CN214957796U

CN214957796U - TOF emitting packaging structure

Info

Publication number: CN214957796U
Application number: CN202121593618.5U
Authority: CN
Inventors: 任金虎
Original assignee: Suzhou Maita Photoelectric Technology Co ltd
Current assignee: Suzhou Maita Photoelectric Technology Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-11-30
Anticipated expiration: 2031-07-14

Abstract

The utility model relates to a packaging structure of TOF transmission, include: the emitting module comprises a substrate, a laser emitter and a current monitor, wherein the laser emitter is used for emitting laser; the diffusion module is used for diffusing the laser; the bracket is arranged on the substrate, and the diffusion module is arranged on the bracket; the metal circuit module is electrically connected with the transmitting module through the bracket; the current monitor is used for monitoring the current change of the metal circuit module so as to judge whether the diffusion module is in good condition. More convenient and faster.

Description

TOF emitting packaging structure

Technical Field

The utility model relates to a packaging structure of TOF transmission belongs to laser technical field.

Background

The TOF technology (time of flight technology) utilizes the difference between the emission time and the return time of an optical signal to obtain depth information, so that the TOF technology has wide market prospect in the fields of automatic driving, face recognition and AR/VR. Among the packaging structure of TOF transmission among the prior art, generally including emission module, diffusion module and support, the diffusion module has the microlens structure, and the microlens structure is direct to be connected with the support, sets up like this and causes the fish tail harm or dirty etc. to the microlens structure easily to lead to optics angle distortion, influence the light transmittance in order to influence optical property.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging structure of TOF transmission, it is when guaranteeing the normal work of transmission module, can also detect out whether there is damage, fish tail and lobe of a leaf scheduling problem in the microlens structure.

In order to achieve the above purpose, the utility model provides a following technical scheme: a TOF emitting package structure comprising:

the emission module comprises a substrate, a laser emitter and a current monitor, wherein the laser emitter is used for emitting laser;

a diffusion module to diffuse the laser;

a support disposed on the substrate, the diffusion module being disposed on the support;

the metal circuit module is electrically connected with the transmitting module through the bracket;

the current monitor is used for monitoring the current change of the metal circuit module so as to judge whether the diffusion module is in good condition.

Further, the metal circuit module comprises a metal circuit, and the metal circuit is arranged around the diffusion module for at least one circle.

Further, the metal circuit module further comprises a metal pad for electrically connecting the metal circuit and the bracket.

Further, an electric connecting piece is arranged between the metal pad and the support.

Further, the diffusion module includes a substrate, and the metal line is disposed on or in the substrate.

Further, the diffusion module further comprises a light-transmitting layer connected with the substrate, and the light-transmitting layer is arranged below the substrate in the height direction of the TOF emitting encapsulation structure.

Further, the diffusion module further comprises a micro-lens structure, and the micro-lens structure is formed on one side of the light-transmitting layer, which is far away from the substrate.

Further, the upper surface and/or the lower surface of the base material are/is also provided with an infrared filter film.

Furthermore, the base material is PVC plastic or glass, the refractive index is 1.5-1.6, and the transmittance at the wavelength of 380-1100 nm is over 90 percent.

Furthermore, the material of the micro-lens structure is epoxy resin or acrylic resin, the refractive index is 1.5-1.6, and the transmittance at the wavelength of 380 nm-1100 nm is more than 90%.

The beneficial effects of the utility model reside in that: through set up the metal wiring module on the substrate, be provided with the current monitor simultaneously on emission module, the metal wiring module is connected so that the current monitor can change through the electric current on the monitoring metal wiring module with the current monitor electricity to judge whether the diffusion module exists intact, convenient and fast more.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

Fig. 1 is a schematic structural view of a TOF emitting package structure of the present invention;

fig. 2 is a top view of the metal wiring module of the present invention;

fig. 3 is a bottom view of the metal circuit module of the present invention;

fig. 4 is a schematic view of a diffusion module according to the present invention;

fig. 5 is a schematic view of a diffusion module according to another aspect of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

Referring to fig. 1, a TOF transmitting package structure 100 according to a preferred embodiment of the present invention includes a transmitting module 1 for emitting laser light, a diffusing module 2 located above the transmitting module 1 for diffusing the laser light emitted from the transmitting module 1, and a bracket 3 for connecting the transmitting module 1 and the diffusing module 2. In this embodiment, two brackets 3 are provided to firmly support the diffusion module 2, but in other embodiments, the number of the brackets 3 may be other, which is not specifically limited herein and is determined according to actual situations. The two brackets 3 are respectively arranged on two sides of the emission module 1, each bracket 3 is provided with a step 31, each step 31 is also provided with an electric connecting piece 4, and the electric connecting pieces 4 can be conductive silver paste and are realized in a dispensing mode; the wire 14 may also be a gold wire, and in other embodiments, the electrical connector 4 may also be other. Note that, the step 31 is provided inside the holder 3, and the overall length of the diffusion module 2 is smaller than that of the emission module 1. Or, in other embodiments, the bracket 3 is not provided with the step 31, and the diffusion module 2 is connected to the bracket 3, where the overall length of the diffusion module 2 is equal to or less than that of the emission module 1, which is not specifically limited herein, depending on the actual situation.

Referring to fig. 1 and 2, the diffusion module 2 includes a substrate 21, a transparent layer 22 connected to the substrate 21, and a micro-lens structure 23 for changing a divergence angle of the laser. In the height direction of the TOF emitting package structure 100, the light-transmitting layer 22 is disposed below the substrate 21, and the microlens structure 23 is formed on a side of the light-transmitting layer 22 away from the substrate 21. In order to ensure the compactness of the diffusion module 2 as a whole, a microlens structure 23 is formed on the surface of the substrate 21 disposed toward the emission module 1. In other embodiments, the microlens structure 23 and the substrate 21 may be integrally formed, and are not particularly limited herein, depending on the actual situation. The microlens structure 23 has a convex surface 231, the angle of the laser beam is changed through the convex surface 231, and the convex surface 231 is disposed toward the emission module 1. Referring to fig. 3 and 4, it should be noted that the width L1 or L2 of the microlens structure 23 is not smaller than the radius R1 or R2 of the microlens structure 23, so as to increase the refractive index of the microlens structure 23. The base material 21 is PVC plastic or glass, the refractive index is 1.5-1.6, and the transmittance at the wavelength of 380-1100 nm is more than 90%. The micro-lens structure 23 is made of epoxy resin or acrylic resin, the refractive index is 1.5-1.6, the transmittance at the wavelength of 380 nm-1100 nm is more than 90%, and the micro-lens structure 23 can be realized on the surface of the base material 21 in a nano-imprinting mode. In this embodiment, the upper surface of the base material 21 and/or the lower surface of the base material 21 are further provided with an infrared filter (not shown), and the infrared filter can ensure that infrared light with a wavelength of more than 840nm passes through the diffusion sheet, so as to obtain an ideal light. In other embodiments, the infrared filter may be disposed only on the upper surface or the lower surface of the substrate 21, which is not particularly limited herein and is determined according to the actual situation.

The emitting module 1 includes a substrate 11, a laser emitter 12 disposed on the substrate 11 for emitting laser light, and a current monitor 13. The surface of the support 3 is provided with a metal circuit which is electrically interconnected with the substrate 11 through a conductive adhesive, or the support 3 and the substrate 11 are QFN metal integrated support 3 and the laser emitter 12 which are electrically interconnected through a bonding pad. Specifically, the current monitor 13 is disposed on one side of the laser emitter 12, the supports 3 are disposed on two sides of the substrate 11, and the laser emitter 12 and the current monitor 13 are disposed between the two supports 3, in this embodiment, the laser emitter 12 is made of GaAs/A1GaAs multiple quantum well material or InP substrate 21 material, and has a plurality of point light sources for emission, and can emit infrared laser with a wavelength of 840nm or 950nm, the laser emitter 12 is provided with a metal pad (not shown), and is electrically connected to the substrate 11 through the metal pad to ensure the power-on operation of the laser emitter 12, and the current monitor 13 is connected to the substrate 11 through a gold wire 14. In other embodiments, the connection between the laser emitter 12 and the substrate 11 may be other types, such as conductive silver paste, gold wires 14, etc., which are not limited herein and are determined according to the actual situation.

In order to ensure the normal operation of the emitting module 1, and at the same time, the current monitor 13 may also monitor the current change on the diffusion module 2 to ensure the normal operation of the diffusion module 2, the TOF emitting package structure 100 further includes a metal line module 5, and the metal line module 5 is electrically connected to the support 3 through the electrical connector 4, so as to be electrically connected to the emitting module 1. In the present embodiment, specifically, referring to fig. 1 and 2, the metal circuit module 5 includes a metal circuit 51 and a metal pad 52. Wherein, the metal pad 52 is used to electrically connect the metal line 51 and the electrical connector 4 on the step 31 of the bracket 3 to realize the electrical connection with the current monitor 13. In the present embodiment, the metal traces 51 are disposed along the surface of the substrate 21 or embedded in the substrate 21 for at least one turn. In this embodiment, the current output power of the laser emitter 12 during normal operation is within 6W, and the resistance value of the metal wire 51 is set so that the operating current and power of the current monitor 13 during connection are not greater than the output power of 6W of the laser emitter 12 during normal operation. When the micro-lens structure 23 is scratched or damaged, the current monitor 13 monitors the current change of the metal line 51 to determine whether the micro-lens structure 23 is intact, for example, when the current monitor 13 monitors that no current passes through the metal line module 5 or the current fluctuation is large, it is determined that the diffusion module 2 is scratched or damaged. In other embodiments, the metal circuit module 5 may be disposed at other positions as long as the above-mentioned effects are achieved, and is not specifically limited herein.

In summary, the following steps: through set up metallic line module 5 on diffusion module 2, be provided with current monitor 13 simultaneously on emission module 1, metallic line module 5 is connected so that current monitor 13 can judge whether diffusion module 2 is intact through monitoring the current change on the metallic line module 5 with current monitor 13 electricity to prevent that conditions such as diffusion module 2 damage, fish tail influence optical angle distortion, influence the light transmissivity.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A TOF emitting package structure, comprising:

a diffusion module to diffuse the laser;

2. The TOF transmitting encapsulation structure of claim 1, wherein the metal wire module comprises a metal wire disposed at least one turn around the diffusion module.

3. The TOF transmitting package structure of claim 2, wherein the metal line module further comprises metal pads to electrically connect the metal lines and a support.

4. The TOF transmitting encapsulation structure of claim 3, wherein an electrical connection is also provided between said metal pad and said support.

5. The TOF emitting encapsulation structure of claim 2, wherein the diffusion module includes a substrate on or within which the metal lines are disposed.

6. The TOF emitting encapsulation structure of claim 5, wherein the diffusing module further comprises a light transparent layer coupled to the substrate, the light transparent layer disposed below the substrate in a height direction of the TOF emitting encapsulation structure.

7. The TOF emitting encapsulation structure of claim 6, wherein the diffusing module further comprises a microlens structure formed on a side of the light transmissive layer away from the substrate.

8. The TOF emitting encapsulation structure of claim 5, wherein the upper and/or lower surface of the substrate is further provided with an infrared filter.

9. The TOF transmitting encapsulation structure of claim 5, wherein the substrate is made of PVC plastic or glass, the refractive index is 1.5-1.6, and the transmittance at the wavelength of 380 nm-1100 nm is above 90%.

10. The TOF transmitting package structure of claim 7, wherein the microlens structure is made of epoxy resin or acrylic resin, the refractive index is 1.5-1.6, and the transmittance at a wavelength of 380 nm-1100 nm is more than 90%.