CN215336815U

CN215336815U - Air cooler

Info

Publication number: CN215336815U
Application number: CN202120870824.XU
Authority: CN
Inventors: 陈锡雁; 梁郁庆
Original assignee: Zhejiang Tianxi Kitchen Appliance Co Ltd
Current assignee: Zhejiang Tianxi Kitchen Appliance Co Ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-12-28
Anticipated expiration: 2031-04-26

Abstract

The present invention provides an air cooler, including: a housing; the semiconductor refrigeration piece is arranged in the shell, comprises a cold end and a hot end, and is configured to transmit heat from the cold end to the hot end in a power-on state; the heat dissipation assembly is arranged inside the shell, can be arranged at the hot end of the semiconductor refrigeration piece in a heat transferring mode, and is configured to dissipate heat to the outside of the shell; and a cooling assembly disposed inside the housing and heat-transferably disposed at a cold end of the semiconductor chilling plate, the cooling assembly further including a cool air fan configured to blow cool air to an outside of the housing. The air cooler provided by the utility model has the advantages that the semiconductor refrigerating sheet is arranged, the cooling air with the temperature lower than the ambient temperature can be provided, the refrigerating requirement of a user can be effectively realized, in addition, the air cooler is small and exquisite in structure, convenient to carry and capable of flexibly adjusting the arrangement position, and the refrigerating requirements of the user on multiple arrangement places and multiple cold air angles are met.

Description

Air cooler

Technical Field

The utility model relates to the field of manufacturing and processing of electric appliances, in particular to an air cooler.

Background

The requirement of refrigeration is very common in life, such as air conditioners and cold air fans for cooling in cities, refrigerators for cooling specific articles and computer radiators; and for example, cold traps and cold boxes for refrigerating experimental instruments in industrial environment, and cooling equipment for refrigerating equipment such as network servers and the like.

Generally, a refrigeration apparatus requires a certain installation condition and can be used only in a specific place. For example: the indoor unit of the air conditioner is generally fixed at a position close to the outdoor unit in a room and is difficult to move due to the installation position of the outdoor unit, and the outlet of the cool air is relatively fixed and is difficult to provide cooling to each corner in the room, which results in people choosing to install a plurality of air conditioners in different rooms. Another example is: in hot summer, people radiate heat and cool outdoors through the handheld electric fan, but the electric fan can only accelerate the flow of air, and the cooling effect is not ideal under the condition of high ambient temperature.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an air cooler, which can provide cooling air at a temperature lower than the ambient temperature, so as to more effectively meet the refrigeration requirements of users.

In one aspect of the present invention, there is provided an air cooler including:

a housing;

the semiconductor refrigeration piece is arranged in the shell, comprises a cold end and a hot end, and is configured to transmit heat from the cold end to the hot end in a power-on state;

the heat dissipation assembly is arranged inside the shell, can be arranged at the hot end of the semiconductor refrigeration piece in a heat transferring mode, and is configured to dissipate heat to the outside of the shell; and

the cooling assembly is arranged inside the shell and is arranged at the cold end of the semiconductor refrigeration piece in a heat transfer mode, and the cooling assembly further comprises a cold air fan which is configured to blow cold air to the outside of the shell.

Preferably, the housing includes a first opening, the cooling assembly further including:

the liquid storage box is made of a heat conduction material, is attached to the cold end of the semiconductor refrigeration piece, is provided with a second opening, and is configured to flow in from the second opening and store liquid; and

a screen assembly disposed within the housing, connected between the first opening and the second opening, and configured to filter liquid flowing from the first opening to the second opening.

Preferably, the filter screen assembly comprises:

a housing; and

a capillary filter disposed inside the housing and configured to filter liquid flowing from the first opening to the second opening and to direct the liquid from the second opening in a direction away from the second opening using capillary action.

Preferably, the filter screen assembly is withdrawable or replaceable with respect to the housing, the filter screen assembly further comprising:

the lifting handle is arranged on the outer side of the shell and used for lifting the filter screen assembly.

Preferably, the capillary filter is detachably disposed inside the housing.

Preferably, the first opening is arranged at the top of the shell, the liquid storage box is arranged at the bottom in the shell, the cooling fan is arranged on the side face of the shell, the cooling fan is located between the first opening and the second opening, and the air inlet face of the cooling fan is opposite to the filter screen assembly.

Preferably, the heat dissipation assembly includes:

the heat dissipation block is made of a heat conduction material and is attached to the hot end of the semiconductor refrigeration piece; and

and the air inlet of the heat radiation fan is opposite to the heat radiation block and is configured to blow heat radiation airflow to the outer side of the shell.

Preferably, the housing further comprises:

the first air outlet net is arranged on the outer side of the cold air fan and can enable air to freely circulate; and

and the second air outlet net is arranged on the outer side of the heat radiation fan and can enable air to freely circulate.

Preferably, the air outlet of the heat dissipation fan is aligned with the bottom of the housing, and the air cooler further includes:

the base is detachably arranged on the outer side of the bottom of the shell and used for elevating the shell so as to enable a space to be reserved between the bottom of the shell and the arrangement plane of the air cooler; or

The pulley is detachably arranged on the outer side of the bottom of the shell and used for realizing transition transportation of the shell relative to the setting plane.

Preferably, the air cooler further includes:

the controller is in communication connection with the semiconductor chilling plate and is configured to respond to a control instruction of a user and adjust the current passing through the semiconductor chilling plate so as to control the temperature difference between the cold end and the hot end of the semiconductor chilling plate; and

a control box disposed inside the case, configured to hermetically accommodate the controller.

Therefore, the air cooler provided by the utility model can provide cooling air with the temperature lower than the ambient temperature by arranging the semiconductor refrigerating sheet, so that the refrigerating requirement of a user is more effectively realized, and the air cooler is small in structure, convenient to carry by the user and capable of flexibly adjusting the arrangement position, so that the refrigerating requirements of the user on multiple arrangement places and multiple cold air angles are met.

Drawings

The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.

FIG. 1 is a schematic structural view of an air cooler of the present invention;

FIG. 2 is a schematic cross-sectional structural view of an air cooler of the present invention;

fig. 3 is an exploded view of the air cooler of the present invention.

Description of reference numerals:

1-a shell; 11-a first opening; 12-a first air outlet net; 13-a second air outlet net; 14-a third air outlet net; 2-semiconductor refrigerating sheet; 21-cold end; 22-hot end; 3-a heat dissipation assembly; 31-a heat sink; 32-a heat dissipation fan; 4-a cooling assembly; 41-a cold air fan; 42-a liquid storage box; 421-a second opening; 43-a screen assembly; 431-a housing; 431 a-water injection port; 432-capillary filter screen; 433-a handle; 5-a base; 6-a controller; 7-control box.

Detailed Description

Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the utility model, its application, or uses. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments are to be construed as merely illustrative, and not as limitative, unless specifically stated otherwise.

As shown in fig. 1-3:

in one aspect of the present invention, there is provided an air cooler comprising a case 1, a semiconductor cooling fin 2, a heat radiating member 3, and a cooling member 4.

The semiconductor cooling fins 2 are disposed inside the housing 1, include a cold end 21 and a hot end 22, and are configured to transfer heat from the cold end 21 to the hot end 22 in an energized state. The working principle of the semiconductor refrigerating plate 2 is the Peltier effect, namely when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively. Based on the Peltier principle, the semiconductor cooling plate 2 can be used as a means for heat transfer, creating a temperature difference between the cold side 21 and the hot side 22.

However, since the semiconductor itself has some resistance, heat is generated by the electrothermal effect when current passes through the semiconductor, thereby affecting the heat transfer from cold end 21 to hot end 22. And spontaneous reverse heat transfer between cold end 21 and hot end 22 will also occur through the ambient air and the semiconductor material itself. It can be seen that when the temperature difference between cold end 21 and hot end 22 reaches a certain temperature, the forward heat transfer and the reverse heat transfer generated by the Peltier principle are equal in quantity, and a balance point is reached, so that the forward heat transfer and the reverse heat transfer are mutually offset. At this point, the temperature difference between cold end 21 and hot end 22 does not continue to change.

To achieve a lower temperature, heat dissipation or the like may be used to lower the temperature of hot side 22. Based on this, the utility model sets the heat radiation component 3 in the shell 1, so that the heat radiation component 3 can be arranged at the hot end 22 of the semiconductor refrigeration piece 2 in a heat transfer way, and the heat radiation component 3 is configured to radiate heat to the outside of the shell 1, thereby continuously reducing the temperature of the hot end 22, enabling the cold end 21 to reach lower temperature, and improving the refrigeration and cooling effects of the air cooler.

In order to transfer the cold quantity of the cold end 21 of the semiconductor refrigeration piece 2, the air cooler further comprises a cooling assembly 4, wherein the cooling assembly 4 is arranged inside the shell 1 and can be arranged at the cold end 21 of the semiconductor refrigeration piece 2 in a heat transfer mode, so that the cold quantity is continuously led out from the cold end 21 of the semiconductor refrigeration piece 2. The cooling module 4 further includes a cold air fan 41, and the cold air fan 41 is configured to blow cold air to the outside of the casing 1, so that the cold energy guided out by the cooling module 4 is blown out of the cold air blower by air, and the requirement of cooling the user is met.

Preferably, the housing 1 comprises a first opening 11, and the cooling assembly 4 further comprises a reservoir 42 and a filter screen assembly 43. The liquid storage box 42 is made of a heat conducting material, is attached to the cold end 21 of the semiconductor chilling plate 2, is provided with a second opening 421, and is configured to flow in from the second opening 421 and store liquid; the filter screen assembly 43 is disposed inside the housing 1, connected between the first opening 11 and the second opening 421, and configured to filter the liquid flowing from the first opening 11 to the second opening 421.

The cooling assembly 4 uses the liquid storage box 42 as an intermediate heat conducting component, and can utilize the advantages of strong heat conducting capacity of the liquid storage box 42 made of heat conducting materials and the liquid in the liquid storage box 42, and more fully guide the cold energy out of the cold end 21 of the semiconductor refrigeration piece 2. And the filter screen then can filter the liquid of pouring into in the stock solution box 42, reduces the impurity and to the adverse effect of stock solution box 42 normal work.

Preferably, filter screen assembly 43 includes a housing 431 and a capillary filter screen 432. The capillary filter 432 is disposed inside the housing 431, and is configured to filter the liquid flowing from the first opening 11 to the second opening 421, and guide the liquid from the second opening 421 to a direction away from the second opening 421 by capillary action.

On one hand, the capillary filter screen 432 can filter the liquid flowing from the first opening 11 to the second opening 421, so that the liquid entering the liquid storage box 42 is purer, the influence of water scale or rust on the liquid storage box 42 is reduced, and the whole heat conductivity coefficient of the cooling assembly 4 is higher and the service life is longer; on the other hand, the capillary filter screen 432 can also continuously guide the liquid in the liquid storage box 42 to the direction far away from the second opening 421 by utilizing the capillary action of the capillary filter screen, so that the distribution range of the liquid for transmitting the cold energy of the cold end 21 of the semiconductor refrigerating sheet 2 is expanded, and the whole refrigerating effect of the cooling assembly 4 has higher efficiency.

Preferably, the filter screen assembly 43 is extractable or retractable with respect to the housing 1, the filter screen assembly 43 further comprises a handle 433, which is disposed at the outer side of the housing 431 for pulling the filter screen assembly 43, and the capillary filter screen 432 is further detachably disposed at the inner side of the housing 431.

Therefore, the filter screen assembly 43 in the utility model can be drawn out from the shell 1 by means of the handle 433, so that a user can clean and clean all structures in the filter screen assembly 43, especially the capillary filter screen 432 is detachably connected with the shell 431, the user can conveniently clean the capillary filter screen 432 which is most easy to accumulate impurities, the capillary filter screen 432 can keep a filtering effect, and the service life of the air cooler is prolonged.

Preferably, the first opening 11 is disposed at the top of the housing 1, and the liquid storage box 42 is disposed at the bottom inside the housing 1, so that the liquid can spontaneously flow from the first opening 11 to the inside of the liquid storage box 42 by the self weight of the liquid. The capillary filter 432 that sucks the liquid by capillary action is not affected by the weight of the liquid, and continuously guides the liquid in the liquid storage box 42 in the direction away from the second opening 421, thereby increasing the distribution range of the liquid that absorbs the cold.

Further, as shown in fig. 2, a water filling port 431a is further provided at the top of the casing 431, so that a user can conveniently and timely replenish the liquid in the liquid storage box 42 and the capillary filter screen 432.

On the basis of the structure that the first opening 11 is arranged at the top of the casing 1 and the liquid storage box 42 is arranged at the bottom in the casing 1, the cooling fan is arranged on the side surface of the casing 1 and is positioned between the first opening 11 and the second opening 421, and then the air inlet surface of the cooling fan is opposite to the filter screen assembly 43, so that the cold energy absorbed by the liquid on the capillary filter screen 432 can be more fully converted into the cold energy of the airflow blown by the cooling fan, and the temperature of the blown air of the cold air fan 41 is lower.

Preferably, the heat dissipating assembly 3 includes a heat dissipating block 31 and a heat dissipating fan 32. The heat dissipation block 31 is made of a heat conduction material and is attached to the hot end 22 of the semiconductor refrigeration piece 2; and an air inlet of the heat dissipation fan 32 faces the heat dissipation block 31 and is configured to blow a heat dissipation air flow to the outside of the housing 1.

The combination of radiating block 31 and radiator fan 32 can take away the heat of semiconductor refrigeration piece 2's hot junction 22 better to make the temperature of hot junction 22 reduce, reduce from the reverse heat transfer of semiconductor refrigeration piece 2's hot junction 22 to cold junction 21, make the temperature of semiconductor refrigeration piece 2's cold junction 21 lower, thereby improve the refrigeration effect of air-cooler.

Preferably, in order to avoid the influence of impurities in the air on the fan and avoid the hands of the user from touching the cool air fan 41 or the cooling fan 32 by mistake, the housing 1 further includes a first air outlet net 12 and a second air outlet net 13. The first air outlet net 12 is arranged outside the cold air fan 41 and can enable air to freely circulate; the second air outlet net 13 is disposed outside the heat dissipating fan 32, and can also allow air to freely flow.

Similarly, the back of the cooling fan far away from the cooling fan is provided with the third air outlet net 14, so that the cooling assembly 4 directly performs natural convection heat exchange with the surrounding environment at the interval of the third air outlet net 14, and the refrigeration range of the cooling fan is expanded.

Preferably, the air outlet of the heat dissipation fan 32 is opposite to the bottom of the casing 1, and the air cooler further comprises a base 5 or a pulley. Wherein, base 5, detachably set up in the bottom outside of casing 1 for raise casing 1 to make the bottom of casing 1 and the setting plane of air-cooler have the interval between, avoid the setting plane of air-cooler is hugged closely to the bottom of casing 1, thereby reserve the space of sufficient heat transfer for radiator fan 32. The pulley is detachably disposed at the outer side of the bottom of the housing 1, and is used for realizing transition transportation of the housing 1 relative to a setting plane, so that a user can flexibly adjust the position of the cooling fan and the blowing direction of the cooling fan 41.

In order to facilitate the control of the cooling effect of the air cooler, preferably, the air cooler further includes a controller 6, and the controller 6 is communicatively connected to the semiconductor chilling plates 2 and configured to adjust the magnitude of the current passing through the semiconductor chilling plates 2 in response to a control instruction of a user, so as to control the temperature difference between the cold end 21 and the hot end 22 of the semiconductor chilling plates 2.

Since the liquid storage box 42 and the capillary filter 432 inside the casing 1 may contain liquid, in order to prevent the controller 6 from being interfered by the liquid, the air cooler of the present invention further includes a control box 7, and the control box 7 is disposed inside the casing 1 and configured to hermetically contain the controller 6.

Therefore, the air cooler provided by the utility model can provide cooling air with temperature lower than the ambient temperature by arranging the semiconductor refrigerating sheet, so that the refrigerating requirement of a user is more effectively realized, and the air cooler is small and exquisite in structure, convenient to carry by the user and capable of flexibly adjusting the arrangement position, so that the refrigerating requirements of the user on multiple arrangement places and multiple cold air angles are met.

So far, some specific embodiments of the present invention have been described in detail by way of examples, but it should be understood by those skilled in the art that the above examples are only for illustrative purposes and are not intended to limit the scope of the present invention. It will be understood by those skilled in the art that various changes may be made in the above embodiments or equivalents may be substituted for elements thereof without departing from the scope and spirit of the utility model. The scope of the utility model is defined by the appended claims.

Claims

1. An air cooler, comprising:

a housing (1);

the semiconductor refrigeration piece (2) is arranged in the shell (1), comprises a cold end (21) and a hot end (22), and is configured to transfer heat from the cold end (21) to the hot end (22) in a power-on state;

the heat dissipation assembly (3) is arranged inside the shell (1), can be arranged at the hot end (22) of the semiconductor refrigeration sheet (2) in a heat transfer mode, and is configured to dissipate heat to the outside of the shell (1); and

a cooling assembly (4) disposed inside the housing (1) and heat-transferably disposed at the cold end (21) of the semiconductor chilling plate (2), the cooling assembly (4) further comprising a cold air fan (41), the cold air fan (41) being configured to blow cold air to the outside of the housing (1).

2. Air-cooler according to claim 1, characterized in that the housing (1) comprises a first opening (11), the cooling assembly (4) further comprising:

the liquid storage box (42) is made of a heat conduction material, is attached to the cold end (21) of the semiconductor refrigeration piece (2), is provided with a second opening (421), and is configured to flow in and store liquid from the second opening (421); and

a filter screen assembly (43) disposed inside the housing (1), connected between the first opening (11) and the second opening (421), and configured to filter liquid flowing from the first opening (11) to the second opening (421).

3. The air cooler according to claim 2, characterized in that the filter screen assembly (43) comprises:

a housing (431); and

a capillary filter (432) disposed inside the housing (431) and configured to filter the liquid flowing from the first opening (11) to the second opening (421) and to guide the liquid from the second opening (421) in a direction away from the second opening (421) by capillary action.

4. The air cooler according to claim 3, characterized in that the filter screen assembly (43) is extractable or retractable with respect to the housing (1), the filter screen assembly (43) further comprising:

and the lifting handle (433) is arranged on the outer side of the shell (431) and is used for lifting the filter screen assembly (43).

5. The air cooler according to claim 3, characterized in that the capillary filter (432) is detachably arranged inside the housing (431).

6. The air cooler according to claim 2, wherein the first opening (11) is disposed at the top of the housing (1), the liquid storage box (42) is disposed at the bottom inside the housing (1), the cooling fan is disposed at the side of the housing (1), the cooling fan is located between the first opening (11) and the second opening (421), and the air inlet surface of the cooling fan faces the filter screen assembly (43).

7. Air-cooler according to claim 1, characterized in that the heat dissipation assembly (3) comprises:

the heat dissipation block (31) is made of a heat conduction material and is attached to the hot end (22) of the semiconductor refrigeration piece (2); and

and the air inlet of the heat radiation fan (32) is opposite to the heat radiation block (31) and is configured to blow heat radiation air flow to the outer side of the shell (1).

8. Air-cooler according to claim 7, characterized in that the housing (1) further comprises:

a first air outlet net (12) which is arranged at the outer side of the cold air fan (41) and can enable air to freely circulate; and

and the second air outlet net (13) is arranged on the outer side of the heat radiation fan (32) and can enable air to freely circulate.

9. The air cooler according to claim 7, characterized in that the air outlet of the heat dissipation fan (32) is directed toward the bottom of the casing (1), the air cooler further comprising:

the base (5) is detachably arranged on the outer side of the bottom of the shell (1) and is used for elevating the shell (1) so that a space is reserved between the bottom of the shell (1) and the arrangement plane of the air cooler; or

The pulley is detachably arranged on the outer side of the bottom of the shell (1) and used for realizing transition transportation of the shell (1) relative to the setting plane.

10. The air cooler of claim 1, further comprising:

the controller (6) is in communication connection with the semiconductor chilling plate (2) and is configured to respond to a control instruction of a user and adjust the current passing through the semiconductor chilling plate (2) so as to control the temperature difference between the cold end (21) and the hot end (22) of the semiconductor chilling plate (2); and

a control box (7) disposed inside the housing (1) and configured to hermetically accommodate the controller (6).