CN215073145U - Aluminum substrate used in corrosive environment - Google Patents
Aluminum substrate used in corrosive environment Download PDFInfo
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- CN215073145U CN215073145U CN202121544570.9U CN202121544570U CN215073145U CN 215073145 U CN215073145 U CN 215073145U CN 202121544570 U CN202121544570 U CN 202121544570U CN 215073145 U CN215073145 U CN 215073145U
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Abstract
The utility model discloses an aluminium base board that uses under corrosive environment, aluminium base board include the panel layer, and one side of panel layer is equipped with anti-corrosion coating, strengthening layer, exchange layer and heat dissipation layer in proper order, and one side and the panel layer fastening connection of anti-corrosion coating, opposite side and strengthening layer fastening connection, one side and the strengthening layer fastening connection on exchange layer, opposite side and heat dissipation layer fastening connection are equipped with heat radiation structure on the heat dissipation layer. This practical aluminium base board is equipped with anti-corrosion coating, strengthening layer, exchange layer and heat dissipation layer, makes aluminium base board have corrosion resistance and oxidation resistance, improves aluminium base board's intensity, passes to the heat dissipation layer fast through exchange layer with the heat on the aluminium base board, dispels the heat, is equipped with heat radiation structure on the heat dissipation layer, and heat radiation structure distributes away the heat through circular slot, through hole and through-hole fast, rapid cooling improves stability in use.
Description
Technical Field
The utility model relates to an aluminium base board specifically is an aluminium base board that uses under corrosive environment.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a single-sided board generally comprises a three-layer structure, namely a circuit layer, an insulating layer and a metal base layer, and is commonly used in LED lighting products. The LED packaging structure has a front surface and a back surface, wherein the white surface is welded with an LED pin, the other surface is in an aluminum natural color, and the LED packaging structure can be generally coated with heat conducting slurry and then is contacted with a heat conducting part, and further comprises a ceramic substrate and the like. The LED aluminum substrate is only made of aluminum alloy, the general circuit board is made of glass fiber, but the LED generates heat greatly, so that the circuit board for the LED lamp is generally an aluminum substrate and can conduct heat quickly, and the circuit board for other equipment or electrical appliances is also a glass fiber board.
The existing aluminum substrate is not corrosion-resistant, and is easy to corrode when used in environments such as chemical plants, and the like, so that short circuit and failure of lighting facilities are caused, and the heat dissipation effect of the aluminum substrate is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an aluminium base board that uses under corrosive environment is equipped with anti-corrosion coating, strengthening layer, exchange layer and heat dissipation layer, makes aluminium base board have corrosion resistance and oxidation resistance, improves the intensity of aluminium base board, passes to the heat dissipation layer through the exchange layer fast with the heat on the aluminium base board, dispels the heat, is equipped with heat radiation structure on the heat dissipation layer, and heat radiation structure passes through circular slot, through hole and through-hole, distributes away the heat fast, and rapid cooling improves the stability in use.
The purpose of the utility model can be realized by the following technical scheme:
the aluminum substrate comprises a panel layer, wherein one side of the panel layer is sequentially provided with an anti-corrosion layer, a strengthening layer, an exchange layer and a heat dissipation layer, one side of the anti-corrosion layer is fixedly connected with the panel layer, the other side of the anti-corrosion layer is fixedly connected with the strengthening layer, one side of the exchange layer is fixedly connected with the strengthening layer, the other side of the exchange layer is fixedly connected with the heat dissipation layer, and the heat dissipation layer is provided with a heat dissipation structure.
Further, the anti-corrosion layer includes acid-resistant layer, and one side on acid-resistant layer is equipped with alkali-resistant layer, corrosion resistant layer and oxidation resistant layer in proper order, and one side and the acid-resistant layer fastening of alkali-resistant layer are connected, and the opposite side and corrosion resistant layer fastening are connected, and one side and the alkali-resistant layer fastening of corrosion resistant layer are connected, and the opposite side and oxidation resistant layer fastening are connected.
Further, the heat dissipation structure comprises circular grooves, through holes and through holes, the through holes are communicated with the circular grooves, and the through holes are communicated with the circular grooves.
Furthermore, the acid-resistant layer is made of silicon carbide and has a thickness of 0.1-0.3 mm; the alkali-resistant layer is made of polyurethane and has a thickness of 0.2-0.4 mm; the corrosion-resistant layer is made of graphene, and the thickness of the corrosion-resistant layer is 0.05-0.1 mm; the oxidation-resistant layer is made of aluminum oxide and has a thickness of 0.2-0.5 mm.
Furthermore, the reinforced layer is made of asbestos fiber and has the thickness of 0.5-1 mm; the exchange layer is made of diamond powder material and has a thickness of 1-1.5 mm.
Furthermore, circular grooves distributed in an array are arranged in the heat dissipation layer, the circular grooves are coaxial, through holes distributed in an array are formed in one side of the heat dissipation layer, through holes distributed in an array are formed in the heat dissipation layer, the heat dissipation layer is made of aluminum alloy materials, and the thickness of the heat dissipation layer is 2-4 mm.
The utility model has the advantages that:
1. the aluminum substrate of the utility model is provided with the anti-corrosion layer, the strengthening layer, the exchange layer and the heat dissipation layer, so that the aluminum substrate has the corrosion resistance and the oxidation resistance, the strength of the aluminum substrate is improved, and the heat on the aluminum substrate is quickly transferred to the heat dissipation layer through the exchange layer for heat dissipation;
2. the utility model discloses aluminium base board is equipped with heat radiation structure on the heat dissipation layer, and heat radiation structure distributes away the heat fast through circular slot, through hole and through-hole, and rapid cooling improves the stability in use.
Drawings
The present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a cross-sectional view of an aluminum substrate of the present invention;
fig. 2 is a schematic structural view of the corrosion protection layer of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
An aluminum substrate used in a corrosive environment comprises a panel layer 1, as shown in fig. 1, an anti-corrosion layer 2, a strengthening layer 3, an exchange layer 4 and a heat dissipation layer 5 are sequentially arranged on one side of the panel layer 1, one side of the anti-corrosion layer 2 is fixedly connected with the panel layer 1, the other side of the anti-corrosion layer is fixedly connected with the strengthening layer 3, one side of the exchange layer 4 is fixedly connected with the strengthening layer 3, and the other side of the exchange layer is fixedly connected with the heat dissipation layer 5.
The anti-corrosion layer 2 comprises an acid-resistant layer 21, one side of the acid-resistant layer 21 is sequentially provided with an alkali-resistant layer 22, an anti-corrosion layer 23 and an anti-oxidation layer 24, one side of the alkali-resistant layer 22 is tightly connected with the acid-resistant layer 21, the other side of the alkali-resistant layer 22 is tightly connected with the anti-corrosion layer 23, one side of the anti-corrosion layer 23 is tightly connected with the alkali-resistant layer 22, and the other side of the anti-corrosion layer is tightly connected with the anti-oxidation layer 24.
The acid-resistant layer 21 is made of silicon carbide, has the advantages of good wear resistance, good acid resistance, good chemical performance and high hardness, and has the thickness of 0.1-0.3 mm; the alkali-resistant layer 22 is made of polyurethane, has the advantages of light plastic weight, sound insulation, excellent heat insulation performance, chemical resistance, good electrical property, easy processing and low water absorption rate, and has the thickness of 0.2-0.4 mm; the corrosion-resistant layer 23 is made of graphene, has the advantages of hydrophobicity, good chemical stability, good thermal conductivity and the like, and has the thickness of 0.05-0.1 mm; the oxidation-resistant layer 24 is made of aluminum oxide, and the aluminum oxide has the advantages of high melting point, high hardness, good insulating property, good oxidation resistance and the like, and the thickness is 0.2-0.5 mm.
The strengthening layer 3 is made of asbestos fiber, the asbestos is light in weight, easy to process and stable in chemical performance, is used for improving the hardness of the aluminum substrate, and has the thickness of 0.5-1 mm.
The exchange layer 4 is made of diamond powder material and has excellent heat conductivity and the thickness of 1-1.5 mm.
The heat dissipation layer 5 is internally provided with circular grooves 6 distributed in an array manner, the circular grooves 6 are coaxial, one side of the heat dissipation layer 5 is provided with through holes 51 distributed in an array manner, the through holes 51 are communicated with the circular grooves 6, the heat dissipation layer 5 is provided with through holes 52 distributed in an array manner, the through holes 52 are communicated with the circular grooves 6 and used for dissipating heat and discharging heat of the aluminum substrate, and the heat dissipation layer 5 is made of aluminum alloy and has the advantages of excellent heat conductivity, good heat dissipation effect and thickness of 2-4 mm.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (6)
1. The aluminum substrate used in the corrosion environment comprises a panel layer (1), and is characterized in that an anti-corrosion layer (2), a strengthening layer (3), an exchange layer (4) and a heat dissipation layer (5) are sequentially arranged on one side of the panel layer (1), one side of the anti-corrosion layer (2) is fixedly connected with the panel layer (1), the other side of the anti-corrosion layer is fixedly connected with the strengthening layer (3), one side of the exchange layer (4) is fixedly connected with the strengthening layer (3), the other side of the exchange layer is fixedly connected with the heat dissipation layer (5), and a heat dissipation structure is arranged on the heat dissipation layer (5).
2. The aluminum substrate used in the corrosive environment according to claim 1, wherein the corrosion-resistant layer (2) comprises an acid-resistant layer (21), one side of the acid-resistant layer (21) is sequentially provided with an alkali-resistant layer (22), a corrosion-resistant layer (23) and an oxidation-resistant layer (24), one side of the alkali-resistant layer (22) is tightly connected with the acid-resistant layer (21), the other side of the alkali-resistant layer is tightly connected with the corrosion-resistant layer (23), one side of the corrosion-resistant layer (23) is tightly connected with the alkali-resistant layer (22), and the other side of the corrosion-resistant layer is tightly connected with the oxidation-resistant layer (24).
3. The aluminum substrate used in the corrosive environment according to claim 1, wherein the heat dissipation structure comprises circular grooves (6), through holes (51) and through holes (52), the through holes (51) are communicated with the circular grooves (6), and the through holes (52) are communicated with the circular grooves (6).
4. The aluminum substrate used in the corrosive environment according to claim 2, wherein the acid-resistant layer (21) is made of silicon carbide and has a thickness of 0.1-0.3 mm; the alkali-resistant layer (22) is made of polyurethane and has the thickness of 0.2-0.4 mm; the corrosion-resistant layer (23) is made of graphene, and the thickness of the corrosion-resistant layer is 0.05-0.1 mm; the oxidation resistant layer (24) is made of aluminum oxide and has the thickness of 0.2-0.5 mm.
5. The aluminum substrate used in the corrosive environment according to claim 1, wherein the strengthening layer (3) is made of asbestos fiber and has a thickness of 0.5-1 mm; the exchange layer (4) is made of diamond powder material, and the thickness is 1-1.5 mm.
6. The aluminum substrate used in corrosive environment according to claim 3, wherein the heat dissipation layer (5) is provided with circular grooves (6) arranged in an array, the circular grooves (6) are coaxial, one side of the heat dissipation layer (5) is provided with through holes (51) arranged in an array, the heat dissipation layer (5) is provided with through holes (52) arranged in an array, and the heat dissipation layer (5) is made of aluminum alloy and has a thickness of 2-4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121544570.9U CN215073145U (en) | 2021-07-07 | 2021-07-07 | Aluminum substrate used in corrosive environment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202121544570.9U CN215073145U (en) | 2021-07-07 | 2021-07-07 | Aluminum substrate used in corrosive environment |
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| CN215073145U true CN215073145U (en) | 2021-12-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114823607A (en) * | 2022-04-11 | 2022-07-29 | 江苏耀鸿电子有限公司 | Corrosion-resistant high-performance IC packaging support plate and preparation method thereof |
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2021
- 2021-07-07 CN CN202121544570.9U patent/CN215073145U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114823607A (en) * | 2022-04-11 | 2022-07-29 | 江苏耀鸿电子有限公司 | Corrosion-resistant high-performance IC packaging support plate and preparation method thereof |
| CN114823607B (en) * | 2022-04-11 | 2023-11-10 | 江苏耀鸿电子有限公司 | Corrosion-resistant high-performance IC packaging carrier plate and preparation method thereof |
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