CN217715229U - Semiconductor air conditioner - Google Patents
Semiconductor air conditioner Download PDFInfo
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- CN217715229U CN217715229U CN202220679785.XU CN202220679785U CN217715229U CN 217715229 U CN217715229 U CN 217715229U CN 202220679785 U CN202220679785 U CN 202220679785U CN 217715229 U CN217715229 U CN 217715229U
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Abstract
The present disclosure relates to a semiconductor air conditioner, including: the air conditioner comprises a shell, an air outlet duct and a heat dissipation duct, wherein the air outlet duct and the heat dissipation duct are formed in the shell; the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct; the electric control assembly is positioned in the heat dissipation air duct; and the air flow circulating in the heat dissipation air duct exchanges heat with the second temperature change surface of the semiconductor heat exchange sheet and the electric control assembly.
Description
Technical Field
The present disclosure relates to a household electrical appliance, and more particularly, to a semiconductor air conditioner.
Background
With the continuous improvement of the living standard of people, the air conditioner becomes electrical equipment commonly used in the life of people; a new type of air conditioner, semiconductor air conditioner, is gradually favored by consumers due to the requirements of the users for the cooling and heating effects and convenience of the air conditioner.
In a semiconductor air conditioner, an electric control element is usually integrated in an electric control box so as to be isolated from other parts in the semiconductor air conditioner, so that the safety is improved; considering that the electric control elements in the electric control box generate heat in the working process, a heat dissipation structure is usually arranged outside the electric control box, and the heat dissipation structure is used for dissipating heat of the electric control elements in the electric control box. In order to achieve a better heat dissipation effect, the size of the arranged heat dissipation structure is larger, and the occupied space is also larger, so that the size of the semiconductor air conditioner is increased, and the semiconductor air conditioner is not portable.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a semiconductor air conditioner.
According to a first aspect of embodiments of the present disclosure, there is provided a semiconductor air conditioner including:
the air conditioner comprises a shell, an air outlet duct and a heat dissipation duct, wherein the air outlet duct and the heat dissipation duct are formed in the shell;
the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct;
the electric control assembly is positioned in the heat dissipation air channel;
and the air flow circulating in the heat dissipation air duct exchanges heat with the second variable temperature surface of the semiconductor heat exchange plate and the electric control assembly.
Optionally, the air conditioner includes:
the first fan is positioned in the air outlet duct and is arranged between an air outlet of the air outlet duct and the semiconductor heat exchange fin;
and the second fan is positioned in the heat dissipation air duct and is arranged between the air outlet of the heat dissipation air duct and the semiconductor heat exchange fins.
Optionally, the air conditioner includes:
the first fan is positioned in the air outlet duct and is arranged between the air inlet of the air outlet duct and the semiconductor heat exchange fin;
and the second fan is positioned in the heat dissipation air channel and is arranged between the air inlet of the heat dissipation air channel and the semiconductor heat exchange fins.
Optionally, the airflow direction in the heat dissipation air duct is opposite to the airflow direction in the air outlet duct.
Optionally, the air outlet of the air outlet duct and the air outlet of the heat dissipation duct are respectively disposed on different sidewalls of the housing;
the air outlet of the air outlet duct and the air inlet of the heat dissipation duct are respectively arranged on different side walls of the shell.
Optionally, the air inlet of the air outlet duct and the air outlet of the air outlet duct are respectively located on different side walls of the housing;
the air inlet of the heat dissipation air duct and the air outlet of the heat dissipation air duct are respectively positioned on different side walls of the shell.
Optionally, a distance between a plane of the air outlet duct and the semiconductor heat exchange plate is less than or equal to 200mm.
Optionally, the air conditioner includes:
the first radiator is positioned in the air outlet duct, is connected with the first temperature changing surface of the semiconductor heat exchange fin and is used for carrying out heat exchange between airflow in the air outlet duct and the first temperature changing surface;
and the second radiator is positioned in the radiating air duct, is connected with the second variable temperature surface of the semiconductor heat exchange fin and is used for carrying out heat exchange between airflow in the radiating air duct and the second variable temperature surface.
Optionally, the first heat sink and the second heat sink are respectively formed with a plurality of heat dissipation fins;
the extending direction of an airflow channel formed among the plurality of radiating fins of the first radiator is parallel to the flowing direction of airflow in the air outlet channel;
the extending direction of an airflow channel formed among a plurality of radiating fins of the second radiator is parallel to the flowing direction of airflow in the radiating channel.
Optionally, the air conditioner includes:
and the filtering component is arranged at the air inlet of the air outlet duct and filters air flowing to the air outlet duct.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
according to the embodiment of the disclosure, the electric control assembly is arranged in the heat dissipation air duct of the semiconductor air conditioner, and the air flow circulating in the heat dissipation air duct is utilized to exchange heat with the second variable temperature surface of the semiconductor heat exchange plate and the electric control assembly, so that the second variable temperature surface of the semiconductor heat exchange plate and the heat dissipation of the electric control assembly are realized, and therefore, a radiator does not need to be arranged for the electric control assembly independently, the number of parts in the semiconductor air conditioner is reduced, and the size of the semiconductor air conditioner is favorably reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a first schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 2 is a schematic structural diagram ii of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 3 is a third schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 4 is a fourth schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.
Fig. 5 is a schematic structural diagram five of a semiconductor air conditioner according to an exemplary embodiment.
In the above figures: 10, a semiconductor air conditioner; 11, a housing; 12, semiconductor heat exchange sheets; 13, an air outlet duct; 14, a heat dissipation air duct; 15, an electric control component; 16, a filter assembly; 131, a first heat sink; 132, a first fan; 141, a second heat sink; 142 and a second fan.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The embodiment of the present disclosure provides a semiconductor air conditioner, as shown in fig. 1, fig. 1 is a schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment. The air conditioner 10 includes:
the air conditioner comprises a shell 11, wherein an air outlet duct 13 and a heat dissipation duct 14 are formed in the shell;
the semiconductor heat exchange fins 12 are arranged in the shell 11, and a first variable temperature surface of each semiconductor heat exchange fin 12 faces the air outlet duct 13, and a second variable temperature surface faces the heat dissipation duct 14;
the electronic control assembly 15 is positioned in the heat dissipation air duct 14;
the air flow circulating in the heat dissipation air duct 14 exchanges heat with the second variable temperature surface of the semiconductor heat exchange plate 12 and the electric control assembly 15.
In an embodiment of the present disclosure, the semiconductor air conditioner includes: a housing;
an accommodating cavity is formed in the shell, and an air outlet duct and a heat dissipation duct which are mutually isolated are formed in the accommodating cavity;
here, the air outlet duct and the heat dissipation duct may be separated by a partition board disposed in the accommodating chamber.
The air conditioner includes: the semiconductor heat exchange fins are arranged in the shell;
here, the partition board may be provided with an installation position, and the installation position communicates the air outlet duct and the heat dissipation duct; the semiconductor heat exchange sheet can be arranged on the mounting position, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface faces the heat dissipation duct.
Here, the first temperature varying surface may be a cooling surface, and the second temperature varying surface may be a heating surface; or, the first temperature changing surface is a heating surface, and the second temperature changing surface may be a cooling surface. The embodiments of the present disclosure are not limited thereto.
The semiconductor heat exchange sheet is an electronic component which generates cold and heat by using a thermoelectric effect (peltier effect); after the direct current is introduced into the semiconductor heat exchange plate, heat transmission can be generated between two end faces of the semiconductor heat exchange plate, and the refrigerating face of the semiconductor heat exchange plate can absorb heat of the surrounding environment, so that the refrigerating effect is realized; the heat absorbed by the refrigerating surface can be transferred to the heating surface, and the heating surface releases heat to the surrounding environment, so that the heating effect is realized.
The air flow circulating in the air outlet duct exchanges heat with the first temperature changing surface of the semiconductor heat exchange sheet, so that the air flow is heated or cooled, and the heated or cooled air flow is output from an air outlet of the air outlet duct; and the air flow circulating in the heat dissipation air duct exchanges heat with the second variable temperature surface of the semiconductor heat exchange plate, so that the second variable temperature surface of the semiconductor heat exchange plate is dissipated.
It can be understood that, because of the resistance of the semiconductor heat exchange plate, when current flows through the semiconductor heat exchange plate, heat is generated, and thus heat transfer is affected; and the heat between the anode and the cathode of the semiconductor heat exchange plate can also be reversely transferred through the air and the semiconductor material. When the temperature difference between the two end surfaces of the semiconductor heat exchange sheet reaches a certain value, the two heat transfer quantities are the same, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually offset; the temperature of the semiconductor heat exchange plate can not be changed continuously.
The second variable temperature surface of the semiconductor heat exchange plate is radiated by utilizing the air flow circulating in the radiating air duct, and the temperature of the second variable temperature surface of the semiconductor heat exchange plate is changed, so that the temperature of the first variable temperature surface of the semiconductor heat exchange plate is correspondingly changed along with the temperature change of the second variable temperature surface, and the refrigerating or heating effect of the semiconductor air conditioner is improved.
The air conditioner further comprises: an electronic control assembly; the electric control assembly is positioned in the heat dissipation air duct.
The electric control assembly can be connected with the semiconductor heat exchange plate and is used for controlling the current direction of the electric signal flowing through the semiconductor heat exchange plate.
It should be noted that, if the direction of the current of the electrical signal flowing through the semiconductor heat exchange plate changes, the cooling surface and the heating surface of the semiconductor heat exchange plate also change accordingly. For example, if the electrical signal flowing through the semiconductor heat exchange plate is in a first current direction, the first temperature changing surface of the semiconductor heat exchange plate is a cooling surface, and the second temperature changing surface of the semiconductor heat exchange plate is a heating surface; if the electric signal flowing through the semiconductor heat exchange plate is in a second current direction, the first temperature changing surface of the semiconductor heat exchange plate is a heating surface, and the second temperature changing surface is a refrigerating surface; here, the first current direction and the second current direction are opposite.
In some embodiments, the electronic control component may be disposed at the air outlet of the heat dissipation air duct.
It should be noted that, because the electronic control assembly generates heat during operation, a heat sink is usually separately provided for the electronic control assembly in the related art to dissipate heat of the electronic control assembly; however, the heat sink occupies a certain space, which results in an increase in the volume of the semiconductor air conditioner.
According to the embodiment of the disclosure, the electric control assembly is arranged in the heat dissipation air duct, and the air flow circulating in the heat dissipation air duct exchanges heat with the second temperature changing surface of the semiconductor heat exchange sheet and the electric control assembly, so that the second temperature changing surface of the semiconductor heat exchange sheet and the heat dissipation of the electric control assembly are realized, and therefore, a radiator does not need to be arranged for the electric control assembly independently, the number of parts in the semiconductor air conditioner is reduced, and the size of the semiconductor air conditioner is favorably reduced.
Alternatively, as shown in fig. 2, fig. 2 is a schematic structural diagram of a semiconductor air conditioner shown according to an exemplary embodiment. The air conditioner 10 includes:
the first fan 132 is located in the air outlet duct 13 and is disposed between the air outlet of the air outlet duct 13 and the semiconductor heat exchanger 12;
the second fan 142 is located in the heat dissipation air duct 14, and is disposed between the air outlet of the heat dissipation air duct 14 and the semiconductor heat exchanging fin 12.
In an embodiment of the present disclosure, the air conditioner may include: a first fan and a second fan;
the first fan can be arranged in the air outlet duct, and is arranged between the air outlet of the air outlet duct and the semiconductor heat exchange sheet; it can be understood that the air inlet side of the first fan is close to the semiconductor heat exchange fins, and the air outlet side of the first fan is close to the air outlet of the air outlet duct.
Under the action of the first fan, external air circulates to the semiconductor heat exchange fins from the air inlet of the air outlet duct and exchanges heat with the first temperature changing surfaces of the semiconductor heat exchange fins, and the air after heat exchange flows through the first fan and finally flows out from the air outlet of the air outlet duct.
The second fan can be arranged in the heat dissipation air channel, and is arranged between the air outlet of the heat dissipation air channel and the semiconductor heat exchange sheet; it can be understood that the air inlet side of the second fan is close to the semiconductor heat exchange fins, and the air outlet side of the second fan is close to the air outlet of the heat dissipation air duct.
Under the action of the second fan, external air flows to the semiconductor heat exchange sheet from the air inlet of the heat dissipation air channel and exchanges heat with the second temperature changing surface of the semiconductor heat exchange sheet, and the air after heat exchange flows through the first fan and the electric control assembly to exchange heat with the electric control assembly and finally flows out from the air outlet of the heat dissipation air channel.
In some embodiments, the first fan may be coupled to the electronic control assembly, and the electronic control assembly may be utilized to control the speed of the first fan.
It can be understood that, the electronic control assembly is used for controlling the rotating speed of the first fan, so as to control the intensity of the cooled or heated air flow output by the air outlet duct.
Alternatively, as shown in fig. 3, fig. 3 is a schematic structural diagram three of a semiconductor air conditioner according to an exemplary embodiment. The air conditioner 10 includes:
the first fan 132 is located in the air outlet duct 13 and is disposed between an air inlet of the air outlet duct 13 and the semiconductor heat exchanger fin 12;
the second fan 142 is located in the heat dissipation air duct 14, and is disposed between the air inlet of the heat dissipation air duct 14 and the semiconductor heat exchanging fin 12.
In an embodiment of the present disclosure, the air conditioner may include: a first fan and a second fan.
The first fan can be arranged in the air outlet duct, and is arranged between the air inlet of the air outlet duct and the semiconductor heat exchange fins; it can be understood that the air inlet side of the first fan is close to the air inlet of the air outlet duct, and the air outlet side of the first fan is close to the semiconductor heat exchange fins.
Under the action of the first fan, external air flows from the air inlet of the air outlet duct to the first fan, flows to the semiconductor heat exchange sheet through the first fan, exchanges heat with the first temperature change surface of the semiconductor heat exchange sheet, and flows out from the air outlet of the air outlet duct after heat exchange.
The second fan can be arranged in the heat dissipation air channel, and is arranged between the air inlet of the heat dissipation air channel and the semiconductor heat exchange fins; it can be understood that the air inlet side of the second fan is close to the air inlet of the heat dissipation air duct, and the air outlet side of the first fan is close to the semiconductor heat exchange fins.
Under the action of the second fan, external air flows to the second fan from the air inlet of the heat dissipation air duct, flows to the semiconductor heat exchange plate and the electric control assembly through the second fan, exchanges heat with the second variable temperature surface of the semiconductor heat exchange plate and the electric control assembly, and flows out from the air outlet of the heat dissipation air duct after heat exchange.
Optionally, as shown in fig. 2 to 3, the airflow direction in the heat dissipation air duct 14 is opposite to the airflow direction in the air outlet duct 13.
In the embodiment of the present disclosure, the flow direction of the air flow in the heat dissipation air duct may be set to be opposite to the flow direction of the air flow in the air outlet air duct; that is, the air inlet side of the first fan and the air inlet side of the second fan face different directions of the housing, respectively.
It can be understood that, considering that there is the difference in temperature between the air temperature of heat dissipation wind channel air outlet output and the air temperature of air outlet wind channel air outlet output, through making the air flow direction in the heat dissipation wind channel with the air flow direction in the air outlet wind channel is opposite, thereby makes the air flow of heat dissipation wind channel air outlet output can not be right the air temperature of air outlet wind channel air outlet output causes the interference, guarantees semiconductor air conditioner refrigeration or heats the effect, promotes user's use and experiences.
Optionally, as shown in fig. 2 to 3, the air outlet of the air outlet duct and the air outlet of the heat dissipation duct are respectively disposed on different sidewalls of the housing;
the air outlet of the air outlet duct and the air inlet of the heat dissipation duct are respectively arranged on different side walls of the shell.
In the embodiment of the present disclosure, since the airflow direction of the air outlet duct is opposite to the airflow direction of the heat dissipation duct, the air outlet of the air outlet duct and the air outlet of the heat dissipation duct are located on different sidewalls of the housing, so as to reduce the influence of the airflow output by the air outlet of the heat dissipation duct on the temperature of the airflow output by the air outlet of the air outlet duct.
Moreover, the air outlet of the air outlet duct and the air inlet of the heat dissipation duct can be respectively arranged on different side walls of the shell; correspondingly, the air inlet of the air outlet duct and the air outlet of the heat dissipation duct are respectively arranged on different side walls of the shell.
It can be understood that, by respectively arranging the air outlet of the air outlet duct and the air inlet of the heat dissipation air duct on different side walls of the housing, the airflow output by the air outlet duct can be effectively prevented from flowing back to the air inlet of the heat dissipation air duct; the air inlet of the air outlet duct and the air outlet of the heat dissipation duct are arranged on different side walls of the shell, so that air flow output by the heat dissipation duct can be effectively prevented from flowing back to the air inlet of the air outlet duct.
In the embodiment of the present disclosure, the positions of the air inlet and the air outlet of the air outlet duct on the housing are not limited, and the positions of the air inlet and the air outlet of the heat dissipation duct on the housing are not limited.
For example, the air inlet of the air outlet duct and the air outlet of the air outlet duct may be located on the same side wall of the housing; and/or the air inlet of the heat dissipation air duct and the air outlet of the heat dissipation air duct can be positioned on the same side wall of the shell.
It should be noted that, if the air inlet of the air outlet duct and the air outlet of the air outlet duct are located on the same side wall of the housing, in order to prevent the air flow output by the air outlet duct from directly flowing back to the air inlet of the air outlet duct, the length of the air outlet duct may be increased to increase the distance between the air inlet and the air outlet of the air outlet duct.
Alternatively, as shown in fig. 4-5, fig. 4 is a schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment; fig. 5 is a schematic structural diagram five of a semiconductor air conditioner according to an exemplary embodiment. The air inlet of the air outlet duct 13 and the air outlet of the air outlet duct 13 are respectively located on different side walls of the housing 11;
the air inlet of the heat dissipation air duct 14 and the air outlet of the heat dissipation air duct 14 are respectively located on different side walls of the housing.
In the embodiment of the present disclosure, since the air outlet of the air outlet duct and the air inlet of the heat dissipation duct are respectively disposed on different sidewalls of the housing, the airflow direction of the air outlet duct is opposite to the airflow direction of the heat dissipation duct; the air inlet of the air outlet duct and the air outlet of the air outlet duct are respectively positioned on different side walls of the shell, and the air inlet of the heat dissipation duct and the air outlet of the heat dissipation duct are respectively positioned on different side walls of the shell; that is, the air inlet and the air outlet of the heat dissipation air duct and the air inlet and the air outlet of the air outlet duct are respectively located on different side walls of the housing.
It can be understood that, considering that if the air inlet of the air outlet duct and the air outlet of the air outlet duct are located on the same side wall of the housing, in order to prevent the airflow output by the air outlet duct from directly flowing back to the air inlet of the air outlet duct (i.e., the airflow is short-circuited), the length of the air outlet duct needs to be increased to increase the distance between the air inlet and the air outlet of the air outlet duct. However, the semiconductor air conditioner is increased in volume by the mode, and the problems of not compact structure and large occupied area exist.
Therefore, in the embodiment of the disclosure, the air inlet and the air outlet of the heat dissipation air duct and the air inlet and the air outlet of the air outlet duct are respectively located on different side walls of the housing, so that on one hand, the short circuit of the air flow can be effectively avoided, and meanwhile, the lengths of the air outlet duct and the heat dissipation air duct do not need to be increased, the volume and the occupied area of the semiconductor air conditioner are effectively reduced, and the structure of the semiconductor air conditioner is more compact; on the other hand, the influence of the air flow output by the air outlet of the heat dissipation air duct on the temperature of the air flow output by the air outlet of the air outlet duct can be reduced, and the probability that the air flow output by the air outlet duct flows back to the air inlet of the heat dissipation air duct can be reduced; the probability that the airflow output by the heat dissipation air duct flows back to the air inlet of the air outlet air duct is reduced, and airflow interference is prevented.
Optionally, a distance between a plane where an air outlet of the air outlet duct is located and the semiconductor heat exchange plate is smaller than or equal to 200mm.
The embodiment of the disclosure considers that temperature changes may exist in the process of transmitting the airflow subjected to heat exchange by the semiconductor heat exchange plate to the first air outlet and/or the second air outlet, for example, temperature return may occur in the airflow cooled by the cooling surface of the semiconductor heat exchange plate.
According to the embodiment of the disclosure, the distance between the plane where the first air outlet and the second air outlet are located and the semiconductor heat exchange plate is smaller than or equal to 200mm, so that the temperature change of the air flow after heat exchange of the semiconductor heat exchange plate in the process of being transmitted to the first air outlet and/or the second air outlet is reduced.
Alternatively, as shown in fig. 1 to 5, the air conditioner 10 includes:
the first radiator 131 is located in the air outlet duct 13, is connected to the first temperature changing surface of the semiconductor heat exchanger fin 12, and is used for performing heat exchange between airflow in the air outlet duct 13 and the first temperature changing surface;
the second radiator 141 is located in the heat dissipation air duct 14, connected to the second variable temperature surface of the semiconductor heat exchanger plate 12, and configured to allow the air flow in the heat dissipation air duct 14 to exchange heat with the second variable temperature surface.
In an embodiment of the present disclosure, the air conditioner includes: a first heat sink and a second heat sink;
the first radiator is arranged in the air outlet duct and is connected with the first variable temperature surface of the semiconductor heat exchange fin, and air flow circulating in the air outlet duct indirectly exchanges heat with the first variable temperature surface of the semiconductor heat exchange fin through the first radiator. The first radiator is utilized to increase the heat exchange area of the semiconductor heat exchange fins for carrying out heat exchange with the air flow circulating in the air outlet duct, and the heating or refrigerating efficiency of the semiconductor air conditioner is improved.
The second radiator is arranged in the radiating air duct and is connected with the second variable-temperature surface of the semiconductor heat exchange fin, and air flow circulating in the radiating air duct indirectly exchanges heat with the second variable-temperature surface of the semiconductor heat exchange fin through the second radiator. And the second radiator is utilized to increase the heat exchange area of the semiconductor heat exchange fins for heat exchange with the air flow circulating in the heat dissipation air duct, so that the heat dissipation efficiency of the semiconductor air conditioner is improved.
Here, in order to increase the heat exchange amount between the semiconductor heat exchange fins and the air flow, the first heat sink and the second heat sink may be aluminum profile heat sinks, heat pipe heat sinks, water cooling heat sinks, or the like.
In some embodiments, considering that a first heat sink is disposed in the air outlet duct, and a second heat sink is disposed in the air outlet duct, the air resistance caused by the first heat sink and the second heat sink is greater than or equal to 50pa, and the air resistance of at least 50pa needs to be overcome by the first fan and the second fan.
Optionally, the first heat sink and the second heat sink are respectively formed with a plurality of heat dissipation fins;
the extending direction of an airflow channel formed among the plurality of radiating fins of the first radiator is parallel to the flowing direction of airflow in the air outlet channel;
the extending direction of an airflow channel formed among a plurality of radiating fins of the second radiator is parallel to the flowing direction of airflow in the radiating channel.
In the embodiment of the present disclosure, the first heat sink and the second heat sink include a plurality of heat dissipation fins thereon, and an airflow channel is formed between the plurality of heat dissipation fins in the first heat sink, and an airflow channel is formed between the plurality of heat dissipation fins in the second heat sink; the airflow channel is used for allowing airflow in the first air channel and the second air channel to circulate.
The extending direction of the airflow channel is parallel to the airflow direction in the first air duct and the second air duct. It can be understood that, in order to ensure that the air can more smoothly circulate in the airflow channel, the airflow channel extends in a direction parallel to the air circulation direction in the first air duct and the second air duct to exchange heat with the heat dissipation fins.
Alternatively, as shown in fig. 4 to 5, the air conditioner 10 includes:
and the filtering component 16 is arranged at the air inlet of the air outlet duct 13 and filters the air flowing to the air outlet duct 13.
In an embodiment of the present disclosure, the air conditioner further includes: a filter assembly;
the filter assembly can set up in the air intake of casing utilizes filter assembly, convection current extremely first wind channel with the air in second wind channel filters to the particle dust in the filtering air, thereby reduces the dust concentration in the air current of first wind channel and second wind channel output, promotes user's use and experiences.
The filter assembly may include: and (4) a filter screen.
It can be understood that the air inlet of the shell is fixedly connected with a filter screen frame, and a filter screen is fixedly connected in the filter screen frame.
The filter screen can be an air filter non-woven fabric, and on one hand, the air filter screen has air permeability and can reduce wind resistance; on the other hand, the filtering efficiency is not influenced.
In some embodiments, the air conditioner includes:
and the filtering component is arranged at the air outlet of the air outlet duct and the air inlet of the heat dissipation air duct and used for filtering the air which circulates to the air outlet duct and the heat dissipation air duct.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (10)
1. A semiconductor air conditioner, characterized in that the air conditioner comprises:
the air conditioner comprises a shell, an air outlet duct and a heat dissipation duct, wherein the air outlet duct and the heat dissipation duct are formed in the shell;
the semiconductor heat exchange sheet is arranged in the shell, the first variable temperature surface of the semiconductor heat exchange sheet faces the air outlet duct, and the second variable temperature surface of the semiconductor heat exchange sheet faces the heat dissipation duct;
the electric control assembly is positioned in the heat dissipation air channel;
and the air flow circulating in the heat dissipation air duct exchanges heat with the second variable temperature surface of the semiconductor heat exchange plate and the electric control assembly.
2. The air conditioner according to claim 1, wherein the air conditioner comprises:
the first fan is positioned in the air outlet duct and is arranged between an air outlet of the air outlet duct and the semiconductor heat exchange sheet;
and the second fan is positioned in the heat dissipation air duct and is arranged between the air outlet of the heat dissipation air duct and the semiconductor heat exchange fins.
3. The air conditioner according to claim 1, wherein the air conditioner comprises:
the first fan is positioned in the air outlet duct and is arranged between the air inlet of the air outlet duct and the semiconductor heat exchange fin;
and the second fan is positioned in the heat dissipation air duct and is arranged between the air inlet of the heat dissipation air duct and the semiconductor heat exchange fins.
4. The air conditioner of claim 1, wherein the airflow direction in the heat dissipation air duct is opposite to the airflow direction in the air outlet duct.
5. The air conditioner according to claim 4, wherein the air outlet of the air outlet duct and the air outlet of the heat dissipation duct are respectively disposed on different sidewalls of the housing;
the air outlet of the air outlet duct and the air inlet of the heat dissipation duct are respectively arranged on different side walls of the shell.
6. The air conditioner according to claim 5, wherein the air inlet of the air outlet duct and the air outlet of the air outlet duct are respectively located on different side walls of the housing;
the air inlet of the heat dissipation air duct and the air outlet of the heat dissipation air duct are respectively positioned on different side walls of the shell.
7. The air conditioner of claim 1, wherein a distance between a plane of an air outlet of the air outlet duct and the semiconductor heat exchange fins is less than or equal to 200mm.
8. The air conditioner according to claim 1, wherein the air conditioner comprises:
the first radiator is positioned in the air outlet duct, is connected with the first temperature changing surface of the semiconductor heat exchange fin and is used for carrying out heat exchange between airflow in the air outlet duct and the first temperature changing surface;
and the second radiator is positioned in the radiating air duct, is connected with the second variable-temperature surface of the semiconductor heat exchange fin and is used for performing heat exchange between the air flow in the radiating air duct and the second variable-temperature surface.
9. The air conditioner according to claim 8, wherein the first and second radiators are respectively formed with a plurality of radiating fins;
the extending direction of an airflow channel formed among a plurality of radiating fins of the first radiator is parallel to the flowing direction of airflow in the air outlet duct;
the extending direction of an airflow channel formed among the plurality of radiating fins of the second radiator is parallel to the flowing direction of airflow in the radiating air duct.
10. The air conditioner according to claim 1, wherein the air conditioner comprises:
and the filtering component is arranged at the air inlet of the air outlet duct and filters the air flowing to the air outlet duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220679785.XU CN217715229U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220679785.XU CN217715229U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
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| Publication Number | Publication Date |
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| CN217715229U true CN217715229U (en) | 2022-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220679785.XU Active CN217715229U (en) | 2022-03-25 | 2022-03-25 | Semiconductor air conditioner |
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