CN212367514U

CN212367514U - Loudspeaker module

Info

Publication number: CN212367514U
Application number: CN202020883966.5U
Authority: CN
Inventors: 陈伟
Original assignee: AAC Technologies Pte Ltd
Current assignee: AAC Technologies Pte Ltd
Priority date: 2020-05-21
Filing date: 2020-05-21
Publication date: 2021-01-15
Anticipated expiration: 2030-05-21
Also published as: WO2021232485A1

Abstract

The utility model provides a loudspeaker module, which is characterized in that the loudspeaker module comprises a shell with an accommodating space, a loudspeaker monomer accommodated in the accommodating space and a circuit board arranged outside the shell; the loudspeaker monomer comprises an elastic pin for accessing an external electric signal; the shell is provided with an opening corresponding to the elastic pin, the circuit board is covered on the opening and is in sealed connection with the shell, and the elastic pin is exposed out of the shell through the opening and is electrically connected with the circuit board. The utility model discloses an with the external occupation space of having practiced thrift the casing inside of circuit board, reduced the volume of speaker module, simultaneously, external circuit board also carries out better sealing to the casing.

Description

Loudspeaker module

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electronic technology equipment field, in particular to speaker module.

[ background of the invention ]

With the development of science and technology, electronic products such as mobile phones have been widely popularized and become an indispensable part of people's work and life. Meanwhile, in order to meet the needs of consumers, the electronic digital products generally have various audio-visual entertainment functions of playing videos, listening songs and the like, and users can also use the electronic products to deliver resumes, store data and the like.

The loudspeaker module of prior art is including the casing that has accommodating space, accommodate in accommodating space's speaker monomer and the circuit board of connecting speaker monomer and external circuit, and the circuit board extends out from the casing is inside usually, and the circuit board occupies the casing inner space on the one hand, influences the free design of speaker, and the position leakproofness that on the other hand the circuit board worn out the casing is difficult to guarantee.

Therefore, there is a need to provide a new circuit board structure and a lead-out method to solve the above problems.

[ Utility model ] content

An object of the utility model is to provide a speaker module reduces speaker module's volume, simultaneously, improves the leakproofness of casing.

The technical scheme of the utility model as follows:

a loudspeaker module comprises a shell with an accommodating space, a loudspeaker single body accommodated in the accommodating space and a circuit board arranged outside the shell;

the loudspeaker monomer comprises an elastic pin for accessing an external circuit;

the shell is provided with an opening corresponding to the elastic pin, the circuit board is covered on the opening and is in sealed connection with the shell, and the elastic pin is exposed out of the shell through the opening and is electrically connected with the circuit board.

The beneficial effects of the utility model reside in that: through having practiced thrift the inside occupation space of casing with the circuit board is external, reduced speaker module's volume, simultaneously, external circuit board also carries out better sealed to the casing.

[ description of the drawings ]

Fig. 1 is an exploded view of each component of a speaker module according to an embodiment of the present invention.

Fig. 2 is a top view of the speaker module assembly shown in fig. 1.

Fig. 3 is a cross-sectional view taken along the plane a-a in fig. 2.

Fig. 4 is a schematic top view of a circuit board according to an embodiment of the present invention.

Fig. 5 is a schematic top view of a sealing layer according to an embodiment of the present invention.

[ detailed description ] embodiments

The present invention will be further described with reference to the accompanying drawings and embodiments.

Referring to fig. 1 to 3, a speaker module includes a housing 10 having an accommodating space, a speaker unit 20 accommodated in the accommodating space, and a circuit board 30 disposed outside the housing; the speaker unit 20 includes an elastic pin 21 for accessing an external circuit, the housing 10 is provided with an opening 11 corresponding to the elastic pin 21, the circuit board 30 covers the opening 11 and forms a sealed connection with the housing 10, and the elastic pin 21 is exposed out of the housing 10 through the opening 11 and electrically connected to the circuit board 30. Arranging the circuit board 30 outside the housing 10 can save the accommodating space inside the housing 10, thereby reducing the volume of the speaker module, and on the other hand, the external circuit board 30 can better seal the housing 10.

Referring to fig. 1 to 5, in the present embodiment, a sealing layer 40 is disposed between the circuit board 30 and the housing 10, the sealing layer 40 does not cover the opening 11, and a hole is also formed in the sealing layer 40 at a position corresponding to the opening 11. Specifically, the sealing layer 40 is an adhesive or a double-sided tape. In the prior art, the circuit board 30 is located inside the casing 10, the casing 10 is provided with an opening, and after the circuit board 30 is worn out from the opening, the gap between the circuit board 30 and the opening needs to be sealed. Adopt the utility model discloses a after the method, when installing circuit board 30, circuit board 30 has also sealed casing 10, has improved machining efficiency. In addition, the circuit board 30 is external, which is helpful for later circuit inspection, circuit board 30 replacement and maintenance, and the like.

In another preferred embodiment, the housing 10 is provided with a groove for accommodating the sealing layer 40, and the thickness of the sealing layer 40 is not greater than the depth of the groove 40, so that the glue overflow can be effectively prevented. Further, the circuit board 30 and the sealing layer 40 are both accommodated in the recess. Further shortening the distance between the circuit board 30 and the elastic pins 21 and reducing the overall height of the speaker module.

Referring to fig. 1 to 3, in particular, the elastic pin 21 includes a first elastic pin 212 and a second elastic pin 214 respectively connected to the positive electrode and the negative electrode of the external circuit, the housing 10 is provided with a first opening 112 corresponding to the first elastic pin 212 and a second opening 114 corresponding to the second elastic pin 214, the first opening 112 is communicated with the accommodating space, the second opening 14 is also communicated with the accommodating space, the first pin 212 extends out of the housing 10 from the first opening 112 to be electrically connected to the circuit board 30, and the second pin 214 extends out of the housing 10 from the second opening 114 to be electrically connected to the circuit board 30.

The specific electrical connection between the circuit board 30 and the elastic pins 21 is that pads corresponding to the elastic pins 21 are provided on the side of the circuit board 30 facing the housing 10, and the elastic pins 21 are in contact with the pads to realize electrical connection. The electrical connection of the spring pins 21 to the circuit board 30 may be accomplished by any electrical connection means known in the art.

Specifically, in this embodiment, the housing 10 includes a first housing 13 and a second housing 15 covering the first housing 13, the first housing 13 and the speaker unit 20 are spaced to form a sealed rear cavity 24, preferably, the opening 11 is disposed in the first housing 13, and the circuit board 30 is disposed outside the first housing 13, because the elastic pin 21 is closer to the first housing 13, the loss resistance between the elastic pin 21 and the circuit board 30 can be reduced.

Speaker monomer 20 and second casing 15 interval form front chamber 23, and front chamber 23 and back chamber 24 do not communicate, and front chamber 23 is used for expanding sound, and front chamber 23 is linked together with the play sound hole of speaker module, and it is located second casing 15 to go out the sound hole, goes out the sound hole and is used for the sound production, and back chamber 24 is used for strengthening sound intensity.

The end face of the speaker unit 20 close to the first housing 13 has a sound guiding port for conducting a sound field, the sound guiding port is communicated with the sound film 22 and the rear cavity 24, the sound field space inside the speaker unit 20 is further widened by the rear cavity 24, and the larger the volume of the rear cavity 24 is, the better the bass effect is.

Specifically, in this embodiment, the speaker unit 20 includes a diaphragm 22 for generating sound by vibration, a voice coil for driving the diaphragm 22 to vibrate, a frame having a cavity, a magnetic bowl accommodated in the frame, and a magnetic steel accommodated in the magnetic bowl, the diaphragm 22 is fixed above the frame, the voice coil is suspended in a gap between the magnetic steel and the magnetic bowl, and the voice coil is connected to the diaphragm 22. The front chamber 23 communicates with the diaphragm 22 and the rear chamber 24 communicates with the diaphragm 22. The magnetic bowl comprises a bottom plate and a side plate, wherein the bottom plate is arranged opposite to the sound film 22, the side plate is bent and extended from the bottom plate to the sound film 22, the basin frame comprises an upper surface close to the sound film 22, a lower surface corresponding to the upper surface and an inner wall which is connected with the upper surface and the lower surface and encloses a containing cavity, the side plate is fixed on the inner wall, and the bottom plate covers the lower surface and seals the containing cavity. Of course, in alternative embodiments, existing speaker units may be used.

Referring to fig. 4, in the present embodiment, the circuit board 30 includes a first end portion 34, a second end portion 35, and a first connection portion 36 connecting the first end portion 34 and the second end portion 35, the first end portion 34 is electrically connected to the speaker unit 20, and the second end portion 35 is electrically connected to an external circuit. Specifically, the first end portion 34 includes a first covering portion 341 covering the first hole 112, a second covering portion 342 covering the second hole 114, and a second connecting portion 343 connecting the first covering portion 341 and the second covering portion 342.

Of course, the circuit board 30 may also include other one, two or more ends connected with electronic components, and different electronic components may be connected respectively. The electronic component may be, but is not limited to, an inductor, a resistor, a capacitor, or the like.

Preferably, the circuit board 30 is a flexible circuit board.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims

1. A loudspeaker module is characterized by comprising a shell with an accommodating space, a loudspeaker single body accommodated in the accommodating space and a circuit board arranged outside the shell;

2. The speaker module of claim 1, wherein: and a sealing layer is arranged between the circuit board and the shell, and the sealing layer does not cover the opening.

3. The speaker module as claimed in claim 2, wherein the sealing layer is an adhesive or a double-sided tape.

4. A loudspeaker module according to claim 2, wherein the housing is provided with a recess for receiving the sealing layer, the sealing layer having a thickness no greater than the depth of the recess.

5. The speaker module as recited in claim 4, wherein the circuit board and the encapsulant layer are both received within the recess.

6. The speaker module of claim 1, wherein: the elastic pins are provided with two and are respectively connected with the positive pole and the negative pole of an external circuit.

7. The speaker module of claim 1, wherein: the casing include first casing and with the second casing that first casing lid closed, first casing with speaker monomer interval forms airtight back chamber, the trompil set up in first casing, the circuit board is arranged in the outside of first casing.

8. The speaker module of claim 1, wherein: the circuit board is a flexible circuit board.

9. The speaker module of claim 1, wherein: the circuit board comprises a first end portion, a second end portion and a first connecting portion, wherein the first connecting portion is connected with the first end portion and the second end portion, the first end portion is electrically connected with the loudspeaker single body, and the second end portion is used for being electrically connected with an external circuit.