CN214924560U - High-power robot heat dissipation joint - Google Patents
High-power robot heat dissipation joint Download PDFInfo
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- CN214924560U CN214924560U CN202121506467.5U CN202121506467U CN214924560U CN 214924560 U CN214924560 U CN 214924560U CN 202121506467 U CN202121506467 U CN 202121506467U CN 214924560 U CN214924560 U CN 214924560U
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Abstract
The application provides a high power type robot heat dissipation joint relates to joint heat dissipation technical field. The high-power robot heat dissipation joint comprises a shell, a power driving plate and a control plate. The shell has first installation face and second installation face, and there is the difference in height in first installation face and second installation face. The power driver board is located in the shell and is installed on the first installation face. The control board is located the casing and installs in the second installation face, and the power drive board is connected with the control board electricity. The high-power robot heat dissipation joint has the advantages that the power element with large heat productivity is arranged on the power driving board, the control circuit with small heat productivity is arranged on the control board, the power driving board and the control board are separately arranged on the first mounting surface and the second mounting surface, heat conduction is carried out on the shell respectively, and the high-power robot heat dissipation joint has a good heat dissipation effect.
Description
Technical Field
The application relates to the technical field of joint heat dissipation, in particular to a high-power robot heat dissipation joint.
Background
The cooperative robot integrated joint has the characteristics of high integration level, compact structure and high power density. The internal transmission part mainly integrates drive equipment such as a servo drive, a motor, a speed reducer and the like, and structurally comprises a joint shell, a blank cap and other various parts. The servo drive is responsible for controlling the motor to move, and the robot action is executed through the speed reducer.
The servo drive power density in the integrated joint is very high, and the space volume is limited, so that the integration of the whole servo control and drive plate is often required to be realized in a compact space. The power of different joints is different, the power is often more than 2KW, and when low-voltage direct current 48V is adopted for power supply, the effective current of an inductor is higher than 40A, the heat loss generated along with the effective current is very high, heating components comprise a stator, a speed reducer, a servo drive board and the like, particularly, a power MOS field effect transistor on the drive board generates a large amount of heat, the reasonable heat dissipation structural design of the power MOS field effect transistor in the compact space is particularly critical, and the power performance of the joints is directly influenced.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the present application is to provide a high power type robot heat dissipation joint, which aims to improve the problem of poor heat dissipation of the robot joint in the related art.
The embodiment of the application provides a high power type robot heat dissipation joint, and this high power type robot heat dissipation joint includes casing, power drive plate and control panel. The shell has first installation face and second installation face, and there is the difference in height in first installation face and second installation face. The power driver board is located in the shell and is installed on the first installation face. The control board is located the casing and installs in the second installation face, and the power drive board is connected with the control board electricity.
In the above technical solution, in the high power type robot heat dissipation joint, the power element with a large heat generation amount is provided on the power driving board, the control circuit with a small heat generation amount is provided on the control board, and the power driving board and the control board are separately provided on the first mounting surface and the second mounting surface, and are respectively thermally conducted to the housing, thereby having a good heat dissipation effect.
As an optional technical solution of the embodiment of the present application, the housing further has a connection surface, and the first mounting surface is connected to the second mounting surface through the connection surface. In the direction perpendicular to the connecting surface, the first mounting surface and the second mounting surface are respectively positioned on two sides of the connecting surface.
In the technical scheme, the first mounting surface and the second mounting surface are respectively positioned at the left side and the right side of the connecting surface, so that the power driving plate and the control plate can be attached to the shell as much as possible, heat is conducted through the shell, and the heat dissipation effect is improved.
As an optional solution of the embodiment of the present application, the first mounting surface is parallel to the second mounting surface.
In the technical scheme, the first mounting surface and the second mounting surface are arranged in parallel, so that the power driving board and the control board can be conveniently mounted.
As an optional technical solution of the embodiment of the present application, the casing includes a casing body and a cover body, and the cover body covers one end of the casing body. The inner surface of the cover body is provided with a first mounting surface and a second mounting surface, and the power driving plate and the control board are positioned in the cover body.
In the technical scheme, the power drive board and the control board are arranged in the cover body, so that the space occupation of the shell body is reduced, and the structure of a motor, a speed reducer and the like is convenient to install in the shell body.
As an optional technical scheme of this application embodiment, the lid includes the plate body and encloses the body that encloses of locating the plate body, encloses the body and is connected with the casing body, and first installation face and second installation face form in the plate body.
Among the above-mentioned technical scheme, install power drive board and control panel on the plate body, stability is better.
As an optional technical solution of the embodiment of the present application, a heat conduction layer is disposed on a side of the power driving board close to the first mounting surface, and the heat conduction layer is configured to contact with the first mounting surface.
In above-mentioned technical scheme, through setting up the heat-conducting layer, the heat transfer promotes the radiating effect.
As an optional technical solution of the embodiment of the present application, the power driving board includes an aluminum substrate and a power element, the power element is mounted on the aluminum substrate, and the aluminum substrate is mounted on the first mounting surface.
In the technical scheme, the aluminum is a good thermal conductor, the power driving board has large heat, and the aluminum substrate is used for heat transfer, so that the heat can be quickly dissipated.
As an optional technical solution of the embodiment of the present application, a heat conduction layer is disposed on a side of the aluminum substrate close to the first mounting surface, and the heat conduction layer is configured to contact with the first mounting surface.
In the technical scheme, the heat conducting layer is arranged on the aluminum substrate, so that heat generated by the power element is conveniently transferred to the shell, and the heat dissipation effect is improved.
As an optional technical solution of the embodiment of the present application, the power driving board includes a first substrate and a power element, the power element is mounted on the first substrate, the first substrate is mounted on the first mounting surface, and an edge profile of the first substrate matches an edge profile of the first mounting surface.
In the technical scheme, the edge profile of the first substrate is matched with the edge profile of the first mounting surface, so that the power driving board is convenient to mount, and the space occupation is reduced.
As an optional solution of the embodiment of the present application, the height of the first mounting surface is higher than the height of the second mounting surface.
In the technical scheme, the height of the first mounting surface is set to be higher than that of the second mounting surface, so that heat dissipation is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is an exploded view of a heat dissipation joint of a high power robot provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a cover provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a power driving board according to an embodiment of the present application.
Icon: 110-a shell body; 120-a cover body; 121-plate body; 1211 — a first mounting surface; 1212 — a second mounting surface; 1213-joint plane; 122-enclosure; 200-power driver board; 210-aluminum substrate; 220-a power element; 300-control panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present application, it is to be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, refer to the orientation or positional relationship as shown in the drawings, or as conventionally placed in use of the product of the application, or as conventionally understood by those skilled in the art, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application.
Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Examples
Referring to fig. 1 in conjunction with fig. 2, the present embodiment provides a high power type robot heat dissipation joint, which includes a housing, a power driving board 200 and a control board 300. The housing has a first mounting surface 1211 and a second mounting surface 1212, and the first mounting surface 1211 and the second mounting surface 1212 have a height difference. Power drive plate 200 is positioned within the housing and mounted to first mounting surface 1211. The control board 300 is located in the housing and mounted on the second mounting surface 1212, and the power driving board 200 is electrically connected with the control board 300. In the high power type robot heat dissipation joint, the power element 220 having a large heat generation amount is provided on the power driving board 200, the control circuit having a small heat generation amount is provided on the control board 300, and the power driving board 200 and the control board 300 are separately provided on the first mounting surface 1211 and the second mounting surface 1212, so that heat conduction is performed to the housing, respectively, and a good heat dissipation effect is obtained.
In some embodiments, the housing further has a connection surface 1213, and the first mounting surface 1211 is connected to the second mounting surface 1212 by the connection surface 1213. In a direction perpendicular to the connection surface 1213, the first and second mounting surfaces 1211 and 1212 are located on both sides of the connection surface 1213, respectively. Referring to fig. 1 and fig. 2, in fig. 1, the first mounting surface 1211 and the second mounting surface 1212 are respectively located on the left and right sides of the connecting surface 1213. In fig. 2, the first mounting surface 1211 and the second mounting surface 1212 are located on the front and rear sides of the connection surface 1213, respectively. Of course, the terms "left and right" and "front and back" are used herein with reference to the specific placement positions shown in fig. 1 and 2, and when the placement positions are changed, which two sides of the connecting surface 1213 the first mounting surface 1211 and the second mounting surface 1212 are located on are changed accordingly.
In some embodiments, first mounting surface 1211 is parallel to second mounting surface 1212, and connection surface 1213 is perpendicular to first mounting surface 1211 and second mounting surface 1212. The first mounting surface 1211 and the second mounting surface 1212 are arranged in parallel, so that the power driving board 200 and the control board 300 can be mounted conveniently. In other embodiments, first mounting surface 1211 is parallel to second mounting surface 1212, and connection surface 1213 is at an acute angle to both first mounting surface 1211 and second mounting surface 1212. In still other embodiments, first mounting surface 1211 is not parallel to second mounting surface 1212, and connection surface 1213 is at an acute angle to both first mounting surface 1211 and second mounting surface 1212.
In some embodiments, the housing includes a housing body 110 and a cover 120, and the cover 120 covers one end of the housing body 110. The inner surface of the cover 120 is formed with a first mounting surface 1211 and a second mounting surface 1212, and the power driving board 200 and the control board 300 are located in the cover 120. The power driving board 200 and the control board 300 are disposed in the cover 120, so that the space occupied by the housing body 110 is reduced, and the structure of a motor, a speed reducer and the like is conveniently installed in the housing body 110. Of course, in other embodiments, the first mounting surface 1211 and the second mounting surface 1212 may be disposed on the inner wall of the housing body 110.
Referring to fig. 1 and fig. 2, in some embodiments, the cover 120 includes a plate 121 and an enclosure 122 enclosing the plate 121, the enclosure 122 is connected to the housing body 110, and the first mounting surface 1211 and the second mounting surface 1212 are formed on the plate 121. The power driving board 200 and the control board 300 are mounted on the board body 121, so that stability is better. Optionally, the height of the first mounting surface 1211 is higher than the height of the second mounting surface 1212. The height of the first mounting surface 1211 is set to be higher than the height of the second mounting surface 1212 to facilitate heat dissipation. In other embodiments, the first mounting surface 1211 and the second mounting surface 1212 may also be disposed on the inner wall of the enclosure 122.
Referring to fig. 3, in some embodiments, the power driving board 200 includes a first substrate and the power element 220, the power element 220 is mounted on the first substrate, and the first substrate is mounted on the first mounting surface 1211. The edge profile of the first substrate matches the edge profile of the first mounting surface 1211. By matching the edge profile of the first substrate with the edge profile of the first mounting surface 1211, mounting of the power driving board 200 is facilitated while space occupation is reduced. Optionally, the first substrate is an aluminum substrate 210. Aluminum is a good heat conductor, the heat of the power driving board 200 is large, and the aluminum substrate 210 is used for heat transfer, so that heat can be quickly dissipated. In addition, in order to further enhance the heat dissipation effect, the aluminum substrate 210 is provided with a heat conduction layer on a side close to the first mounting surface 1211, and the heat conduction layer is used for contacting with the first mounting surface 1211.
The power driving board 200 also has a power line thereon for connecting with a power supply to supply power to the power driving board 200 and the control board 300.
The control Board 300 is a single-layer or multi-layer PCB (Printed Circuit Board), and a control Circuit is disposed on the control Board 300. The control circuit is electrically connected to the power element 220. Specifically, the power driving board 200 and the control board 300 are signal-connected by a board-to-board connector.
The present embodiment provides a high power type robot heat dissipation joint including a housing, a power driving board 200 and a control board 300. The housing has a first mounting surface 1211 and a second mounting surface 1212, and the first mounting surface 1211 and the second mounting surface 1212 have a height difference. Power drive plate 200 is positioned within the housing and mounted to first mounting surface 1211. The control board 300 is located in the housing and mounted on the second mounting surface 1212, and the power driving board 200 is electrically connected with the control board 300. The housing further has a connection surface 1213, the first mounting surface 1211 and the second mounting surface 1212 are connected by the connection surface 1213, and the first mounting surface 1211 and the second mounting surface 1212 are respectively located on both sides of the connection surface 1213 in a direction perpendicular to the connection surface 1213. The housing includes a housing body 110 and a cover 120, the cover 120 covers one end of the housing body 110, a first mounting surface 1211 and a second mounting surface 1212 are formed on an inner surface of the cover 120, and the power driving board 200 and the control board 300 are located in the cover 120. Power drive board 200 includes aluminum substrate 210 and power element 220, power element 220 is mounted on aluminum substrate 210, and aluminum substrate 210 is mounted on first mounting surface 1211. The aluminum substrate 210 has a heat conductive layer on a side close to the first mounting surface 1211, and the heat conductive layer is in contact with the first mounting surface 1211. In the high power type robot heat dissipation joint, the power element 220 having a large heat generation amount is provided on the power driving board 200, the control circuit having a small heat generation amount is provided on the control board 300, and the power driving board 200 and the control board 300 are separately provided on the first mounting surface 1211 and the second mounting surface 1212, so that heat conduction is performed to the housing, respectively, and a good heat dissipation effect is obtained.
It should be noted that the high-power robot heat dissipation joint may be a joint with an effective inductive current exceeding 40A during operation. And, the higher the power, the better the rendering effect.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A high power type robot heat dissipation joint, characterized in that, high power type robot heat dissipation joint includes:
a housing having a first mounting surface and a second mounting surface, the first mounting surface and the second mounting surface having a height difference;
a power drive plate positioned within the housing and mounted to the first mounting surface; and
and the control board is positioned in the shell and is arranged on the second mounting surface, and the power driving board is electrically connected with the control board.
2. The high power type robot heat dissipation joint of claim 1, wherein the housing further has a connection surface through which the first mounting surface and the second mounting surface are connected, and the first mounting surface and the second mounting surface are respectively located on both sides of the connection surface in a direction perpendicular to the connection surface.
3. The high power type robotic heat dissipating joint of claim 2, wherein the first mounting surface is parallel to the second mounting surface.
4. The high power type robot heat dissipation joint of claim 1, wherein the housing comprises a housing body and a cover body, the cover body covers one end of the housing body, the inner surface of the cover body is formed with the first mounting surface and the second mounting surface, and the power driving board and the control board are located in the cover body.
5. The high power type robot heat dissipation joint of claim 4, wherein the cover comprises a plate body and an enclosure body enclosing the plate body, the enclosure body is connected to the housing body, and the first mounting surface and the second mounting surface are formed on the plate body.
6. The high power type robotic heat dissipating joint of claim 1, wherein a side of the power driving board near the first mounting surface is provided with a heat conducting layer for contacting the first mounting surface.
7. The high power type robot heat dissipation joint of claim 1, wherein the power driving board comprises an aluminum substrate and a power element, the power element is mounted on the aluminum substrate, and the aluminum substrate is mounted on the first mounting surface.
8. The high power type robot heat dissipation joint of claim 7, wherein a side of the aluminum substrate close to the first mounting surface is provided with a heat conduction layer, and the heat conduction layer is used for contacting with the first mounting surface.
9. The high power robotic heat dissipating joint of claim 1, wherein the power driving board comprises a first substrate and a power element, the power element is mounted to the first substrate, the first substrate is mounted to the first mounting surface, and an edge profile of the first substrate matches an edge profile of the first mounting surface.
10. The high power type robotic heat dissipating joint of claim 1, wherein the first mounting surface is higher than the second mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121506467.5U CN214924560U (en) | 2021-07-02 | 2021-07-02 | High-power robot heat dissipation joint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121506467.5U CN214924560U (en) | 2021-07-02 | 2021-07-02 | High-power robot heat dissipation joint |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214924560U true CN214924560U (en) | 2021-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121506467.5U Active CN214924560U (en) | 2021-07-02 | 2021-07-02 | High-power robot heat dissipation joint |
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|---|---|
| CN (1) | CN214924560U (en) |
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2021
- 2021-07-02 CN CN202121506467.5U patent/CN214924560U/en active Active
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Address after: Building 6, 646 Jianchuan Road, Minhang District, Shanghai 201100 Patentee after: Jieka Robot Co.,Ltd. Address before: Building 6, 646 Jianchuan Road, Minhang District, Shanghai 201100 Patentee before: SHANGHAI JAKA ROBOTICS Ltd. |