CN215072867U

CN215072867U - Microphone sound cavity encapsulation dustproof construction

Info

Publication number: CN215072867U
Application number: CN202120704857.7U
Authority: CN
Inventors: 刘文革; 黄辉
Original assignee: Shenzhen Dongtaiyuan Electronics Co ltd
Current assignee: Shenzhen Dongtaiyuan Electronics Co ltd
Priority date: 2021-04-07
Filing date: 2021-04-07
Publication date: 2021-12-07
Anticipated expiration: 2031-04-07

Abstract

The utility model discloses a microphone sound cavity packaging dustproof structure, which relates to the technical field of microphones, wherein the microphone converts sound into electric signals, the microphone is developed into inductance and capacitance conversion by resistance conversion sound and electricity at first, a great deal of new microphone technology is gradually developed, human voice enters the microphone through a sound picking hole, a vibration film vibrates through air, a polar plate is made to change the capacitance along with the vibration of sound waves, electric signals are formed, an effect transistor is used for controlling and amplifying the electric signals, and then the fluctuation current is changed into sound, in order to prevent water stain and dust from entering the interior and causing the damage of components, the utility model discloses a sealing mechanism is arranged, a pressure induction surface, a sealing plate and a compression spring are arranged in the sealing mechanism, the sealing can be carried out when water enters through a through hole at the top of a protective shell, water is prevented from entering, and a lug is arranged at the top of the shell, foreign matters can be effectively prevented from entering the microphone.

Description

Microphone sound cavity encapsulation dustproof construction

Technical Field

The utility model relates to a microphone technical field specifically is a microphone sound chamber encapsulation dustproof construction.

Background

With the rapid development of electroacoustic technology, various electroacoustic products are developed. A microphone is one of very important devices in electroacoustic products as a transducer for converting sound into an electrical signal, and nowadays, the microphone is widely applied to various electronic products of different types, such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches, smart wearing, and the like. In recent years, for a microphone packaging structure, the design of the structure thereof has become an important point and a focus of research by those skilled in the art. The existing microphone package structure is generally: the chip module comprises a shell with a containing cavity, and chip components, such as MEMS chips, ASIC chips and the like, are contained and fixed in the containing cavity; and a sound pickup hole is also arranged on the shell.

However, in long-term application, it is found that particles and foreign matters such as external dust and liquid are easily introduced into the accommodating cavity of the microphone through the sound pickup hole, and the foreign matters easily cause certain damage to components such as a chip assembly in the accommodating cavity.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a microphone sound chamber encapsulation dustproof construction installs protecting crust and sealing mechanism outside the microphone, can prevent that external dust and liquid from getting into inside the microphone, causes the damage to the chip subassembly, influences life to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a microphone sound chamber encapsulation dustproof construction, includes protective housing and casing, protective housing inner chamber top is provided with sealing mechanism, sealing mechanism bottom fixed mounting has compression spring, compression spring other end fixedly connected with closing plate, the sealing plate surface is provided with the forced induction face, the casing passes through the fixed grafting of installation piece in protective housing, casing top fixed surface installs the lug, the casing bottom is provided with heat abstractor, heat abstractor's graphite fin fixed mounting is in the protective housing bottom.

Preferably, a through hole is formed in the top of the protective shell, and the sealing mechanism is fixedly installed in the through hole.

Preferably, the sealing mechanism comprises a connector, an installation bin, a pressure sensing surface, a sealing plate, a compression spring and a limiting groove, the installation bin is arranged at the bottom of an inner cavity of the sealing mechanism, one end of the compression spring is fixedly installed in the installation bin, the pressure sensing surface is fixedly installed on the surface of the sealing plate, and the connector is arranged on two sides of the sealing plate.

Preferably, the top surface of the shell is provided with a sound pickup hole, the bump is fixedly mounted above the sound pickup hole, and the center of the bump is provided with a hole corresponding to the sound pickup hole.

Preferably, the dust cover is fixedly connected to the surface of the membrane ring below the sound pickup hole, a membrane is fixedly mounted at the center of the membrane ring, and a gasket is fixedly connected to the bottom of the membrane ring.

Preferably, the bottom of the gasket is fixedly connected with a polar plate, a steel ring is fixedly installed below the polar plate, and a field effect transistor is arranged in the steel ring and fixedly installed on the surface of the PCB.

Preferably, the heat dissipation device comprises a heat conducting fin, a heat conducting column and a graphite heat dissipation fin, the heat conducting fin is fixedly installed at the bottom of the PCB through a bolt, one end of the heat conducting column is fixedly connected to the bottom of the heat conducting fin, and the other end of the heat conducting column is fixedly connected with the graphite heat dissipation fin.

Preferably, the bottom of the protective shell is provided with a positioning hole, and a heat conducting column is fixedly mounted in the positioning hole.

Preferably, a positioning block is fixedly mounted at the bottom of the protective shell, and a positioning groove is formed in the surface of the positioning block.

Preferably, a loudspeaker is fixedly mounted in the positioning groove, and a mesh enclosure is arranged around the loudspeaker and fixedly mounted at the bottom of the protective shell.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model is provided with the sealing mechanism, the pressure sensing surface, the sealing plate and the compression spring are arranged in the sealing mechanism, the sealing can be carried out when the through hole at the top of the protective shell is filled with water, so as to prevent excessive water or other foreign matters from entering, and the lug is arranged at the top of the shell, so as to prevent the water and the foreign matters from entering the microphone;

2. the utility model discloses a be provided with heat abstractor in the PCB board bottom of microphone, heat abstractor's graphite cooling fin is connected outside the protecting crust, can dispel the heat to the microphone.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

FIG. 3 is an enlarged schematic view of the area A of FIG. 2 according to the present invention;

fig. 4 is an enlarged schematic view of the area B of fig. 2 according to the present invention.

In the figure: 1. a protective housing; 2. a mesh enclosure; 3. a through hole; 4. a sealing mechanism; 401. a connecting port; 402. installing a bin; 403. a pressure sensing surface; 404. a sealing plate; 405. a compression spring; 406. a limiting groove; 5. a bump; 6. an inner shell; 7. a sound pickup hole; 8. a dust cover; 9. a membrane ring; 10. a membrane; 11. a gasket; 12. a polar plate; 13. a steel ring; 14. a field effect transistor; 15. mounting blocks; 16. a heat sink; 161. a heat conductive sheet; 162. a heat-conducting column; 163. a graphite heat sink; 17. positioning a groove; 18. a speaker; 19. positioning blocks; 20. and (7) positioning the holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: the microphone sound cavity packaging dustproof structure comprises a protective shell 1 and a shell 6, wherein a sealing mechanism 4 is arranged at the top of an inner cavity of the protective shell 1, a compression spring 405 is fixedly arranged at the bottom of the sealing mechanism 4, the other end of the compression spring 405 is fixedly connected with a sealing plate 404, a pressure sensing surface 403 is arranged on the surface of the sealing plate 404, the shell 6 is fixedly inserted into the protective shell 1 through a mounting block 15, a convex block 5 is fixedly arranged on the surface of the top of the shell 6, a heat dissipation device 16 is arranged at the bottom of the shell 6, and a graphite cooling fin 163 of the heat dissipation device 16 is fixedly arranged at the bottom of the protective shell 1;

the top of the protective shell 1 is provided with a through hole 3, the through hole 3 is used for allowing sound to enter the device, the protective shell 1 is used for protecting internal components, a sealing mechanism 4 is fixedly arranged in the through hole 3, the sealing mechanism 4 comprises a connecting port 401, an installation bin 402, a pressure sensing surface 403, a sealing plate 404, a compression spring 405 and a limiting groove 406, the installation bin 402 is arranged at the bottom of an inner cavity of the sealing mechanism 4, one end of the compression spring 405 is fixedly arranged in the installation bin 402, the pressure sensing surface 403 is fixedly arranged on the surface of the sealing plate 404, the connecting port 401 is arranged on two sides of the sealing plate 404, the sealing mechanism 4 passes through the internally arranged pressure sensing surface 403, the sealing plate 404 and the compression spring 405, the pressure sensing surface is a contact surface of a pressure sensor and is used for sensing and reacting foreign matters entering the sealing mechanism and can be sealed when water enters the through hole 3 on the top of the protective shell 1, excessive water or other foreign matters are prevented from entering, and the lug 5 is arranged on the top of the shell 6, so that the water and the foreign matters can be prevented from entering the microphone;

the top surface of the shell 6 is provided with a sound picking hole 7, the sound picking hole 7 is an inlet for collecting sound by using a device, the bump 5 is fixedly arranged above the sound picking hole 7, the bump 5 is used for preventing water from contacting components when water enters the protective shell 1, and the center of the bump 5 is provided with a hole corresponding to the sound picking hole 7; a dust cover 8 is arranged below the sound pickup hole 7 and fixedly connected to the surface of a membrane ring 9, a membrane 10 is fixedly installed in the center of the membrane ring 9, the membrane ring 9 is an assembly used for installing the membrane 10, the membrane 10 is an assembly used for receiving sound waves, and a gasket 11 is fixedly connected to the bottom of the membrane ring 9;

the bottom of the gasket 11 is fixedly connected with a polar plate 12, the polar plate 12 is used for reflecting the intensity of external sound pressure, a steel ring 13 is fixedly arranged below the polar plate 12, a field effect transistor 14 is arranged in the steel ring 13 and fixedly arranged on the surface of the PCB 21, and the field effect transistor 14 has the advantages of high input resistance, low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown phenomenon, wide safe working area and the like;

the heat dissipation device 16 comprises a heat conduction sheet 161, a heat conduction column 162 and a graphite heat dissipation sheet 163, wherein the heat conduction sheet 161 is fixedly installed at the bottom of the PCB 21 through a bolt, one end of the heat conduction column 162 is fixedly connected to the bottom of the heat conduction sheet 161, the other end of the heat conduction column 162 is fixedly connected with the graphite heat dissipation sheet 163, the graphite heat dissipation sheet 163 is a brand new heat conduction and dissipation material, has unique crystal grain orientation, conducts heat uniformly along two directions, and a lamellar structure can be well adapted to any surface, shields heat sources and components and simultaneously improves the performance of consumer electronic products;

the bottom of the protective shell 1 is provided with a positioning hole 20, the positioning hole 20 is used for positioning the heat sink 16, and a heat-conducting column 162 is fixedly arranged in the positioning hole 20; a positioning block 19 is fixedly arranged at the bottom of the protective shell 1, and a positioning groove 17 is formed in the surface of the positioning block 19; a loudspeaker 18 is fixedly arranged in the positioning groove 17, and a mesh enclosure 2 is arranged around the loudspeaker 18 and fixedly arranged at the bottom of the protective shell 1.

Through with casing 6 through installation piece 15 fixed mounting in protective housing 1, can effectively play the guard action to the components and parts in the casing 6, it installs at protective housing 1 inner chamber top to be provided with sealing mechanism 4 in casing 6 top, when through-hole 3 at protective housing 1 has water or other foreign matters to enter, can contact the forced induction face 403 of bottom, make compression spring 405 protect the ejecting sealed through-hole 3 position of closing plate 404, be provided with the lug in the pickup hole 7 position of casing 6, can effectually prevent that there is the foreign matter to get into can be internal, it carries out dustproof processing to be provided with dust cover 8 below pickup hole 7, prevent that the foreign matter from causing the damage to the chip components and parts in the casing 6, influence its device life.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a microphone sound chamber encapsulation dustproof construction, includes protecting sheathing (1) and casing (6), its characterized in that: protection casing (1) inner chamber top is provided with sealing mechanism (4), sealing mechanism (4) bottom fixed mounting has compression spring (405), compression spring (405) other end fixedly connected with closing plate (404), closing plate (404) surface is provided with forced induction face (403), casing (6) are through installation piece (15) fixed grafting in protection casing (1), casing (6) top fixed surface installs lug (5), casing (6) bottom is provided with heat abstractor (16), graphite cooling fin (163) fixed mounting of heat abstractor (16) is in protection casing (1) bottom.

2. The microphone sound cavity packaging dustproof structure of claim 1, characterized in that: through-hole (3) have been seted up at protective housing (1) top, sealing mechanism (4) fixed mounting is in through-hole (3).

3. The microphone sound cavity packaging dustproof structure of claim 1, characterized in that: the sealing mechanism (4) comprises a connecting port (401), an installation bin (402), a pressure sensing surface (403), a sealing plate (404), a compression spring (405) and a limiting groove (406), the installation bin (402) is arranged at the bottom of an inner cavity of the sealing mechanism (4), one end of the compression spring (405) is fixedly installed in the installation bin (402), the pressure sensing surface (403) is fixedly installed on the surface of the sealing plate (404), and the connecting port (401) is arranged on two sides of the sealing plate (404).

4. The microphone sound cavity packaging dustproof structure of claim 1, characterized in that: the sound picking hole (7) is formed in the top surface of the shell (6), the bump (5) is fixedly installed above the sound picking hole (7), and the center of the bump (5) is provided with a hole corresponding to the sound picking hole (7).

5. The microphone sound cavity packaging dustproof structure of claim 4, characterized in that: pick up sound hole (7) below and be provided with dust cover (8) fixed connection and encircle (9) surface at membrane, membrane ring (9) center fixed mounting has diaphragm (10), membrane ring (9) bottom fixedly connected with gasket (11).

6. The microphone sound cavity packaging dustproof structure of claim 5, characterized in that: gasket (11) bottom fixedly connected with polar plate (12), polar plate (12) below fixed mounting has steel ring (13), be provided with field effect transistor (14) fixed mounting in steel ring (13) on PCB board (21) surface.

7. The microphone sound cavity packaging dustproof structure of claim 1, characterized in that: the heat dissipation device (16) comprises a heat conducting sheet (161), a heat conducting column (162) and a graphite heat dissipation sheet (163), wherein the heat conducting sheet (161) is fixedly installed at the bottom of the PCB (21) through a bolt, one end of the heat conducting column (162) is fixedly connected to the bottom of the heat conducting sheet (161), and the other end of the heat conducting column (162) is fixedly connected with the graphite heat dissipation sheet (163).

8. The microphone sound cavity packaging dustproof structure of claim 7, characterized in that: the heat-conducting plate is characterized in that a positioning hole (20) is formed in the bottom of the protective shell (1), and a heat-conducting column (162) is fixedly mounted in the positioning hole (20).

9. The microphone sound cavity packaging dustproof structure of claim 1, characterized in that: a positioning block (19) is fixedly mounted at the bottom of the protective shell (1), and a positioning groove (17) is formed in the surface of the positioning block (19).

10. The microphone sound cavity packaging dustproof structure of claim 9, characterized in that: the loudspeaker (18) is fixedly installed in the positioning groove (17), and a mesh enclosure (2) is arranged around the loudspeaker (18) and fixedly installed at the bottom of the protective shell (1).