CN215300680U

CN215300680U - Electronic device

Info

Publication number: CN215300680U
Application number: CN202121642216.XU
Authority: CN
Inventors: 周旭林; 王虎杰
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2021-07-19
Filing date: 2021-07-19
Publication date: 2021-12-24
Anticipated expiration: 2031-07-19

Abstract

The utility model discloses an electronic device, which comprises a middle frame, a heat absorption part, a power device and a radiating pipe, wherein the heat absorption part, the power device and the radiating pipe are arranged in the middle frame; the heat absorption part is internally provided with heat conduction fluid and is in contact with a heating element of the electronic equipment; the inlet end of the power device is communicated with the heat absorption part, and the power device is connected with a controller of the electronic equipment; the inlet end of the radiating pipe is communicated with the outlet end of the power device, the outlet end of the radiating pipe is communicated with the heat absorption part, and the radiating pipe is arranged around the circumference of the middle frame. Through contacting heat absorption portion and electronic equipment's heating element to set up the cooling tube around the circumference of center, realize directly taking away the inside heat of electronic equipment and through center extension heat dissipation route, with the purpose that reaches high-efficient radiating, thereby solve present external cooling system and to the inside heat dissipation of cell-phone insufficient, external cooling system is bulky, is difficult to carry, operates complicated problem.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

Along with the improvement of the requirements of people on living work, electronic equipment, particularly mobile phones, are more and more widely applied, and the functions of the mobile phones are more and more, so that components in the mobile phones generate a large amount of heat in the high-speed running process of the mobile phones.

The mobile phone is overheated for a long time to cause the damage of internal components or shorten the service life, so an external heat dissipation system is mostly arranged to help the mobile phone to dissipate heat at present.

However, the existing external heat dissipation system can only dissipate heat from the outer surface of the mobile phone, the internal heat dissipation is insufficient, and the external heat dissipation system is large in size, difficult to carry and complex to operate.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides an electronic equipment to solve present external cooling system and can only dispel the heat to the surface of cell-phone, inside heat dissipation is not abundant, and external cooling system is bulky, is difficult to carry, operates complicated problem.

In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:

a first aspect of the present application provides an electronic device, which includes a middle frame, and a heat absorption portion, a power device and a heat dissipation pipe disposed in the middle frame;

the heat absorption part is internally provided with heat conduction fluid and is in contact with a heating element of the electronic equipment;

the inlet end of the power device is communicated with the heat absorption part, and the power device is connected with a controller of the electronic equipment;

the inlet end of the radiating pipe is communicated with the outlet end of the power device, the outlet end of the radiating pipe is communicated with the heat absorption part, and the radiating pipe is arranged around the circumference of the middle frame.

In some modified embodiments of the first aspect of the present application, in the electronic device, the heat dissipation pipe includes at least a first portion and a second portion;

the first part is arranged around the circumference of the middle frame and is attached to the inner surface of the middle frame, and the first end of the first part is communicated with the outlet end of the power device;

the second part is continuously bent in the electronic device, and two ends of the second part are respectively communicated with the second end of the first part and the heat absorption part.

In some modified embodiments of the first aspect of the present application, in the electronic device described above, the second portion is disposed in a middle region of the electronic device;

the second part comprises a plurality of radiating sub-pipes arranged along the first direction and a plurality of bent pipes arranged along the second direction, and one end of each radiating sub-pipe is connected to one end of the adjacent radiating sub-pipe through the bent pipe;

the first direction is perpendicular to the second direction, and the first direction is the length/width direction of the middle frame.

In some modified embodiments of the first aspect of the present application, in the electronic device, the distances between the adjacent radiating sub-pipes are equal.

In some modified embodiments of the first aspect of the present application, the electronic device is described above, wherein the middle frame includes a first side and a second side opposite to each other, and the first side and the second side of the middle frame are respectively provided with a display screen and a rear shell;

the heat absorption part, the power device and the radiating pipe are arranged between the display screen and the rear shell;

at least part of the rear shell is in a grid shape, and the grid-shaped rear shell covers at least part of the radiating pipe.

In some modified embodiments of the first aspect of the present application, the heat absorbing portion includes a flat cavity, the flat cavity is disposed parallel to the display screen, and an outer surface of at least a portion of the flat cavity is attached to the heat generating element.

In some modified embodiments of the first aspect of the present application, in the electronic device, a plurality of flow deflectors are disposed in the heat absorbing portion to guide the heat transfer fluid in the heat absorbing portion.

In some modified embodiments of the first aspect of the present application, in the electronic device, the heat dissipation pipe is a heat conductive metal pipe;

the radiating pipe is a flat pipe body.

In some modified embodiments of the first aspect of the present application, in the electronic device, the heat transfer fluid is water-cooled liquid or compressed gas.

In some modified embodiments of the first aspect of the present application, the electronic device is a water pump or a compressor.

Compared with the prior art, the electronic equipment that this application first aspect provided, heating element through with heat absorption portion and electronic equipment contacts, and set up the circumference that the cooling tube wound the center, realize directly taking away the inside heat of electronic equipment and through center extension heat dissipation route, in order to reach high-efficient radiating purpose, thereby solve present external cooling system and can only dispel the heat to the surface of cell-phone, inside heat dissipation is insufficient, and external cooling system is bulky, be difficult to carry, the problem of operation complicacy.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 schematically illustrates a structural diagram of an electronic device provided in an embodiment of the present application;

fig. 2 schematically illustrates an exploded structural diagram of an electronic device provided in an embodiment of the present application;

fig. 3 schematically illustrates a structural matching schematic diagram of a heat absorption part, a power device and a heat dissipation pipe in the electronic device provided by the embodiment of the present application;

FIG. 4 schematically illustrates the second perspective view of FIG. 3;

FIG. 5 schematically illustrates the third perspective view of FIG. 3;

FIG. 6 schematically illustrates an exploded view of the structure of FIG. 3;

the reference numbers illustrate: the electronic device 1, the middle frame 2, the heat absorption part 3, the power device 4, the radiating pipe 5, the first part 51, the second part 52, the radiating sub-pipe 521, the bent pipe 522, the rear shell 6, the first direction a and the second direction b.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.

The utility model discloses technical scheme for solving above-mentioned technical problem, the general thinking is as follows: example 1

Referring to fig. 1 and 2, an electronic device 1 according to an embodiment of the present invention includes a middle frame 2, and a heat absorption portion 3, a power device 4, and a heat dissipation tube 5 disposed in the middle frame 2; taking a smart phone as an example, the middle frame is a frame body structure, and the frame body comprises a frame body forming an installation space frame body and a frame body used for installing or/and fixing components of the smart phone. For example, the display screen can be installed in the frame body structure and be located one side of support body, other components and parts such as mainboard and battery are installed on the support body of frame body structure and be located the opposite side of support body, smart mobile phone's apron install in structural conduct of frame body is as smart mobile phone's backshell. The utility model discloses an electronic equipment's that embodiment described center can the different thickness electronic equipment of adaptation unidimensional not, also can the electronic equipment that the different components and parts of adaptation constitute. The embodiment of the utility model discloses a heating element can be for following at least one: a chip of an electronic device (e.g., CPU, GPU, communication chip, AI chip, audio chip, etc.), a battery, a circuit board, and the like.

The heat absorbing part 3 contains heat-conducting fluid, and the heat absorbing part 3 is in contact with a heat generating element (not shown in the figure) of the electronic device 1;

the inlet end of the power device 4 is communicated with the heat absorption part 3, and the power device 4 is connected with a controller (not shown in the figure) of the electronic equipment 1;

the inlet end of the radiating pipe 5 is communicated with the outlet end of the power device 4, the outlet end of the radiating pipe 5 is communicated with the heat absorption part 3, and the radiating pipe 5 winds the circumferential direction of the middle frame 2. Or may be embedded in the frame body of the middle frame 2.

The utility model provides an electronic equipment 1, it is through inside setting at center 2 the heat absorption portion 3 power device 4 and cooling tube 5 forms the inside cooling system of electronic equipment 1, utilizes radiating fluid to absorb heat with 3 direct contact heating element (CPU) of heat absorption portion to take away the heat through cooling tube 5, rethread power device 4 carries out the reciprocating circulation flow of radiating fluid in heat absorption portion 3 and cooling tube 5 in order to carry out the efficient heat dissipation, effectively reduces the inside temperature of electronic equipment when guaranteeing the CPU performance in order to solve present external cooling system and can only dispel the heat to the surface of cell-phone, and inside heat dissipation is insufficient to external cooling system to be difficult to carry, the problem of operation complicacy.

The electronic device 1 in the present application may be a terminal device with a display screen, such as a mobile phone, a tablet computer, a display, a television, and the like; the middle frame 2 is a metal frame structure, and provides a setting space for a battery, a CPU, a circuit board, a controller and a display screen of the electronic device 1.

Wherein the heat absorbing part 3 has a containing space filled with a heat transfer fluid, such as: water-cooling liquid or compressed gas, and the heat absorption part 3 is made of heat absorption material, such as: metal, and further, can efficiently absorb heat when the heat absorbing portion 3 is in contact with the heat generating element; the heating element in the embodiment mainly aims at the CPU with larger heating value, and can be applied to any heating element; the heat absorbing part 3 at least covers part of the surface of the heating element to achieve the purpose of efficiently absorbing heat; the heat absorption part 3 is provided with an inlet and an outlet, the outlet is communicated with the power device 4, the outlet is communicated with the radiating pipe 5, the power device is communicated with the radiating pipe 5, a closed circulating space is formed among the heat absorption part 3, the power device 4 and the radiating pipe 5, and the heat conduction fluid can flow in a reciprocating mode in the closed circulating space under the driving of the power device 4, so that the heat of the heating element is taken away.

The power device 4 is a water pump or a compressor, and can be arranged corresponding to the condition that the heat-conducting fluid is water cooling liquid or compressed air, and the power device 4 is connected with a controller of the electronic equipment 1 and receives a starting/closing signal of the controller; further, a temperature sensor (not shown in the figure) is disposed in the electronic device 1 to detect the temperature of the heating element, and when the temperature of the heating element reaches a threshold (temperature reduction is required or not required), the temperature sensor sends an on/off signal to the controller to realize intelligent control of the power device 4, for example: when a user plays a game through the mobile phone, the CPU can generate a large amount of heat, when the temperature sensor detects that the temperature of the CPU reaches the preset value requiring heat dissipation, a signal for starting heat dissipation is sent to the controller, the controller controls the power device 4 to start circulation for realizing heat absorption and flowing heat dissipation of the heat-conducting fluid, and when the temperature sensor detects that the temperature of the CPU reaches the threshold value requiring no heat dissipation, a signal for closing heat dissipation is sent to the controller, and the controller controls the power device 4 to stop working, so that the holding comfort of the mobile phone and the full performance of the CPU under the game state are guaranteed.

The radiating pipes 5 are arranged around the circumference of the middle frame 2, so that heat absorbed by the heat-conducting fluid in the heat absorption part 3 can be radiated out through a longer-distance radiating line; the heat dissipation pipe 5 in this embodiment is a metal hollow tubular structure, for example: the copper pipe can not only make full use of the limited space in the electronic equipment, but also can efficiently dissipate heat.

According to the above list, the electronic equipment that this application first aspect provided, through contacting heat absorbing part 3 with electronic equipment 1's heating element, and set up cooling tube 5 around the circumference of center 2, realize directly taking away the inside heat of electronic equipment 1 and through center 2 extension heat dissipation route, with the purpose that reaches high-efficient radiating, thereby solve present external cooling system and can only dispel the heat to the surface of cell-phone, inside heat dissipation is insufficient, and external cooling system is bulky, be difficult to carry, the problem of the operation complicacy.

The term "and/or" herein is merely an associative relationship describing an associated object, meaning that three relationships may exist, e.g., a and/or B, specifically understood as: both a and B may be included, a may be present alone, or B may be present alone, and any of the three cases can be provided.

Further, referring to fig. 3, in the electronic device 1 provided in the embodiment of the present application, in a specific implementation, the heat dissipation pipe 5 at least includes a first portion 51 and a second portion 52;

the first part 51 is arranged around the circumference of the middle frame 2 and is attached to the inner surface of the middle frame 2, and the first end of the first part 51 is communicated with the outlet end of the power device 4;

the second portion 52 is continuously bent in the electronic device 1, and two ends of the second portion 52 are respectively communicated with the second end of the first portion 51 and the heat absorbing portion 3.

Specifically, in order to realize that the heat radiating pipe 5 can radiate heat through a long heat radiating line, in this embodiment, the heat radiating pipe 5 is configured to include at least a first portion 51 and a second portion 52; referring to fig. 2 and 3, the first portion 51 is disposed around the circumference of the middle frame 2 and attached to the inner surface of the middle frame 2, and on one hand, the first portion is directly attached to the middle frame 2 made of metal to perform efficient heat dissipation, for example: bonding through heat-conducting gel; on the other hand, the heat dissipation circuit is prolonged through a surrounding arrangement mode, and the heat dissipation efficiency is improved; referring to fig. 3 and 4, the second portion 52 is continuously bent within an allowable space range of the electronic device 1, so as to extend the heat dissipation path as much as possible and increase the heat dissipation area, so as to provide a long enough path and a sufficient heat dissipation area for heat dissipation of the heat-conducting fluid; the two ends of the first portion 51 are respectively connected to the power device 4 and the second portion 52 to guide the heat-conducting fluid led out from the heat absorbing portion 3 into the second portion 52, so that the heat-conducting fluid flows in all the heat dissipation pipes 5, the heat dissipation circuit is extended, and the second portion 52 is finally connected to the heat absorbing portion 3, so that the heat-conducting fluid after heat dissipation is input back into the heat absorbing portion 3 again to absorb heat of the heating element again, thereby performing a reciprocating cycle.

Specifically, the heat dissipation pipe 5 is a heat conductive metal pipe, for example: a copper pipe; and the radiating pipe 5 is a flat pipe body, so that the flow resistance of the radiating pipe 5 is ensured to be smaller, the burden of a power device is reduced, and the radiating area is increased.

Further, referring to fig. 2, fig. 5 and fig. 6, in the electronic device 1 provided in the embodiment of the present application, in a specific implementation, the second portion 52 is disposed in a middle region of the electronic device 1;

the second portion 52 includes a plurality of radiating sub-pipes 521 arranged along the first direction a and a plurality of bent pipes 522 arranged along the second direction b, and one end of the radiating sub-pipe 521 is connected to one end of an adjacent radiating sub-pipe 521 through the bent pipe 522;

the first direction a is perpendicular to the second direction b, and the first direction a is the length/width direction of the middle frame 2.

Specifically, in order to adapt to an electronic device provided with two batteries, in this embodiment, the second portion 52 is disposed in a middle region of the electronic device 1, and the middle region is continuously arranged in a bent shape, referring to fig. 1 and fig. 2, a space is respectively provided at upper and lower ends of the middle frame 2, the space is used for disposing the batteries, and then the second portion 52 is arranged in the middle region of the two spaces, so as to prevent the battery disposing space from being occupied, and prevent the second portion 52 from generating heat dissipation at the portion held by the user when disposed at both sides, which leads to poor user experience; further, the second portion 52 includes a plurality of sub-radiating pipes 521 arranged side by side and at intervals along the first direction a, and one end of each sub-radiating pipe 521 is connected to one end of an adjacent sub-radiating pipe 521 through an elbow 522, so as to form a reciprocating serpentine arrangement of a plurality of sub-radiating pipes 521, and the distances between adjacent sub-radiating pipes 521 are equal, thereby ensuring the radiating efficiency;

specifically, in order to extend the heat dissipation circuit as much as possible, referring to fig. 4, in this embodiment, the inlet end of the power device 4 and the outlet end of the heat dissipation pipe 5 are spaced apart from each other at the installation position of the heat absorption portion 3, so as to ensure that the heat transfer fluid which is fully dissipated enters the inlet end of the heat absorption portion 3; specifically, the first portion 51 of the heat dissipation pipe 5 is returned to a position close to the outlet end of the power device 4 from the outlet end of the power device 4 by a distance as farthest as possible, the second portion 52 is bent and arranged from the position to a direction away from the outlet end of the power device 4, and the tail end of the second portion 52 is connected to the inlet end of the heat absorption part 3 as the outlet end of the heat dissipation pipe 5;

it can be understood that: the battery may power the power means 4.

Further, referring to fig. 1, in an electronic device 1 provided in the embodiment of the present application, in a specific implementation, the middle frame 2 includes a first side and a second side opposite to each other, and the first side and the second side of the middle frame 2 are respectively provided with a display screen (not shown in the figure) and a rear housing 6;

the heat absorption part 3, the power device 4 and the heat dissipation pipe 5 are arranged between the display screen and the rear shell 6;

at least part of the rear shell 6 is in a grid shape, and the grid-shaped rear shell 6 covers at least part of the radiating pipe 5.

Specifically, in order to realize efficient heat dissipation of the heat dissipation system composed of the heat absorption portion 3, the power device, and the heat dissipation pipe 5 without affecting the appearance of the electronic device 1, in this embodiment, the heat absorption portion 3, the power device 4, and the heat dissipation pipe 5 are disposed between the display screen and the rear housing 6, specifically, referring to fig. 2, the display screen (not shown in the figure), the heating element (CPU, not shown in the figure), the heat absorption portion 3, the power device 4, and the heat dissipation pipe 5 are sequentially disposed in the thickness direction from left to right and from left to right of the middle frame 2; the rear shell 6 needs to cover the second side of the whole middle frame, namely the battery covers corresponding to the two battery parts and the part corresponding to the middle area, so as to realize efficient heat dissipation of the heat dissipation pipe 5, in this embodiment, at least the rear shell 6 corresponding to the second part 52, namely the middle area, is arranged in a grid shape, so that heat inside the heat dissipation pipe 5 and the electronic equipment is effectively dissipated to the outside, external air is fully utilized to realize passive heat dissipation, and therefore, the heat dissipation efficiency can be improved, and the power consumption of the heat dissipation system of this embodiment can be reduced to a certain extent; and the setting of grid can effectively shelter from the structure setting of inside cooling tube 5, reinforcing aesthetic property.

Further, referring to fig. 6, in an implementation of the electronic device 1 provided in the embodiment of the present application, the heat absorbing portion 3 includes a flat cavity, the flat cavity is disposed parallel to the display screen, and at least a portion of an outer surface of the flat cavity is attached to the heat generating element.

Specifically, in order to realize efficient heat absorption of the heat absorption portion 3, in this embodiment, the heat absorption portion 3 is set to be a flat and thin metal cavity, and the flat cavity is parallel to the display screen and attached to the heating element (CPU), so that efficient heat absorption can be realized by using a large contact area, and heat of the heating element (CPU) can be rapidly dissipated.

Further, in the electronic device 1 provided in the embodiment of the present application, in a specific implementation, a plurality of flow guiding plates (not shown in the figure) are disposed in the heat absorbing portion 3 to guide the heat conducting fluid in the heat absorbing portion 3.

Specifically, in order to realize efficient heat conduction of the heat absorption portion 3, in this embodiment, a plurality of flow guide plates are arranged in the heat absorption portion 3, so that a path for a heat transfer fluid in the heat absorption portion 3 to enter the power device 4 and return to the heat absorption portion 3 can be effectively controlled, mixed flow is avoided, the temperature at the inlet end of the heat absorption portion 3 can be ensured to be in a low-temperature state for a long time, and a better heat absorption and heat conduction state is realized.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising:

the heat absorption device comprises a middle frame, and a heat absorption part, a power device and a radiating pipe which are arranged in the middle frame;

2. The electronic device of claim 1, wherein:

the radiating pipe at least comprises a first part and a second part;

3. The electronic device of claim 2, wherein:

the second portion is disposed within a middle region of the electronic device;

4. The electronic device of claim 3, wherein:

the distances between the adjacent radiating sub-pipes are equal.

5. The electronic device of claim 1, wherein:

the middle frame comprises a first side and a second side which are opposite, and the first side and the second side of the middle frame are respectively provided with a display screen and a rear shell;

6. The electronic device of claim 5, wherein:

the heat absorption part comprises a flat cavity, the flat cavity is parallel to the display screen, and at least part of the outer surface of the flat cavity is attached to the heating element.

7. The electronic device of claim 1, wherein:

the heat absorption part is internally provided with a plurality of guide plates for guiding heat-conducting fluid in the heat absorption part.

8. The electronic device of claim 1, wherein:

the radiating pipe is a heat-conducting metal pipe;

the radiating pipe is a flat pipe body.

9. The electronic device of claim 1, wherein:

the heat-conducting fluid is water-cooling liquid or compressed gas.

10. The electronic device of claim 1, wherein:

the power device is a water pump or a compressor.