CN219834526U - Mixed pressing device with controllable plate thickness - Google Patents
Mixed pressing device with controllable plate thickness Download PDFInfo
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- CN219834526U CN219834526U CN202321051912.2U CN202321051912U CN219834526U CN 219834526 U CN219834526 U CN 219834526U CN 202321051912 U CN202321051912 U CN 202321051912U CN 219834526 U CN219834526 U CN 219834526U
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- microcontroller
- heating
- temperature
- signal
- pressing
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- 238000003825 pressing Methods 0.000 title claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 71
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 238000004891 communication Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000012545 processing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 36
- 238000003475 lamination Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 108010053481 Antifreeze Proteins Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model relates to a mixed pressing device with controllable plate layer thickness, and belongs to the technical field of PCB processing. The temperature sensor is arranged on the top wall of the supporting table and is used for collecting temperature signals of epoxy resin in the plate layer and transmitting the temperature signals to the microcontroller; the microcontroller is used for receiving the temperature signal and outputting a heating signal when the temperature signal is lower than a preset threshold value; the heating assembly is arranged on the bottom wall of the supporting table and used for heating the plate layer according to the heating signals. The accurate control sheet layer heating temperature, accurate temperature control for sheet layer pressfitting thickness is controllable, ensures that the sheet layer pressfitting is stable, makes its thickness unanimous, improves product quality.
Description
Technical Field
The utility model belongs to the technical field of PCB processing, and particularly relates to a mixing and pressing device with a controllable plate layer thickness.
Background
With the development of the electronic industry towards high end, the PCB as a main body for supporting the PCB is developed, which is characterized by higher and higher requirements on production technology, higher and more severe requirements on production equipment and higher and more severe requirements on size control. Therefore, the plate thickness, which is one of the dimensional controls, is highlighted. In the lamination process of the PCB, particularly for two or more layers of PCB products, the lamination process mainly comprises hot pressing and cold pressing. The hot pressing is to melt and solidify the prepreg (epoxy resin material) into a desired multilayer circuit board by heating the prepreg and applying a certain pressure such as 200-500PSI/cm 2. In the existing copper foil conductive heating press-fit machine, a copper foil conductive heating circuit board is continuously wound, and a heating disc is arranged on the upper portion and the lower portion of a cavity respectively, so that the auxiliary heating device is mainly used for auxiliary heating of a PCB product. The main shortcoming that exists of current PCB sheet lamination machine is: most of the existing laminating machines adopt a heating mode of heating an electric heating rod, so that the service life is short, the maintenance difficulty is high, the thermal hysteresis is large, and the accurate temperature control is not easy; and the PCB board is in the lamination process, can not carry out effective real-time control to the temperature of actual PCB board, can't guarantee the pressfitting stability of PCB board, causes the PCB board thickness inconsistent after the pressfitting, influences product quality.
Disclosure of Invention
The utility model aims to provide a mixed pressing device with controllable plate thickness, which is used for solving the problems that in the prior art, the PCB plate pressing machine is difficult to accurately control the temperature, the actual temperature of a PCB cannot be effectively and accurately controlled in real time, and the thickness of the pressed PCB plate layers is inconsistent, so that the product quality is affected.
The aim of the utility model can be achieved by the following technical scheme:
the utility model provides a controllable mixed pressure device of sheet thickness, includes brace table and the microcontroller that bears the weight of the sheet, and with microcontroller communication connection's temperature sensor and heating element, temperature sensor installs in the brace table roof for gather the temperature signal of sheet internal epoxy resin and transmit to microcontroller; the microcontroller is used for receiving the temperature signal and outputting a heating signal when the temperature signal is lower than a preset threshold value; the heating assembly is arranged on the bottom wall of the supporting table and used for heating the plate layer according to the heating signals.
As a further scheme of the utility model: still include casing and mix the pressure cylinder, mix the pressure cylinder install in the casing top, mix the pressure cylinder piston rod and run through the casing is connected with the clamp plate, the clamp plate bottom is connected with the pressure post, the brace table install in the casing diapire.
As a further scheme of the utility model: the driving cylinder is installed on two opposite side walls of the shell, and the output end of the driving cylinder is connected with a glue blocking edge plate.
As a further scheme of the utility model: the temperature sensor further comprises a delay circuit which is in communication connection with the microcontroller and is used for delaying the temperature signal received by the microcontroller.
As a further scheme of the utility model: the heating assembly comprises a relay and a heater, wherein the relay is respectively connected with the heater and the microcontroller and is used for controlling the heater to heat according to the heating signal output by the microcontroller.
As a further scheme of the utility model: the operation unit is in communication connection with the microcontroller and is used for receiving a user operation signal to output a key signal.
As a further scheme of the utility model: the microcontroller is further configured to generate the threshold value according to the key signal.
As a further scheme of the utility model: the temperature sensor is characterized by further comprising a display unit which is in communication connection with the microcontroller and is used for displaying the temperature signal and a preset threshold value.
The utility model has the beneficial effects that:
the utility model discloses a plate layer thickness controllable pressure mixing device, which is characterized in that a supporting table for bearing a plate layer, a microcontroller, a temperature sensor and a heating component are arranged, wherein the temperature sensor and the heating component are in communication connection with the microcontroller; the microcontroller is used for receiving the temperature signal and outputting a heating signal when the temperature signal is lower than a preset threshold value; the heating element install in the brace table diapire for heat the sheet layer according to this heating signal, when temperature signal reached the default threshold value, microcontroller stopped the heating to this position through relay control heater, accurate control sheet layer heating temperature for sheet layer pressfitting thickness is controllable, and accurate accuse temperature ensures that the sheet layer pressfitting is stable, makes its thickness unanimous, improves product quality.
Drawings
The utility model is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the internal structure of a device for mixing and pressing with a controllable thickness of a plate layer according to the present utility model;
FIG. 2 is a block diagram of a microcontroller of a hybrid device with a controllable plate thickness according to the present utility model;
fig. 3 is a block diagram of a heating assembly of a mixing and pressing device with a controllable thickness of a plate layer.
In the figure: 1. a housing; 2. pressing a column; 3. a mixing cylinder; 4. a pressing plate; 5. a guide rod; 6. a driving cylinder; 7. a glue blocking edge plate; 8. a support table; 9. a temperature sensor; 10. a heating assembly; 11. an operation unit; 12. a heat conduction channel; 13. and a display unit.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-3, a plate thickness controllable mix pressure device, including casing 1, mix pressure cylinder 3 is installed to casing 1 roof, mix pressure cylinder 3's piston rod slidable runs through in casing 1 roof, be connected with clamp plate 4 at mix pressure cylinder 3's piston rod end, install clamp post 2 at clamp plate 4's diapire, be connected with two guide bars 5 that symmetry set up at clamp plate 4's top surface, guide bar 5 runs through casing 1 roof slidable and passes casing 1 roof, install brace table 8 in casing 1 bottom, brace table 8 is used for bearing the plate layer of waiting the pressfitting, the in-process that stretches out through mix pressure cylinder 3 piston rod drives clamp post 2 decline and applys decurrent extrusion force to the plate layer and pressfitting the plate layer.
In an embodiment, two symmetrically distributed guide rods 5 are fixed on the top surface of the pressing plate 4, the top ends of the guide rods 5 penetrate through the top wall of the shell 1, and when the pressing plate 4 moves, the guide rods 5 can be driven to move, and the guide rods 5 are in guide fit with the shell 1, so that the pressing plate 4 moves more stably.
In the lamination process, epoxy resin is heated to be in a flowable liquid state from a semi-solidification state, the epoxy resin flows along a plate surface under the pressure action of a mixing cylinder 3, but the flowing state and the fluidity of the epoxy resin are different through the heating of an electric heating rod, if the temperature is higher, the viscosity of the epoxy resin is lower, the epoxy resin flows easily, more gummosis is caused in the lamination process, the plate thickness is thinner, if the temperature is lower, the viscosity of the epoxy resin is higher, the epoxy resin does not flow easily, less gummosis is caused in the lamination process, the heating temperature of the electric heating rod is not easy to accurately control the temperature, the plate thickness is thicker and the gummosis is uneven, the product quality cannot meet the production requirement, and the product is unqualified, so that the production cost is increased, the heating temperature can be detected in real time when the epoxy resin flows in the plate layer, the accurate temperature control is realized, and the accurate control of the heating temperature is realized through the microcontroller, the temperature sensor 9, the heating component 10, the display unit 13, the processor, the operating unit 11 and the storage unit;
wherein the temperature sensor 9 is arranged on the top wall of the supporting table 8 and is used for collecting real-time temperature signals of epoxy resin in the plate layers and transmitting the real-time temperature signals to the microcontroller, the microcontroller obtains real-time temperature through the processor and displays temperature information through a display screen which is connected to the shell 1 through the display unit 13, the memory unit stores preset threshold temperatures for pressing the required heating epoxy resin of the plate layers with different pressing layers, the microcontroller is used for receiving the temperature signals and obtaining temperature information and outputting heating signals to the heating component 10 when the temperature is lower than the preset threshold, the heating component 10 is arranged on the bottom wall of the supporting table 8, heat generated by heating of the heating component 10 is transmitted to the epoxy resin in the plate layers through the heat conducting channel 12 and is heated to the temperature required by the epoxy resin in the plate layers with the type, the temperature sensor 9 is connected with the microcontroller through a delay circuit, the heating component 10 is connected with the microcontroller and used for heating according to heating signals, the heating component 10 comprises a relay and a heater, the relay is respectively connected with the heater and the microcontroller and used for controlling the heater to heat according to the heating signals output by the microcontroller, when the temperature signals are lower than a preset threshold value, the microcontroller generates a heating signal to enable the relay to control the heater to heat and raise the temperature of the position, when the temperature signals reach the preset threshold value, the microcontroller controls the heater to stop heating the position through the relay, the board layer heating temperature is accurately controlled, the board layer lamination is ensured to be stable, the thickness of the board layer is consistent, and the product quality is improved; the process of comparing the threshold value of the temperature signal by the delay circuit is delayed, so that the condition that the quality of the product is reduced due to the condition that the temperature signal is abnormally increased or reduced due to the error acquisition of the temperature sensor 9 in the temperature measurement process is avoided, and the error starting condition of the heating assembly 10 is caused;
in an embodiment, the operation unit 11 is communicatively connected to a microcontroller for receiving a user operation signal to output a key signal, and the microcontroller is further configured to generate a preset threshold value according to the key signal.
In an embodiment, the display unit 13 is in communication with the microcontroller for displaying the temperature signal and the preset threshold value.
In one embodiment, in order to more accurately measure the temperature of the epoxy resin at different positions, there may be a plurality of temperature sensors 9, and a heating element 10 is disposed near each temperature sensor 9 to achieve a point-to-point accurate heating process.
The PCB board is very extensive in our life use, common circuit board divide into single-layer board, bilayer board and multiply wood, and multiply wood then carries out two liang pressfitting through the mode of pressfitting, then carry out whole pressfitting, but also there are some problems in the in-process that pressfitting is carried out to the circuit board, for example, need the manual work to carry out orderly putting to the circuit board, waste time and energy, and carry out the in-process that pressfitting is carried out to the circuit board, the PCB board easily takes place the skew, thereby influence the pressfitting effect, will lead to the circuit board unable to use when serious, increase manufacturing cost, in order to avoid this problem, drive cylinder 6 is installed to the relative both sides wall of casing 1, drive cylinder 6's output is connected with and hinders the gluey arris board 7, in the pressfitting in-process, place the sheet that will need pressfitting on supporting bench 8, it is neat to be close to the clamping of board layer that waits to extrude simultaneously to drive cylinder 6's piston rod downwardly, it aligns to extrude 2 board layer through mixing cylinder 3 at this moment, PCB board emergence skew influences product quality in the process, thereby manufacturing cost has been reduced.
In an embodiment, in order to prevent epoxy from flowing out from between the plate layers in the extrusion process, the uneven lamination between the plate layers is caused, the lamination strength does not reach the standard, after the plate layers are orderly, the glue blocking edge plates 7 are abutted to the left and right plate layers, the gaps between the plate layers are blocked by the glue blocking edge plates 7, the escape of glue flowing is avoided, after lamination, the glue blocking edge plates 7 are separated from the lamination after lamination by the retracting driving force of the driving cylinder 6, and then the pressing column 2 of the mixing cylinder 3 is lifted to finish the plate layer mixing lamination.
The utility model relates to a working principle of a plate layer thickness controllable mixing and pressing device, which comprises the following steps:
the temperature sensor 9 is installed in supporting bench 8 roof for gather the real-time temperature signal of sheet internal epoxy resin, and transmit to microcontroller, microcontroller obtains real-time temperature through the treater, and connect the display screen on casing 1 through display element 13 and show temperature information, the memory cell stores the preset threshold temperature that the required heating epoxy resin of different lamination number sheet layers carries out the pressfitting, microcontroller is used for receiving this temperature signal and obtains temperature information, and when this temperature is less than preset threshold value, output heating signal to heating element 10, this heating element 10 installs in supporting bench 8 diapire, the heat that produces through heating element 10 heating passes through heat conduction channel 12 and transmits the epoxy resin in to this sheet internal epoxy resin of this model, be connected with microcontroller through delay circuit to it, heating element 10 is connected with microcontroller, be used for heating according to heating signal, heating element 10 includes relay and heater, the relay is connected with heater respectively, be used for controlling the heater according to the heating signal that microcontroller output heats, when temperature signal is less than preset threshold value, microcontroller generates a heating signal and makes this heating element control the heater heat the position, it heats the sheet layer through the temperature-stabilizing and heat the temperature signal, the temperature control thickness is accurate, the temperature control is realized, the temperature control thickness is accurate and is stable, the sheet layer is heated through the temperature control, the temperature control is realized, the temperature control is accurate and the thickness is stable.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (8)
1. The device is characterized by comprising a supporting table (8) for bearing the plate layer, a microcontroller, a temperature sensor (9) and a heating assembly (10), wherein the temperature sensor (9) is in communication connection with the microcontroller, and the temperature sensor (9) is arranged on the top wall of the supporting table (8) and is used for acquiring temperature signals of epoxy resin in the plate layer and transmitting the temperature signals to the microcontroller; the microcontroller is used for receiving the temperature signal and outputting a heating signal when the temperature signal is lower than a preset threshold value; the heating assembly (10) is arranged on the bottom wall of the supporting table (8) and is used for heating the plate layer according to the heating signal.
2. The device for mixing and pressing the plate layer with the controllable thickness according to claim 1, further comprising a shell (1) and a mixing and pressing cylinder (3), wherein the mixing and pressing cylinder (3) is installed at the top of the shell (1), a piston rod of the mixing and pressing cylinder (3) penetrates through the shell (1) to be connected with a pressing plate (4), the bottom of the pressing plate (4) is connected with a pressing column (2), and the supporting table (8) is installed at the bottom wall of the shell (1).
3. The device for mixing and pressing the plate layers with the controllable thickness according to claim 2, wherein driving air cylinders (6) are arranged on two opposite side walls of the shell (1), and the output ends of the driving air cylinders (6) are connected with glue blocking edge plates (7).
4. The device of claim 1, further comprising a delay circuit in communication with the microcontroller for delaying receipt of the temperature signal by the microcontroller.
5. The device according to claim 1, wherein the heating assembly (10) comprises a relay and a heater, the relay being connected to the heater and the microcontroller, respectively, for controlling the heater to heat according to the heating signal output from the microcontroller.
6. The device of claim 1, further comprising an operation unit communicatively coupled to the microcontroller for receiving a user operation signal to output a key signal.
7. The device of claim 6, wherein the microcontroller is further configured to generate the threshold based on the key signal.
8. The device of claim 1, further comprising a display unit communicatively coupled to the microcontroller for displaying the temperature signal and a predetermined threshold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321051912.2U CN219834526U (en) | 2023-05-05 | 2023-05-05 | Mixed pressing device with controllable plate thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321051912.2U CN219834526U (en) | 2023-05-05 | 2023-05-05 | Mixed pressing device with controllable plate thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219834526U true CN219834526U (en) | 2023-10-13 |
Family
ID=88251210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321051912.2U Active CN219834526U (en) | 2023-05-05 | 2023-05-05 | Mixed pressing device with controllable plate thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219834526U (en) |
-
2023
- 2023-05-05 CN CN202321051912.2U patent/CN219834526U/en active Active
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