CN215222816U - Radiating anti-static mobile phone mainboard - Google Patents
Radiating anti-static mobile phone mainboard Download PDFInfo
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- CN215222816U CN215222816U CN202120834718.6U CN202120834718U CN215222816U CN 215222816 U CN215222816 U CN 215222816U CN 202120834718 U CN202120834718 U CN 202120834718U CN 215222816 U CN215222816 U CN 215222816U
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- heat dissipation
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Abstract
The utility model relates to the technical field of mobile phone mainboards, in particular to a heat-dissipation and anti-static mobile phone mainboard, which comprises a mainboard body and a metal heat-transfer sheet, wherein a chip is arranged on the upper surface of the mainboard body, a plurality of evenly-distributed metal heat-transfer sheets are arranged on the surface of a protection board, a plurality of evenly-distributed clamping grooves are arranged on the protection board, each clamping groove is matched and connected with a fixed supporting component, and a connecting component comprises a first fixed block and a second fixed block, and then the rotating block is matched and connected with the clamping groove to fix the protection plate.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field particularly, relates to static mobile phone motherboard is prevented in heat dissipation.
Background
At present, most of mobile phone mainboards are in the use process after installation, because various electronic components are installed on the mobile phone mainboard, heat can be generated during operation, if the heat generated by the mobile phone mainboard is not radiated, the temperature is too high, the electronic components are damaged, the mobile phone cannot be used, the work efficiency is reduced, and when the mobile phone is used, the accident that the mobile phone is accidentally dropped can occur, so that the damage of the electronic components installed on the mainboard cannot be used to delay the work process.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides the static mobile phone motherboard is prevented in the heat dissipation, can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
static mobile phone motherboard is prevented in heat dissipation, including mainboard body and metal heat transfer piece, surface mounting has the chip on the mainboard body, mainboard body top is connected with the protection shield through coupling assembling, the protection shield is equipped with a plurality of evenly distributed's metal heat transfer piece on the surface, be provided with a plurality of evenly distributed's draw-in groove on the protection shield, every the draw-in groove is connected with the cooperation of fixed stay subassembly, coupling assembling includes first fixed block and second fixed block.
Preferably, the first fixing block is fixedly connected with the upper end of the protection plate, the second fixing block is fixedly connected with the upper end of the main board body, and the first fixing block is movably connected with the second fixing block through a hinge.
Preferably, each metal heat transfer piece penetrates through and is fixedly arranged on the protection plate, and the lower surface of each metal heat transfer piece is tightly attached to the chip.
Preferably, each of the fixed support components comprises a housing, a support block and a rotating block, each of the housings is fixedly connected to the upper surface of the main board body, and the support block is movably mounted on the upper end surface of each of the housings.
Preferably, the upper surface of each support block is rotatably connected with a rotating rod, and the upper end of each rotating rod is fixedly connected with a rotating block.
Preferably, a spring is fixedly connected between the lower end surface of the supporting block and the lower surface of the inner side of the shell, and each rotating block is rotatably connected with the clamping groove in a matched mode.
Compared with the prior art, the utility model discloses following beneficial effect has:
because pass through hinge swing joint between first fixed block and the second fixed block, through hinge connection between first fixed block and the second fixed block, make this mobile phone motherboard be convenient for install and dismantle, convenient maintenance, make afterwards to link together protection shield and mainboard body through the fixed stay subassembly, play the effect jack-up supporting shoe that supports through being equipped with the spring, make to play the effect that supports the absorbing to the protection shield, the security of this mobile phone motherboard has been improved, make to rotate rotatory piece through being provided with the rotary rod afterwards, make to fix the protection shield through rotatory piece and draw-in groove cooperation connection afterwards.
Drawings
Fig. 1 is a schematic view of the overall structure of the heat dissipation anti-static mobile phone motherboard of the present invention;
fig. 2 is a schematic view of the overall opening structure of the heat dissipation anti-static mobile phone motherboard of the present invention;
fig. 3 is a schematic view of the protective plate structure of the heat dissipation anti-static mobile phone motherboard of the present invention;
fig. 4 is a schematic structural view of the main board body of the heat dissipation anti-static mobile phone main board of the present invention;
fig. 5 is a schematic structural view of a fixing and supporting component of the heat dissipation anti-static mobile phone motherboard of the present invention;
fig. 6 is the sectional structure diagram of the fixing and supporting component of the heat dissipation anti-static mobile phone motherboard of the present invention.
In the figure: 1. a main board body; 2. a protection plate; 3. a metal heat transfer sheet; 4. a connecting assembly; 5. fixing the support component; 6. a card slot; 7. a chip; 8. rotating the rod; 9. a spring; 10. a first fixed block; 11. a hinge; 12. a second fixed block; 13. rotating the block; 14. a support block; 15. a housing.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1-6, the radiating anti-static mobile phone motherboard comprises a motherboard body 1 and a metal heat transfer sheet 3, wherein a chip 7 is mounted on the upper surface of the motherboard body 1, a protection board 2 is connected above the motherboard body 1 through a connecting component 4, the metal heat transfer sheet 3 is arranged on the surface of the protection board 2 and is provided with a plurality of uniformly distributed clamping grooves 6, each clamping groove 6 is connected with a fixed supporting component 5 in a matching manner, and the connecting component 4 comprises a first fixed block 10 and a second fixed block 12.
Through the technical scheme, at first install mainboard body 1 in the cell-phone, make to link together protection shield 2 and mainboard body 1 through fixed supporting component 5 owing to be provided with coupling assembling 4 afterwards, play the effect of supporting the absorbing through fixed supporting component 5 when protecting mainboard body 1, the security of this cell-phone mainboard has been improved, be equipped with metal heat transfer piece 3 through protection shield 2 afterwards, make to dispel the heat to mainboard body 1 chip 7 on the surface, the heat that produces when will moving blows off.
In this embodiment, first fixed block 10 fixed connection and 2 upper ends of protection shield, second fixed block 12 fixed connection and the 1 upper end of mainboard body, through hinge 11 swing joint between first fixed block 10 and the second fixed block 12, through being connected through hinge 11 between first fixed block 10 and the second fixed block 12 for this mobile phone motherboard is convenient for install and dismantle, convenient maintenance.
In this embodiment, each metal heat transfer sheet 3 penetrates and is fixedly arranged on the protection plate 2, the lower surface of each metal heat transfer sheet 3 is closely attached to the chip 7, and the metal heat transfer sheets 3 are arranged to provide power to dissipate heat generated by the chip 7 in operation.
In this embodiment, every fixed stay subassembly 5 includes shell 15, supporting shoe 14 and rotatory piece 13, every shell 15 fixed connection is in 1 upper surface of mainboard body, every shell 15 upper end surface movable mounting has supporting shoe 14, every supporting shoe 14 upper surface rotates and is connected with the rotatory piece 13 of 8 upper end fixedly connected with of every rotary rod of 8 rotary rods, fixedly connected with spring 9 between supporting shoe 14 lower extreme surface and the inboard lower surface of shell 15, every rotatory piece 13 is rotatory to be connected with the cooperation of draw-in groove 6, jack-up supporting shoe 14 through being equipped with the effect that spring 9 played the support, make to play the absorbing effect of support to protection shield 2, the security of this cell-phone mainboard has been improved, make to rotate rotatory piece 13 through being provided with rotary rod 8 afterwards, make to fix protection shield 2 through rotatory piece 13 and draw-in groove 6 cooperation connection.
The working principle of the radiating anti-static mobile phone mainboard is as follows:
during the use, at first install mainboard body 1 in the cell-phone, afterwards because through hinge 11 swing joint between first fixed block 10 and the second fixed block 12, through connecting through hinge 11 between first fixed block 10 and the second fixed block 12, make this cell-phone mainboard be convenient for install and dismantle, convenient maintenance, afterwards make can link together protection shield 2 and mainboard body 1 through fixed stay subassembly 5, effect jack-up supporting shoe 14 through being equipped with spring 9 and playing the support, make to play the effect that supports the absorbing to protection shield 2, the security of this cell-phone mainboard has been improved, afterwards make through being provided with rotary rod 8 and can rotate rotatory piece 13, make to fix protection shield 2 through rotatory piece 13 and draw-in groove 6 cooperation connection afterwards.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. Static mobile phone motherboard is prevented in heat dissipation includes mainboard body (1) and metal heat transfer piece (3), its characterized in that: surface mounting has chip (7) on mainboard body (1), mainboard body (1) top is connected with protection shield (2) through coupling assembling (4), protection shield (2) are equipped with a plurality of evenly distributed's metal heat transfer piece (3) on the surface, be provided with a plurality of evenly distributed's draw-in groove (6) on protection shield (2), every draw-in groove (6) are connected with fixed stay subassembly (5) cooperation, coupling assembling (4) include first fixed block (10) and second fixed block (12).
2. The heat dissipation antistatic mobile phone motherboard of claim 1, characterized in that: first fixed block (10) fixed connection and protection shield (2) upper end, second fixed block (12) fixed connection and mainboard body (1) upper end, through hinge (11) swing joint between first fixed block (10) and the second fixed block (12).
3. The heat dissipation antistatic mobile phone motherboard of claim 1, characterized in that: each metal heat transfer sheet (3) penetrates through and is fixedly arranged on the protection plate (2), and the lower surface of each metal heat transfer sheet (3) is tightly attached to the chip (7).
4. The heat dissipation antistatic mobile phone motherboard of claim 1, characterized in that: each fixed supporting component (5) comprises a shell (15), a supporting block (14) and a rotating block (13), each shell (15) is fixedly connected to the upper surface of the main board body (1), and the supporting block (14) is movably mounted on the upper end surface of each shell (15).
5. The heat dissipation antistatic mobile phone motherboard of claim 4, characterized in that: the upper surface of each supporting block (14) is rotatably connected with a rotating rod (8), and the upper end of each rotating rod (8) is fixedly connected with a rotating block (13).
6. The heat dissipation antistatic mobile phone motherboard of claim 5, characterized in that: and a spring (9) is fixedly connected between the lower end surface of the supporting block (14) and the inner lower surface of the shell (15), and each rotating block (13) is rotatably connected with the clamping groove (6) in a matched manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120834718.6U CN215222816U (en) | 2021-04-22 | 2021-04-22 | Radiating anti-static mobile phone mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120834718.6U CN215222816U (en) | 2021-04-22 | 2021-04-22 | Radiating anti-static mobile phone mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215222816U true CN215222816U (en) | 2021-12-17 |
Family
ID=79450105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120834718.6U Active CN215222816U (en) | 2021-04-22 | 2021-04-22 | Radiating anti-static mobile phone mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215222816U (en) |
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2021
- 2021-04-22 CN CN202120834718.6U patent/CN215222816U/en active Active
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