CN215397401U - Flexible copper clad laminate - Google Patents
Flexible copper clad laminate Download PDFInfo
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- CN215397401U CN215397401U CN202121308108.9U CN202121308108U CN215397401U CN 215397401 U CN215397401 U CN 215397401U CN 202121308108 U CN202121308108 U CN 202121308108U CN 215397401 U CN215397401 U CN 215397401U
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Abstract
The utility model relates to the technical field of copper clad plates, and provides a flexible copper clad plate which comprises a copper foil, a base film and adhesive layers, wherein the copper foil is arranged above the base film, the adhesive layers are arranged between the base film and the copper foil, a buffer structure is arranged between the adhesive layers and comprises a buffer layer and a honeycomb cushion pad, the buffer layer is arranged between the two groups of adhesive layers, the honeycomb cushion pad is arranged inside the buffer layer, a plurality of holes are designed on the surface of the honeycomb cushion pad, a toughness structure is arranged between the base film and the adhesive layers, the toughness structure comprises a graphite sheet, a polyurethane elastomer and a glass fiber material, and the graphite sheet is arranged between the base film and the adhesive layers.
Description
Technical Field
The utility model relates to the technical field of copper clad plates, in particular to a flexible copper clad plate.
Background
The flexible copper clad laminate is a composite material, which is mainly used by covering a copper foil with a base film material, has very wide application, and is used in various electronic products and large-scale equipment;
for this reason, patent publication No. CN20238885U discloses a flexible copper clad laminate, which is a multilayer composite structure and includes a copper foil layer, a thermosetting polyimide layer, an adhesive layer and an insulating base film layer, wherein the adhesive layer is bonded between the insulating base film layer and the thermosetting polyimide layer, and the copper foil layer is located on the thermosetting polyimide layer. According to the flexible copper clad laminate, the thermosetting polyimide layer is added between the copper foil layer and the adhesive layer, so that the insulating base film layer of the board is directly contacted with the copper foil layer by the thermosetting polyimide instead of the adhesive, and the flexible copper clad laminate has excellent heat resistance, heat aging resistance, flame retardance and chemical resistance, is easy to manufacture, has moderate material cost, and is very suitable for manufacturing flexible printed circuit boards with high requirements on heat resistance and heat aging resistance.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a flexible copper clad laminate, which is used for solving the defects that the existing flexible copper clad laminate does not have buffer performance, is easy to be extruded in the using process and is easy to cause damage of the copper clad laminate.
In order to solve the technical problems, the utility model provides the following technical scheme: the flexible copper clad laminate comprises a copper foil, a base film and an adhesive layer, wherein the copper foil is arranged above the base film;
an adhesive layer is arranged between the base film and the copper foil;
a buffer structure is arranged between the adhesive layers and comprises a buffer layer and a honeycomb cushion pad, and the buffer layer is arranged between the two adhesive layers.
Preferably, the top end of the copper foil is provided with a heat conduction structure, the heat conduction structure comprises a heat conduction metal sheet, a heat conduction silica gel sheet and heat conduction silicone grease, and the heat conduction metal sheet is arranged on the top end of the copper foil.
Preferably, a flexible structure is arranged between the base film and the adhesive layer, the flexible structure comprises a graphite sheet, a polyurethane elastomer and a glass fiber material, and the graphite sheet is arranged between the base film and the adhesive layer.
Preferably, the bottom of the graphite sheet is provided with a polyurethane elastomer, a glass fiber material is arranged below the polyurethane elastomer, and the graphite sheet, the polyurethane elastomer and the glass fiber material are attached to each other.
Preferably, a heat-conducting silicone sheet is arranged between the heat-conducting metal sheet and the copper foil, heat-conducting silicone grease is arranged below the heat-conducting silicone sheet, and the heat-conducting silicone grease is coated on the surface of the heat-conducting silicone sheet.
Preferably, a honeycomb cushion pad is arranged inside the buffer layer, and a plurality of holes are designed on the surface of the honeycomb cushion pad.
The flexible copper clad laminate provided by the utility model has the advantages that: by arranging the buffer structure, the buffer layer is additionally arranged between the adhesive layers at the bottom of the copper foil, the honeycomb cushion pad is filled in the buffer layer, and the holes on the surface of the honeycomb cushion pad are utilized, so that the holes on the surface are contracted and close to each other when being extruded, and a good buffer effect is achieved;
by arranging the toughness structure, the graphite flake is arranged between the adhesive layer and the base film, and the polyurethane elastomer and the glass fiber material are arranged below the graphite flake, so that the materials have good toughness, and the toughness of the tube plate can be effectively improved when the tube plate is used, so that the tube plate can be folded;
through being provided with heat conduction structure, be provided with the heat conduction sheetmetal on the surface of copper foil, the below of heat conduction sheetmetal is provided with the heat conduction silica gel piece and the coating has heat conduction silicone grease, utilizes heat conduction sheetmetal and heat conduction silica gel piece etc. to carry out good heat conduction, plays quick heat conduction effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic cross-sectional structural view of a ductile structure according to the present invention;
FIG. 4 is a schematic cross-sectional view of a heat conducting structure according to the present invention;
fig. 5 is a schematic top view of the present invention.
The reference numerals in the figures illustrate: 1. copper foil; 2. a base film; 3. a ductile structure; 301. a graphite sheet; 302. a polyurethane elastomer; 303. a glass fiber material; 4. a heat conducting structure; 401. a heat conductive metal sheet; 402. a heat-conducting silica gel sheet; 403. heat-conducting silicone grease; 5. an adhesive layer; 6. a buffer structure; 601. a buffer layer; 602. a honeycomb cushion.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the flexible copper clad laminate provided by the utility model comprises a copper foil 1, a base film 2 and an adhesive layer 5, wherein the copper foil 1 is arranged above the base film 2, the adhesive layer 5 is arranged between the base film 2 and the copper foil 1, a buffer structure 6 is arranged between the adhesive layers 5, the buffer structure 6 comprises a buffer layer 601 and a honeycomb cushion 602, the buffer layer 601 is arranged between the two groups of adhesive layers 5, the honeycomb cushion 602 is arranged in the buffer layer 601, and the surface of the honeycomb cushion 602 is provided with a plurality of holes;
when the structure is used, the honeycomb cushion 602 and the holes on the surface of the honeycomb cushion can be used for buffering in the extrusion process, so that good buffering performance is achieved, and meanwhile, the honeycomb cushion 602 is designed in a metal wire structure, so that the conductive effect is not influenced;
the top end of the copper foil 1 is provided with a heat conduction structure 4, the heat conduction structure 4 comprises a heat conduction metal sheet 401, a heat conduction silicon sheet 402 and heat conduction silicone grease 403, the heat conduction metal sheet 401 is arranged at the top end of the copper foil 1, the heat conduction silicon sheet 402 is arranged between the heat conduction metal sheet 401 and the copper foil 1, the heat conduction silicone grease 403 is arranged below the heat conduction silicon sheet 402, and the heat conduction silicone grease 403 is coated on the surface of the heat conduction silicon sheet 402;
when the structure is used, the surface of the copper foil 1 is provided with the heat-conducting metal sheet 401, the heat-conducting silicone sheet 402 and the heat-conducting silicone grease 403 are coated below the heat-conducting metal sheet 401, good heat conduction can be performed by utilizing the heat-conducting metal sheet 401, the heat-conducting silicone sheet 402 and the like, and a quick heat conduction effect is achieved;
a flexible structure 3 is arranged between the base film 2 and the adhesive layer 5, the flexible structure 3 comprises a graphite sheet 301, a polyurethane elastomer 302 and a glass fiber material 303, the graphite sheet 301 is arranged between the base film 2 and the adhesive layer 5, the polyurethane elastomer 302 is arranged at the bottom of the graphite sheet 301, the glass fiber material 303 is arranged below the polyurethane elastomer 302, and the graphite sheet 301, the polyurethane elastomer 302 and the glass fiber material 303 are attached to each other;
when the structure is used, the graphite sheet 301, the polyurethane elastomer 302 and the glass fiber material 303 have good toughness and ductility, and are not easy to break when being folded, so that the structure is added to the copper plate to improve the toughness of the whole copper plate.
The working principle is as follows: when the copper plate is used, firstly, the copper plate is taken to a required position, a good heat conduction effect can be achieved by utilizing the heat conduction metal sheet 401 above the copper foil 1, and the heat conduction silicone sheet 402 and the heat conduction silicone grease 403 are arranged below the heat conduction metal sheet 401, so that the whole copper plate can conduct heat conduction quickly;
secondly, a graphite sheet 301, a polyurethane elastomer 302 and a glass fiber material 303 are arranged between the adhesive layer 5 and the base film 2, have good toughness and ductility, are not easy to break when being folded, and are added to the copper plate to improve the toughness of the whole copper plate;
finally, add honeycomb blotter 602 between adhesive layer 5, utilize honeycomb blotter 602 and the hole on its surface can carry out the buffering operation in the extrusion process, play good shock-absorbing capacity, honeycomb blotter 602 adopts the design of wire structure simultaneously, does not influence electrically conductive effect, finally accomplishes this use work that is used for.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. The utility model provides a flexible copper-clad plate, includes copper foil (1), base film (2) and adhesive layer (5), its characterized in that: a copper foil (1) is arranged above the base film (2);
an adhesive layer (5) is arranged between the base film (2) and the copper foil (1);
a buffer structure (6) is arranged between the adhesive layers (5), the buffer structure (6) comprises a buffer layer (601) and a honeycomb cushion pad (602), and the buffer layer (601) is arranged between the two groups of adhesive layers (5).
2. The flexible copper clad laminate according to claim 1, wherein: the top end of the copper foil (1) is provided with a heat conduction structure (4), the heat conduction structure (4) comprises a heat conduction metal sheet (401), a heat conduction silicon rubber sheet (402) and heat conduction silicone grease (403), and the heat conduction metal sheet (401) is arranged on the top end of the copper foil (1).
3. The flexible copper clad laminate according to claim 1, wherein: a flexible structure (3) is arranged between the base film (2) and the adhesive layer (5), the flexible structure (3) comprises a graphite sheet (301), a polyurethane elastomer (302) and a glass fiber material (303), and the graphite sheet (301) is arranged between the base film (2) and the adhesive layer (5).
4. The flexible copper clad laminate according to claim 3, wherein: the bottom of graphite flake (301) is provided with polyurethane elastomer (302), the below of polyurethane elastomer (302) is provided with glass fiber material (303), graphite flake (301), polyurethane elastomer (302) and glass fiber material (303) are laminated mutually.
5. The flexible copper clad laminate according to claim 2, wherein: a heat-conducting silicon sheet (402) is arranged between the heat-conducting metal sheet (401) and the copper foil (1), heat-conducting silicone grease (403) is arranged below the heat-conducting silicon sheet (402), and the heat-conducting silicone grease (403) is coated on the surface of the heat-conducting silicon sheet (402).
6. The flexible copper clad laminate according to claim 1, wherein: the buffer layer (601) is internally provided with a honeycomb cushion pad (602), and the surface of the honeycomb cushion pad (602) is designed with a plurality of holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121308108.9U CN215397401U (en) | 2021-06-11 | 2021-06-11 | Flexible copper clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121308108.9U CN215397401U (en) | 2021-06-11 | 2021-06-11 | Flexible copper clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215397401U true CN215397401U (en) | 2022-01-04 |
Family
ID=79638690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121308108.9U Active CN215397401U (en) | 2021-06-11 | 2021-06-11 | Flexible copper clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215397401U (en) |
-
2021
- 2021-06-11 CN CN202121308108.9U patent/CN215397401U/en active Active
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