CN210200566U - Heating and pressurizing curing equipment - Google Patents
Heating and pressurizing curing equipment Download PDFInfo
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- CN210200566U CN210200566U CN201921453226.1U CN201921453226U CN210200566U CN 210200566 U CN210200566 U CN 210200566U CN 201921453226 U CN201921453226 U CN 201921453226U CN 210200566 U CN210200566 U CN 210200566U
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Abstract
The utility model relates to an automatic technical field discloses heating pressurization curing equipment, include: the device comprises a machine table, wherein a lower die set is arranged on the machine table and comprises a lower heating template and a lower heat insulation plate which are arranged in a stacked mode; the support is arranged above the machine table, and an upper module and a driving device for driving the upper module to longitudinally displace are arranged on the support; the upper die set comprises an upper pressing heating template and an upper heat insulation plate which are arranged in a stacked mode; the driving device comprises a servo motor and a screw rod which are arranged on the bracket. The heating pressurization curing equipment can adjust the downforce of the upper module by controlling the output torque of the servo motor in the processing process, so that the pressure is controllable, or the stroke of the screw rod is adjusted, the thickness is controllable, when the hot pressing equipment faces products with different layers, different thicknesses and different deformation characteristics, the thickness can be correspondingly controlled and adjusted, and the product thickness also has controllability.
Description
Technical Field
The utility model relates to an automatic technical field especially relates to stromatolite solid electrolytic capacitor's heating pressurization curing equipment.
Background
In the laminated production process of the laminated solid electrolytic capacitor, in order to realize the parallel connection of the tablet cores inside, the anode region is mainly conducted and connected in a welding mode, and the cathode region is mainly conducted and connected by adhering the tablet cores through conductive glue. The conductive adhesive can be conductive silver adhesive, conductive nickel adhesive, conductive copper adhesive, conductive silver-clad aluminum adhesive, and the like.
The heating and pressurizing curing machine in the prior art can automatically produce laminated solid electrolytic capacitors and generally comprises a machine table, wherein a lower heat conduction template, a lower heating plate and a lower heat insulation plate are sequentially arranged on the table top of a base table, and an upper heat insulation plate, an upper heating plate and an upper heat conduction template are arranged on a support on the upper part of the machine table. The upper heat insulation plate, the upper heating plate and the upper heat conduction template are pressed downwards to pressurize and solidify the cathode of the solid electrolytic capacitor. In the prior art, a cylinder or a vertical pressing block is generally adopted to realize a pressing process, the pressing force is mainly determined by the weight of an upper die (a heat insulation plate, an upper heating plate and an upper heat conduction template), so that the pressure of the pressing die is almost not adjustable, the thickness of a product after being solidified depends on the weight of the upper die and the deformation characteristic of the product, and the thickness of the product is not controllable.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heating and pressurizing solidification equipment aims at solving the unable adjustment pressure of heating and pressurizing solidification machine among the prior art, leads to product thickness not to possess the problem of controllability.
The utility model discloses a realize like this, provide heating pressurization curing equipment, include: the device comprises a machine table, wherein a lower die set is arranged on the machine table and comprises a lower heating template and a lower heat insulation plate which are arranged in a stacked mode; the support is arranged above the machine table, and an upper module and a driving device for driving the upper module to longitudinally displace are arranged on the support; the upper die set comprises an upper pressing heating template and an upper heat insulation plate which are arranged in a stacked mode; the driving device comprises a servo motor and a screw rod which are arranged on the bracket.
Further, a pressure sensor is arranged between the driving device and the upper die set.
Furthermore, a plurality of longitudinally extending guide rods are arranged on the upper die set, and a plurality of longitudinally extending guide holes for the guide rods to pass through are correspondingly formed in the bracket.
Further, the support comprises an upper plate, a lower plate and a plurality of support columns for supporting the upper plate, the lower plate is mounted on the machine table, the lower module is mounted on the lower plate, and the driving device is mounted on the upper plate.
Further, each support column is arranged vertically.
Further, the pressure sensor and the servo motor are electrically connected to the controller.
The heating pressurization curing equipment can adjust the downforce of the upper module by controlling the output torque of the servo motor in the processing process, so that the pressure is controllable, or the stroke of the screw rod is adjusted, the thickness is controllable, when the hot pressing equipment faces products with different layers, different thicknesses and different deformation characteristics, the thickness can be correspondingly controlled and adjusted, and the product thickness also has controllability.
Drawings
Fig. 1 is a schematic structural view of a heating, pressurizing and curing device provided in an embodiment of the present invention;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The implementation of the present embodiment is described in detail below with reference to specific drawings.
As shown in fig. 1, the heating and pressing curing apparatus provided in this embodiment includes a machine table 1 and a support 2, wherein the machine table 1 is provided with a lower module 11, and the lower module 11 includes a lower heating template 12 and a lower heat insulation board 13 which are stacked. The support 2 is arranged above the machine table 1, an upper module 24 and a driving device are installed on the support, and the driving device is used for driving the upper module 24 to longitudinally displace. The upper die set 24 includes an upper heated platen 26 and an upper heat shield 25 which are stacked. The driving means comprises a servo motor 27 and a lead screw 271 mounted on the stand 2.
In the processing process, the servo motor 27 outputs torque, the upper module 24 is driven to move longitudinally through the lead screw 271, not only the downward pressing action of the upper module 24 can be realized, but also the downward pressure of the upper module 24 can be adjusted by controlling the output torque of the servo motor 27, when products with different layers, different thicknesses and different deformation characteristics are subjected to hot pressing, the thicknesses can be correspondingly controlled and adjusted, namely the thicknesses of the products have controllability.
Preferably, a pressure sensor 272 is further provided between the driving device and the upper die set 24, and the output torque of the servo motor 27 and thus the down pressure can be adjusted more precisely according to the pressure value fed back by the pressure sensor 272.
Preferably, the heating, pressurizing and curing device in this embodiment further includes a controller, the pressure sensor 272 and the servo motor 27 are both electrically connected to the controller, the controller can be controlled by a preset program or an operator in real time, and the rotation of the servo motor 27 is precisely controlled according to the feedback pressure value, so that the independent automatic control of the hot pressing pressure of products with different layer numbers, different thicknesses and different deformation characteristics is realized. In specific application, specific pressure can be set, then the output power of the servo motor 27 is adjusted according to the pressure sensor 272, pressure control is realized, accurate down pressure is provided according to feedback pressure value adjustment, and the hot pressing pressure requirements of different products are met. Or, a specific screw rod pressing stroke is set, so that the stroke is controllable, the accurate pressing distance is provided, and the hot pressing thickness requirements of different products are met.
Preferably, a plurality of guide rods 28 extending longitudinally are arranged on the upper die set 24, a plurality of guide holes extending longitudinally are correspondingly formed in the bracket 2, and the guide rods 28 penetrate through the corresponding guide holes, so that the upper die set 24 can keep a vertical direction in the displacement process by matching of the guide rods 28 and the guide holes, and accurate die assembly with the lower die set 11 is ensured. The number of the guide rods 28 in this embodiment is four, and each guide rod is cylindrical, and correspondingly, the number of the guide holes is also 4, and each guide hole is a circular hole.
Preferably, the bracket 2 includes an upper plate 21, a lower plate 23, and a plurality of support columns 22. Wherein, the lower plate 23 is installed on the machine table 1, and the lower module 11 is installed on the lower plate 23. The drive unit is mounted on the upper plate 21, the guide holes are also formed in the upper plate 21, and the upper die set 24 is positioned below the upper plate 21 and moves longitudinally relative to the upper plate 21 to clamp the lower die set 11.
Preferably, each support column 22 is vertically disposed to cooperate with a guide bar 28 to further increase guidance.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. Heating and pressurizing curing equipment is characterized by comprising:
the device comprises a machine table, wherein a lower die set is arranged on the machine table and comprises a lower heating template and a lower heat insulation plate which are arranged in a stacked mode;
the support is arranged above the machine table, and an upper module and a driving device for driving the upper module to longitudinally displace are arranged on the support;
the upper die set comprises an upper pressing heating template and an upper heat insulation plate which are arranged in a stacked mode;
the driving device comprises a servo motor and a screw rod which are arranged on the bracket.
2. The apparatus according to claim 1, wherein a pressure sensor is further provided between the driving means and the upper mold set.
3. The apparatus according to claim 1, wherein the upper mold block is provided with a plurality of longitudinally extending guide rods, and the support is correspondingly provided with a plurality of longitudinally extending guide holes for the guide rods to pass through.
4. The apparatus according to claim 1, wherein the support includes an upper plate, a lower plate mounted to the table, and a plurality of support columns for supporting the upper plate, the lower module is mounted to the lower plate, and the driving means is mounted to the upper plate.
5. The apparatus according to claim 4, wherein each of the support columns is arranged vertically.
6. The apparatus according to claim 2, further comprising a controller, wherein the pressure sensor and the servo motor are electrically connected to the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921453226.1U CN210200566U (en) | 2019-09-03 | 2019-09-03 | Heating and pressurizing curing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921453226.1U CN210200566U (en) | 2019-09-03 | 2019-09-03 | Heating and pressurizing curing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210200566U true CN210200566U (en) | 2020-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921453226.1U Active CN210200566U (en) | 2019-09-03 | 2019-09-03 | Heating and pressurizing curing equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN210200566U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534358A (en) * | 2019-09-03 | 2019-12-03 | 丰宾电子（深圳）有限公司 | Heat-pressure curing equipment |
-
2019
- 2019-09-03 CN CN201921453226.1U patent/CN210200566U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534358A (en) * | 2019-09-03 | 2019-12-03 | 丰宾电子（深圳）有限公司 | Heat-pressure curing equipment |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Tangwei Industrial Zone, Tangwei Village, Gongming Town, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Fengbin Electronic Technology Co.,Ltd. Address before: 518000 Tangwei Industrial Zone, Tangwei Village, Gongming Town, Guangming New District, Shenzhen City, Guangdong Province Patentee before: CAPXON ELECTRONIC (SHEN ZHEN) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |