CN215145781U - Laser processing system - Google Patents
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- CN215145781U CN215145781U CN202120287536.1U CN202120287536U CN215145781U CN 215145781 U CN215145781 U CN 215145781U CN 202120287536 U CN202120287536 U CN 202120287536U CN 215145781 U CN215145781 U CN 215145781U
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Abstract
The utility model provides a laser processing system can be used to confirm the distance between laser cutting head and the work piece. The laser processing system includes: the device comprises a laser cutting head, a nozzle, a laser displacement sensor and a first optical filter; the laser cutting head is provided with a second optical filter, and first laser obtained by the laser cutting head can penetrate through the second optical filter and is projected onto a target part of a workpiece to be processed through a nozzle so as to process the target part; the laser displacement sensor is used for emitting second laser which can penetrate through the first optical filter and is reflected by the second optical filter to be projected onto a target part, and the laser displacement sensor is used for receiving third laser formed by reflecting the second laser on a workpiece to be processed, and the third laser is used for determining the distance between the target part of the workpiece to be processed and the laser cutting head; the first laser and the second laser are the same in the axial direction of the light beam between the second filter and the target part, or are parallel and have a specified distance.
Description
Technical Field
The utility model relates to a laser beam machining technical field especially relates to a laser beam machining system.
Background
Laser processing refers to a method for processing a material by using a converged laser beam, and is generally performed by using laser equipment including a laser, a processing machine, an optical fiber, a laser head, and the like. In laser processing, a converged laser beam is required to achieve energy concentration for cutting, and a position where a cross-sectional area of the converged laser beam is smallest is called a focal point.
In general, the machining requirements are variable, sometimes requiring the laser apparatus to machine at a positive focal length (focus above the workpiece), sometimes requiring the laser apparatus to machine at a negative focal length (focus below the workpiece), and sometimes requiring the laser apparatus to machine at 0 focal length (focus directly above the workpiece). The focus position needs to be adjusted before the machining, and if the focus position is not accurate or is deviated, the machining quality is affected, and in a serious case, the machining fails.
Therefore, the accuracy of the focal point position is important, and it is generally required to keep the distance between the laser cutting head and the workpiece constant during the cutting process, but for some workpieces with varying surface shapes, the distance between the laser cutting head and the workpiece needs to be determined in real time so as to keep the distance between the laser cutting head and the workpiece constant, for metal workpieces, the distance between the metal workpiece and the laser cutting head can be determined by detecting the capacitance value between the metal workpiece and the laser cutting head, and for non-metal workpieces, a scheme capable of determining the distance between the laser cutting head and the workpiece is currently absent.
Disclosure of Invention
The utility model provides a laser processing system can be used to confirm the distance between laser cutting head and the work piece.
The utility model provides a laser processing system, include: the device comprises a laser cutting head, a nozzle, a laser displacement sensor and a first optical filter;
the laser cutting head is provided with a second optical filter, and first laser obtained by the laser cutting head can penetrate through the second optical filter and is projected onto a target part of a workpiece to be processed through the nozzle so as to process the target part of the workpiece to be processed;
the laser displacement sensor is used for emitting second laser which can penetrate through the first optical filter and be reflected by the second optical filter to be projected onto a target part of the workpiece to be machined, and the laser displacement sensor is used for receiving third laser formed by reflecting the second laser on the workpiece to be machined, and the third laser is used for determining the distance between the target part of the workpiece to be machined and the laser cutting head;
the first laser and the second laser are the same in the axial direction of the light beam between the second optical filter and the target part, or are parallel and have a specified distance.
According to one embodiment of the present invention,
the first optical filter is used for transmitting light with the wavelength within a first specified wavelength range;
the second optical filter is used for transmitting light with the wavelength within a second specified wavelength range, and the first specified wavelength range is different from the second specified wavelength range;
the wavelengths of the second and third lasers are within the first specified wavelength range but outside the second specified wavelength range.
According to one embodiment of the present invention,
the wavelength of the first laser light is within the second specified wavelength range;
and the first laser is reflected on the workpiece to be processed to form fourth laser, and the wavelength of the fourth laser is out of the first specified wavelength range.
According to one embodiment of the present invention,
the wavelength of the first laser light is within the second specified wavelength range but outside the first specified wavelength range.
According to one embodiment of the present invention,
when the beam radius of the first laser beam reaching the target part is smaller than that of the second laser beam, the axial directions of the beams of the first laser beam and the second laser beam between the second optical filter and the target part are the same;
and when the beam radius of the first laser beam reaching the target part is larger than or equal to that of the second laser beam, the first laser beam and the second laser beam are parallel to the axial direction of the beam between the second optical filter and the target part and are separated by a specified distance.
According to an embodiment of the utility model, the laser cutting head further comprises a laser light emitting unit, wherein the laser light emitting unit is connected with the laser cutting head and is used for emitting laser to the laser cutting head;
the laser cutting head is also provided with a focusing lens, and the laser received by the laser cutting head from the laser light-emitting unit passes through the focusing lens to obtain the first laser.
According to an embodiment of the invention, the laser displacement sensor has a laser emitter; the second laser is laser light emitted by the laser emitter.
According to an embodiment of the present invention, the laser emitter is a point laser emitter.
According to the utility model discloses an embodiment still includes the cutting head protective glass, sets up the light-emitting position of laser cutting head is used for the protection the laser cutting head.
According to an embodiment of the present invention, the distance between the laser cutting head and the laser displacement sensor is greater than the specified distance;
the light-emitting part of the laser cutting head is perpendicular to the direction of the light-emitting part of the laser displacement sensor.
According to the utility model discloses an embodiment, the work piece of waiting to process is non-metallic material, or metallic material.
The utility model discloses following beneficial effect has:
in the embodiment of the utility model, the laser displacement sensor and the first optical filter are arranged in the laser processing system, the second optical filter is arranged in the laser cutting head, the first laser of the laser cutting head can penetrate through the second optical filter to reach the target part of the workpiece to be processed to realize the laser cutting of the target part by setting the position relation among the first optical filter, the laser displacement sensor and the second optical filter, the second laser sent by the laser displacement sensor can penetrate through the first optical filter but can not penetrate through the second optical filter, can be reflected by the second optical filter and projected onto the target part, and the axial directions of the beams between the second optical filter and the target part are the same or parallel and have a specified distance, because the first laser is sent towards the workpiece to be processed in the front, therefore, the range of the second laser between the second optical filter and the target part is measured, the distance between the target part and the laser cutting head can be determined, the third laser formed by the reflection of the second laser on the target part is associated with the second laser (for example, the range is the same), therefore, the laser displacement sensor can determine the range of the second laser between the second optical filter and the target part based on the third laser after the third laser is collected, the distance between the target part of the workpiece and the laser cutting head can be determined, and the laser displacement sensor is applicable to both metal materials and non-metal materials, has wider application range and more accurate result.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a block diagram of a laser processing system according to an embodiment of the present invention;
fig. 2 is a block diagram of a laser processing system according to another embodiment of the present invention;
fig. 3 is a block diagram of a laser processing system according to another embodiment of the present invention.
Description of reference numerals:
a laser cutting head 10; a second optical filter 11; a focusing lens 12; a nozzle 20; a laser displacement sensor 30; a laser transmitter 31; a first filter 40; a workpiece 50 to be machined; a laser light emitting unit 60; the cutting head protects the glasses 70.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The technical solution of the present invention will be described in detail with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
The utility model provides a laser processing system, this laser processing system can be used for treating the processing work piece and realize laser cutting, in cutting process, still can realize the distance measurement between laser cutting head and the cutting position to in time adjust the height of laser cutting head, avoid leading to forming bad work piece.
Referring to fig. 1 and 2, in one embodiment, a laser processing system may include: laser cutting head 10, nozzle 20, laser displacement sensor 30 and first filter 40.
The nozzle 20 is positioned below the laser cutting head 10 and can be fixed on the laser cutting head 10, and laser emitted by the laser cutting head 10 can pass through the nozzle 20, so that light stimulation or damage to the outside caused by laser with too high energy is avoided. The nozzle 20 can also be connected with an air source, and the air source can output air to the nozzle 20 in the laser cutting process, so that the nozzle 20 can blow air towards the workpiece 50 to be processed, impurities generated in the laser cutting process are blown away, and the cutting seam is prevented from being influenced by the impurities.
The laser cutting head 10 has a second optical filter 11, and the first laser light obtained by the laser cutting head 10 can penetrate through the second optical filter 11 and be projected onto the target part of the workpiece 50 to be processed through the nozzle 20, so as to process the target part of the workpiece 50 to be processed.
After passing through the second filter 11, the first laser can be filtered to remove unnecessary interference light, and then is emitted from the laser cutting head 10 and projected onto the target portion of the workpiece 50 to be processed through the nozzle 20 to process the target portion of the workpiece 50 to be processed, where the processing may be referred to as laser cutting.
Since the beam is of a certain radius and generally not a point, the target region may be the area onto which the beam of the first laser is projected or a larger area including the area onto which the beam is projected. For example, the target portion may be an area portion of the workpiece 50 to be processed, which is centered on the projection area of the first laser, although not limited specifically.
The first optical filter 40 is disposed between the laser displacement sensor 30 and the laser cutting head 10, and more specifically, between the laser displacement sensor 30 and the second optical filter 11 of the laser cutting head 10, as long as the positional relationship between the first optical filter 40 and the second optical filter 11 ensures that the laser emitted by the laser displacement sensor 30 can penetrate through the first optical filter 40 to reach the second optical filter 11 and be reflected by the second optical filter 11 to the currently processed target part, and the reflected light of the laser at the target part can be reflected by the second optical filter 11 and then reach the laser displacement sensor 30 through the first optical filter 40.
The laser displacement sensor 30 is configured to emit a second laser beam, which can be transmitted through the first filter 40 and reflected by the second filter 11 to be projected onto a target portion of the workpiece 50 to be processed, wherein the first laser beam and the second laser beam have the same axial direction between the second filter 11 and the target portion, or are parallel to each other and have a specified distance therebetween.
The laser displacement sensor 30 may be installed at a position other than the emission light path (or referred to as a main light path, i.e., a light path for processing from the laser head to the bottom) of the laser cutting head 10, and since the energy of the emission light path (i.e., the first laser light) of the laser cutting head 10 is large enough to damage the laser displacement sensor 30, it is preferable to install the laser displacement sensor 30 so as to avoid the emission light path.
The light-emitting part of the laser displacement sensor 30 and the light-emitting part of the laser cutting head 10 are oriented differently, the light-emitting part of the laser cutting head 10 faces the workpiece 50 to be processed, so the range of the first laser light is linear, and the laser displacement sensor 30 does not face the workpiece 50 to be processed, but the second laser light can be turned to reach the workpiece 50 to be processed by reflection of the second optical filter 11, so the range of the second laser light is a broken line type, and more preferably a right-angle broken line type as shown in fig. 1 and fig. 2.
The laser displacement sensor 30 is also used for receiving third laser light formed by reflecting the second laser light on the workpiece 50 to be processed, and the third laser light is used for determining the distance between the target part of the workpiece 50 to be processed and the laser cutting head 10.
The first filter 40 may transmit the second laser light and the third laser light, and may block interference light, for example, may block the first laser light or reflected light of the first laser light, so as to avoid interference with the measurement of the laser displacement sensor 30.
By setting the positional relationship between the laser cutting head 10, the first optical filter 40 and the laser displacement sensor 30, the axial directions of the beams of the first laser and the second laser between the second optical filter 11 and the target portion can be the same, that is, the first laser and the second laser are coaxial between the second optical filter 11 and the target portion, as shown in fig. 1, the axial directions of the beams of the first laser and the second laser are coincident, and then, the range of the first laser between the second optical filter 11 and the target portion and the range of the second laser between the second optical filter 11 and the target portion are equal.
Alternatively, by setting the positional relationship between the laser cutting head 10, the first filter 40 and the laser displacement sensor 30, the beams of the first laser and the second laser between the second filter 11 and the target site may be parallel to each other and have a predetermined distance therebetween, and the first laser and the second laser have a certain offset in the axial direction between the second filter 11 and the target site, as shown in fig. 2 (fig. 2 shows the beams by a line for better illustration, and should actually have a certain width).
On the basis of the above positional relationship, the ranges of the third laser light and the second laser light may be the same, and the distance between the second filter 11 and the laser displacement sensor 30 is predetermined, and therefore, the range of the second laser light between the second filter 11 and the target portion, that is, the range of the first laser light between the second filter 11 and the target portion may be determined from the third laser light, so that the distance between the target portion and the laser cutting head 10 may be determined.
Specifically, for example, the total range of the second laser or the third laser (specifically, half of the product of the time difference and the light speed) is calculated according to the time difference between the time of emitting the second laser and the time of receiving the third laser, and the light speed of the laser, the difference between the total range and the distance from the second optical filter 11 to the laser displacement sensor 30 is calculated, the range of the second laser between the second optical filter 11 and the target portion is obtained, and the distance between the target portion and the laser cutting head 10 can be determined according to the range. For example, the range may be determined as a distance between the target portion and the laser cutting head 10, or a difference between the range and a distance from the second optical filter 11 to the light emitting portion of the laser cutting head 10 is used as the distance between the target portion and the laser cutting head 10, which is not limited specifically.
It is understood that the calculation of the distance between the target site and the laser cutting head 10 can be realized by the laser displacement sensor 30, or can be realized by an external processing device, which is not limited in particular.
Preferably, when the beam radius of the first laser beam when reaching the target portion is smaller than the beam radius of the second laser beam, the beam axes of the first laser beam and the second laser beam between the second filter 11 and the target portion are the same.
Under the condition that the beam radius of the first laser when reaching the target part is smaller than that of the second laser, and the beam axes of the first laser and the second laser are the same, even if a slit is cut on the target part by the first laser, one part (middle part) of the second laser passes through the slit, and the other part (peripheral part) of the second laser can be reflected by the target part, so that the laser displacement sensor 30 can collect reflected light, and measurement can be normally realized.
Preferably, when the beam radius of the first laser beam when reaching the target portion is equal to or greater than the beam radius of the second laser beam, the first laser beam and the second laser beam are parallel to each other in the axial direction of the beam between the second filter 11 and the target portion and are separated by a predetermined distance.
Under the condition that the beam radius of the first laser beam when reaching the target part is greater than or equal to the beam radius of the second laser beam, if the beam axes of the first laser beam and the second laser beam are still the same, a slit is cut on the target part by the first laser beam, and the second laser beam, because of the smaller beam radius, completely passes through the slit and cannot be reflected by the target part at the moment, so that the laser displacement sensor 30 cannot normally measure the laser displacement. For example, the beams of the first laser light and the second laser light between the second filter 11 and the target region may have a partial intersection, but not a coincidence.
Optionally, the specified distance may be within 1cm, and even within 1mm, so as to ensure that the distance between the first laser and the second laser in the axial direction of the beam between the second filter 11 and the target portion is small, so that the measurement result may be more accurate. Of course, the method is not particularly limited.
Preferably, the distance between the laser cutting head 10 and the laser displacement sensor 30 is greater than a specified distance; the light-emitting part of the laser cutting head 10 is perpendicular to the direction of the light-emitting part of the laser displacement sensor 30. As shown in fig. 1 and 2, the light-emitting portion of the laser cutting head 10 faces the workpiece 50 to be processed, the laser displacement sensor 30 is located on one side of the laser cutting head 10 and faces the second optical filter 11, and the two faces are perpendicular to each other.
The laser displacement sensor 30 can be far away from the laser cutting head 10, so that the light emitting of the laser displacement sensor 30 is prevented from being influenced when the nozzle 20 is close to the surface of the workpiece 50 to be processed, and the influence of the shape of the nozzle 20 is also avoided, of course, the distance between the laser cutting head 10 and the laser displacement sensor 30 is not limited specifically, and the distance can be determined according to the installation space of a laser processing system.
Alternatively, the workpiece 50 to be processed is a non-metallic material, or a metallic material. The material of the workpiece 50 to be processed is not particularly limited as long as it can be cut by laser and can reflect light. In other words, the utility model discloses a laser beam machining system can be applicable to non-metallic material work piece and metallic material work piece, no matter be the metallic material work piece, still non-metallic material work piece, can all be added man-hour and measure the distance between corresponding position and the laser cutting head 10, also is exactly the height of laser cutting head 10, and application scope is wider, and measuring result is comparatively accurate.
In one embodiment, the first filter 40 is configured to transmit light having a wavelength within a first specified wavelength range;
the second optical filter 11 is configured to transmit light having a wavelength within a second specified wavelength range, where the first specified wavelength range is different from the second specified wavelength range;
the wavelengths of the second laser light and the third laser light are within the first specified wavelength range but outside the second specified wavelength range.
The first specified wavelength range and the second specified wavelength range may or may not have an intersection, and are not particularly limited. In the case where the first specified wavelength range and the second specified wavelength range intersect with each other, the wavelengths of the second laser light and the third laser light may be in a range where the first specified wavelength range does not intersect with the second specified wavelength range.
Preferably, the second filter 11 is used only for transmitting laser beams having the same wavelength as the second laser beam and the third laser beam, and the first filter 40 is used only for transmitting laser beams having the same wavelength as the first laser beam.
Since the wavelengths of the second laser light and the third laser light are within the first predetermined wavelength range but outside the second predetermined wavelength range, the second laser light and the third laser light may pass through the first filter 40 but may not pass through the second filter 11, and may be reflected when reaching the second filter 11, so that the second laser light and the third laser light may reach a desired position.
The wavelengths of the second laser light and the third laser light may be the same. Of course, if the reflection performance of the target portion is too strong, the first laser beam may be reflected by the target portion, and other interference laser beams with similar wavelengths may appear, and these interference laser beams may be reflected under the action of the first optical filter 40, so as to avoid entering the laser displacement sensor 30 to interfere with the measurement.
In one embodiment, the wavelength of the first laser light is within a second specified wavelength range, and thus, the first laser light may be transmitted through the second filter 11.
The wavelength of the first laser light is different from the wavelengths of the second laser light and the third laser light, and in the above embodiment, the second filter 11 may be used to distinguish the first laser light from the third laser light, so that the first laser light can transmit through the second filter 11, and the second laser light and the third laser light are reflected by the second filter 11.
Preferably, the wavelength of the first laser light is within the second specified wavelength range but outside the first specified wavelength range, so that the first laser light can pass through the second optical filter 11 but be blocked by the first optical filter 40 to avoid entering the laser displacement sensor 30 to interfere with the measurement of the laser displacement sensor 30.
In one embodiment, the first laser light is reflected on the workpiece 50 to be machined to form a fourth laser light having a wavelength outside the first specified wavelength range.
The first laser is reflected on the target portion of the workpiece 50 to be processed to form a fourth laser, and due to the laser cutting, the fourth laser may have lasers with multiple wavelengths, and may include the same laser wavelength as the first laser wavelength or different laser wavelengths from the first laser wavelength, depending on the reflective performance of the target portion.
The fourth laser beam may reach the second optical filter 11, and a part of the fourth laser beam may be reflected by the second optical filter 11 to reach the first optical filter 40, and since the wavelength of the fourth laser beam is outside the first specified wavelength range, even if the fourth laser beam reaches the first optical filter 40, the fourth laser beam may still be reflected by the first optical filter 40, so that the measurement of the laser displacement sensor 30 is not disturbed.
The wavelength of the fourth laser light is different from the wavelengths of the second laser light and the third laser light, and in the above embodiment, the first filter 40 may be used to distinguish the wavelengths, so that the second laser light and the third laser light can transmit through the first filter 40, and the fourth laser light is reflected by the first filter 40.
In an embodiment, referring to fig. 3 (fig. 3 is obtained on the basis of fig. 2, and may also be obtained on the basis of fig. 1, and the figure is only schematic), the laser processing system may further include a laser light emitting unit 60, and the laser light emitting unit 60 is connected to the laser cutting head 10 and is used for emitting laser light to the laser cutting head 10. The laser cutting head 10 further has a focusing lens 12, and the laser light received by the laser cutting head 10 from the laser light emitting unit 60 passes through the focusing lens 12 to obtain the first laser light.
The laser light emitting unit 60 and the laser cutting head 10 can be connected through an optical channel, and laser can be transmitted from the laser light emitting unit 60 to the laser cutting head 10. The laser light emitted by the laser light emitting unit 60 may be parallel light, and after passing through the focusing lens 12 of the laser cutting head 10, the parallel light can be converged, so that energy can be accumulated to obtain a first laser, and the first laser penetrates through the second optical filter 11 and passes through the spray nozzle, and finally, the laser cutting can be performed on the workpiece 50 to be processed.
The focusing lens 12 may be a convex lens, and may realize focusing of parallel light, and the focal position may be, for example, a target portion of the workpiece 50 to be processed, and is not limited specifically.
The laser light emitting unit 60 and the laser displacement sensor 30 can emit light synchronously, so that the distance between the target part to be processed and the laser cutting head 10 can be measured in real time in the cutting process, the height of the laser cutting head 10 can be adjusted in time, and high-quality processing is realized.
In one embodiment, referring to fig. 1-3, the laser displacement sensor 30 has a laser emitter 31. The laser emitter 31 is used for emitting laser; the second laser light is laser light emitted by the laser light emitter 31. Further, the laser emitter 31 may be a spot laser emitter 31.
It will be appreciated that the laser displacement sensor 30 may of course also have other device components, for example, a laser receiver for receiving the reflected laser light, a processor for performing data processing, such as distance measurement, etc., may also be included.
In one embodiment, the laser processing system may further include a cutting head protection lens 70 disposed at a light exit portion of the laser cutting head 10 for protecting the laser cutting head 10, so as to prevent impurities generated in the cutting process from splashing onto the laser cutting head 10 to damage the laser cutting head 10. Alternatively, the laser cutting head 10, the cutting head protective lens 70, and the nozzle 20 may be connected together in sequence.
In the above-mentioned embodiment, the laser displacement sensor 30 and the first optical filter 40 are arranged in the laser processing system, the second optical filter 11 is arranged in the laser cutting head 10, by setting the position relationship among the first optical filter 40, the laser displacement sensor 30 and the second optical filter 11, the first laser of the laser cutting head 10 can reach the target part of the workpiece 50 to be processed through the second optical filter 11 to realize the laser cutting of the target part, while the second laser emitted by the laser displacement sensor 30 can penetrate through the first optical filter 40 but cannot penetrate through the second optical filter 11, can be reflected by the second optical filter 11 and projected onto the target part, and the axial directions of the beams of the first laser and the second laser between the second optical filter 11 and the target part are ensured to be the same, or, parallel and at a specified distance, because the first laser is emitted towards the workpiece 50 to be processed, therefore, the range of the second laser between the second optical filter 11 and the target portion is measured, that is, the distance between the target portion and the laser cutting head 10 can be determined, and the third laser formed by reflecting the second laser on the target portion is associated with the second laser (for example, the range is the same), so that the laser displacement sensor 30 can determine the range of the second laser between the second optical filter 11 and the target portion based on the third laser after acquiring the third laser, that is, the distance between the target portion of the workpiece and the laser cutting head 10 can be determined, and the laser displacement sensor is applicable to both metal materials and non-metal materials, so that the application range is wider, and the result is more accurate.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (11)
1. A laser machining system, comprising: the device comprises a laser cutting head, a nozzle, a laser displacement sensor and a first optical filter;
the laser cutting head is provided with a second optical filter, and first laser obtained by the laser cutting head can penetrate through the second optical filter and is projected onto a target part of a workpiece to be processed through the nozzle so as to process the target part of the workpiece to be processed;
the laser displacement sensor is used for emitting second laser which can penetrate through the first optical filter and be reflected by the second optical filter to be projected onto a target part of the workpiece to be machined, and the laser displacement sensor is used for receiving third laser formed by reflecting the second laser on the workpiece to be machined, and the third laser is used for determining the distance between the target part of the workpiece to be machined and the laser cutting head;
the first laser and the second laser are the same in the axial direction of the light beam between the second optical filter and the target part, or are parallel and have a specified distance.
2. The laser machining system of claim 1,
the first optical filter is used for transmitting light with the wavelength within a first specified wavelength range;
the second optical filter is used for transmitting light with the wavelength within a second specified wavelength range, and the first specified wavelength range is different from the second specified wavelength range;
the wavelengths of the second and third lasers are within the first specified wavelength range but outside the second specified wavelength range.
3. The laser machining system of claim 2,
the wavelength of the first laser light is within the second specified wavelength range;
and the first laser is reflected on the workpiece to be processed to form fourth laser, and the wavelength of the fourth laser is out of the first specified wavelength range.
4. The laser machining system of claim 2,
the wavelength of the first laser light is within the second specified wavelength range but outside the first specified wavelength range.
5. The laser machining system of claim 1,
when the beam radius of the first laser beam reaching the target part is smaller than that of the second laser beam, the axial directions of the beams of the first laser beam and the second laser beam between the second optical filter and the target part are the same;
and when the beam radius of the first laser beam reaching the target part is larger than or equal to that of the second laser beam, the first laser beam and the second laser beam are parallel to the axial direction of the beam between the second optical filter and the target part and are separated by a specified distance.
6. The laser processing system of claim 1, further comprising a laser light emitting unit connected to the laser cutting head for emitting laser light to the laser cutting head;
the laser cutting head is also provided with a focusing lens, and the laser received by the laser cutting head from the laser light-emitting unit passes through the focusing lens to obtain the first laser.
7. The laser machining system of claim 1, wherein the laser displacement sensor has a laser emitter; the second laser is laser light emitted by the laser emitter.
8. The laser machining system of claim 7, wherein the laser emitter is a spot laser emitter.
9. The laser machining system of claim 1, further comprising a cutting head protection mirror disposed at a light exit portion of the laser cutting head for protecting the laser cutting head.
10. The laser machining system of claim 1, wherein a distance between the laser cutting head and the laser displacement sensor is greater than the specified distance;
the light-emitting part of the laser cutting head is perpendicular to the direction of the light-emitting part of the laser displacement sensor.
11. The laser processing system of claim 1, wherein the workpiece to be processed is a non-metallic material or a metallic material.
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| CN202120287536.1U CN215145781U (en) | 2021-02-01 | 2021-02-01 | Laser processing system |
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| CN202120287536.1U CN215145781U (en) | 2021-02-01 | 2021-02-01 | Laser processing system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115113315A (en) * | 2022-06-15 | 2022-09-27 | 大格创新科技(深圳)有限公司 | Optical filter preparation method and system and optical filter |
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2021
- 2021-02-01 CN CN202120287536.1U patent/CN215145781U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115113315A (en) * | 2022-06-15 | 2022-09-27 | 大格创新科技(深圳)有限公司 | Optical filter preparation method and system and optical filter |
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