CN215147985U

CN215147985U - Semiconductor wafer polishing device capable of effectively preventing waste chip from being blocked

Info

Publication number: CN215147985U
Application number: CN202121118015.XU
Authority: CN
Inventors: 王岳峰
Original assignee: Shenzhen Yingfushi Technology Co ltd
Current assignee: Shenzhen Yingfushi Technology Co ltd
Priority date: 2021-05-24
Filing date: 2021-05-24
Publication date: 2021-12-14
Anticipated expiration: 2031-05-24

Abstract

The utility model relates to a semiconductor wafer polishing technical field specifically is a semiconductor wafer burnishing device who effectively prevents sweeps jam, comprises a workbench, the roof intermediate position of workstation is provided with polishing mechanism, and the workstation is close to left end position department and is provided with placement mechanism, and placement mechanism includes that first board and the second of placing place the board, and first board of placing, the structure that the board was placed to the second is unanimous, and first board of placing, second are placed and are passed through connecting rod fixed connection between the board, and first place and seted up on the board and place the hole, place and be fixed with on the hole pore wall and place the support, has seted up three through-hole on the workstation. The utility model discloses a setting placement machine constructs, can carrying out placing and polishing of semiconductor wafer in turn, the support of placing that sets up in the placement machine constructs simultaneously for the piece that produces during the polishing can directly drop in the support, has solved general burnishing device, can consume unnecessary polishing time, and the piece that produces in the polishing process is piled up easily and is caused the problem of jam.

Description

Semiconductor wafer polishing device capable of effectively preventing waste chip from being blocked

Technical Field

The utility model relates to a semiconductor wafer polishing technical field specifically is a semiconductor wafer burnishing device who effectively prevents sweeps jam.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, and the surface of the wafer needs to be polished in the production process of the semiconductor wafer, but a general polishing device has low efficiency in polishing, and when a worker puts and takes the wafer, the polishing time is wasted, and scraps generated in the polishing process are easily accumulated at a polishing position to cause blockage. In view of the above, a semiconductor wafer polishing apparatus effective in preventing clogging with debris is provided.

SUMMERY OF THE UTILITY MODEL

In order to make up for the above insufficiency, the utility model provides a semiconductor wafer polishing device which effectively prevents the sweeps from blocking.

The technical scheme of the utility model is that:

the utility model provides an effectively prevent semiconductor wafer burnishing device of sweeps jam, includes the workstation, the roof intermediate position of workstation is provided with polishing mechanism, the workstation is close to left end position department and still is provided with places the mechanism, place the mechanism including sliding connection in first place the board and the board is placed to the second on the workstation roof, first place the board, the structure that the board was placed to the second is unanimous, just first place board, second and place through connecting rod fixed connection between the board, first place and seted up on the board and place the hole, the pore wall lower extreme position of placing the hole is fixed with places the support, just set up three equidistant through-hole on the workstation.

Preferably, the through holes correspond to the placing holes, the aperture of each through hole is larger than that of each placing hole, the placing support is composed of a plurality of annular triangular supporting rods distributed at equal intervals, the top ends of the triangular supporting rods are arc-shaped, and rubber layers are bonded to the top ends of the triangular supporting rods.

According to a preferable technical scheme, locking screws are connected to the middle positions of the outer walls of the four sides of the first placing plate in a threaded mode, one ends of the locking screws are connected with clamping arc blocks in a rotating mode, and rubber gaskets are tightly bonded on the clamping arc blocks.

As the preferred technical scheme, a pushing cylinder is installed on the left side wall of the workbench, and the end position of a piston rod of the pushing cylinder is fixedly connected with the left side wall of the second placing plate.

As a preferred technical scheme, a funnel is fixed at the bottom end of the through hole in the middle of the workbench, and the bottom end of the funnel is communicated with an air suction pipe.

According to a preferable technical scheme, the polishing mechanism comprises a top plate, supporting rods are fixed at four corners of the bottom wall of the top plate, an electric push rod is arranged in the middle of the bottom wall of the top plate, a polishing frame is fixed at the end part of a piston rod of the electric push rod, supporting springs are fixed at positions, close to the four corners, of the bottom wall of the polishing frame, four limiting rods are fixed on the top wall of the workbench, the limiting rods penetrate through the corresponding supporting springs and are in sliding connection with the polishing frame, a polishing motor is installed in the middle of the bottom wall of the polishing frame, a polishing plate is fixed at the end part of an output shaft of the polishing motor, and polishing fabrics are fixed on the polishing plate.

As a preferred technical scheme, a support is fixed on the bottom wall of the workbench, and the through hole is communicated with the interior of the support.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a set up placement machine and construct, can carry out placing of semiconductor wafer in turn, polish in turn, make the efficiency of polishing obtain improving, the support of placing that sets up in the placement machine simultaneously, make the piece that produces during polishing directly drop in the support, general burnishing device has been solved, efficiency when polishing is lower, when the staff puts and gets the wafer, all can consume unnecessary polishing time, and the piece that produces in the polishing process, pile up easily at the polishing position, cause the problem of jam.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a front view of the present invention;

FIG. 3 is a schematic structural view of a placement mechanism of the present invention;

FIG. 4 is a front view of the placement mechanism of the present invention;

fig. 5 is a schematic structural view of the first placing board and the second placing board of the present invention;

fig. 6 is a schematic structural view of the bracket of the present invention.

In the figure: the polishing device comprises a workbench 1, a through hole 11, a polishing mechanism 2, a top plate 21, a support rod 211, an electric push rod 212, a polishing frame 22, a limiting rod 221, a support spring 2211, a polishing motor 23, a polishing plate 231, a polishing fabric 2311, a placing mechanism 3, a first placing plate 31, a placing hole 311, a placing support 312, a triangular support rod 3121, a locking screw 313, a clamping arc block 314, a rubber gasket 3141, a second placing plate 32, a connecting rod 33, a pushing cylinder 34, a support 4 and an air suction pipe 5.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-6, the present invention provides a technical solution:

the utility model provides an effectively prevent semiconductor wafer burnishing device of sweeps jam, including workstation 1, the roof intermediate position of workstation 1 is provided with polishing mechanism 2, workstation 1 is close to left end position department and still is provided with placing mechanism 3, placing mechanism 3 includes that sliding connection places board 31 and the second on 1 roof of workstation places board 32 in the first place of mechanism, the first board 31 of placing, the structure that board 32 was placed to the second is unanimous, and the first board 31 of placing, the second is placed and is passed through connecting rod 33 fixed connection between the board 32, the first hole 311 of placing has been seted up on the board 31 and has been placed hole 311, the pore wall lower extreme rigidity of placing hole 311 is fixed with places support 312, and set up three equidistant through-hole 11 on the workstation 1.

In this embodiment, the polishing mechanism 2 includes a top plate 21, support rods 211 are fixed at four corners of a bottom wall of the top plate 21, an electric push rod 212 is fixed at a middle position of the bottom wall of the top plate 21, a polishing frame 22 is fixed at an end of a piston rod of the electric push rod 212, support springs 2211 are fixed at positions, close to the four corners, of the bottom wall of the polishing frame 22, four limit rods 221 are fixed on a top wall of the workbench 1, the limit rods 221 penetrate through the corresponding support springs 2211 and are slidably connected with the polishing frame 22, a polishing motor 23 is installed at the middle position of the bottom wall of the polishing frame 22, a polishing plate 231 is fixed at an end of an output shaft of the polishing motor 23, and a polishing fabric 2311 is fixed on the polishing plate 231; the electric push rod 212 drives the polishing frame 22 to move downwards, then the polishing motor 23 is started, the polishing motor 23 drives the polishing plate 231 and the polishing fabric 2311 to rotate and polish the wafer, and in the process, the supporting spring 2211 plays a role in buffering and supporting the polishing frame 22, so that the normal and effective operation of polishing is ensured, and the extrusion to the wafer during polishing can be prevented.

In addition, the through hole 11 corresponds to the placing hole 311, the aperture of the through hole 11 is larger than that of the placing hole 311, the placing support 312 is composed of a plurality of annular triangular support bars 3121 which are distributed at equal intervals, and the top ends of the triangular support bars 3121 are arc-shaped and are adhered with rubber layers; through placing support 312, the piece that produces in the polishing process can directly drop from placing hole 311, and rethread through-hole 11 is discharged, has guaranteed that the piece that produces in the polishing process can not pile up to guarantee to last effectual polishing.

Furthermore, a funnel is fixed at the bottom end of the through hole 11 in the middle of the workbench 1, and the bottom end of the funnel is communicated with an air suction pipe 5; the through hole of 1 intermediate position of workstation corresponds polishing mechanism 2, and aspiration channel 5 is linked together with the air inlet port of outside air exhauster for the piece that produces in the polishing process can not fly away to the air, but can directly be siphoned away, and when further having guaranteed long-time polishing, the piece can not pile up and then cause the jam and influence follow-up polishing.

Furthermore, the middle positions of the outer walls of the four sides of the first placing plate 31 are all in threaded connection with locking screws 313, one end of each locking screw 313 is rotatably connected with a clamping arc block 314, and rubber gaskets 3141 are tightly adhered on the clamping arc blocks 314; through the clamping arc blocks 314 with at least four clamping blocks, the wafer is clamped and fixed under the action of the locking screw 313, the wafer is prevented from moving in the polishing process, and the polishing effect is ensured.

Further, a pushing cylinder 34 is installed on the left side wall of the workbench 1, and the end position of a piston rod of the pushing cylinder 34 is fixedly connected with the left side wall of the second placing plate 32; after the wafer placed on the first placing plate 31 is polished, the pushing cylinder 34 is started to work, the second placing plate 32 and the first placing plate 31 are pushed to move towards the right end of the workbench 1, at the moment, the second placing plate 32 is located under the polishing mechanism 2, the first placing plate 31 is located at the right end of the workbench 1, when the wafer placed in the second placing plate 32 is polished, the polished wafer on the first placing plate 31 is taken out, a new wafer is placed, when the piston rod of the pushing cylinder 34 returns to the original position, the first placing plate 31 is located under the polishing mechanism 2, at the moment, the second placing plate 32 is located at the left end of the workbench 1, the wafer in the second placing plate 32 is taken out and a new wafer is placed, the process is repeated, time can be effectively saved, and polishing efficiency is improved.

In the embodiment, the bottom wall of the workbench 1 is fixed with the bracket 4, and the through hole 11 is communicated with the inside of the bracket 4; the carrier 4 is used to store the debris generated during the polishing process and prevent the debris from drifting into the air.

It should be noted that, in the present embodiment, the electric push rod 212, the polishing motor 23, and the pushing cylinder 34 are all in the prior art, and are not described herein again.

The utility model discloses a semiconductor wafer polishing device that effectively prevents sweeps jam when using, at first place the semiconductor wafer in the first board 31 and the second place the board 32 in place the hole 311 to with the locking of centre gripping arc piece 314, start electric putter 212 work drive polishing frame 22 and move down afterwards, open polishing motor 23, polishing motor 23 work drives polishing board 231 and polishing fabric 2311 and rotates and polish the wafer;

after the wafer placed on the first placing plate 31 is polished, the piston rod of the electric push rod 212 returns to the original position, the pushing cylinder 34 is started to work, the second placing plate 32 and the first placing plate 31 are pushed to move towards the right end of the workbench 1, the second placing plate 32 is located right below the polishing mechanism 2 at the moment, the first placing plate 31 is located at the right end of the workbench 1, the polished wafer on the first placing plate 31 is taken out while polishing is carried out on the wafer placed in the second placing plate 32, a new wafer is placed, when the piston rod of the pushing cylinder 34 returns to the original position, the first placing plate 31 is located right below the polishing mechanism 2, the second placing plate 32 is located at the left end of the workbench 1 at the moment, the wafer in the second placing plate 32 is taken out and a new wafer is placed, and the process is repeated;

in this process, the piece is direct from placing support 312, placing hole 311 and dropping, and rethread through-hole 11 discharges, has solved general burnishing device, and efficiency when the polishing is lower, and when the staff put and gets the wafer, all can consume unnecessary polishing time, and the piece that produces in the polishing process piles up easily at the polishing position, causes the problem of jam.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A semiconductor wafer polishing apparatus effective in preventing clogging with shavings, comprising a table (1), characterized in that: the polishing device is characterized in that a polishing mechanism (2) is arranged at the middle position of the top wall of the workbench (1), a placing mechanism (3) is further arranged at the position, close to the left end, of the workbench (1), the placing mechanism (3) comprises a first placing plate (31) and a second placing plate (32) which are connected to the top wall of the workbench (1) in a sliding mode, the first placing plate (31) and the second placing plate (32) are consistent in structure, the first placing plate (31) and the second placing plate (32) are fixedly connected through a connecting rod (33), a placing hole (311) is formed in the first placing plate (31), a placing support (312) is fixed to the lower end of the hole wall of the placing hole (311), and three equidistant through holes (11) are formed in the workbench (1).

2. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: the through hole (11) corresponds to the placing hole (311), the aperture of the through hole (11) is larger than that of the placing hole (311), the placing support (312) is composed of a plurality of annular triangular supporting rods (3121) distributed at equal intervals, and the top ends of the triangular supporting rods (3121) are arc-shaped and are bonded with rubber layers.

3. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: the middle positions of the outer walls of the four sides of the first placing plate (31) are in threaded connection with locking screw rods (313), one ends of the locking screw rods (313) are rotatably connected with clamping arc blocks (314), and rubber gaskets (3141) are tightly bonded on the clamping arc blocks (314).

4. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: a pushing cylinder (34) is installed on the left side wall of the workbench (1), and the end position of a piston rod of the pushing cylinder (34) is fixedly connected with the left side wall of the second placing plate (32).

5. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: the bottom end of the through hole (11) positioned in the middle of the workbench (1) is fixed with a funnel, and the bottom end of the funnel is communicated with an air suction pipe (5).

6. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: polishing mechanism (2) includes roof (21), the diapire four corners rigidity of roof (21) has bracing piece (211), diapire intermediate position electric putter (212) of roof (21), the piston rod end fixing of electric putter (212) has polishing frame (22), the position that the diapire of polishing frame (22) is close to the four corners all is fixed with supporting spring (2211), just be fixed with four gag lever posts (221) on the roof of workstation (1), gag lever post (221) pass and correspond supporting spring (2211) and with polishing between the frame (22) sliding connection, polishing motor (23) are installed to the diapire intermediate position of polishing frame (22), the output shaft end fixing of polishing motor (23) has polishing board (231), be fixed with polishing fabric (2311) on polishing board (231).

7. A semiconductor wafer polishing apparatus effective in preventing debris clogging as recited in claim 1, wherein: a support (4) is fixed on the bottom wall of the workbench (1), and the through hole (11) is communicated with the inside of the support (4).