CN215243543U - Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing - Google Patents

Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing Download PDF

Info

Publication number
CN215243543U
CN215243543U CN202120018018.XU CN202120018018U CN215243543U CN 215243543 U CN215243543 U CN 215243543U CN 202120018018 U CN202120018018 U CN 202120018018U CN 215243543 U CN215243543 U CN 215243543U
Authority
CN
China
Prior art keywords
plate
copper
prepreg
clad plate
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202120018018.XU
Other languages
Chinese (zh)
Inventor
路伟征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Shengyi Special Materials Co ltd
Original Assignee
Jiangsu Shengyi Special Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Shengyi Special Materials Co ltd filed Critical Jiangsu Shengyi Special Materials Co ltd
Priority to CN202120018018.XU priority Critical patent/CN215243543U/en
Application granted granted Critical
Publication of CN215243543U publication Critical patent/CN215243543U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

The utility model discloses a hot-pressing glue flow prevention structure for copper-clad plate prepregs, which comprises a laminating machine pressure device, wherein the laminating machine pressure device comprises an upper pressure plate and a lower supporting plate, and the upper pressure plate can move up and down relative to the lower supporting plate; a copper-clad plate and a mirror copper plate are arranged between the upper pressing plate and the lower pressing plate, a prepreg is impregnated on the surface of the mirror copper plate, and an infrared sensor is arranged at the upper edge of the lower pressing plate; the infrared sensor is used for monitoring glue overflow of the prepreg on the surface of the copper-clad plate when the upper pressing plate is pressed downwards. The utility model discloses an excessive glue of infrared sensor response, with signal transmission for the main control computer, control the top board through the main control computer and step down, prevent that the excessive glue is too big, can prevent the production of excessive glue problem.

Description

Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing
Technical Field
The utility model relates to a copper-clad plate prepreg hot pressing prevents gummosis structure.
Background
In the hot pressing process of the copper-clad plate, a step-down measure must be taken to meet the thickness requirement after the prepreg flows, which is a known technology. CN200910188749.2 discloses a method for controlling gummosis, which mainly comprises reducing the gummosis by reducing the pressure within ± 10 ℃ of the softening temperature of the prepreg according to the temperature parameter. However, this method is carried out on the premise that the softening temperature of the prepreg must be within the required control range, and if the softening temperature is too low due to quality fluctuations, the use of this method still leads to flow problems due to too late depressurization.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model aims at solving the not enough among the prior art, provide an overflow and can trigger induction system when gluing begins, step down automatically, prevent to overflow and glue a too big copper-clad plate prepreg hot pressing and prevent the gummosis structure.
The technical scheme is as follows: the utility model relates to a hot-pressing glue-flow-prevention structure for a copper-clad plate prepreg, which comprises a laminating machine pressure device, wherein the laminating machine pressure device comprises an upper pressure plate and a lower supporting plate, and the upper pressure plate can move up and down relative to the lower supporting plate; a copper-clad plate and a mirror copper plate are arranged between the upper pressure plate and the lower support plate, and an infrared sensor is arranged at the upper edge of the lower support plate; the infrared sensor is used for monitoring glue overflow of the prepreg on the surface of the copper-clad plate when the upper pressing plate is pressed downwards.
The utility model discloses a further improvement lies in, top board, infrared sensor all are connected with the main control computer electricity, and the main control computer is used for reciprocating through pneumatic cylinder control top board.
The utility model discloses a further improvement lies in, and the main control computer is singlechip or PLC's arbitrary one.
The utility model discloses a further improvement lies in, is equipped with temperature sensor on the lower supporting plate of infrared sensor offside, and temperature sensor is used for monitoring the temperature between top board and the lower supporting plate, and temperature sensor is connected with main control computer, bee calling organ electricity, and the main control computer is connected with the electric fan heater electricity.
The utility model discloses a further improvement lies in, and the copper-clad plate upper and lower surface that has the prepreg of flooding all is equipped with the mirror surface copper, all is equipped with the copper foil between mirror surface copper and the copper-clad plate.
The utility model discloses a further improvement lies in, mirror surface copper, copper foil, the copper-clad plate that the flooding has the prepreg between top board and the bottom suspension fagging, copper foil, mirror surface copper, from the top down arranges in proper order.
Compared with the prior art, the utility model provides a pair of copper-clad plate prepreg hot pressing prevents gummosis structure has realized following beneficial effect at least:
after the copper-clad plate is fed into the laminating machine, a plurality of touch sensing devices are arranged at the edge of the prepreg, when the edge of the copper-clad plate begins to generate glue overflow during hot pressing, the overflowing glue triggers the sensing devices, the sensing devices generate signals and transmit the signals to a main control computer of the laminating machine, and the main control computer of the laminating machine generates signals for reducing the voltage and controls the laminating machine to reduce the voltage, so that the problem of glue overflow is prevented.
Of course, it is not necessary for any product of the present invention to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the working schematic diagram of the touch infrared sensor of the present invention;
FIG. 3 is a schematic view of an electrical connection structure between a main control machine and an infrared sensor and a temperature sensor;
wherein, 1, an upper pressing plate; 2-a lower support plate; 3-copper clad laminate; 4-mirror copper plate; 5-a prepreg; 6-copper foil; 7-infrared sensor.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1, 2 and 3, the hot-pressing glue flow prevention structure for the copper-clad plate and the prepreg comprises a laminating machine pressure device, wherein the laminating machine pressure device comprises an upper pressure plate 1 and a lower support plate 2, and the upper pressure plate 1 can move up and down relative to the lower support plate 2; a copper-clad plate 3 and a mirror copper plate 4 are arranged between the upper pressure plate 1 and the lower support plate 2, and an infrared sensor 7 is arranged at the upper edge of the lower support plate 2; the infrared sensor 7 is used for monitoring glue overflow of the prepreg 5 on the surface of the copper-clad plate 3 when the upper press plate 1 is pressed downwards.
Based on the above embodiment, the upper press plate 1 above the laminating machine press device can be connected with the lower support plate 2 through the hydraulic cylinder or the air cylinder, and the upper press plate 1 is driven to move up and down through the push rod of the air cylinder, the electric cylinder or the hydraulic cylinder, so that the copper-clad plate 3 and the mirror surface copper plate 4 are extruded. The prepreg 5 is impregnated on the surface of the copper-clad plate 3, and once the extrusion force is too large, the prepreg overflows. The infrared sensor 7 is arranged to monitor the overflow condition, so that the pressure of the upper press plate 1 can be adjusted according to the overflow condition.
In the above embodiment, the upper and lower surfaces of the copper clad laminate 3 impregnated with the prepreg 5 are both provided with the mirror copper plates 4, and the copper foils 6 are both arranged between the mirror copper plates 4 and the copper clad laminate 3. Specifically, the mirror copper plate 4, the copper foil 6, the copper clad laminate 3 impregnated with the prepreg 5, the copper foil 6, and the mirror copper plate 4 are sequentially arranged from top to bottom between the pressing plate 1 and the lower supporting plate 2.
To further explain the present embodiment, it should be noted that the upper platen 1 and the infrared sensor 7 are both electrically connected to a main control computer, and the main control computer is used for controlling the upper platen 1 to move up and down through an air cylinder, an electric cylinder, or a hydraulic cylinder. Specifically, the main control computer is any one of a single chip microcomputer or a PLC. In this embodiment, when the infrared sensor 7 transmits the monitoring signal to the main control computer, the main control computer controls the power device of the upper platen 1, so as to adjust the stroke of the upper platen 1. In this embodiment, the brand and model of the single chip microcomputer and the PLC are not limited.
In order to further explain the embodiment, it should be noted that a temperature sensor is arranged on the lower support plate 2 opposite to the infrared sensor 7, the temperature sensor is used for monitoring the temperature between the upper pressure plate 1 and the lower support plate 2, the temperature sensor is electrically connected with the main control computer and the buzzer, and the main control computer is electrically connected with the fan heater. In this embodiment, the buzzer setting can remind the operator to pay attention to the production temperature, makes corresponding adjustment to the temperature according to actual conditions, has played the effect of duplicate protection.
According to the above embodiment, the utility model provides a pair of copper-clad plate prepreg hot pressing prevents gummosis structure has realized following beneficial effect at least:
after the copper-clad plate is fed into the laminating machine, a plurality of touch sensing devices are arranged at the edge of the prepreg, when the edge of the copper-clad plate begins to generate glue overflow during hot pressing, the overflowing glue triggers the sensing devices, the sensing devices generate signals and transmit the signals to a main control computer of the laminating machine, and the main control computer of the laminating machine generates signals for reducing the voltage and controls the laminating machine to reduce the voltage, so that the problem of glue overflow is prevented.
Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (6)

1. The utility model provides a copper-clad plate prepreg hot pressing prevents gummosis structure which characterized in that: the laminating machine pressure device comprises an upper pressure plate (1) and a lower support plate (2), wherein the upper pressure plate (1) can move up and down relative to the lower support plate (2); a copper-clad plate (3) and a mirror surface copper plate (4) are arranged between the upper pressure plate (1) and the lower support plate (2), and an infrared sensor (7) is arranged at the upper edge of the lower support plate (2);
the infrared sensor (7) is used for monitoring glue overflow of the prepreg (5) on the surface of the copper-clad plate (3) when the upper pressing plate (1) is pressed downwards.
2. The copper-clad plate and prepreg hot-pressing glue flow prevention structure according to claim 1, which is characterized in that: the upper pressing plate (1) and the infrared sensor (7) are electrically connected with a main control machine, and the main control machine is used for controlling the upper pressing plate (1) to move up and down through a hydraulic cylinder.
3. The copper-clad plate and prepreg hot-pressing glue flow prevention structure according to claim 2, which is characterized in that: the main control machine is any one of a single chip microcomputer or a PLC.
4. The copper-clad plate and prepreg hot-pressing glue flow prevention structure according to claim 2, which is characterized in that: the temperature sensor is arranged on the lower supporting plate (2) on the opposite side of the infrared sensor (7) and used for monitoring the temperature between the upper pressing plate (1) and the lower supporting plate (2), the temperature sensor is electrically connected with the main control computer and the buzzer, and the main control computer is electrically connected with the fan heater.
5. The copper-clad plate and prepreg hot-pressing glue flow prevention structure according to claim 1, which is characterized in that: the copper-clad plate (3) upper and lower surfaces impregnated with the prepreg (5) are respectively provided with a mirror surface copper plate (4), and a copper foil (6) is arranged between the mirror surface copper plate (4) and the copper-clad plate (3).
6. The copper-clad plate and prepreg hot-pressing glue flow prevention structure according to claim 5, which is characterized in that: mirror surface copper (4), copper foil (6), copper-clad plate (3) that have impregnated prepreg (5), copper foil (6), mirror surface copper (4) are arranged from the top down in proper order between top board (1) and bottom suspension board (2).
CN202120018018.XU 2021-01-06 2021-01-06 Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing Active CN215243543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120018018.XU CN215243543U (en) 2021-01-06 2021-01-06 Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120018018.XU CN215243543U (en) 2021-01-06 2021-01-06 Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing

Publications (1)

Publication Number Publication Date
CN215243543U true CN215243543U (en) 2021-12-21

Family

ID=79489447

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120018018.XU Active CN215243543U (en) 2021-01-06 2021-01-06 Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing

Country Status (1)

Country Link
CN (1) CN215243543U (en)

Similar Documents

Publication Publication Date Title
CN203611323U (en) Wood-based panel hot press
CN201550361U (en) Multilayer printed circuit board
CN208810887U (en) Automatic hot apparatus control device
CN215243543U (en) Structure for preventing glue flowing in copper-clad plate prepreg through hot pressing
CN108811328B (en) Automatic film pressing temperature adjusting device and automatic film pressing temperature adjusting method for film pressing machine
CN210415823U (en) Hot-pressing composite device of packaging bag making equipment
CN203110476U (en) Voltage heating type circuit board pressing system based on Industry Ethernet
CN204076625U (en) A kind of heating and melting multilayer film pressure device of thermoplastic composite
CN213321777U (en) Full-automatic mask hot-press forming device
CN208290612U (en) A kind of controllable cross cutting indentation equipment
CN210200566U (en) Heating and pressurizing curing equipment
CN110534358A (en) Heat-pressure curing equipment
CN214214495U (en) Laminating device of rigid-flex board
CN211074767U (en) Thermosetting continuous pressing production line for carbon fiber composite material
CN201275903Y (en) Cardboard production apparatus
CN212422447U (en) Microwave pressing production line for composite door and furniture board
CN208052192U (en) A kind of fiberboard compression set
CN2183250Y (en) Knurling machine for plate
CN2368255Y (en) Device for preheating circuitboard before press-filming
CN212798895U (en) Polycarbonate film production coiling mechanism
CN218838903U (en) Controllable temperature pressing equipment for laminated glass
CN219834526U (en) Mixed pressing device with controllable plate thickness
CN214082833U (en) Automatic laminating calendering device of black PE membrane
CN221429198U (en) PI film laminating jig
CN208242004U (en) A kind of presser device of multi-layer PCB board

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant