CN215601548U - Double-sided conductive PI copper foil for flexible circuit board - Google Patents
Double-sided conductive PI copper foil for flexible circuit board Download PDFInfo
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- CN215601548U CN215601548U CN202122357657.1U CN202122357657U CN215601548U CN 215601548 U CN215601548 U CN 215601548U CN 202122357657 U CN202122357657 U CN 202122357657U CN 215601548 U CN215601548 U CN 215601548U
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Abstract
The utility model discloses a double-sided conductive PI copper foil for a flexible circuit board, which comprises a copper foil body, wherein the surface of the copper foil body is wrapped with an anti-corrosion coating, the inner cavity of the anti-corrosion coating comprises a polyurethane coating, a phenolic acid-resistant coating and a vinyl peroxide coating, and the surface of the anti-corrosion coating is wrapped with a high-temperature-resistant coating. According to the utility model, the corrosion-resistant coating, the polyurethane coating, the phenolic acid-resistant coating and the ethylene peroxide coating are arranged, so that the corrosion-resistant effect can be achieved, the phenomenon that the surface is corroded due to long service time in an environment with high humidity is avoided, the service life of the copper foil is greatly reduced, the high-temperature-resistant effect can be achieved due to the arrangement of the high-temperature-resistant coating, the polytetrafluoroethylene coating, the phosphate lead powder coating and the organic silicon coating, the phenomenon that the performance of the copper foil is reduced due to overhigh temperature of a circuit board is avoided, and the problem that the corrosion-resistant effect of the existing copper foil is poor is solved.
Description
Technical Field
The utility model relates to the technical field of copper foil, in particular to a double-sided conductive PI copper foil for a flexible circuit board.
Background
The copper foil is made by forging copper and other metals in a certain proportion, the copper foil generally comprises 90 foils and 88 foils, namely the copper foil with the copper content of 90 percent and 88 percent and the size of 16 x 16cm, and is a most widely used decorative material, such as: hotel, temple Buddha, pyramid signboard, ceramic tile mosaic, handicraft etc. current copper foil is not good because corrosion-resistant effect, leads to the long phenomenon that the corruption appears in the surface of live time, has not only reduced the availability factor of copper foil, has also reduced the life of copper foil simultaneously.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a double-sided conductive PI copper foil for a flexible circuit board, which has the advantage of corrosion resistance and solves the problem of poor corrosion resistance of the existing copper foil.
In order to achieve the purpose, the utility model provides the following technical scheme: the double-sided conductive PI copper foil for the flexible circuit board comprises a copper foil body, wherein a corrosion-resistant coating is wrapped on the surface of the copper foil body, an inner cavity of the corrosion-resistant coating comprises a polyurethane coating, a phenolic acid-resistant coating and a vinyl peroxide coating, a high-temperature-resistant coating is wrapped on the surface of the corrosion-resistant coating, and an inner cavity of the high-temperature-resistant coating comprises a polytetrafluoroethylene coating, a phosphate lead powder coating and an organic silicon coating.
Preferably, the thickness of the polyurethane coating is greater than the thickness of the phenolic acid-resistant coating, which is greater than the thickness of the ethylene peroxide coating.
Preferably, the thickness of the polytetrafluoroethylene coating is greater than that of the lead phosphate powder coating, and the thickness of the lead phosphate powder coating is greater than that of the organic silicon coating.
Preferably, the outer surface of the ethylene peroxide coating is positioned on the inner surface of the phenolic acid-resistant coating, and the outer surface of the phenolic acid-resistant coating is positioned on the inner surface of the polyurethane coating.
Preferably, the outer surface of the organic silicon coating is positioned on the inner surface of the lead phosphate powder coating, and the outer surface of the lead phosphate powder coating is positioned on the inner surface of the polytetrafluoroethylene coating.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the corrosion-resistant coating, the polyurethane coating, the phenolic acid-resistant coating and the ethylene peroxide coating are arranged, so that the corrosion-resistant effect can be achieved, the phenomenon that the surface is corroded due to long service time in an environment with high humidity is avoided, the service life of the copper foil is greatly reduced, the high-temperature-resistant effect can be achieved due to the arrangement of the high-temperature-resistant coating, the polytetrafluoroethylene coating, the phosphate lead powder coating and the organic silicon coating, the phenomenon that the performance of the copper foil is reduced due to overhigh temperature of a circuit board is avoided, and the problem that the corrosion-resistant effect of the existing copper foil is poor is solved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the internal structure of the corrosion-resistant coating of the present invention;
FIG. 3 is a cross-sectional view of the internal structure of the refractory coating of the present invention.
In the figure: 1. a copper foil body; 2. a corrosion-resistant coating; 201. a polyurethane coating; 202. a phenolic acid-resistant coating; 203. a ethylene peroxide coating; 3. a high temperature resistant coating; 301. a polytetrafluoroethylene coating; 302. a phosphate lead powder coating; 303. and (3) a silicone coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1-3, a double-sided conductive PI copper foil for a flexible circuit board includes a copper foil body 1, a corrosion-resistant coating 2 is wrapped on the surface of the copper foil body 1, an inner cavity of the corrosion-resistant coating 2 includes a polyurethane coating 201, a phenolic acid-resistant coating 202 and a vinyl peroxide coating 203, the thickness of the polyurethane coating 201 is greater than that of the phenolic acid-resistant coating 202, the thickness of the phenolic acid-resistant coating 202 is greater than that of the vinyl peroxide coating 203, the outer surface of the vinyl peroxide coating 203 is located on the inner surface of the phenolic acid-resistant coating 202, the outer surface of the phenolic acid-resistant coating 202 is located on the inner surface of the polyurethane coating 201, the surface of the corrosion-resistant coating 2 is wrapped with a high-temperature-resistant coating 3, the inner cavity of the high-temperature-resistant coating 3 includes a polytetrafluoroethylene coating 301, a lead phosphate coating 302 and an organic silicon coating 303, the thickness of the polytetrafluoroethylene coating 301 is greater than that of the lead phosphate coating 302, the thickness of the lead phosphate powder coating 302 is greater than that of the organic silicon coating 303, the outer surface of the organic silicon coating 303 is positioned on the inner surface of the lead phosphate powder coating 302, the outer surface of the lead phosphate powder coating 302 is positioned on the inner surface of the polytetrafluoroethylene coating 301, through the arrangement of the corrosion-resistant coating 2, the polyurethane coating 201, the phenolic acid-resistant coating 202 and the vinyl peroxide coating 203, can play a role of corrosion resistance, avoids the phenomenon of surface corrosion caused by long service time in a high-humidity environment, greatly reduces the service life of the copper foil, through the arrangement of the high-temperature resistant coating 3, the polytetrafluoroethylene coating 301, the phosphate lead powder coating 302 and the organic silicon coating 303, can play high temperature resistance, avoid leading to the phenomenon that the performance reduces to appear in the copper foil because of the circuit board high temperature, solved the problem that current copper foil is corrosion-resistant not good effect simultaneously.
The standard parts used in this document are commercially available, all the components in this document are customized according to the description of the specification and the drawings, and the connection relationship and specific structure between the layers in this document are all performed by the prior art, such as by mechanical methods, by adhesives, by various welding methods such as thermal welding, ultrasonic welding, flux, welding, and fusion crimping, and no specific description is made here.
During the use, through corrosion-resistant coating 2, polyurethane coating 201, phenolic aldehyde acid-resistant coating 202 and peroxide ethylene coating 203's setting, can play corrosion-resistant effect, avoided the live time long in the environment that humidity is big, lead to the phenomenon that the corruption appears in the surface, great reduction the life of copper foil, through high temperature resistant coating 3, polytetrafluoroethylene coating 301, phosphate lead powder coating 302 and organosilicon coating 303's setting, can play high temperature resistant effect, avoided because of circuit board high temperature, lead to the phenomenon that the performance reduces to appear in the copper foil.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a flexible line way board is with two-sided electrically conductive PI copper foil, includes copper foil body (1), its characterized in that: the surface of the copper foil body (1) is wrapped with the corrosion-resistant coating (2), the inner cavity of the corrosion-resistant coating (2) comprises a polyurethane coating (201), a phenolic acid-resistant coating (202) and a ethylene peroxide coating (203), the surface of the corrosion-resistant coating (2) is wrapped with the high-temperature-resistant coating (3), and the inner cavity of the high-temperature-resistant coating (3) comprises a polytetrafluoroethylene coating (301), a phosphate lead powder coating (302) and an organic silicon coating (303).
2. The double-sided conductive PI copper foil for the flexible circuit board as claimed in claim 1, wherein: the thickness of the polyurethane coating (201) is greater than the thickness of the phenolic acid-resistant coating (202), and the thickness of the phenolic acid-resistant coating (202) is greater than the thickness of the ethylene peroxide coating (203).
3. The double-sided conductive PI copper foil for the flexible circuit board as claimed in claim 1, wherein: the thickness of the polytetrafluoroethylene coating (301) is larger than that of the lead phosphate powder coating (302), and the thickness of the lead phosphate powder coating (302) is larger than that of the organic silicon coating (303).
4. The double-sided conductive PI copper foil for the flexible circuit board as claimed in claim 1, wherein: the outer surface of the ethylene peroxide coating (203) is positioned on the inner surface of the phenolic acid-resistant coating (202), and the outer surface of the phenolic acid-resistant coating (202) is positioned on the inner surface of the polyurethane coating (201).
5. The double-sided conductive PI copper foil for the flexible circuit board as claimed in claim 1, wherein: the outer surface of the organic silicon coating (303) is positioned on the inner surface of the lead phosphate powder coating (302), and the outer surface of the lead phosphate powder coating (302) is positioned on the inner surface of the polytetrafluoroethylene coating (301).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122357657.1U CN215601548U (en) | 2021-09-27 | 2021-09-27 | Double-sided conductive PI copper foil for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122357657.1U CN215601548U (en) | 2021-09-27 | 2021-09-27 | Double-sided conductive PI copper foil for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215601548U true CN215601548U (en) | 2022-01-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122357657.1U Active CN215601548U (en) | 2021-09-27 | 2021-09-27 | Double-sided conductive PI copper foil for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215601548U (en) |
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2021
- 2021-09-27 CN CN202122357657.1U patent/CN215601548U/en active Active
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