CN215177112U - Radiating structure with good heat conduction effect - Google Patents

Radiating structure with good heat conduction effect Download PDF

Info

Publication number
CN215177112U
CN215177112U CN202121105454.7U CN202121105454U CN215177112U CN 215177112 U CN215177112 U CN 215177112U CN 202121105454 U CN202121105454 U CN 202121105454U CN 215177112 U CN215177112 U CN 215177112U
Authority
CN
China
Prior art keywords
heat
heat conduction
pipe
good
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202121105454.7U
Other languages
Chinese (zh)
Inventor
陈恺
谭张明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Songwei Technology Co ltd
Original Assignee
Shenzhen Songwei Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Songwei Technology Co ltd filed Critical Shenzhen Songwei Technology Co ltd
Priority to CN202121105454.7U priority Critical patent/CN215177112U/en
Application granted granted Critical
Publication of CN215177112U publication Critical patent/CN215177112U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a heat radiation structure that heat conduction effect is good, including the heat conduction piece, heat pipe and the radiator unit who connects gradually, the both ends of heat pipe respectively with heat conduction piece, radiator unit connect, the one end of heat pipe is pegged graft in the heat conduction piece, the other end of heat pipe wears to establish radiator unit and expose in radiator unit's one end, a plurality of heat pipes are buckled and are pegged graft in the heat conduction piece, the heat conduction piece is connected with external heat conduction spare part. The utility model discloses a radiating structure that the heat conduction effect is good has advantages such as heat conductivility excellence.

Description

Radiating structure with good heat conduction effect
Technical Field
The utility model relates to a heat radiation structure technical field, concretely relates to heat radiation structure that heat conduction effect is good.
Background
At present current heat radiation structure, all be with the direct laminating of heat pipe on the heat conduction piece, through modes such as soldering tin or glue with the heat pipe laminating on the heat conduction piece, make the interval grow between heat pipe and the heat pipe like this, the heat pipe quantity that can set up on the heat conduction piece of same area still less, influence the radiating effect.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure that heat conduction effect is good aims at solving above-mentioned problem.
According to a heat radiation structure that heat conduction effect is good that this application embodiment provided, including the heat conduction piece, heat pipe and the radiator unit who connects gradually, the both ends of heat pipe respectively with heat conduction piece, radiator unit connect, the one end of heat pipe is pegged graft in the heat conduction piece, the other end of heat pipe wears to establish radiator unit and expose in radiator unit's one end, a plurality of heat pipes buckle to peg graft in the heat conduction piece, the heat conduction piece is connected with external heat conduction spare part.
Preferably, the heat dissipation assembly includes a plurality of heat dissipation fins distributed in an array, and a plurality of heat pipes sequentially penetrate through the heat dissipation fins.
Preferably, the heat dissipation fins are made of aluminum.
Preferably, the distance between two adjacent heat dissipation fins is 2.1mm, and the thickness of each heat dissipation fin is 0.4 mm.
Preferably, the heat dissipation fins are provided with a plurality of through holes for the heat conduction pipes to penetrate through, and the through holes are provided with pinholes for leading in welding media.
Preferably, a sleeve is arranged at the joint of the heat conduction pipe penetrating through the heat dissipation fins, and the heat conduction pipe is welded with the sleeve through solder paste.
Preferably, fixing plates are arranged on two sides of the plurality of radiating fins, and the fixing plates between two adjacent radiating fins are abutted to each other.
Preferably, the heat conduction pipe is made of red copper, and the heat conduction block is made of copper.
Preferably, the heat conduction pipes are distributed in an array and inserted into the heat conduction blocks, and the heat conduction pipes are distributed in an array and penetrate through the heat dissipation assembly.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
1. the application designs a heat radiation structure that heat conduction effect is good, including the heat conduction piece, heat pipe and the radiator unit who connects gradually, the both ends of heat pipe respectively with heat conduction piece, radiator unit connect, the one end of heat pipe is pegged graft in the heat conduction piece, the other end of heat pipe wears to establish radiator unit just expose in radiator unit's one end, a plurality of heat pipes buckle to peg graft in the heat conduction piece, the heat conduction piece is connected with external heat conduction spare part. The design of the direct laminating of heat pipe on the heat conduction piece among the prior art adopts the utility model discloses a design, for prior art, the utility model discloses a directly peg graft the heat pipe in the heat conduction piece, adopt the mode that the heat pipe was pegged graft, the spacing distance between heat pipe and the heat pipe diminishes for the heat pipe that can set up is more in quantity on the heat conduction piece of the same cross section, and a plurality of heat pipes of setting on the heat conduction piece are more intensive, and the heat conduction effect is better.
2. The heat-radiating fins are provided with a plurality of through holes for the heat-conducting pipes to penetrate through, and the through holes are provided with pinholes for leading in welding media. The heat conduction pipe penetrates through the joint of the heat dissipation fins, and is provided with a sleeve, and the heat conduction pipe is welded with the sleeve through solder paste. The sleeve is designed, so that the contact area between the heat conduction pipe and the heat dissipation fins is greatly increased, the heat dissipation area is increased, and the heat dissipation efficiency is improved; secondly, the pinholes for leading in welding media are arranged above the through holes of the heat dissipation fins, and the arrangement of the pinholes ensures that the soldering paste can be conveniently and quickly injected between the heat conduction pipes and the heat dissipation fins, so that the heat conduction pipes and the heat dissipation fins are well welded, the heat conduction efficiency is improved, and the heat dissipation efficiency is improved.
3. The fixing plates are arranged on two sides of the plurality of radiating fins, the fixing plates between two adjacent radiating fins are mutually abutted, the design of the fixing plates is convenient for the structural support between the two adjacent radiating fins, and the two adjacent radiating fins are spaced at intervals, so that the radiating area of the radiating fins is increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a schematic structural view of a heat dissipation structure with good heat conduction effect of the present invention;
fig. 2 is a schematic structural view of the heat dissipation structure with good heat conduction effect according to the present invention;
FIG. 3 is an enlarged view of area A of FIG. 2;
fig. 4 is a schematic structural view of the fixing plate in the heat dissipation structure of the present invention with good heat conduction effect.
Description of reference numerals:
10. the heat dissipation structure has a good heat conduction effect; 20. a heat conducting block; 30. a heat conducting pipe; 40. a heat dissipating component; 41. Heat dissipation fins; 42. a through hole; 43. a pinhole; 44. a sleeve; 45. and (7) fixing the plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1 and 2, the present invention discloses a heat dissipation structure 10 with good heat conduction effect, a heat conduction block 20, a heat conduction pipe 30 and a heat dissipation assembly 40 connected in sequence, wherein two ends of the heat conduction pipe 30 are respectively connected with the heat conduction block 20 and the heat dissipation assembly 40, one end of the heat conduction pipe 30 is inserted into the heat conduction block 20, the other end of the heat conduction pipe 30 is inserted into the heat dissipation assembly 40 and exposed out of one end of the heat dissipation assembly 40, a plurality of heat conduction pipes 30 are bent and inserted into the heat conduction block 20, and the heat conduction block 20 is connected with external heat conduction components.
Design of heat pipe 30 direct laminating on heat conduction piece 20 among the prior art adopts the utility model discloses a design, for prior art, the utility model discloses a directly peg graft heat pipe 30 in heat conduction piece 20, adopt the mode of heat pipe 30 grafting, the spacing distance between adjacent heat pipe 30 and the heat pipe 30 diminishes for heat pipe 30 that can set up is more in quantity on the heat conduction piece 20 of the same cross section, and a plurality of heat pipes 30 of setting on heat conduction piece 20 are more intensive, and the heat conduction effect is better.
Referring to fig. 1 and 2, the heat dissipation assembly 40 includes a plurality of heat dissipation fins 41 distributed in an array, and a plurality of heat pipes 30 sequentially penetrate through the heat dissipation fins 41. The heat dissipation fins 41 are made of aluminum, the distance between every two adjacent heat dissipation fins 41 is 2.1mm, and the thickness of each heat dissipation fin 41 is 0.4 mm.
Referring to fig. 2 and 3, the heat dissipation fins 41 are provided with a plurality of through holes 42 for the heat conduction pipe 30 to pass through, and the through holes 42 are provided with pinholes 43 for introducing a welding medium. A sleeve 44 is disposed at a connection position where the heat pipe 30 penetrates through the heat dissipation fin 41, and the heat pipe 30 and the sleeve 44 are welded by solder paste.
The sleeve 44 is designed to greatly increase the contact area between the heat pipe 30 and the heat dissipation fins 41, thereby increasing the heat dissipation area and improving the heat dissipation efficiency; secondly, the pinholes 43 for guiding the soldering medium are formed above the through holes 42 of the heat dissipation fins 41, and the arrangement of the pinholes 43 ensures that the soldering paste can be conveniently and rapidly injected between the heat conduction pipe 30 and the heat dissipation fins 41, so that the heat conduction pipe 30 and the heat dissipation fins 41 can be well soldered, the heat conduction efficiency is improved, and the heat dissipation efficiency is improved.
Referring to fig. 3 and 4, fixing plates 45 are disposed on two sides of the plurality of heat dissipation fins 41, and the fixing plates 45 between two adjacent heat dissipation fins 41 are abutted to each other. The design of the fixing plate 45 facilitates the structural support between two adjacent heat dissipating fins 41, and at the same time, the two adjacent heat dissipating fins 41 are spaced apart to increase the heat dissipating area of the heat dissipating fins 41.
It is understood that the heat pipe 30 is made of red copper and the heat conducting block 20 is made of copper.
It is understood that the heat conducting pipes 30 are distributed in an array and inserted into the heat conducting block 20, and the heat conducting pipes 30 are distributed in an array and penetrate through the heat dissipation assembly 40.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
1. the application designs a heat radiation structure that heat conduction effect is good, including the heat conduction piece, heat pipe and the radiator unit who connects gradually, the both ends of heat pipe respectively with heat conduction piece, radiator unit connect, the one end of heat pipe is pegged graft in the heat conduction piece, the other end of heat pipe wears to establish radiator unit just expose in radiator unit's one end, a plurality of heat pipes buckle to peg graft in the heat conduction piece, the heat conduction piece is connected with external heat conduction spare part. The design of the direct laminating of heat pipe on the heat conduction piece among the prior art adopts the utility model discloses a design, for prior art, the utility model discloses a directly peg graft the heat pipe in the heat conduction piece, adopt the mode that the heat pipe was pegged graft, the spacing distance between heat pipe and the heat pipe diminishes for the heat pipe that can set up is more in quantity on the heat conduction piece of the same cross section, and a plurality of heat pipes of setting on the heat conduction piece are more intensive, and the heat conduction effect is better.
2. The heat-radiating fins are provided with a plurality of through holes for the heat-conducting pipes to penetrate through, and the through holes are provided with pinholes for leading in welding media. The heat conduction pipe penetrates through the joint of the heat dissipation fins, and is provided with a sleeve, and the heat conduction pipe is welded with the sleeve through solder paste. The sleeve is designed, so that the contact area between the heat conduction pipe and the heat dissipation fins is greatly increased, the heat dissipation area is increased, and the heat dissipation efficiency is improved; secondly, the pinholes for leading in welding media are arranged above the through holes of the heat dissipation fins, and the arrangement of the pinholes ensures that the soldering paste can be conveniently and quickly injected between the heat conduction pipes and the heat dissipation fins, so that the heat conduction pipes and the heat dissipation fins are well welded, the heat conduction efficiency is improved, and the heat dissipation efficiency is improved.
3. The fixing plates are arranged on two sides of the plurality of radiating fins, the fixing plates between two adjacent radiating fins are mutually abutted, the design of the fixing plates is convenient for the structural support between the two adjacent radiating fins, and the two adjacent radiating fins are spaced at intervals, so that the radiating area of the radiating fins is increased.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (9)

1. The utility model provides a heat radiation structure that heat conduction effect is good which characterized in that: the heat conduction device comprises a heat conduction block, heat conduction pipes and a heat dissipation assembly which are sequentially connected, wherein two ends of each heat conduction pipe are respectively connected with the heat conduction block and the heat dissipation assembly, one end of each heat conduction pipe is inserted into the corresponding heat conduction block, the other end of each heat conduction pipe penetrates through the corresponding heat dissipation assembly and is exposed out of one end of the corresponding heat dissipation assembly, the heat conduction pipes are bent and inserted into the corresponding heat conduction blocks, and the heat conduction blocks are connected with external heat conduction parts.
2. The heat dissipating structure with a good heat conducting effect of claim 1, wherein: the heat dissipation assembly comprises a plurality of heat dissipation fins distributed in an array mode, and a plurality of heat conduction pipes penetrate through the heat dissipation fins in sequence.
3. The heat dissipating structure with a good heat conducting effect of claim 2, wherein: the radiating fins are made of aluminum.
4. The heat dissipating structure with a good heat conducting effect of claim 2, wherein: the distance between two adjacent radiating fins is 2.1mm, and the thickness of each radiating fin is 0.4 mm.
5. The heat dissipating structure with a good heat conducting effect of claim 2, wherein: the heat-radiating fins are provided with a plurality of through holes for the heat-conducting pipes to penetrate through, and the through holes are provided with pinholes for leading in welding media.
6. The heat dissipating structure with good heat conduction effect of claim 5, wherein: the heat conduction pipe penetrates through the joint of the heat dissipation fins, and is provided with a sleeve, and the heat conduction pipe is welded with the sleeve through solder paste.
7. The heat dissipating structure with a good heat conducting effect of claim 2, wherein: the fixing plates are arranged on two sides of the plurality of radiating fins, and the fixing plates between two adjacent radiating fins are mutually abutted.
8. The heat dissipating structure with a good heat conducting effect of claim 1, wherein: the heat conduction pipe is made of red copper, and the heat conduction block is made of copper.
9. The heat dissipating structure with a good heat conducting effect of claim 1, wherein: the heat conduction pipes are distributed in an array and are inserted in the heat conduction blocks, and the heat conduction pipes are distributed in an array and penetrate through the heat dissipation assembly.
CN202121105454.7U 2021-05-22 2021-05-22 Radiating structure with good heat conduction effect Active CN215177112U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121105454.7U CN215177112U (en) 2021-05-22 2021-05-22 Radiating structure with good heat conduction effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121105454.7U CN215177112U (en) 2021-05-22 2021-05-22 Radiating structure with good heat conduction effect

Publications (1)

Publication Number Publication Date
CN215177112U true CN215177112U (en) 2021-12-14

Family

ID=79374509

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121105454.7U Active CN215177112U (en) 2021-05-22 2021-05-22 Radiating structure with good heat conduction effect

Country Status (1)

Country Link
CN (1) CN215177112U (en)

Similar Documents

Publication Publication Date Title
US7441592B2 (en) Cooler module
US7036566B1 (en) Heat dissipating module
US20090314471A1 (en) Heat pipe type heat sink and method of manufacturing the same
JP3106428B2 (en) Heat sink and method of manufacturing the same, and electronic device with heat sink and method of manufacturing the same
CN110730559A (en) PCB heat dissipation assembly and server with same
US20110279981A1 (en) Heat Dissipating Assembly
CN215177112U (en) Radiating structure with good heat conduction effect
CN219202287U (en) Heat dissipation device
CN210868300U (en) PCB heat dissipation assembly and server with same
CN209525628U (en) A kind of new radiator
CN217363616U (en) Heat radiation structure for electronic product
CN217363614U (en) Heat radiation unit for radiator
CN217363612U (en) Heat pipe mounting structure of radiator
CN213958942U (en) Radiating mechanism of patch power device
CN210428345U (en) Novel computer cooling fin
CN114850811A (en) Method for processing radiator
CN214544913U (en) Heat sink
CN102454956A (en) Single LED (light-emitting diode) light source radiating seat and LED lamp
CN218125034U (en) Circuit module and power device
CN211090321U (en) Power components and parts fixation clamp
CN219459575U (en) Oblique fin radiator
CN213126874U (en) Novel structure radiator of solderless processing procedure
CN211352914U (en) Radiator, circuit board radiating assembly and server
JP3120171U (en) A heat dissipation module that can be quickly coupled
CN220653844U (en) Glue tin combined radiator

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant