CN215067719U - Lithography machine and exposure mechanism capable of achieving accurate alignment - Google Patents

Abstract

The utility model relates to the technical field of photoetching machines, in particular to a photoetching machine and an exposure mechanism capable of being accurately aligned, wherein the exposure mechanism comprises an upper template, a lower template, a wafer supporting plate, a mask mounting plate, an alignment driving mechanism and a leveling driving mechanism; the mask mounting plate can be arranged on the upper template in a floating manner, so that the corners of the mask mounting plate can be lifted relatively; the wafer supporting plate is movably arranged on the supporting surface of the lower template, so that each corner of the wafer supporting plate can relatively move along the direction parallel to the supporting surface; the leveling driving mechanism is used for applying force to the mask mounting plate along the direction vertical to the supporting surface so that the mask mounting plate is parallel to the wafer; the alignment driving mechanism is used for applying force to the wafer supporting plate along the direction parallel to the supporting surface so as to adjust the position of the wafer supporting plate. According to the utility model discloses a scheme, it can be to the accurate counterpoint of wafer, makes wafer and mask slice parallel, and makes the wafer and predetermine the position and adjust well.

Description

Lithography machine and exposure mechanism capable of achieving accurate alignment

Technical Field

The utility model relates to a lithography machine technical field, in particular to lithography machine and exposure mechanism that can accurately counterpoint thereof.

Background

Photolithography, which is a process of sequentially transferring chip patterns on a series of masks to corresponding layers of a silicon wafer by exposure, is a very important process in the semiconductor manufacturing process and is considered as a core step in the large-scale integrated circuit manufacturing. A series of complex and time-consuming photolithography processes in semiconductor manufacturing are mainly performed by corresponding photolithography machines.

An exposure mechanism of an existing lithography machine comprises a mask mounting plate and a wafer supporting plate used for bearing a wafer, and in order to improve exposure accuracy, accurate alignment of the wafer is required, so that the wafer is parallel to a mask plate, and the wafer is aligned with a preset position, and therefore, the exposure pattern on the wafer is prevented from being layered off, and how to accurately align the wafer is a technical problem which needs to be solved in the field.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a lithography machine and can accurate counterpoint exposure mechanism thereof, the main technical problem that will solve is: how to precisely align the wafer, so that the wafer is parallel to the mask plate and aligned with the predetermined position.

In order to achieve the above object, the utility model mainly provides the following technical scheme:

on one hand, the embodiment of the utility model provides a but accurate counterpoint exposure mechanism of lithography machine, it includes cope match-plate pattern, lower bolster, the wafer backup pad that is used for bearing the weight of the wafer, the mask mounting panel that is used for installing the mask board, alignment actuating mechanism and leveling actuating mechanism;

the mask mounting plate can be arranged on the upper template in a floating manner, so that the corners of the mask mounting plate can be lifted relatively;

the wafer supporting plate is movably arranged on the supporting surface of the lower template, so that each corner of the wafer supporting plate can relatively move along the direction parallel to the supporting surface;

the leveling driving mechanism is used for applying force to the mask mounting plate along the direction vertical to the supporting surface so that the mask mounting plate is parallel to the wafer;

the alignment driving mechanism is used for applying force to the wafer supporting plate along the direction parallel to the supporting surface so as to adjust the position of the wafer supporting plate.

Optionally, the mask mounting plate is provided with three adjusting areas M1, M2 and M3 which are distributed at intervals;

the leveling driving mechanism is used for respectively applying force to the three adjusting areas M1, M2 and M3 to enable the mask mounting plate to be parallel to the wafer.

Optionally, the leveling driving mechanism includes an elastic member and three driving mechanisms, and the elastic member is used for providing a force for lowering each adjusting area on the mask plate relative to the wafer supporting plate;

the three driving mechanisms correspond to the three adjusting regions M1, M2 and M3 one by one, so as to respectively drive the corresponding adjusting regions to ascend.

Optionally, the exposure mechanism capable of being accurately aligned further comprises a limiting structure, and the limiting structure is used for limiting the floating height of the mask mounting plate.

Optionally, the limiting structure comprises a bolt and a nut screwed on the bolt;

the mask mounting plate is provided with through holes, and the screw rods of the bolts are used for sequentially penetrating through the through holes of the upper template and the mask mounting plate, so that the upper template and the mask mounting plate are positioned between the heads of the bolts and the nuts; the aperture of the via hole is larger than the outer diameter of the screw, and the limiting structure stops the mask mounting plate through the head of the bolt or the nut so as to limit the floating height of the mask mounting plate.

Optionally, the wafer supporting plate is connected with the lower template through a first plane bearing;

the first plane bearing comprises an upper gasket, a lower gasket and a plane retainer positioned between the upper gasket and the lower gasket, the upper gasket of the first plane bearing is used for keeping relatively fixed with the lower template through a fixed shaft, and the lower gasket of the first plane bearing is used for keeping relatively fixed with the wafer supporting plate.

Optionally, the alignment driving mechanism is configured to apply force to three positions on the wafer supporting plate along different directions to adjust the position of the wafer supporting plate; the wafer supporting plate is provided with three stress positions A1, A2 and A3, the stress direction of the wafer supporting plate at the stress position A1 is the X direction, the stress direction of the wafer supporting plate at the stress position A2 is the Y1 direction, the stress direction of the wafer supporting plate at the stress position A3 is the Y2 direction, the stress position A1 is located at one side of the wafer supporting plate, and the stress positions A2 and A3 are located at the other adjacent side of the wafer supporting plate and are arranged at intervals; the Y1 direction and the Y2 direction are parallel and both are perpendicular to the X direction.

Optionally, the alignment driving mechanism includes an X position adjusting mechanism, a Y1 position adjusting mechanism, and a Y2 position adjusting mechanism;

the X position adjustment mechanism is configured to apply a force to the wafer support plate in the X direction, the Y1 position adjustment mechanism is configured to apply a force to the wafer support plate in the Y1 direction, and the Y2 position adjustment mechanism is configured to apply a force to the wafer support plate in the Y2 direction.

Optionally, the upper template can be lifted relative to the lower template;

the exposure mechanism further comprises a lifting driving mechanism for driving the upper template to move.

On the other hand, the embodiment of the utility model provides a lithography machine still provides, it can include any kind of above-mentioned but accurate counterpoint exposure mechanism.

Borrow by above-mentioned technical scheme, the utility model discloses lithography machine and can accurate counterpoint exposure mechanism have following beneficial effect at least:

because the mask mounting plate is designed in a floating manner, the corners of the mask mounting plate can be lifted relatively, so that the mask mounting plate can be leveled when the leveling driving mechanism applies force to the mask mounting plate, and the mask plate is parallel to the wafer. In addition, because the wafer supporting plate is designed in a floating mode, all corners of the wafer supporting plate can move relatively along the direction parallel to the supporting surface, and therefore when the aligning driving mechanism applies force to the wafer supporting plate, the wafer supporting plate can be aligned. The double-floating design of the mask mounting plate and the wafer supporting plate can realize accurate alignment of the wafer, so that the wafer is parallel to the mask plate and aligned to the preset position.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

Fig. 1 is a schematic structural diagram of an exposure mechanism of a lithography machine according to an embodiment of the present invention, which can be precisely aligned;

FIG. 2 is a schematic partial structural view of the lithography machine of FIG. 1 when the upper plate of the exposure mechanism is raised;

FIG. 3 is a schematic structural diagram showing a structure of the back surface of the mask mounting plate;

FIG. 4 is a schematic structural diagram showing the front structure of the wafer supporting plate;

FIG. 5 is an exploded view of the mask mounting plate and the upper template;

FIG. 6 is a schematic view of the drive mechanism;

FIG. 7 is a schematic structural view of the lower template;

FIG. 8 is an enlarged schematic view of the structure at A in FIG. 7;

fig. 9 is an exploded view of a connector according to an embodiment of the present invention;

fig. 10 is a schematic structural view of the X position adjustment mechanism.

Reference numerals: 1. mounting a template; 2. a wafer supporting plate; 3. a mask mounting plate; 4. a drive mechanism; 5. an elastic member; 6. a limiting structure; 7. a connecting member; 8. a mask plate; 9. a wafer; 10. a lower template; 11. mounting holes; 12. a support table; 13. a guide bar; 14. a limiting block; 15. a support pillar; 16. a machine platform; 17. a lifting drive mechanism; 18. an X position adjusting mechanism; 19. a Y1 position adjustment mechanism; 20. a Y2 position adjustment mechanism; 21. a first planar bearing; 22. mounting grooves; 23. a second planar bearing; 32. a via hole; 41. a screw motor; 42. an output shaft; 43. a push rod; 44. a limiting rod; 45. a first stopper; 46. a second stopper; 61. a bolt; 62. a nut; 71. a connecting plate; 72. a clamping and fixing piece; 73. a screw; 701. a clamping hole; 702. another via hole; 181. a first drive mechanism; 182. a first elastic device; 201. a support surface; 211. an upper gasket; 212. a lower gasket; 213. a fixed shaft; 231. an upper base plate; 232. and a lower cushion plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

As shown in fig. 1 and fig. 2, an embodiment of the present invention provides a lithography machine's exposure mechanism that can be accurately aligned, which includes an upper template 1, a lower template 10, a wafer supporting plate 2, a mask mounting plate 3, an alignment driving mechanism and a leveling driving mechanism. The wafer supporting plate 2 is used for supporting the wafer 9, and the wafer supporting plate 2 may have a supporting portion thereon to support the wafer 9 through the supporting portion. The mask mounting plate 3 is used for mounting the mask plate 8, for example, the mask plate 8 can be fixed on the mask mounting plate 3 by adsorption.

The mask mounting plate 3 is floatably mounted on the upper mold plate 1 so that the corners of the mask mounting plate 3 can be relatively raised and lowered. The wafer supporting plate 2 is movably mounted on the supporting surface 201 of the lower template 10, so that each corner of the wafer supporting plate 2 can relatively move along the direction parallel to the supporting surface 201. The leveling driving mechanism is used to apply a force to the mask mounting plate 3 in a direction perpendicular to the supporting surface 201, so that the mask mounting plate 3 is parallel to the wafer 9. The alignment drive mechanism is used to apply a force to the wafer support plate 2 in a direction parallel to the support surface 201 to adjust the position of the wafer support plate 2.

In the above example, since the mask mounting plate 3 is designed in a floating manner, the corners of the mask mounting plate 3 can be lifted and lowered relatively, so that the mask mounting plate 3 can be leveled when the leveling driving mechanism applies force to the mask mounting plate 3, and the mask plate 8 is parallel to the wafer 9. In addition, since the wafer supporting plate 2 is designed to be floating, each corner of the wafer supporting plate 2 can move relatively along the direction parallel to the supporting surface 201, so that the wafer supporting plate 2 can be aligned when the alignment driving mechanism applies force to the wafer supporting plate 2. The double-floating design of the mask mounting plate 3 and the wafer supporting plate 2 can realize accurate alignment of the wafer 9, so that the wafer 9 is parallel to the mask plate and the wafer 9 is aligned with the preset position.

In order to realize the function of the leveling driving mechanism, the leveling driving mechanism can level the mask mounting plate 3, and as shown in fig. 3, the mask mounting plate 3 can have three adjusting areas M1, M2 and M3 which are distributed at intervals. The adjustment regions M1, M2, and M3 may be three vertices of a triangle, such as an equilateral triangle. The leveling driving mechanism is used for respectively applying force to the three adjusting areas M1, M2 and M3 to make the mask mounting plate 3 parallel to the wafer 9. Since one plane can be determined by the three points, the plane where the mask plate 8 is located can be adjusted by adjusting the three adjustment regions M1, M2, and M3, so that the mask plate 8 is parallel to the wafer 9.

Further, as shown in fig. 2, the leveling driving mechanism may include an elastic member 5 and three driving mechanisms 4, and the elastic member 5 may be a spring or a flexible plastic. The elastic member 5 is used to provide a force for lowering each adjustment area on the mask plate with respect to the wafer support plate 2. The three driving mechanisms 4 are in one-to-one correspondence with the three adjustment regions M1, M2, and M3 to drive the respective adjustment regions to rise, respectively. In this example, the elastic member 5 cooperates with each driving mechanism 4, so as to control the ascending and descending of each adjustment area.

As shown in fig. 2, the exposure mechanism of the present invention may further include a limiting structure 6, wherein the limiting structure 6 is used for limiting the floating height of the mask mounting plate 3, so that the mask mounting plate 3 floats within a predetermined range, thereby reducing the floating of the mask mounting plate, and improving the floating efficiency. Wherein, the quantity of limit structure 6 can equal with the quantity of the corner of mask mounting panel 3, and the one-to-one correspondence, and each limit structure 6 is used for spacing the floating height to the corner of corresponding mask mounting panel 3. In a specific application example, the mask mounting plate 3 is square, and has four corners, and the number of the limiting structures 6 is four and corresponds to the four corners of the mask mounting plate 3 one by one. In this example, by disposing the respective limit structures 6 at the corners of the mask mounting plate 3, it is possible to avoid the limit structures 6 from interfering with the exposure light in the center of the mask mounting plate 3.

As shown in fig. 5, the aforementioned limiting structure 6 may include a bolt 61 and a nut 62 for screwing on the bolt 61. The mask mounting plate 3 is provided with through holes 32, and the screw rods 73 of the bolts 61 are used for sequentially passing through the through holes 32 of the upper template 1 and the mask mounting plate 3, so that the upper template 1 and the mask mounting plate 3 are positioned between the heads of the bolts 61 and the nuts 62. Wherein, the aperture of via hole 32 is greater than the external diameter of screw rod 73, and screw rod 73 can be spacing to the floating of mask mounting panel 3 to the side, for example can be spacing to the floating of mask mounting panel 3 in direction such as preceding, back, left and right. In addition, the limiting structure 6 also limits the floating height of the mask mounting plate 3 by stopping the head of the bolt 61 or the nut 62.

As shown in fig. 5, the upper template 1 is further provided with a mounting hole 11 for accommodating the mask mounting plate 3, and the mounting hole 11 is internally provided with a support base 12 for supporting the mask mounting plate 3; the bolt 61 is used to pass through the support base 12 to be connected with the upper die plate 1 through the support base 12. In this example, the mask mounting plate 3 can be mounted inside the upper mold plate 1 through the mounting holes 11 provided, so that the assembly structure of the two is more compact.

As shown in fig. 5, the screw 73 of the bolt 61 is preferably used to pass through the support stand 12 and the mask mounting plate 3 from the lower side so that the nut 62 is positioned on the upper side of the mask mounting plate 3 to facilitate the worker to screw the nut 62 from the upper side.

As shown in fig. 6, the aforementioned driving mechanism 4 may include a lead screw motor 41, and the lead screw motor 41 drives the corresponding adjustment region to ascend through an output end thereof. The driving mechanism 4 is not connected to the mask plate, and when the output end of the lead screw motor 41 rises, the corresponding adjusting area of the mask plate is pushed to rise, and when the output end of the lead screw motor 41 falls, the corresponding area of the mask plate falls under the pushing action of the elastic member 5. In a specific application example, the output shaft 42 of the lead screw motor 41 may be clamped with a push rod 43, so as to push the corresponding adjusting area of the mask plate to ascend through the push rod 43. The output shaft 42 of the lead screw motor 41 may further be provided with a limiting rod 44, for example, the limiting rod 44 is fixedly sleeved on the output shaft 42. The stopper 44 is adapted to be lifted together with the output shaft 42 of the motor. A first stopper 45 and a second stopper 46 are also mounted on the wafer support plate 2. The limit rod 44 is used for abutting against the first stop member 45 when the output shaft 42 of the lead screw motor 41 ascends to the upper limit position, and for abutting against the second stop member 46 when the output shaft 42 of the lead screw motor 41 descends to the lower limit position. In this example, the output shaft 42 of the screw motor 41 can be prevented from being excessively extended and contracted by the provision of the first stopper 45 and the second stopper 46.

Here, it should be noted that: as shown in fig. 5, when the aforementioned limiting structures 6 comprise bolts 61 and nuts 62 for screwing on the bolts 61, the number of the elastic members 5 is equal to the number of the limiting structures 6, and corresponds to one. The elastic member 5 is used for being sleeved on the screw 73 of the bolt 61 and is located on one side, away from the upper template 1, of the mask mounting plate 3. When the screw 73 passes through the mask mounting plate 3 from the lower side with the nut 62 positioned on the upper side of the mask mounting plate 3, the elastic member 5 may be positioned between the mask mounting plate 3 and the nut 62. In this example, when the worker screws the nut 62, the force applied to the mask mounting plate 3 by the elastic member 5 can be adjusted to suit the working environment of the site.

In order to reduce the wear of the mask mounting plate 3, the wear plates may be mounted in the adjustment areas of the mask mounting plate 3, and the wear plates may be detachable with respect to the mask mounting plate 3, for example, detachably connected by screws. Each of the aforementioned driving mechanisms 4 drives the corresponding adjustment area of the mask mounting plate 3 to rise by pushing against the wear plate.

For the purpose of enabling the corners of the wafer supporting plate 2 to move relatively in a direction parallel to the supporting surface 201, as shown in fig. 4, the wafer supporting plate 2 may be connected to the lower mold plate 10 through a first plane bearing 21. The number of the first planar bearings 21 may be two or more, and preferably, the number of the first planar bearings 21 is four, and the first planar bearings 21 are distributed at intervals around the circumferential direction of the wafer support plate 2. In a specific application example, as shown in fig. 8, the first planar bearing 21 may include an upper washer 211, a lower washer 212, and a planar retainer between the upper washer 211 and the lower washer 212. The upper washer 211 of the first planar bearing 21 is used to be relatively fixed with the lower template 10 through the fixing shaft 213, and the fixing shaft 213 may be fixed with both the upper washer 211 of the first planar bearing 21 and the lower template 10. The lower washer 212 and the planar retainer of the first planar bearing 21 are both provided with a clearance via hole for the fixed shaft 213 to pass through, and the aperture of the clearance via hole is larger than the shaft diameter of the fixed shaft 213. The lower washer 212 of the first planar bearing 21 is adapted to remain relatively fixed with respect to the wafer support plate 2. Preferably, the wafer supporting plate 2 is provided with a mounting groove 22, the first planar bearing 21 is configured to be mounted in the mounting groove 22 through a lower gasket 212, and the lower gasket 212 is fixedly sleeved in the mounting groove 22. In this example, the wafer support plate 2 can be moved relative to the lower template 10 by the first planar bearing 21 in a direction parallel to the support surface 201.

In order to reduce the frictional resistance between the wafer supporting plate 2 and the lower mold plate 10, it is preferable that a second planar bearing 23 is further disposed between the wafer supporting plate 2 and the lower mold plate 10 as shown in fig. 7, and the second planar bearing 23 includes an upper pad 231, a lower pad 232, and a planar holder disposed between the upper pad 231 and the lower pad 232 as shown in fig. 8. The second plane bearing 23 is connected with the lower template 10 through a lower backing plate 232, and the lower backing plate 232 and the lower template 10 are relatively fixed. The second flat bearing 23 supports the wafer support plate 2 by an upper pad 231 such that the wafer support plate 2 is spaced apart from the support surface 201.

The number of the second flat bearings 23 may be two or more, and in a specific application example, the number of the second flat bearings 23 is four and is distributed at intervals around the circumferential direction of the wafer support plate 2.

In order to adjust the wafer 9 to be consistent with the preset position, preferably, the alignment driving mechanism is used for applying force to three positions on the wafer supporting plate 2 along different directions so as to adjust the position of the wafer supporting plate 2; the wafer supporting plate 2 is provided with three stress positions A1, A2 and A3, the stress direction of the wafer supporting plate 2 at the stress position A1 is the X direction, the stress direction of the wafer supporting plate 2 at the stress position A2 is the Y1 direction, the stress direction of the wafer supporting plate 2 at the stress position A3 is the Y2 direction, wherein the stress position A1 is positioned at one side of the wafer supporting plate 2, and the stress positions A2 and A3 are positioned at the other adjacent side of the wafer supporting plate 2 and are arranged at intervals. The Y1 direction and the Y2 direction are parallel and both are perpendicular to the X direction.

In the above example, the alignment driving mechanism may adjust the position of the wafer support plate 2 in an xyz manner so that the position of the wafer support plate 2 coincides with the preset position.

Further, as shown in fig. 2, the aforementioned alignment drive mechanism may include an X position adjustment mechanism 18, a Y1 position adjustment mechanism 19, and a Y2 position adjustment mechanism 20. The X position adjustment mechanism 18 is for applying a force to the wafer support plate 2 in the X direction, the Y1 position adjustment mechanism 19 is for applying a force to the wafer support plate 2 in the Y1 direction, and the Y2 position adjustment mechanism 20 is for applying a force to the wafer support plate 2 in the Y2 direction.

As shown in fig. 10, the aforementioned X-position adjusting mechanism 18 may include a first driving mechanism 181 and a first elastic device 182. The first driving mechanism 181 is configured to drive the wafer supporting plate 2 to move to one side along the X direction, wherein the first driving mechanism 181 may include a first linear motion module to drive the wafer supporting plate 2 to move to one side along the X direction through the first linear motion module, and the first linear motion module may be a driving cylinder or a ball screw structure. The first elastic device 182 is used for driving the wafer supporting plate 2 to move along the other side opposite to the X direction. In this example, the first driving mechanism 181 and the first elastic device 182 cooperate with each other to drive the wafer support plate 2 to move forward or backward along the X direction. In a specific application example, as shown in fig. 10, the first elastic device 182 may be a spring or an elastic plastic, and one end of the first elastic device 182 is connected to the wafer supporting plate 2, and the other end is connected to the lower mold plate 10.

The aforementioned Y1 position adjusting mechanism 19 may include a second driving mechanism and a second elastic device. The second driving mechanism is used for driving the wafer supporting plate 2 to move to one side along the Y1 direction, wherein the second driving mechanism may include a second linear motion module to drive the wafer supporting plate 2 to move to one side along the Y1 direction through the second linear motion module, and the second linear motion module may be a driving cylinder or a ball screw structure. The second elastic device is used for driving the wafer supporting plate 2 to move towards the other side opposite to the other side along the Y1 direction. In this example, the second driving mechanism and the second elastic device cooperate with each other to drive the wafer supporting plate 2 to move forward or backward along the direction Y1. In a specific application example, the second elastic device may be a spring or elastic plastic, and one end of the second elastic device is connected to the wafer supporting plate 2, and the other end is connected to the lower template 10.

The aforementioned Y2 position adjustment mechanism 20 may include a third drive mechanism and a third resilient device. The third driving mechanism is used for driving the wafer supporting plate 2 to move to one side along the Y2 direction, wherein the third driving mechanism may include a third linear motion module to drive the wafer supporting plate 2 to move to one side along the Y2 direction through the third linear motion module, and the third linear motion module may be a driving cylinder or a ball screw structure. The third elastic device is used for driving the wafer supporting plate 2 to move towards the other side opposite to the other side along the Y2 direction. In this example, the third driving mechanism and the third elastic device cooperate with each other to drive the wafer supporting plate 2 to move forward or backward along the direction Y2. In a specific application example, as shown in the figure, the third elastic device may be a spring or an elastic plastic, and one end of the third elastic device is connected to the wafer supporting plate 2, and the other end is connected to the lower template 10.

Further, the upper mold plate 1 can be lifted relative to the lower mold plate 10. As shown in fig. 1, the exposure mechanism further includes a lift drive mechanism 17 for driving the upper plate 1 to move. When the upper template 1 rises to be far away from the lower template 10, the distance between the upper template 1 and the lower template 10 is increased, so that the effect of conveniently taking and placing the wafer 9 is achieved. In addition, when some wafers 9 are processed, the mask plate 8 needs to be abutted against the wafers 9. Because the mask mounting panel 3 is the floating plate, when the upper die plate 1 drives the mask plate 8 to be close to the wafer 9 until offsetting with the wafer 9, the mask plate 8 can be promoted by the wafer 9 in the process of pushing down the wafer 9, and make each corner of self take place the motion of different degrees, in order to compensate the clearance between each corner and the wafer 9, make each corner of mask plate 8 all laminate with the wafer 9, thereby can guarantee that the mask plate 8 is parallel with the wafer 9, so can improve the depth of parallelism of mask plate 8 and wafer 9.

The aforementioned exposure mechanism may further include a guide portion for guiding the elevation of the upper plate 1 to improve the accuracy of the elevation of the upper plate 1. As shown in fig. 1, the guide portion may include a guide rod 13 for connecting with the upper template 1, the lower template 10 is provided with a guide hole for the guide rod 13 to pass through, and the guide rod 13 is used for sliding fitting with the guide hole and passing through the machine table 16. Wherein, lift actuating mechanism 17 is used for driving cope match-plate pattern 1 through guide bar 13 and goes up and down, has so realized the drive connection's of actuating mechanism 4 and the cope match-plate pattern 1 of top below board 16 effect.

The lower template 10 may be fixed on the machine table 16 through the supporting column 15, and a gap is formed between the lower template 10 and the machine table 16, so that it is convenient to install other components between the lower template 10 and the machine table 16. Wherein, support column 15 is located between lower bolster 10 and the board 16, and support column 15 one end can be through screw etc. and lower bolster 10 fixed connection, and the other end of support column 15 can be through screw etc. and board 16's upside fixed connection. The aforementioned guide rod 13 is used to pass through the machine platform 16 via the inside of the supporting column 15, which has the effect of saving space.

As shown in fig. 1, the guide rod 13 may further be sleeved with a limiting block 14, and the limiting block 14 may be fastened to the guide rod 13 to lift along with the guide rod 13. The limiting block 14 is located between the upper template 1 and the lower template 10, and the limiting block 14 is used for abutting against the lower template 10 when the upper template 1 descends to a limiting position so as to limit the descending height of the upper template 1 and prevent the lower template 10 from being crushed due to the excessive descending of the upper template 1.

In order to achieve the aforementioned function of the elevation drive mechanism 17, the elevation drive mechanism 17 may include a screw nut structure. The screw rod nut structure is provided with a screw rod and a nut seat sleeved on the screw rod, and the screw rod can drive the nut seat to linearly move along the screw rod when rotating. The guide rod 13 is used for being connected with a nut seat of the feed screw nut structure so as to be driven by a feed screw of the feed screw nut structure to lift. The lifting driving mechanism 17 may further include a driving motor, and the driving motor is used for driving the screw rod of the screw rod nut structure to rotate.

In a specific application example, as shown in fig. 1, the number of the guide bars 13 may be four, and the guide bars may be arranged at four corners of the upper die plate 1 in a one-to-one correspondence. Wherein, these four guide bars 13 divide into two sets ofly, and every group all contains two guide bars 13, and the lower part of these two guide bars 13 passes through connecting piece 7 to be connected. The number of the lifting driving mechanisms 17 is also two, and the lifting driving mechanisms 17 correspond to the two connecting pieces 7 one by one, and the nut seat of each lifting driving mechanism 17 is used for being connected with the corresponding connecting piece 7 so as to drive the corresponding guide rod 13 to lift through the connecting piece 7. In this example, the lifting accuracy of the upper die plate 1 can be improved by providing the guide bars 13 at all four corners of the upper die plate 1. In addition, through dividing into two sets of guide bar 13 to every group all drives through a lift actuating mechanism 17, so have the advantage of saving lift actuating mechanism 17 quantity, and can guarantee that the elevating movement of two guide bar 13 can keep unanimous in every group.

As shown in fig. 9, the aforementioned connecting member 7 may include a connecting plate 71 and a fastener 72. The two clamping pieces 72 are provided with two clamping holes 701 for being sleeved on the guide rod 13, the two clamping pieces 72 are correspondingly arranged at the lower sides of the two ends of the connecting plate 71, and the two clamping pieces 72 can be fixed with the connecting plate 71 through screws. The two ends of the connecting plate 71 are respectively provided with another through hole 702 for the guide rod 13 to penetrate into the clamping hole 701. Wherein, the connecting piece 7 is connected with the nut seat of the corresponding lifting driving mechanism 17 through the connecting plate 71. Preferably, the middle portion of the connection plate 71 may be fixed to a nut seat of the corresponding elevation driving mechanism 17 by a screw.

As shown in fig. 9, a screw 73 may be screwed to the bottom of the fastener 72, and the screw 73 may be a bolt 61 or the like. The screw 73 is used for abutting against the lower end of the guide rod 13 to limit the depth of the guide rod 13 inserted into the clamping hole 701, so as to prevent the guide rod 13 on one side of the connecting piece 7 from being excessively inserted to influence the connection of the guide rod 13 on the other side.

The embodiment of the utility model provides a lithography machine is still provided, but it can include the accurate counterpoint exposure mechanism in any above-mentioned example. In this example, due to the fact that the lithography machine employs the above-mentioned exposure mechanism capable of being precisely aligned, the mask mounting plate 3 and the wafer supporting plate 2 are designed in a double floating manner, so that the wafer 9 can be precisely aligned, the wafer 9 is parallel to the mask plate, and the wafer 9 is aligned with the predetermined position.

Here, it should be noted that: in the case of no conflict, a person skilled in the art may combine the related technical features in the above examples according to actual situations to achieve corresponding technical effects, and details of various combining situations are not described herein.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. An exposure mechanism capable of being aligned accurately of a photoetching machine is characterized by comprising an upper template (1), a lower template (10), a wafer supporting plate (2) for bearing a wafer (9), a mask mounting plate (3) for mounting a mask plate (8), an alignment driving mechanism and a leveling driving mechanism;

the mask mounting plate (3) can be arranged on the upper template (1) in a floating manner, so that the corners of the mask mounting plate (3) can be lifted relatively;

the wafer supporting plate (2) is movably arranged on the supporting surface of the lower template (10), so that each corner of the wafer supporting plate (2) can relatively move along the direction parallel to the supporting surface (201);

the leveling driving mechanism is used for applying force to the mask mounting plate (3) along the direction vertical to the supporting surface (201) so that the mask mounting plate (3) is parallel to the wafer (9);

the alignment driving mechanism is used for applying force to the wafer supporting plate (2) along the direction parallel to the supporting surface (201) so as to adjust the position of the wafer supporting plate (2).

2. The precisely alignable exposure mechanism of claim 1,

the mask mounting plate (3) is provided with three adjusting areas M1, M2 and M3 which are distributed at intervals;

the leveling driving mechanism is used for respectively applying force to the three adjusting areas M1, M2 and M3 to enable the mask mounting plate (3) to be parallel to the wafer (9).

3. The precisely alignable exposure mechanism of claim 2,

the leveling driving mechanism comprises an elastic piece (5) and three driving mechanisms (4), wherein the elastic piece (5) is used for providing descending force of each adjusting area on the mask plate relative to the wafer supporting plate (2);

three driving mechanisms (4) are in one-to-one correspondence with the three adjustment regions M1, M2 and M3 to respectively drive the corresponding adjustment regions to ascend.

4. The exposure mechanism of any one of claims 1 to 3, further comprising a limiting structure (6), wherein the limiting structure (6) is used for limiting the floating height of the mask mounting plate (3).

5. The precisely alignable exposure mechanism of claim 4,

the limiting structure (6) comprises a bolt (61) and a nut (62) screwed on the bolt (61);

the mask mounting plate (3) is provided with a through hole (32), a screw rod (73) of the bolt (61) is used for sequentially penetrating through the upper template (1) and the through hole (32) of the mask mounting plate (3), and the upper template (1) and the mask mounting plate (3) are positioned between the head of the bolt (61) and the nut (62); the aperture of the via hole (32) is larger than the outer diameter of the screw (73), and the limiting structure (6) stops the mask mounting plate (3) through the head of the bolt (61) or the nut (62) so as to limit the floating height of the mask mounting plate.

6. The precisely alignable exposure mechanism of any one of claims 1 to 3, 5,

the wafer supporting plate (2) is connected with the lower template (10) through a first plane bearing (21);

the first plane bearing (21) comprises an upper gasket (211), a lower gasket (212) and a plane retainer positioned between the upper gasket (211) and the lower gasket (212), the upper gasket (211) of the first plane bearing (21) is used for keeping relatively fixed with the lower template (10) through a fixed shaft (213), and the lower gasket (212) of the first plane bearing (21) is used for keeping relatively fixed with the wafer supporting plate (2).

7. The precisely alignable exposure mechanism of any one of claims 1 to 3, 5,

the alignment driving mechanism is used for applying force to three positions on the wafer supporting plate (2) along different directions so as to adjust the position of the wafer supporting plate (2); the wafer supporting plate (2) is provided with three stress parts A1, A2 and A3, the stress direction of the wafer supporting plate (2) at the stress part A1 is the X direction, the stress direction of the wafer supporting plate (2) at the stress part A2 is the Y1 direction, the stress direction of the wafer supporting plate (2) at the stress part A3 is the Y2 direction, the stress part A1 is positioned at one side of the wafer supporting plate (2), and the stress parts A2 and A3 are positioned at the other adjacent side of the wafer supporting plate (2) and are arranged at intervals; the Y1 direction and the Y2 direction are parallel and both are perpendicular to the X direction.

8. The precisely alignable exposure mechanism of claim 7,

the alignment driving mechanism comprises an X position adjusting mechanism (18), a Y1 position adjusting mechanism (19) and a Y2 position adjusting mechanism (20);

the X position adjusting mechanism (18) is used for applying force to the wafer supporting plate (2) along the X direction, the Y1 position adjusting mechanism (19) is used for applying force to the wafer supporting plate (2) along the Y1 direction, and the Y2 position adjusting mechanism (20) is used for applying force to the wafer supporting plate (2) along the Y2 direction.

9. The precisely alignable exposure mechanism of any one of claims 1 to 3, 5, 8,

the upper template (1) can lift relative to the lower template (10);

the exposure mechanism also comprises a lifting driving mechanism (17) for driving the upper template (1) to move.

10. A lithography machine, characterized in that, includes the accurate alignment exposure mechanism of any one of claims 1 to 9.

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