to the external air of the shell, the continuous refrigeration requirement of the semiconductor can be met, and the icing effect of the semiconductor can be controlled by adjusting the lengths of different metal shells, so that different refrigeration requirements can be met.

Because the heat dissipation assembly is also provided with the heat pipe, heat can be quickly transferred, heat dissipation is stable, and heat dissipation efficiency is improved.

Because the vibration motor is arranged in the head shell, the vibration massage health-care function is generated when the head shell contacts the skin surface of a human body.

By exchanging the refrigerating surface and the heat conducting surface of the semiconductor, the skin can be warmed, so that the local skin temperature is raised, the blood capillaries are expanded, and the local blood circulation is promoted.

Of course, the present invention may have other embodiments, and those skilled in the art can obtain other embodiments without any inventive work, and the embodiments are within the protection scope of the present invention.

Claims

1. The semiconductor massager is characterized by comprising a conduction assembly and a heat dissipation assembly, wherein the conduction assembly is provided with a semiconductor, the semiconductor comprises a refrigerating surface and a heat conduction surface opposite to the refrigerating surface, and the refrigerating surface is used for cold compress on skin; the heat conducting surface is connected with the heat radiating assembly, the heat radiating assembly comprises a metal shell for radiating heat and radiating fins arranged inside the metal shell, and the metal shell radiates heat to the air outside the shell.

2. The semiconductor massager of claim 1, further comprising a head housing and a handle, and connected by the metal housing.

3. The semiconductor massager of claim 1, wherein the heat dissipation assembly further comprises a heat pipe that transfers the generated heat to the heat sink.

4. The semiconductor massager of claim 1 wherein the metal housing is cylindrical.

5. The semiconductor massage apparatus as recited in claim 2, wherein the head housing is provided therein with a vibration motor.

6. The semiconductor massage apparatus as claimed in claim 2, wherein the handle is provided with a semiconductor switch, a vibration switch, and a DC socket.

7. The semiconductor massager of claim 1, wherein the polarities of the positive and negative electrodes of the semiconductor are reversed to warm the skin.