CN215421306U

CN215421306U - Heat radiator

Info

Publication number: CN215421306U
Application number: CN202120576608.4U
Authority: CN
Inventors: 方庆; 康伟; 王绪栋; 郭东明
Original assignee: Shenzhen TCL New Technology Co Ltd
Current assignee: Shenzhen TCL New Technology Co Ltd
Priority date: 2021-03-19
Filing date: 2021-03-19
Publication date: 2022-01-04
Anticipated expiration: 2031-03-19

Abstract

The utility model discloses a radiator, belongs to the technical field of electric appliances, and is designed for solving the problem that the existing radiator cannot be applied to a circuit board with higher components. The radiator can radiate heat of the circuit board and comprises a base, wherein the base can be connected to the circuit board, and at least part of the structure of the base is sunken along the direction far away from the circuit board to form an avoiding part. The space formed between the avoiding part of the radiator and the circuit board is larger, higher components can be accommodated, the application range is wider, and the typesetting and routing difficulty of each component on the circuit board is reduced; the bottom surface of the avoiding part is far away from the components on the circuit board, so that signal crosstalk can be effectively avoided; the design of dodging the portion is favorable to the circulation of air, improves the radiating efficiency.

Description

Heat radiator

Technical Field

The utility model relates to the technical field of electric appliances, in particular to a radiator.

Background

In an electrical device such as a television, a circuit board (or referred to as a PCB) is generally provided, and a device such as a chip is mounted on the circuit board to realize various functions of the electrical device such as the television. When the chip works, heat is generated, and when the heat is accumulated too much, the working state of the chip is affected. Therefore, a heat dissipation member needs to be installed on the chip to dissipate the heat on the chip in time.

As shown in fig. 1, most of the conventional heat dissipation members 100 have a rectangular cross section or a double-layer structure with a vertical rod added in the rectangular cross section, a chip 200 is soldered on a circuit board 300, the heat dissipation member 100 is mounted on the chip 200, heat on the chip 200 is transferred to the heat dissipation member 100 through contact, and then the heat dissipation member 100 dissipates the heat to the surrounding environment.

The defects of the heat sink 100 include: 1. the distance between the bottom surface of the heat sink 100 and the circuit board 300 is small, and no component higher than the chip 200 exists in the range of the heat sink 100, otherwise the bottom surface of the heat sink 100 cannot be attached to the chip 200, so that the typesetting difficulty of the circuit board 300 is increased; 2. the bottom surface of the heat sink 100 is lower, which causes the heat sink 100 to be close to the circuit around the chip 200, and is easy to cause signal crosstalk and electromagnetic radiation; 3. the double-layer structure results in that the central position of the heat sink 100 cannot be perforated, which is inconvenient for detection.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a radiator with a wider application range.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a radiator, can be for the circuit board heat dissipation, includes the base, the base can connect in the circuit board, at least partial structure of base is along keeping away from the sunken portion of dodging that forms of direction of circuit board.

Particularly, dodge the portion including setting up respectively the first portion of dodging and the second of base both sides dodge the portion, first dodge and form first ventilation hole between portion and the roof, the second dodges and forms the second ventilation hole between portion and the roof.

In particular, the top wall includes a first top wall and a second top wall, a bottom edge of the first top wall is connected to the base or the first avoidance portion, and a bottom edge of the second top wall is connected to the base or the second avoidance portion.

Particularly, a detection hole is formed in the base and is located between the first avoidance portion and the second avoidance portion.

In particular, the first top wall and/or the second top wall are arch-bridge shaped.

Particularly, the bottom edge of the first top wall is connected to the base, and a first auxiliary vent hole is formed between the side surface of the first top wall and the side surface of the first avoidance part.

Particularly, the bottom edge of the second top wall is connected to the base, and a second auxiliary vent hole is formed between the side surface of the second top wall and the side surface of the second avoidance part.

In particular, the inner vertical wall of the first top wall close to the center of the base on the first top wall is an inclined plane, the inner vertical wall of the second top wall close to the center of the base on the second top wall is an inclined plane, and the distance between the inner vertical wall of the first top wall and the inner vertical wall of the second top wall increases along the direction far away from the base.

In particular, a heat dissipation coating is formed on the outer surface of the top wall in a spraying mode.

Particularly, one side edge of the base is connected with the bottom edge of the first avoiding part, and the other side edge of the base is connected with the bottom edge of the second avoiding part.

At least part of the structure of the base of the radiator is recessed along the direction far away from the circuit board to form an avoiding part, the avoiding part enables the space above the circuit board to be larger, higher components can be accommodated, the application range is wider, and the typesetting and routing difficulty of each component on the circuit board is reduced; the bottom surface of the avoiding part is far away from the components on the circuit board, so that signal crosstalk can be effectively avoided; the design of dodging the portion is favorable to the circulation of air, improves the radiating efficiency.

Drawings

FIG. 1 is a schematic view of a conventional heat sink in use;

FIG. 2 is a schematic view of a heat sink provided in accordance with an embodiment of the present invention;

FIG. 3 is a front view of a heat sink provided in accordance with an embodiment of the present invention;

FIG. 4 is a top view of a heat sink provided in accordance with an embodiment of the present invention;

fig. 5 to 8 are front views of modified structures of a heat sink according to embodiments of the present invention.

In the figure:

1. a base; 2. a first avoidance portion; 3. a second avoidance portion; 4. a first vent hole; 5. a second vent hole; 6. a first top wall; 7. a second top wall; 8. a first auxiliary vent hole; 9. a second auxiliary vent; 11. a detection hole; 61. a first top wall inner vertical wall; 71. a second top wall inner vertical wall; 100. a heat sink; 200. a chip; 300. a circuit board.

Detailed Description

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

The embodiment discloses a heat radiator for radiating heat of a circuit board. As shown in fig. 2 to 8, the heat sink includes a base 1, the base 1 can be connected to a circuit board, and at least a part of the base 1 is recessed in a direction away from the circuit board to form an escape portion. Preferably, the circuit board includes a chip disposed thereon, and the heat sink is attached to the chip, thereby more effectively reducing the temperature on the chip.

The specific shape of the avoiding part is not limited, and the space can be increased for the circuit board below. Preferably, dodge the portion including set up respectively in base 1 both sides first dodge portion 2 and the second dodge portion 3, first dodge portion 2 and roof between form first ventilation hole 4, the second dodge portion 3 and roof between form second ventilation hole 5. Preferably, the first avoidance part 2 and the second avoidance part 3 are symmetrically arranged relative to the base 1, so that the processing is more convenient, and the installation efficiency is high. The specific shape of the first escape portion 2 and the second escape portion 3 is not limited, and any shape may be used as long as the distance between the first escape portion and the lower circuit board is increased, and preferably, the shape is a straight line extending obliquely upward, a curved line extending obliquely upward, or an arch bridge shape. All shown in fig. 2 to 8 are arch-bridge shaped.

Compared with a planar structure, the upward bending shape of the first avoiding part 2 and the second avoiding part 3 can increase the space above the circuit board, can accommodate higher components and reduce the typesetting and routing difficulty of each component on the circuit board; the bottom surfaces of the first avoiding part 2 and the second avoiding part 3 are far away from components on the circuit board, so that signal crosstalk can be effectively avoided; the first ventilation holes 4 and the second ventilation holes 5 are beneficial to the circulation of air, and the heat dissipation efficiency is improved.

On the basis of the structure, the top wall comprises a first top wall 6 and a second top wall 7, the bottom edge of the first top wall 6 is connected to the base 1 or the first avoiding part 2, and the bottom edge of the second top wall 7 is connected to the base 1 or the second avoiding part 3.

The first top wall 6 and the second top wall 7 form a structure similar to an M shape, and the area for heat radiation is larger, and the heat radiation effect is better. An air passing channel is formed between the first top wall 6 and the second top wall 7, and the air passing channel is the same as the first vent hole 4 and the second vent hole 5, so that the contact area of the airflow and the radiator is increased, and the heat radiation capacity is further enhanced.

After the top wall is divided into a first top wall 6 and a second top wall 7, and the first top wall 6 and the second top wall 7 form an M-shaped structure, the base 1 is an open single-layer structure. The base 1 is provided with the detection hole 11 between the first avoidance part 2 and the second avoidance part 3, so that the detection requirements of a factory are facilitated.

The specific shape of the first top wall 6 and the second top wall 7 is not limited, and preferably, the first top wall 6 and the second top wall 7 are both in an arch bridge shape, so that the surface area for radiating heat is increased, and the heat dissipation effect is better. The first top wall inner vertical wall 61 on the first top wall 6 close to the center of the base 1 is an inclined surface, the second top wall inner vertical wall 71 on the second top wall 7 close to the center of the base 1 is an inclined surface, and the distance between the first top wall inner vertical wall 61 and the second top wall inner vertical wall 71 increases along the direction away from the base 1. Under the unchangeable condition of vertical height, the inclined plane is bigger than the area of vertical face, and the radiating effect is better.

The width of the base 1 is not limited, and in order to increase the contact area between the base 1 and the chip, as shown in fig. 6, the base 1 may be appropriately widened; in order to avoid interference between the base 1 and components on the circuit board, as shown in fig. 3, 5, 7 and 8, one side edge of the base 1 is connected with the bottom edge of the first avoiding part 2, the other side edge of the base 1 is connected with the bottom edge of the second avoiding part 3, the space at the bottom of the first avoiding part 2 and the bottom of the second avoiding part 3 is opened as much as possible to accommodate higher components on the circuit board, and the application range is wider.

In addition to the above configuration, as shown in fig. 8, the bottom side of the first ceiling wall 6 is connected to the base 1, and a first auxiliary vent hole 8 is formed between the side surface of the first ceiling wall 6 and the side surface of the first escape portion 2. The bottom edge of the second top wall 7 is connected to the base 1, and a second auxiliary vent hole 9 is formed between the side surface of the second top wall 7 and the side surface of the second escape part 3. The first auxiliary ventilation hole 8 and the second auxiliary ventilation hole 9 can increase the contact area of the air flow and the radiator, and improve the radiating efficiency.

On the basis of the structure, the heat dissipation coating is formed on the outer surface of the top wall in a spraying mode, heat dissipation efficiency is further improved, and the television and other electric appliances are guaranteed to be in a good working environment.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. The utility model provides a radiator, can be for the circuit board heat dissipation, characterized in that, includes base (1), base (1) can connect in the circuit board, at least partial structure of base (1) is along keeping away from the sunken portion of dodging that forms of direction of circuit board.

2. The radiator according to claim 1, wherein the avoiding portion comprises a first avoiding portion (2) and a second avoiding portion (3) which are respectively arranged at two sides of the base (1), a first vent hole (4) is formed between the first avoiding portion (2) and the top wall, and a second vent hole (5) is formed between the second avoiding portion (3) and the top wall.

3. A radiator according to claim 2, wherein the top wall comprises a first top wall (6) and a second top wall (7), the bottom edge of the first top wall (6) is connected to the base (1) or to the first escape portion (2), and the bottom edge of the second top wall (7) is connected to the base (1) or to the second escape portion (3).

4. A radiator according to claim 3, wherein the base (1) is provided with a detection hole (11), and the detection hole (11) is located between the first avoidance portion (2) and the second avoidance portion (3).

5. A radiator according to claim 3, characterised in that said first top wall (6) and/or said second top wall (7) are arched.

6. A radiator according to claim 3, wherein the bottom edge of the first top wall (6) is connected to the base (1), and a first auxiliary vent hole (8) is formed between the side surface of the first top wall (6) and the side surface of the first escape part (2).

7. A radiator according to claim 3, wherein the bottom edge of the second top wall (7) is connected to the base (1), and a second auxiliary vent hole (9) is formed between the side surface of the second top wall (7) and the side surface of the second escape portion (3).

8. A heat sink according to claim 3, characterised in that the first top wall inner vertical wall (61) on the first top wall (6) near the centre of the base (1) is bevelled, and the second top wall inner vertical wall (71) on the second top wall (7) near the centre of the base (1) is bevelled, the distance between the first top wall inner vertical wall (61) and the second top wall inner vertical wall (71) increasing in a direction away from the base (1).

9. The heat sink as claimed in any one of claims 2 to 8, wherein a heat dissipating coating is spray formed on an outer surface of the top wall.

10. A radiator according to any one of claims 2 to 8, wherein one side edge of the base (1) is connected to the bottom edge of the first avoidance portion (2), and the other side edge of the base (1) is connected to the bottom edge of the second avoidance portion (3).