CN214937901U

CN214937901U - Novel plating bath

Info

Publication number: CN214937901U
Application number: CN202120152810.4U
Authority: CN
Inventors: 江德馨; 刘鹏
Original assignee: Dongguan Zhuoji Mechanical Equipment Technology Co ltd
Current assignee: Dongguan Zhuoji Mechanical Equipment Technology Co ltd
Priority date: 2021-01-20
Filing date: 2021-01-20
Publication date: 2021-11-30
Anticipated expiration: 2031-01-20

Abstract

The utility model relates to a circuit board is electroplated or chemical plating technical field discloses a novel plating bath, including the plating bath body, install the more than one interpolation basket that is used for depositing the copper ball on the lateral wall of plating bath body, be equipped with the titanium net of vertical setting on the outside of interpolation basket, the evenly distributed through-hole on the surface of titanium net. The dissolved copper ions pass through the titanium mesh in a uniform mode and are electroplated on the circuit board, so that the uniform electroplating and the electroplating quality of the product are improved.

Description

Novel plating bath

Technical Field

The utility model relates to a circuit board is electroplated or chemical plating field indicates a novel plating bath especially.

Background

The plating bath on the existing market is used for depositing the plating solution and sets up the interpolation basket that is used for adding the copper ball, along with electroplating operation, constantly adds the copper ball that is consumed. The electroplating bath has the following technical defects that the traditional copper ball baskets are arranged side by side in a circular structure, and uniform electroplating cannot be realized because copper balls reach a circuit board in an uneven diffusion mode of an arc structure in the continuous consumption process.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a novel plating bath, its main objective is when solving the copper ball consumption to the circuit board is reachd to the mode of even diffusion, improves circuit board electroplating uniformity.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides a novel plating bath, includes the plating bath body, install more than one on the lateral wall of plating bath body and be used for depositing the interpolation basket of copper ball, be equipped with the titanium net of vertical setting on the outside of interpolation basket, the on-surface evenly distributed through-hole of titanium net.

Furthermore, the adding basket is a square box, and through holes which are uniformly distributed are formed in each surface of the square box.

The utility model discloses a set up the titanium net outside the interpolation basket of copper ball, set up the through-hole of even setting on the titanium net, when the copper ball consumed, need pass through the through-hole on the titanium net, realize through this mode that the copper ion reaches the circuit board with even mode on, improve circuit board electroplating uniformity.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of a titanium mesh.

Fig. 3 is a schematic view of the structure of the addition basket.

The reference numbers illustrate: 1. a plating bath body; 2. an adding basket; 3. a titanium mesh; 4. and a through hole.

Detailed Description

Please refer to fig. 1-3, which illustrate a novel electroplating bath according to the present invention, the novel electroplating bath includes an electroplating bath body 1, wherein more than one additional basket 2 for storing copper balls is installed on the sidewall of the electroplating bath body 1, a titanium mesh 3 is vertically installed on the outer side of the additional basket 2, and through holes 4 are uniformly distributed on the surface of the titanium mesh 3.

In view of the current electroplating bath on the market can't realize reacing the circuit board with the mode of even diffusion with copper ion, cause the influence to the homogeneity after the circuit board is electroplated, to this, the utility model discloses in provide a novel electroplating bath, it is through setting up the titanium net 3 of vertically placing on the outside that adds basket 2, simultaneously, evenly set up through-hole 4 on the titanium net 3, when placing the copper ion that the copper ball consumption on adding basket 2 produced, need pass through-hole 4 on the titanium net 3 to realize that copper ion diffuses to the circuit board with even mode, improve circuit board electroplating uniformity.

In specific implementation, the adding basket 2 is a square box, and through holes are uniformly distributed on each surface of the square box. The square box can realize that copper ions pass through the through holes in the square box in a uniform mode.

The above embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by the technical solution of the present invention by those skilled in the art are all within the scope of the present invention as defined by the claims.

Claims

1. A novel electroplating bath comprises an electroplating bath body and is characterized in that: more than one adding basket for storing copper balls is installed on the side wall of the electroplating bath body, a titanium net is longitudinally arranged on the outer side of the adding basket, and through holes are uniformly distributed on the surface of the titanium net.

2. The novel plating bath as claimed in claim 1, wherein: the adding basket is a square box, and through holes which are uniformly distributed are formed in each surface of the square box.