CN215117141U - Heat dissipation module and projection ray apparatus - Google Patents
Heat dissipation module and projection ray apparatus Download PDFInfo
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- CN215117141U CN215117141U CN202121229894.3U CN202121229894U CN215117141U CN 215117141 U CN215117141 U CN 215117141U CN 202121229894 U CN202121229894 U CN 202121229894U CN 215117141 U CN215117141 U CN 215117141U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 54
- 238000009833 condensation Methods 0.000 claims abstract description 17
- 230000005494 condensation Effects 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 12
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 10
- 238000013461 design Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Abstract
The embodiment of the utility model provides a relate to projection ray apparatus design technical field, disclose a be applied to heat dissipation module of projection ray apparatus, this heat dissipation module includes: at least a heat pipe and aluminium alloy radiator, the end setting that generates heat of an at least heat pipe is in the side of being shaded of the light source module of projection ray apparatus, the fixed setting of condensation end of an at least heat pipe is in the aluminium alloy radiator, through the heat pipe with the aluminium alloy radiator realizes right the heat dissipation of light source module in the projection ray apparatus, the embodiment of the utility model provides a heat dissipation module journey system simple process, with low costs, the thermal resistance is low and good reliability.
Description
Technical Field
The embodiment of the utility model provides a relate to projection ray apparatus design technical field, in particular to heat dissipation module and projection ray apparatus.
Background
In the operation process of an optical machine module in the projection equipment, the light source module is limited by physical characteristics, electric energy can be converted into light energy and heat energy in the operation process, the heat energy is usually reflected in a mode that the temperature of an object rises, and the influence of the material, the packaging material, the process and the like of the current light source chip is led to, and the risks of light effect reduction, color temperature drift, forward voltage (VF value) drift, even burning of electronic components and the like of the light source module can usually occur when the temperature of components in the light source module, such as a PN junction in a light emitting diode light source, rises.
In implementing the embodiments of the present invention, the inventor finds that there are at least the following problems in the above related art: at present, in order to solve the problem that a light source in a projection light machine is easily overheated, an existing scheme generally selects to reduce the heat generation of the light source, for example, to reduce the number of light sources such as light emitting diodes in the light source and increase the area of a light source panel, or directly adopts a cold light source or a fluorescent light source with low thermal efficiency, and most of the light sources are improved, however, such improvements bring about the problems of unsatisfactory light emitting effect of the light source, increased cost and the like.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a heat dissipation module and a projection optical machine, which have the advantages of simple process, good reliability and low cost.
The embodiment of the utility model provides an aim at is realized through following technical scheme:
in order to solve the above technical problem, the first aspect of the present invention provides a heat dissipation module for projection optical machine, projection optical machine is applied to, projection optical machine is provided with the light source module, heat dissipation module includes:
the heating end of the at least one heat pipe is arranged on the backlight side of the light source module;
the aluminum profile radiator, the fixed setting of condensation end of an at least heat pipe is in the aluminum profile radiator.
In some embodiments, the aluminum profile heat sink is an integrally formed aluminum structure formed by an aluminum extrusion drawing process.
In some embodiments, the heat dissipation module further comprises:
and the fan is arranged on one side of the aluminum profile radiator.
In some embodiments, the light source module comprises an led light source and a copper substrate, the led light source is fixedly disposed on one side of the copper substrate,
and the heating end of the at least one heat pipe is fixed on the other side of the copper substrate through low-temperature solder paste in a welding manner.
In some embodiments, the aluminum profile heat radiator is provided with slots with the same number as the heat pipes, and the condensation end of the at least one heat pipe is fixed in the aluminum profile heat radiator through the slots.
In some embodiments, the condensation end of the at least one heat pipe is fixed in the groove of the aluminum profile heat sink by soldering.
In some embodiments, the condensation end of the at least one heat pipe is fixed in the slot of the aluminum profile heat sink by interference fit.
In some embodiments, the number of heat pipes is two and the number of slots is two.
In order to solve the above technical problem, the second aspect of the present invention provides a projection optical machine, including:
a light source module;
the heat dissipation module according to the first aspect is disposed on the backlight side of the light source module.
In some embodiments, the light engine further comprises:
and the projection lens is arranged on the light emergent side of the light source module.
Compared with the prior art, the beneficial effects of the utility model are that: be different from prior art's condition, the embodiment of the utility model provides a be applied to heat dissipation module of projection ray apparatus, this heat dissipation module includes: at least a heat pipe and aluminium alloy radiator, the end setting that generates heat of an at least heat pipe is in the side of being shaded of the light source module of projection ray apparatus, the fixed setting of condensation end of an at least heat pipe is in the aluminium alloy radiator, through the heat pipe with the aluminium alloy radiator realizes right the heat dissipation of light source module in the projection ray apparatus, the embodiment of the utility model provides a heat dissipation module journey system simple process, with low costs, the thermal resistance is low and good reliability.
Drawings
The embodiments are illustrated by the figures of the accompanying drawings which correspond and are not meant to limit the embodiments, in which elements/blocks having the same reference number designation may be represented by like elements/blocks, and in which the drawings are not to scale unless otherwise specified.
Fig. 1 is a schematic structural view of a heat dissipation module according to a first embodiment of the present invention at a viewing angle;
fig. 2 is a schematic structural view of a heat dissipation module at another viewing angle according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a heat pipe in the heat dissipation module shown in FIG. 1;
FIG. 4 is a schematic view of an aluminum heat sink in the heat dissipation module shown in FIG. 1;
FIG. 5 is a schematic structural diagram of an aluminum profile heat sink in the heat dissipation module shown in FIG. 1 from another perspective;
fig. 6 is a schematic structural diagram of a projection optical machine according to a second embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that, if not conflicted, the various features of the embodiments of the invention can be combined with each other and are within the scope of protection of the present application. In addition, although the functional blocks are divided in the device diagram, in some cases, the blocks may be divided differently from those in the device.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
In order to solve the light source module heat dissipation difficulty in present projection ray apparatus, the high temperature problem appears easily, the embodiment of the utility model provides a collect the light source, transfer heat, heat transfer in an organic whole, be applied to the heat dissipation module of projection ray apparatus, it is through addding the heat pipe on the light source module, then through the heat pipe with heat conduction to aluminium alloy radiator realize radiating mode, preparation simple process, the cost is lower, and can effectively improve the radiating efficiency of light source module, good reliability, reduce the thermal resistance of whole ray apparatus.
Specifically, the embodiments of the present invention will be further explained with reference to the drawings.
Example one
The embodiment of the utility model provides a heat dissipation module, please refer to fig. 1 and fig. 2 in the lump, it shows respectively the utility model provides a heat dissipation module is in the structure at two visual angles, the projection ray apparatus can be applied to heat dissipation module, the projection ray apparatus is provided with heat dissipation module 100 and light source module 200, heat dissipation module 100 includes: at least one heat pipe 110 and an aluminum profile heat sink 120.
Further, in some embodiments, with continuing reference to fig. 1 and fig. 2, the heat dissipation module 100 further includes: and a fan 130 disposed at one side of the aluminum profile heat sink 120. Preferably, the direction of the air inlet and the air outlet of the fan 130 is set on any side of the aluminum profile heat sink 120 that can generate convection, and/or preferably on the side with the largest area, so as to change the convection heat transfer coefficient of the aluminum profile heat sink 120 in the convection heat transfer process and improve the convection heat dissipation. It should be noted that, in the embodiment of the present invention, the fan 130 may not be provided, and the fan 130 is not provided, and the heat of the aluminum profile heat sink 120 is dissipated by natural convection, in practical use, the setting position and the number of the fan 130 can be set according to actual needs, and do not need to be restricted by the embodiment of the present invention.
In an embodiment of the present invention, referring to fig. 1 and fig. 2, the light source module 200 includes a light-emitting diode (LED) light source 210 and a copper substrate 220, the LED light source 210 is fixedly disposed on one side of the copper substrate 220, and the heat-emitting end 111 of the at least one heat pipe 110 is fixed on the other side of the copper substrate 220 by low-temperature solder paste. In the embodiment of the present invention, the PN junction of the led light source 210 generates a large amount of heat during the operation of the projection light machine, and the heat is diffused and conducted to the copper substrate 220 through the package structure of the light source module 200. In an actual application scenario, the light source module 200 may not be the structure of the light source module 200 as described above and shown in fig. 1 and fig. 2, but may also be other types of light sources, such as laser, and the light source bulb may also be installed on other types of substrates, specifically, may be set according to actual needs, and does not need to be restricted to the embodiments of the present invention.
The heating end 111 of the at least one heat pipe 110 is arranged on the backlight side of the light source module 200; the condensation end 112 of the at least one heat pipe 110 is fixedly arranged in the aluminum profile heat sink 120. Preferably, the heat pipe 110 may be made of a material with strong heat conductivity and/or high specific heat capacity, such as metal, and may be hollow or solid, and after the material is made into a long rod shape, the heat pipe 110 is made by bending, further, both ends of the heat pipe 110 may be subjected to a certain friction treatment, so as to improve the friction force at both ends, so that both ends of the heat pipe can be more firmly fixed when being respectively fixed on the light source module 200 and the aluminum profile heat sink 120, specifically, with regard to the setting of the material, the shape and the size of the heat pipe 110, the setting may be performed according to the heat generation condition of the light source module 200 during the actual use, and heat pipes with different size efficiencies and the like are selected, which does not need to be limited by the embodiments of the present invention.
The aluminum profile radiator 120 is an aluminum structure integrally formed by stretching and processing an aluminum extruded material. The aluminum profile heat sink 120 is provided with the same number of slots 121 as the heat pipes 110, and the condensation end 112 of at least one heat pipe 110 is fixed in the aluminum profile heat sink 120 through the slots 121. The aluminum profile radiator 120 is formed by sequentially performing secondary processing procedures of cutting, grooving, hole milling, anodic oxidation and the like on an aluminum extruded profile in a stretching mode. Specifically, among the aluminium alloy radiator 120, heat transfer area and size etc. can set up according to actual need, need not be restricted in the utility model discloses the injeciton.
The condensation end 112 of the at least one heat pipe 110 is fixed in the slot 121 of the aluminum profile heat sink 120 by soldering, or the condensation end 112 of the at least one heat pipe 110 is fixed in the slot 121 of the aluminum profile heat sink 120 by interference fit. Wherein, through the fixed mode of low temperature soldering tin, can be more effective quick transmission heat, and the fixed mode of adoption interference fit then can have simple structure, the centering nature is good, bear the weight of advantages such as dynamic height, can select according to actual conditions in the in-service use. In other embodiments, the two ends of the heat pipe 110 may also be fixed to the light source module 200 and the aluminum profile heat sink 120 respectively by other methods, for example, by fastening, screwing, adhering with high-temperature glue, or the like, and specifically, the heat pipe may be set according to actual needs without being restricted by the embodiments of the present invention.
Specifically, in the embodiment of the present invention, please refer to fig. 3, fig. 4 and fig. 5 together, wherein fig. 3 shows a structure of the heat pipe 110 in the heat dissipation module 100 shown in fig. 1, fig. 4 and fig. 5 respectively show a structure of the aluminum profile heat sink 120 in the heat dissipation module 100 shown in fig. 1 at two viewing angles, as shown in fig. 3, fig. 4 and fig. 5, the number of the heat pipes 110 is two, the number of the slots 121 is two, and the heat generated by the light source module 200 is conducted to the aluminum profile heat sink 120 through the two heat pipes 110 to achieve heat dissipation. In practical use, the quantity of the slot 121 in the heat pipe 110 and the aluminum profile heat sink 120 can be set according to actual needs, and does not need to be restricted by the embodiment of the present invention.
The heat dissipation module provided by the embodiment of the present invention adopts a mode of directly assembling the copper substrate 220 of the light source module 200, the heat pipe 110 and the aluminum profile heat sink 120 into an integral module by low temperature welding, the led light source 210 is packaged on the copper substrate 220, in operation, the led light source 210 generates a large amount of thermal power during operation, the thermal power is conducted to the heating end 111 of the at least one heat pipe 110 through the copper substrate 220 and the soldering medium metal tin layer, the thermal power is conducted from the heating end 111 to the condensing end 112 by utilizing the evaporation-condensation phase-change heat transfer characteristics of the heat pipe 110, the condensation end 112 of the heat pipe 110 diffuses the thermal power to the aluminum profile heat sink 120, the fan 130 provides forced convection heat transfer air volume and air pressure for the aluminum profile heat sink 120, and performs convection heat transfer on the heat transfer surface of the aluminum profile heat sink 120.
Example two
The embodiment of the utility model provides a projection ray apparatus please see fig. 6, and it shows the utility model provides a structure of projection ray apparatus, projection ray apparatus 10 includes: as in the heat dissipation module 100 and the light source module 200 of the first embodiment, the heat dissipation module 100 is disposed on the backlight side of the light source module 200.
The heat dissipation module 100 is the heat dissipation module 100 according to the first embodiment, and the specific structure and connection manner thereof are shown in the first embodiment and the drawings, and the structure of the heat dissipation module 100 will not be described in detail herein.
Further, with continued reference to fig. 6, the optical projector 10 further includes: and a projection lens 300 disposed on the light emitting side of the light source module 200. Projection lens 300 is for can be by light source module 200 arouses after shining and produces the projection image and adjust the device of projection image in order to realize the projection, preferably, it should include projection chip and lens group at least, and projection chip is used for receiving light source light that light source module 200 is emergent and produce projection image light, the lens group is used for adjusting focus, distortion, projection direction and size etc. of projection image, specifically, projection lens 300's specific structure can set up according to actual need, need not be restricted to the description and the injecing of the embodiment of the utility model.
The embodiment of the utility model provides an in provide a be applied to heat dissipation module of projection ray apparatus, this heat dissipation module includes: at least a heat pipe and aluminium alloy radiator, the end setting that generates heat of an at least heat pipe is in the side of being shaded of the light source module of projection ray apparatus, the fixed setting of condensation end of an at least heat pipe is in the aluminium alloy radiator, through the heat pipe with the aluminium alloy radiator realizes right the heat dissipation of light source module in the projection ray apparatus, the embodiment of the utility model provides a heat dissipation module journey system simple process, with low costs, the thermal resistance is low and good reliability.
It should be noted that the above-described device embodiments are merely illustrative, where the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments can be combined, steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. The utility model provides a heat dissipation module, its characterized in that is applied to the projection ray apparatus, the projection ray apparatus is provided with the light source module, heat dissipation module includes:
the heating end of the at least one heat pipe is arranged on the backlight side of the light source module;
the aluminum profile radiator, the fixed setting of condensation end of an at least heat pipe is in the aluminum profile radiator.
2. The heat dissipation module of claim 1,
the aluminum profile radiator is an aluminum structure integrally formed by stretching and processing an aluminum extruded section.
3. The heat dissipation module of claim 2,
the heat dissipation module further comprises:
and the fan is arranged on one side of the aluminum profile radiator.
4. The heat dissipation module of claim 3,
the light source module comprises a light-emitting diode light source and a copper substrate, the light-emitting diode light source is fixedly arranged on one side of the copper substrate,
and the heating end of the at least one heat pipe is fixed on the other side of the copper substrate through low-temperature solder paste in a welding manner.
5. The heat dissipation module of claim 4,
the aluminum profile radiator is provided with groove positions with the same number as the heat pipes, and the condensation end of at least one heat pipe is fixed in the aluminum profile radiator through the groove positions.
6. The heat dissipation module of claim 5,
and the condensation end of the at least one heat pipe is fixed in the groove position of the aluminum profile radiator through low-temperature welding tin welding.
7. The heat dissipation module of claim 5,
and the condensation end of the at least one heat pipe is fixed in the groove position of the aluminum profile radiator in an interference fit manner.
8. The heat dissipation module of claim 6 or 7,
the number of the heat pipes is two, and the number of the groove positions is two.
9. A projection light engine, comprising:
a light source module;
the heat dissipation module as claimed in any one of claims 1 to above, disposed on a backlight side of the light source module.
10. The light engine of claim 9,
the projection light engine further comprises:
and the projection lens is arranged on the light emergent side of the light source module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121229894.3U CN215117141U (en) | 2021-06-02 | 2021-06-02 | Heat dissipation module and projection ray apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121229894.3U CN215117141U (en) | 2021-06-02 | 2021-06-02 | Heat dissipation module and projection ray apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215117141U true CN215117141U (en) | 2021-12-10 |
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ID=79303215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121229894.3U Active CN215117141U (en) | 2021-06-02 | 2021-06-02 | Heat dissipation module and projection ray apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215117141U (en) |
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2021
- 2021-06-02 CN CN202121229894.3U patent/CN215117141U/en active Active
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Effective date of registration: 20231226 Granted publication date: 20211210 |