CN215377432U - Packaging structure for LED - Google Patents
Packaging structure for LED Download PDFInfo
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- CN215377432U CN215377432U CN202120708282.6U CN202120708282U CN215377432U CN 215377432 U CN215377432 U CN 215377432U CN 202120708282 U CN202120708282 U CN 202120708282U CN 215377432 U CN215377432 U CN 215377432U
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- emitting chip
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Abstract
The utility model discloses a packaging structure for LED, comprising: a substrate and a pad. The substrate is provided with a power supply connecting part connected with a power supply, and the upper end surface of the substrate is provided with a bonding pad fixing position; the pad is arranged on the pad fixing position and is connected with the power supply connecting part. According to the utility model, the bonding pad is connected with the power supply connecting part, namely the bonding pad is directly connected with the power supply through the power supply connecting part, so that the space wiring amount of the packaging structure is reduced, the structure of the space wiring is simplified, and the production efficiency of the packaging structure is improved.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a packaging structure for an LED.
Background
An LED is an abbreviation of Light Emitting Diode, i.e., a Light Emitting Diode, which is a solid state semiconductor device capable of converting electrical energy into Light. The forward mounting is the earliest and the most mature packaging structure, and the packaging structure comprises P-GaN, a light emitting layer, N-GaN and a substrate from top to bottom in sequence. The packaging mode is developed for 20 years, the technology is highly mature and widely accepted by the market, and the up-stream, middle-stream and down-stream of the industrial chain form a very sound supply relation, so that the packaging mode is very complete in relevant production inspection equipment, process routes and the matching of raw materials and auxiliary materials, and has the capability level of large-scale mass production.
In the prior art, the space wiring of the packaging structure is complex, and the production efficiency of the packaging structure is reduced.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a package structure for an LED, which is used to solve the problems that the space wiring of the package structure is complicated and the production efficiency of the package structure is reduced in the prior art.
To achieve one or a part of or all of the above or other objects, the present invention provides a package structure for an LED, including:
the substrate is provided with a power supply connecting part connected with a power supply, and the upper end surface of the substrate is provided with a bonding pad fixing position;
and the bonding pad is arranged on the bonding pad fixing position and is connected with the power supply connecting part.
In the package structure for an LED of the present invention, the power connection portions are disposed at four corners of the substrate, and the pad fixing portions are correspondingly disposed at four corners of the substrate.
In the package structure for an LED of the present invention, the pad has a regular rectangular shape.
In the package structure for an LED of the present invention, the power supply connection portion is a via hole, and the pad is connected to a power supply through the via hole.
In the package structure for an LED of the present invention, the pad fixing portion is disposed at an edge of the substrate, and the pad is disposed at the edge of the substrate through the pad fixing portion.
In the packaging structure for the LED, the edges of the bonding pads are connected by arcs.
In the package structure for an LED of the present invention, the pad is provided with a first light-emitting fixing site for disposing a first light-emitting chip.
In the packaging structure for the LED, the upper end face of the substrate is provided with a second light-emitting fixing position and a third light-emitting fixing position;
the second light-emitting fixing position and the third light-emitting fixing position are located between the bonding pad fixing positions.
In the package structure for an LED of the present invention, a second light emitting chip is disposed on the second light emitting fixing site; and a third light-emitting chip is arranged on the third light-emitting fixing position.
In the package structure for an LED of the present invention, the first light emitting chip, the second light emitting chip, and the third light emitting chip are light emitting chips of different colors;
the first light-emitting chip is one of a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip;
the second light-emitting chip is one of a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip;
the second light emitting chip is one of a red light emitting chip, a blue light emitting chip and a green light emitting chip.
Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the bonding pad is connected with the power supply connecting part, namely the bonding pad is directly connected with the power supply through the power supply connecting part, so that the space wiring amount of the packaging structure is reduced, the structure of the space wiring is simplified, and the production efficiency of the packaging structure is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package structure for an LED in one embodiment.
Wherein:
11. a substrate; 111. a power supply connection part; 12. a pad; 131. a first light emitting chip; 132. a second light emitting chip; 133. and a third light emitting chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a package structure for an LED includes: a substrate 11 and a pad 12.
The substrate 11 is provided with a power supply connection portion 111 connected to a power supply, and the upper end surface of the substrate 11 is provided with a pad fixing position.
The pad 12 is disposed on the pad-fixing site. The pad 12 is connected to the power supply connection portion 111.
In this embodiment, the pad 12 is connected to the power connection portion 111, that is, the pad 12 is directly connected to the power supply through the power connection portion 111, so that the amount of space wiring of the package structure is reduced, the structure of the space wiring is simplified, and the production efficiency of the package structure is improved.
In one embodiment, in order to increase the space for space wiring of the package structure, the power supply connection portions 111 are disposed at four corners of the substrate 11, and the pad fixing portions are correspondingly disposed at four corners of the substrate 11.
Specifically, the power supply connection portion 111 is a via hole, the pad 12 is connected to the power supply through the via hole, the pad fixing portion is disposed at the edge of the substrate 11, and the pad 12 is disposed at the edge of the substrate 11 through the pad fixing portion.
In one embodiment, the pads 12 are regular rectangles to facilitate the layout of the flex lines and to make the structure within the package more regular.
Further, in order to prevent the wire from being cut, the corners of the bonding pad 12 are connected by using a cambered surface.
In one embodiment, the bonding pad 12 is provided with a first light-emitting fixing position for setting the first light-emitting chip 131. The upper end face of the substrate 11 is provided with a second light-emitting fixing position and a third light-emitting fixing position. The second light-emitting fixing position and the third light-emitting fixing position are located between the bonding pad fixing positions.
Specifically, the second light emitting chip 132 is disposed on the second light emitting fixing site. The third light emitting fixing position is provided with a third light emitting chip 133.
In the present embodiment, a space is directly reserved for the second light emitting chip 132 and the third light emitting chip 133, and the light emitting chips are directly disposed on the substrate 11, so that the usage of the bonding pads 12 is reduced, and the heat dissipation is more efficient.
Further, the first light emitting chip 131, the second light emitting chip 132, and the third light emitting chip 133 are light emitting chips of different colors.
The first light emitting chip 131 is one of a red light emitting chip, a blue light emitting chip, and a green light emitting chip.
The second light emitting chip 132 is one of a red light emitting chip, a blue light emitting chip, and a green light emitting chip.
The second light emitting chip 132 is one of a red light emitting chip, a blue light emitting chip, and a green light emitting chip.
In the present embodiment, the color of light emitted by the LED is realized by the cooperation of the red light emitting chip, the green light emitting chip, and the blue light emitting chip.
In one embodiment, the light emitting chip is connected with other parts of the packaging structure through wires. Specifically, the wire may be made of conductive materials such as gold wire, copper wire, and nickel wire.
To facilitate understanding of this scheme, other structures of the light emitting chip and the package structure are briefly described:
the light-emitting chip is provided with a first connecting position, in other areas on the substrate, other parts needing to be connected with the light-emitting chip are provided with a second connecting position connected with the light-emitting part, and the light-emitting chip and other parts are connected through the first connecting position and the second connecting position.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the utility model is not limited by the scope of the appended claims.
Claims (9)
1. A package structure for an LED, comprising:
the substrate is provided with a power supply connecting part connected with a power supply, and the upper end surface of the substrate is provided with a bonding pad fixing position;
and the bonding pad is arranged on the bonding pad fixing position and is connected with the power supply connecting part.
2. The package structure of claim 1, wherein the power connections are disposed at the four corners of the substrate, and the pad fixing locations are correspondingly disposed at the four corners of the substrate.
3. The package structure for an LED of claim 2, wherein the pad is a regular rectangle.
4. The package structure of claim 3, wherein the power connection portion is a via hole, and the pad is connected to a power source through the via hole.
5. The package structure for an LED of claim 4, wherein the pad-holding sites are disposed at edge locations of the substrate, the pads being disposed at the edge locations of the substrate by the pad-holding sites.
6. The package structure of any one of claims 1 to 5, wherein the bonding pad has a first light-emitting fixing site for disposing a first light-emitting chip.
7. The package structure for an LED of claim 6, wherein the substrate upper face is provided with a second light emitting fixing site and a third light emitting fixing site;
the second light-emitting fixing position and the third light-emitting fixing position are located between the bonding pad fixing positions.
8. The package structure for LED of claim 7, wherein a second light emitting chip is disposed on said second light emitting fixing site; and a third light-emitting chip is arranged on the third light-emitting fixing position.
9. The package structure for an LED of claim 8, wherein the first light emitting chip, the second light emitting chip, and the third light emitting chip are different color light emitting chips;
the first light-emitting chip is one of a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip;
the second light-emitting chip is one of a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip;
the second light emitting chip is one of a red light emitting chip, a blue light emitting chip and a green light emitting chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120708282.6U CN215377432U (en) | 2021-04-07 | 2021-04-07 | Packaging structure for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120708282.6U CN215377432U (en) | 2021-04-07 | 2021-04-07 | Packaging structure for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215377432U true CN215377432U (en) | 2021-12-31 |
Family
ID=79626589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120708282.6U Active CN215377432U (en) | 2021-04-07 | 2021-04-07 | Packaging structure for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215377432U (en) |
-
2021
- 2021-04-07 CN CN202120708282.6U patent/CN215377432U/en active Active
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