CN215069970U

CN215069970U - Integrated circuit with embedded MRAM

Info

Publication number: CN215069970U
Application number: CN202121449638.5U
Authority: CN
Inventors: 张均颜
Original assignee: Shenzhen Junmin Technology Co ltd
Current assignee: Shenzhen Junmin Technology Co ltd
Priority date: 2021-06-28
Filing date: 2021-06-28
Publication date: 2021-12-07
Anticipated expiration: 2031-06-28

Abstract

The utility model discloses an integrated circuit of embedding MRAM relates to integrated circuit technical field, including the integrated circuit body, the equal fixedly connected with welding pin in both sides of integrated circuit body, the fixed welding in top of integrated circuit body has the hardware chip, the fixed welding in center department at integrated circuit body top has the embedding MRAM body, the top of integrated circuit body is provided with jam-proof mechanism. The utility model discloses a magnetic shield and the design of inhaling the wave plate, avoid embedding the problem that produces electromagnetic interference each other between MRAM body and the hardware chip, through being equipped with the jam-proof dictyosome and thin stereotype, avoid embedding the problem that produces signal interference each other between MRAM body and the hardware chip, guarantee embedding MRAM body's normal operating, solve the embedding MRAM body and receive the interference of other hardware chips easily when the operation, thereby influence the problem of the read write ability of embedding MRAM body, the throughput of reinforcing embedding MRAM body promotes the practicality of this device.

Description

Integrated circuit with embedded MRAM

Technical Field

The utility model relates to an integrated circuit relates to integrated circuit technical field, concretely relates to embedded MRAM's integrated circuit.

Background

MRAM is a nonvolatile magnetic random access memory that has the high-speed read and write capabilities of static random access memory and the high integration of dynamic random access memory, and can be written to repeatedly, essentially indefinitely, and is used in everyday applications by embedding it into an integrated circuit. The following problems exist in the prior art:

1. the existing MRAM integrated circuit does not have the capacity of resisting interference, so that the embedded MRAM is easily interfered by other hardware chips when in operation, and the read-write capacity of the MRAM is influenced;

2. the existing MRAM integrated circuit has poor heat dissipation performance, runs for a long time, easily causes the integrated circuit to have abnormal temperature, and influences the normal use of users.

SUMMERY OF THE UTILITY MODEL

The utility model provides an integrated circuit embedded with MRAM, one of which aims to have anti-interference capability and solve the problem that the MRAM is easily interfered by other hardware chips during operation so as to influence the read-write capability of the MRAM; the other purpose is to solve the problem that the temperature abnormality of the integrated circuit is easily caused by long-time operation, so as to achieve the effect of efficiently dissipating heat of the integrated circuit.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

the utility model provides an embedded MRAM's integrated circuit, includes the integrated circuit body, the equal fixedly connected with welding pin in both sides of integrated circuit body, the fixed welding in top of integrated circuit body has the hardware chip, the fixed welding in center department at integrated circuit body top has the embedded MRAM body, the top of integrated circuit body is provided with jam-proof mechanism, the bottom of integrated circuit body is provided with heat dissipation mechanism.

The anti-interference mechanism comprises an insulating rubber frame, the insulating rubber frame is fixedly installed at the top of the integrated circuit body, a magnetic separation sheet is attached to the inner wall of the insulating rubber frame, and a wave absorbing plate is attached to the outer wall of the insulating rubber frame.

The heat dissipation mechanism comprises an aluminum bottom plate, the aluminum bottom plate is fixedly installed at the bottom of the integrated circuit body, the bottom of the aluminum bottom plate is fixedly connected with flexible heat dissipation fins, and elastic blocks located on two sides of each flexible heat dissipation fin are fixedly installed at the bottom of the aluminum bottom plate.

The utility model discloses technical scheme's further improvement lies in: the outer wall and the inner wall of the insulating rubber frame are both provided with absorption holes, and an anti-interference net body is fixedly connected in the inner cavity of the insulating rubber frame.

The utility model discloses technical scheme's further improvement lies in: the shape of the anti-interference net body is in a grid shape, and a thin lead plate is fixedly connected to the middle of the anti-interference net body.

The utility model discloses technical scheme's further improvement lies in: the top of insulating rubber frame is provided with physics protection mechanism, physics protection mechanism includes the sponge ground mat, sponge ground mat fixed mounting is at the top of insulating rubber frame.

The utility model discloses technical scheme's further improvement lies in: the top fixedly connected with of sponge ground mat seals the leather sheath, the top fixedly connected with elastic support rod of sponge ground mat, the top fixed connection of elastic support rod and sealed leather sheath inner chamber.

The utility model discloses technical scheme's further improvement lies in: the bottom fixedly connected with graphite alkene heating panel of flexible heat dissipation wing, the bottom of elasticity piece and the top fixed connection of graphite alkene heating panel, the radiating groove has been seted up to the bottom of graphite alkene heating panel.

Owing to adopted above-mentioned technical scheme, the utility model discloses relative prior art, the technological progress who gains is:

1. the utility model provides an integrated circuit of embedding MRAM, adopt and separate the magnetic sheet, inhale the wave plate, the combination of jam-proof dictyosome and thin stereotype, through separating the magnetic sheet and inhaling the design of wave plate, avoid embedding the problem that produces electromagnetic interference each other between MRAM body and the hardware chip, through being equipped with jam-proof dictyosome and thin stereotype, avoid embedding the problem that produces signal interference each other between MRAM body and the hardware chip, guarantee embedding MRAM body's normal operating, solve the interference that the embedding MRAM body received other hardware chips when the operation easily, thereby influence the problem of the read write ability of embedding MRAM body, the throughput of reinforcing embedding MRAM body, promote the practicality of this device.

2. The utility model provides an embedded MRAM's integrated circuit, adopt aluminium system bottom plate, flexible heat dissipation wing, the combination of elastic block and graphite alkene heating panel, design through the elastic block, make the bottom of graphite alkene heating panel hug closely together with the top of circuit board when the installation, through aluminium system bottom plate with the heat transfer that integrated circuit body during operation produced to flexible heat dissipation wing on, dispel the heat through the side of flexible heat dissipation wing, part heat on the flexible heat dissipation wing can be absorbed by graphite alkene heating panel, spread the heat through radiating groove and circuit board, the realization is to the integrated circuit body carry out high-efficient radiating function, avoid long-time operation to lead to the problem of integrated circuit temperature abnormal conditions to appear easily, promote the security of this device.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic top view of the interference prevention mechanism of the present invention;

FIG. 3 is a schematic cross-sectional view of the insulating rubber frame of the present invention;

FIG. 4 is a schematic structural view of the physical protection mechanism of the present invention;

fig. 5 is a schematic structural view of the heat dissipation mechanism of the present invention.

In the figure: 1. an integrated circuit body; 2. welding pins; 3. a hardware chip; 4. an embedded MRAM body;

5. an interference prevention mechanism; 51. an insulating rubber frame; 511. an absorption hole; 512. an anti-interference net body; 513. a thin lead plate; 52. a physical protection mechanism; 521. a sponge floor mat; 522. sealing the leather sheath; 523. an elastic strut; 53. a magnetic shield sheet; 54. a wave absorbing plate;

6. a heat dissipation mechanism; 61. an aluminum bottom plate; 62. flexible heat dissipation fins; 63. an elastic block; 64. a graphene heat dissipation plate; 65. a heat dissipation groove.

Detailed Description

The present invention will be described in further detail with reference to the following examples:

example 1

As shown in FIGS. 1-5, the present invention provides an integrated circuit embedded with MRAM, which comprises an integrated circuit body 1, wherein both sides of the integrated circuit body 1 are fixedly connected with welding pins 2, the top of the integrated circuit body 1 is fixedly welded with a hardware chip 3, the center of the top of the integrated circuit body 1 is fixedly welded with an embedded MRAM body 4, the top of the integrated circuit body 1 is provided with an anti-interference mechanism 5, the bottom of the integrated circuit body 1 is provided with a heat dissipation mechanism 6, the anti-interference mechanism 5 comprises an insulating rubber frame 51, the insulating rubber frame 51 is fixedly installed at the top of the integrated circuit body 1, the inner wall of the insulating rubber frame 51 is attached with a magnetism isolating sheet 53, the outer wall of the insulating rubber frame 51 is attached with a wave absorbing sheet 54, and the problems of electromagnetic interference generated between the embedded MRAM body 4 and the hardware chip 3 are avoided by the magnetism isolating sheet 53 and the wave absorbing sheet 54, the heat dissipation mechanism 6 comprises an aluminum base plate 61, the aluminum base plate 61 is fixedly installed at the bottom of the integrated circuit body 1, the bottom of the aluminum base plate 61 is fixedly connected with flexible heat dissipation fins 62, elastic blocks 63 located on two sides of the flexible heat dissipation fins 62 are fixedly installed at the bottom of the aluminum base plate 61, the extruding degree of the elastic blocks 63 is smaller than that of the flexible heat dissipation fins 62, the flexible heat dissipation fins 62 are protected through the design of the elastic blocks 63, and the problem that the flexible heat dissipation fins 62 are damaged due to too large pressing is avoided.

Example 2

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, absorption holes 511 have been all seted up on the outer wall and the inner wall of insulating rubber frame 51, fixedly connected with jam-proof net body 512 in the inner chamber of insulating rubber frame 51, the shape of jam-proof net body 512 sets up latticedly, thin lead plate 513 of middle part fixedly connected with of jam-proof net body 512, through being equipped with absorption holes 511, can avoid the heat to produce in the inner chamber of insulating rubber frame 51 and collect, through being equipped with jam-proof net body 512 and thin lead plate 513, avoid embedding the problem that produces signal interference each other between MRAM body 4 and the hardware chip 3, guarantee the normal operating of embedding MRAM body 4.

Example 3

As shown in fig. 1-5, on the basis of embodiment 1, the utility model provides a technical solution: preferably, the physical protection mechanism 52 is arranged on the top of the insulating rubber frame 51, the physical protection mechanism 52 includes a sponge ground mat 521, the sponge ground mat 521 is fixedly mounted on the top of the insulating rubber frame 51, a sealing leather sheath 522 is fixedly connected to the top of the sponge ground mat 521, an elastic supporting rod 523 is fixedly connected to the top of the sponge ground mat 521, the top of the elastic supporting rod 523 is fixedly connected to the top of the inner cavity of the sealing leather sheath 522, a graphene heat dissipation plate 64 is fixedly connected to the bottom of the flexible heat dissipation fin 62, the bottom of the elastic block 63 is fixedly connected to the top of the graphene heat dissipation plate 64, a heat dissipation groove 65 is formed in the bottom of the graphene heat dissipation plate 64, through the design of the sponge ground mat 521, the sealing leather sheath 522 and the elastic supporting rod 523, the problem that the embedded MRAM body 4 is damaged due to extrusion caused by foreign matters is avoided, and the function of performing pressure-proof protection on the top of the embedded MRAM body 4 is realized, by providing the graphene heat dissipation plate 64 and the heat dissipation groove 65, the heat at the bottom of the integrated circuit body 1 can be quickly diffused.

The operation of the integrated circuit in which the MRAM is embedded will be described in detail below.

As shown in fig. 1-5, when using, the device is welded in a circuit board through a welding pin 2, the device can be normally used for reading and writing, the problem of mutual interference between a hardware chip 3 and an embedded MRAM body 4 during working is avoided through the design of a magnetism isolating sheet 53, a wave absorbing sheet 54, an anti-interference net body 512 and a thin lead plate 513, the problem that the embedded MRAM body 4 is damaged due to extrusion of foreign matters on the embedded MRAM body 4 is avoided through the design of a sponge ground mat 521, a sealing leather sheath 522 and an elastic supporting rod 523, and the function of heat dissipation of the embedded MRAM body 4 is realized through the matching of an aluminum bottom plate 61, a flexible heat dissipation fin 62 and a graphene heat dissipation plate 64.

The present invention has been described in detail with reference to the above general description, but it will be apparent to one of ordinary skill in the art that modifications and improvements can be made to the invention. Therefore, modifications or improvements without departing from the spirit of the invention are within the scope of the invention.

Claims

1. An integrated circuit with embedded MRAM comprises an integrated circuit body (1), wherein welding pins (2) are fixedly connected to two sides of the integrated circuit body (1), a hardware chip (3) is fixedly welded to the top of the integrated circuit body (1), and an embedded MRAM body (4) is fixedly welded to the center of the top of the integrated circuit body (1), and is characterized in that: the top of the integrated circuit body (1) is provided with an anti-interference mechanism (5), and the bottom of the integrated circuit body (1) is provided with a heat dissipation mechanism (6);

the anti-interference mechanism (5) comprises an insulating rubber frame (51), the insulating rubber frame (51) is fixedly arranged at the top of the integrated circuit body (1), a magnetism isolating sheet (53) is attached to the inner wall of the insulating rubber frame (51), and a wave absorbing plate (54) is attached to the outer wall of the insulating rubber frame (51);

the heat dissipation mechanism (6) comprises an aluminum bottom plate (61), the aluminum bottom plate (61) is fixedly installed at the bottom of the integrated circuit body (1), flexible heat dissipation fins (62) are fixedly connected to the bottom of the aluminum bottom plate (61), and elastic blocks (63) located on two sides of the flexible heat dissipation fins (62) are fixedly installed at the bottom of the aluminum bottom plate (61).

2. An integrated circuit embedded with MRAM according to claim 1, wherein: the outer wall and the inner wall of the insulating rubber frame (51) are both provided with absorption holes (511), and an anti-interference net body (512) is fixedly connected in the inner cavity of the insulating rubber frame (51).

3. An integrated circuit embedded with MRAM according to claim 2, wherein: the shape of the anti-interference net body (512) is in a grid shape, and the middle of the anti-interference net body (512) is fixedly connected with a thin lead plate (513).

4. An integrated circuit embedded with MRAM according to claim 1, wherein: the top of the insulating rubber frame (51) is provided with a physical protection mechanism (52), the physical protection mechanism (52) comprises a sponge ground mat (521), and the sponge ground mat (521) is fixedly arranged on the top of the insulating rubber frame (51).

5. An integrated circuit embedded with MRAM according to claim 4, wherein: the top fixedly connected with of sponge ground mat (521) seals leather sheath (522), the top fixedly connected with of sponge ground mat (521) has elastic supporting rod (523), the top of elastic supporting rod (523) and the top fixed connection of sealed leather sheath (522) inner chamber.

6. An integrated circuit embedded with MRAM according to claim 1, wherein: the bottom fixedly connected with graphite alkene heating panel (64) of flexible heat dissipation wing (62), the bottom of elasticity piece (63) and the top fixed connection of graphite alkene heating panel (64), radiating groove (65) have been seted up to the bottom of graphite alkene heating panel (64).