CN215118642U - Semiconductor with buffering protective structure - Google Patents
Semiconductor with buffering protective structure Download PDFInfo
- Publication number
- CN215118642U CN215118642U CN202121447566.0U CN202121447566U CN215118642U CN 215118642 U CN215118642 U CN 215118642U CN 202121447566 U CN202121447566 U CN 202121447566U CN 215118642 U CN215118642 U CN 215118642U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- elastic
- packaging shell
- capacitor
- rubber pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a semiconductor with buffering protective structure, including the circuit board, reinforce welt, protection machanism and coupling mechanism, the welt is reinforceed to the positive lower extreme of circuit board is provided with, the upper end of circuit board is provided with protection machanism, the inside of circuit board is provided with coupling mechanism. This semiconductor with buffering protective structure can surround the protection around the electrolytic lateral wall of electric capacity through the setting of protection machanism, and elastic resin then can make and bond as an organic wholely between electric capacity electrolysis and the packaging shell, and elastic resin's elastic characteristic also makes electric capacity electrolysis can form certain elastic buffering when receiving horizontal or longitudinal pressure, can further promote the enhancement to the whole rigidity of circuit board through the setting of reinforceing welt and first rubber pad, and the effect of first rubber pad lies in can preventing that the circuit board can keep certain elasticity when receiving great vertical pressure, and prevent that the circuit board from appearing splitting.
Description
Technical Field
The utility model relates to the field of semiconductor technology, specifically be a semiconductor with buffering protective structure.
Background
The semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, as the most common semiconductor form, a circuit board is widely applied in daily life, the existing circuit board is easy to damage point components due to slight collision during installation and movement, and no corresponding relatively perfect measures exist.
Although the conventional semiconductor circuit board is seemingly compact in structure composition of components, the capacitor mounted on the surface of the conventional semiconductor circuit board is extremely easy to damage and fall off when being collided, and relatively speaking, effective buffering protection measures are also lacked, so that a semiconductor with a buffering protection structure is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor with buffering protective structure to solve the common semiconductor circuit board that proposes in the above-mentioned background art and comparatively complicated in the structure composition of components and parts, though seem fixed knot structure inseparabler, nevertheless its surface-mounted's electric capacity electrolysis appears damaged and drops very easily when receiving the collision, also lacks the problem of effectual buffering safeguard measure relatively speaking.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor with a buffer protection structure comprises a circuit board, a reinforced lining plate, a protection mechanism and a connecting mechanism, wherein the reinforced lining plate is arranged at the right lower end of the circuit board, the protection mechanism is arranged at the upper end of the circuit board, and the connecting mechanism is arranged in the circuit board;
the guard mechanism further includes:
packaging the shell;
the triangular clamping strip is fixed around the edge of the lower end of the packaging shell;
a reserved hole position which is arranged at the upper end of the packaging shell;
the elastic sealing ring is arranged on the edge of the reserved hole site for one circle;
the liquid injection holes are formed in two sides of the upper end of the packaging shell;
and the elastic resin is filled in the inner side of the packaging shell.
Preferably, the reserved hole position at the upper end of the packaging shell, the elastic sealing ring and the liquid injection hole are circular, and the capacitor is electrolyzed to form an elastic structure between the elastic resin and the packaging shell.
Preferably, the packaging shell is embedded with the circuit board through a triangular clamping strip and a triangular groove, and the triangular clamping strip is triangular.
Preferably, the circuit board further includes:
a chip assembly fixed to an upper surface of the circuit board;
the triangular groove is formed in the upper surface layer of the circuit board.
Preferably, the reinforcing liner plate further comprises:
the first rubber pad is attached to the upper end of the reinforced lining plate;
and the clamping strip is arranged around the edge of the reinforced lining plate.
Preferably, the reinforced lining plate forms an elastic structure with the circuit board through the first rubber pad, and the reinforced lining plate forms a clamping structure with the circuit board through the clamping strip.
Preferably, the connection mechanism further comprises:
a terminal portion;
the pin is arranged at the lower end of the terminal part;
the second rubber pad surrounds the upper end of the terminal part for a circle;
a capacitor is electrolyzed and is attached to the upper end of the second rubber pad;
and the lead is arranged at the center of the lower end of the capacitor.
Preferably, the capacitor is connected with the pins through the leads and the terminal parts, and the capacitor is connected with the terminal parts through the second rubber pad to form an elastic structure.
Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor with the buffer protection structure can surround and protect the periphery of the electrolytic side wall of the capacitor through the arrangement of the protection mechanism, the elastic resin can enable the capacitor to be electrolyzed and the packaging shell to be bonded into a whole, the elastic characteristic of the elastic resin also enables the capacitor to form certain elastic buffer when the capacitor is subjected to transverse or longitudinal pressure, the overall rigidity of the circuit board can be further improved and strengthened through the arrangement of the strengthening lining plate and the first rubber pad, and the first rubber pad has the function of preventing the circuit board from keeping certain elasticity when the circuit board is subjected to larger vertical pressure and preventing the circuit board from cracking;
through the arrangement of the packaging shell and the first rubber pad, the capacitor electrolysis is outstanding in structure, and the bottom connecting part is relatively fragile, so that the structure is extremely easy to damage by the outside world and is completely damaged, the packaging shell has the function of surrounding and protecting the periphery of the electrolytic side wall of the capacitor, the elastic resin can bond the capacitor electrolysis and the packaging shell into a whole, the elastic characteristic of the elastic resin also enables the capacitor electrolysis to form certain elastic buffer when the capacitor electrolysis is subjected to transverse or longitudinal pressure, meanwhile, the elastic resin also plays a role in bonding and fixing the packaging shell and the circuit board, the reserved hole position and the elastic sealing ring are convenient for the capacitor electrolysis to be inserted into the packaging shell and prevent the elastic resin from overflowing, and the liquid injection hole mainly plays a role in facilitating the injection of elastic resin liquid;
through the arrangement of the reinforced lining plate and the first rubber pad, the circuit board has stronger rigidity, but is easy to break when being subjected to larger impact pressure, so that the reinforced lining plate has the function of further improving and reinforcing the integral rigidity of the circuit board, the first rubber pad has the function of preventing the circuit board from keeping certain elasticity when being subjected to larger vertical pressure and preventing the circuit board from cracking, and the clamping strip mainly plays a role in limiting and mounting the circuit board and the reinforced lining plate;
through the setting of second rubber pad and terminal part, although the cooperation between encapsulation shell and the elastic sealing ring can form stronger side direction elastic support to the electric capacity electrolysis, then weak to some extent when receiving vertical pressure, consequently the effect of second rubber pad lies in can effectively strengthening the electrolytic perpendicular pressurized elasticity of electric capacity, and terminal part and lead wire mainly play the effect of being connected between electric capacity electrolysis and the pin.
Drawings
FIG. 1 is a schematic view of the overall internal structure of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the package casing of the present invention;
fig. 3 is a schematic diagram of the internal structure of the package casing of the present invention.
In the figure: 1. a circuit board; 101. a chip assembly; 102. a triangular groove; 2. reinforcing the lining plate; 201. a first rubber pad; 202. clamping the strip; 3. a protection mechanism; 301. packaging the shell; 302. a triangular clamping strip; 303. reserving hole sites; 304. an elastic sealing ring; 305. a liquid injection hole; 306. an elastic resin; 4. a connecting mechanism; 401. a terminal portion; 402. a pin; 403. a second rubber pad; 404. electrolyzing by a capacitor; 405. and (7) leading wires.
Detailed Description
Referring to fig. 1-3, the present invention provides a technical solution: a semiconductor with a buffer protection structure comprises a circuit board 1, a reinforced lining plate 2, a protection mechanism 3 and a connecting mechanism 4, wherein the reinforced lining plate 2 is arranged at the right lower end of the circuit board 1, the protection mechanism 3 is arranged at the upper end of the circuit board 1, and the connecting mechanism 4 is arranged in the circuit board 1;
the guard mechanism 3 further includes:
a package casing 301;
the triangular clamping strip 302 is fixed around the edge of the lower end of the packaging shell 301;
a reserved hole site 303 which is arranged at the upper end of the packaging shell 301;
the elastic sealing ring 304 is arranged on the edge of the reserved hole site 303 for one circle;
the liquid injection hole 305 is formed in the two sides of the upper end of the packaging shell 301;
and an elastic resin 306 filled inside the package case 301.
The packaging shell 301 is embedded with the circuit board 1 through the triangular clamping strip 302 and the triangular groove 102, the triangular clamping strip 302 is triangular, the reserved hole 303 at the upper end of the packaging shell 301, the elastic sealing ring 304 and the liquid injection hole 305 are circular, the capacitor electrolyte 404 forms an elastic structure with the packaging shell 301 through the elastic resin 306, the capacitor electrolyte 404 is protruded due to the structure, the bottom connecting part is relatively fragile, and the structure is extremely easy to be damaged by external damage, so the packaging shell 301 has the function of surrounding and protecting the periphery of the side wall of the capacitor electrolyte 404, the elastic resin 306 can bond the capacitor electrolyte 404 and the packaging shell 301 into a whole, the elastic characteristic of the elastic resin 306 enables the capacitor electrolyte 404 to form certain elastic buffering when being subjected to transverse or longitudinal pressure, and the elastic resin 306 also plays a role in bonding and fixing the packaging shell 301 and the circuit board 1, the reserved hole 303 and the elastic sealing ring 304 facilitate the capacitor electrolyte 404 to be inserted into the packaging shell 301 and prevent the elastic resin 306 from overflowing, and the liquid injection hole 305 mainly plays a role in facilitating the injection of the elastic resin 306 liquid.
The circuit board 1 further includes:
a chip module 101 fixed to the upper surface of the circuit board 1;
the triangular groove 102 is opened in the upper surface layer of the circuit board 1.
The reinforced lining board 2 further comprises:
a first rubber pad 201 attached to the upper end of the reinforcing liner plate 2;
the clamping strip 202 is arranged around the edge of the reinforced lining plate 2;
reinforce welt 2 and constitute elastic construction between through first rubber pad 201 and circuit board 1, and reinforce welt 2 and constitute the block structure through between card strip 202 and the circuit board 1, circuit board 1 though has stronger rigidity, it is easy breaking phenomenon to take place when receiving great impact pressure, consequently strengthen welt 2's effect lie in can further promoting the enhancement to circuit board 1's whole rigidity, and first rubber pad 201's effect lies in can preventing that circuit board 1 can keep certain elasticity when receiving great vertical pressure, and prevent that circuit board 1 from appearing splitting, card strip 202 then mainly plays the effect of carrying out spacing installation between circuit board 1 and the reinforced welt 2.
The connection mechanism 4 further includes:
a terminal portion 401;
a pin 402 disposed at a lower end of the terminal portion 401;
a second rubber pad 403 which surrounds the upper end of the terminal portion 401 by one turn;
a capacitor electrolyte 404 attached to the upper end of the second rubber pad 403;
a lead 405 disposed at the center of the lower end of the capacitor electrolyte 404;
the capacitor electrolyte 404 is connected with the pin 402 through the lead 405 and the terminal part 401, and the capacitor electrolyte 404 forms an elastic structure with the terminal part 401 through the second rubber gasket 403, although the sealing shell 301 and the elastic sealing ring 304 are matched to form a strong lateral elastic support for the capacitor electrolyte 404, the capacitor electrolyte 404 is weak when being subjected to vertical pressure, so that the second rubber gasket 403 can effectively enhance the vertical pressure elasticity of the capacitor electrolyte 404, and the terminal part 401 and the lead 405 mainly play a role in connecting the capacitor electrolyte 404 and the pin 402.
The working principle is as follows: for the semiconductor with the buffer protection structure, firstly, when the circuit board 1 is laterally collided, in order to avoid the capacitor electrolyte 404 from being damaged and falling off, here, the packaging shell 301 can surround and protect the periphery of the side wall of the capacitor electrolyte 404, the elastic resin 306 can bond the capacitor electrolyte 404 and the packaging shell 301 into a whole, the elastic characteristic of the elastic resin 306 also enables the capacitor electrolyte 404 to form certain elastic buffer when the capacitor electrolyte 404 is laterally or longitudinally pressed, meanwhile, the elastic resin 306 also plays a role in bonding and fixing the packaging shell 301 and the circuit board 1, the reserved hole 303 and the elastic sealing ring 304 are convenient for the capacitor electrolyte 404 to be inserted into the packaging shell 301 and prevent the elastic resin 306 from overflowing, the liquid injection hole 305 mainly plays a role in facilitating the liquid injection of the elastic resin 306, and in addition, the circuit board 1 has stronger rigidity, but it is easy to break when it is subjected to a large impact pressure, so the reinforcing liner plate 2 is used to further enhance the overall rigidity of the circuit board 1, the first rubber pad 201 is used to prevent the circuit board 1 from maintaining a certain elasticity when it is subjected to a large vertical pressure, and prevent the circuit board 1 from breaking, and finally, the second rubber pad 403 is used to effectively enhance the vertical compression elasticity of the capacitor electrolyte 404, and the terminal portion 401 and the lead 405 mainly play a role in connecting the capacitor electrolyte 404 and the lead 402.
Claims (8)
1. The utility model provides a semiconductor with buffering protective structure, includes circuit board, reinforces welt, protection machanism and coupling mechanism, its characterized in that: a reinforced lining plate is arranged at the right lower end of the circuit board, a protection mechanism is arranged at the upper end of the circuit board, and a connecting mechanism is arranged in the circuit board;
the guard mechanism further includes:
packaging the shell;
the triangular clamping strip is fixed around the edge of the lower end of the packaging shell;
a reserved hole position which is arranged at the upper end of the packaging shell;
the elastic sealing ring is arranged on the edge of the reserved hole site for one circle;
the liquid injection holes are formed in two sides of the upper end of the packaging shell;
and the elastic resin is filled in the inner side of the packaging shell.
2. A semiconductor provided with a buffer protection structure according to claim 1, wherein: the reserved hole position, the elastic sealing ring and the liquid injection hole at the upper end of the packaging shell are circular, and the capacitor electrolysis and the packaging shell form an elastic structure through elastic resin.
3. A semiconductor provided with a buffer protection structure according to claim 1, wherein: the packaging shell is embedded with the circuit board through the triangular clamping strip and the triangular groove, and the triangular clamping strip is triangular.
4. A semiconductor provided with a buffer protection structure according to claim 1, wherein: the circuit board further includes:
a chip assembly fixed to an upper surface of the circuit board;
the triangular groove is formed in the upper surface layer of the circuit board.
5. A semiconductor provided with a buffer protection structure according to claim 1, wherein: the reinforced liner plate further comprises:
the first rubber pad is attached to the upper end of the reinforced lining plate;
and the clamping strip is arranged around the edge of the reinforced lining plate.
6. A semiconductor provided with a buffer protection structure according to claim 5, wherein: the reinforced lining plate forms an elastic structure with the circuit board through the first rubber pad, and the reinforced lining plate forms a clamping structure with the circuit board through the clamping strip.
7. A semiconductor provided with a buffer protection structure according to claim 6, wherein: the connecting mechanism further comprises:
a terminal portion;
the pin is arranged at the lower end of the terminal part;
the second rubber pad surrounds the upper end of the terminal part for a circle;
a capacitor is electrolyzed and is attached to the upper end of the second rubber pad;
and the lead is arranged at the center of the lower end of the capacitor.
8. The semiconductor provided with the buffer protection structure as claimed in claim 7, wherein: the capacitor is connected with the pins through the leads and the terminal parts, and the capacitor is connected with the terminal parts through the second rubber pads to form an elastic structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121447566.0U CN215118642U (en) | 2021-06-28 | 2021-06-28 | Semiconductor with buffering protective structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121447566.0U CN215118642U (en) | 2021-06-28 | 2021-06-28 | Semiconductor with buffering protective structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215118642U true CN215118642U (en) | 2021-12-10 |
Family
ID=79311808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121447566.0U Active CN215118642U (en) | 2021-06-28 | 2021-06-28 | Semiconductor with buffering protective structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215118642U (en) |
-
2021
- 2021-06-28 CN CN202121447566.0U patent/CN215118642U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102760824B (en) | Package structure for LED | |
| TW200603372A (en) | Lead frame with improved molding reliability and package with the lead frame | |
| CN106257652B (en) | Packaging module and packaging method | |
| CN106946213A (en) | A kind of pressure sensor and preparation method thereof | |
| TWI613782B (en) | Semiconductor device | |
| JP2016100475A (en) | Semiconductor device | |
| CN215118642U (en) | Semiconductor with buffering protective structure | |
| CN205452281U (en) | Take power module of double -deck encapsulating of shell fragment | |
| CN210200718U (en) | High-power small-sized packaged silicon controlled rectifier | |
| CN101777827A (en) | SCR-based dedicated hybrid intelligent power module | |
| CN208655634U (en) | A kind of chip compact package structure | |
| CN211743155U (en) | Chip 3D packaging combination stacking structure | |
| CN213366587U (en) | Lead protection mechanism based on microelectronic packaging | |
| CN206559782U (en) | A kind of controller and electric tool | |
| CN201956341U (en) | Lead framework structure of middle pin | |
| CN212432264U (en) | Water meter adopting sealed photoelectric module | |
| CN208507649U (en) | A kind of electronic element packaging structure and electrical equipment | |
| CN211719600U (en) | Paster diode with shake buffer structure | |
| CN209607733U (en) | A kind of antivibration crash-proof chip diode | |
| CN206945202U (en) | A kind of pressure sensor | |
| CN101937898A (en) | Rectifier structure for moisture protection | |
| CN220976583U (en) | Sensor packaging structure and electronic equipment | |
| CN213184344U (en) | Packaging structure of PLCC LED of long-life | |
| CN211828732U (en) | Lead protection mechanism based on microelectronic packaging | |
| CN210438261U (en) | Crane balance beam structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |