CN214898491U - Display module and display screen - Google Patents

Abstract

The application provides a display module assembly and display screen, display module assembly includes the circuit board, light emitting component, and solder, the circuit board includes the substrate, first pad, and second pad, first pad and second pad interval set up, and set up on the substrate, light emitting component includes first pin, and the second pin, first pin passes through solder connection in first pad, the second pin passes through solder connection in the second pad, the minimum distance of first pad and second pad is the pad internal distance, the minimum distance of first pin and second pin is the pin internal distance, the pad internal distance is less than the pin internal distance. The application provides a display module assembly can eliminate better and show the color cast phenomenon.

Description

Display module and display screen

Technical Field

The application relates to the technical field of display, in particular to a display module and a display screen.

Background

With the rapid development of display technology, LED display screens have been rapidly developed into mainstream products for flat panel display with the characteristics of high reliability, long service life, strong environmental adaptability, etc., and are widely used in the field of information display. The LED display screen is an electronic display screen composed of Light Emitting Diode (LED) lattices, and changes the screen display content form, such as the timely conversion of characters, animations, pictures, and videos, by turning on and off the lamp beads, and performs component display control by a modular structure. The LED display screen mainly comprises a display module, a control system and a power supply system. The display module is composed of an LED lamp dot array and is responsible for screen luminous display; the control system is responsible for regulating and controlling the on-off condition of lamp beads in the specified area so as to realize conversion of the content displayed on the screen; the power supply system is responsible for converting input voltage and current, so that the requirements of a display screen can be met.

A Printed Circuit Board (PCB) is one of the important components of an LED display screen, and is used for mounting electronic components, so that the electronic components are electrically connected to the PCB. In the prior art, the LED lamp is welded on the PCB through a surface mounting process, specifically, the LED lamp is provided with a plurality of pins, a plurality of welding pads corresponding to the number of the pins of the LED lamp are arranged on the PCB, the inner distance between the welding pads of the adjacent welding pads is equal to the inner distance between the pins of the adjacent welding pads, and the LED lamp is welded on the corresponding welding pads through tin cream, so that the electric connection between the LED lamp and the PCB is realized.

However, the LED display screen in the prior art is prone to display color cast phenomena, such as yin and yang colors. The phenomenon of color cast is that when the LED display screen is viewed from different angles, especially when the LED display screen is viewed from a large side angle, the LED display screen exhibits regular brightness difference, and obviously, the existence of color cast seriously affects the visual angle and the experience of the LED display screen. A series of researches and verifications are carried out for the purpose, and the researches find that the main reason for the generation of the display color cast is that the welded LED lamp is not flat, namely, the light-emitting surface of the LED lamp is inclined relative to the surface of the PCB, so that the display color cast phenomenon is caused. In the prior art, the inner distance of the bonding pad is equal to the inner distance of the pin, when the solder paste is printed with offset or a paster has offset, the inner side of the pin on one side of the LED lamp is limited due to more contact solder paste and the inner side position of the bonding pad, the solder paste climbs to the inner side of the pin, so that the pin is jacked up to incline the LED lamp, the light emitting surface of the LED lamp is inclined correspondingly, and color cast display is also generated accordingly. In order to meet the consistency problem of the display angle, some mechanism researches and corresponding improvement verifications need to be carried out, so that the problem to be solved urgently for the LED display screen is solved.

SUMMERY OF THE UTILITY MODEL

The application provides a display module assembly and display screen, and this display module assembly can eliminate better and show the color cast phenomenon.

The application provides a display module assembly, display module assembly includes the circuit board, light emitting component, and solder, the circuit board includes the substrate, first pad, and the second pad, first pad and second pad interval set up, and set up on the substrate, light emitting component includes first pin, and the second pin, first pin passes through the solder to be connected in first pad, the second pin passes through the solder to be connected in the second pad, the minimum distance of first pad and second pad is the pad internal distance, the minimum distance of first pin and second pin is the pin internal distance, the pad internal distance is less than the pin internal distance.

The display module provided by the application has the advantages that the inner distance of the bonding pad is smaller than the inner distance of the pin, in other words, the distance between the opposite sides of the first bonding pad and the second bonding pad is smaller than the distance between the opposite sides of the first pin and the second pin, and compared with the condition that the inner distance of the bonding pad is equal to the inner distance of the pin, the inner distance of the bonding pad is smaller than the inner distance of the pin, so that the opposite ends of the first bonding pad and the second bonding pad can be provided with more positions for accommodating solder, and the solder can extend to the opposite ends of the first bonding pad and the second bonding pad more, so that the climbing phenomenon that the solder climbs towards the inner sides of the first pin or the second pin can be avoided or weakened, the light-emitting element is not inclined or the inclination degree is reduced, and the color cast phenomenon is eliminated or weakened. Meanwhile, the light-emitting element is not inclined or the inclination degree is reduced, so that the welding thrust can be improved, and the connection between the light-emitting element and the first bonding pad and the connection between the light-emitting element and the second bonding pad are more stable.

Wherein, the inner distance of the bonding pad is 50-80% of the inner distance of the pin.

The maximum distance between the first bonding pad and the second bonding pad is the outer distance of the bonding pads, the direction of the first bonding pad towards the second bonding pad is the preset direction, and the outer distance of the bonding pads is 85% -110% of the external dimension of the light-emitting element in the preset direction.

Wherein the first pad and the second pad are rectangular in shape.

The size of the welding surface of the first welding pad and the second welding pad is 0.7 x 0.6mm, and the inner distance of the welding pads is 0.6 mm.

The first pin and the second pin are rectangular, the size of a welding surface of the first pin and the second pin is 0.5 x 0.5mm, and the inner distance of the pins is 1.1 mm.

And in the direction of the first bonding pad towards the second bonding pad, the size of the first bonding pad is larger than that of the first pin, and the size of the second bonding pad is larger than that of the second pin.

In the direction of the first bonding pad towards the second bonding pad, the size of the first bonding pad is smaller than or equal to that of the first pin, and the size of the second bonding pad is smaller than or equal to that of the second pin.

The application still provides a display screen, and the display screen includes box, display module assembly, and the box is connected in display module assembly.

Wherein, the orthographic projection of the display module on the box body at least partially falls into the range of the box body.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a prior art offset solder paste printing process;

FIG. 2 is a schematic view of the structure of FIG. 1 with the LED lamp tilted after solder paste is cured;

fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a display module with offset in solder printing under the condition that the inner pitch of a pad is smaller than that of a pin;

FIG. 5 is a schematic view of the display module shown in FIG. 4 after the solder is solidified;

fig. 6 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

FIG. 7 is a diagram of relevant parameters of a bonding pad provided in an embodiment of the present application;

fig. 8 is a related parameter diagram of a light emitting device according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

fig. 13 is a schematic structural diagram of a display module according to yet another embodiment of the present disclosure;

FIG. 14 is a schematic view (side view) of a display screen provided in accordance with an embodiment of the present application;

fig. 15 is a schematic view (front view) of a display screen provided in another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments, in case at least two embodiments are combined together without contradiction.

Referring to fig. 1 to 2, fig. 1 is a schematic view illustrating a solder paste printing offset in the prior art; FIG. 2 is a schematic diagram of the structure shown in FIG. 1 with the LED lamp tilted after solder paste is cured. In the prior art, the display color cast phenomenon is easy to occur on the LED display screen, and researches show that the main reason for the display color cast is that the welded LED lamp 120 is not flat, that is, the light emitting surface 1211 of the LED lamp 120 is inclined relative to the surface of the PCB 110, so that the display color cast phenomenon is caused. In the prior art, the pad inner distance H1 between adjacent pads 112 and 113 is equal to the pin inner distance H3 between adjacent pins 124 and 125, and when the solder paste 130 is printed or the solder paste is pasted with an offset, the inner side of the pin on one side of the LED lamp 120 contacts more solder paste 130 and the inner side of the pad has a limited position, and the solder paste 130 climbs to the inner side of the pin, so that the pin is jacked up, the LED lamp 120 is inclined, the light emitting surface 1211 of the LED lamp 120 is correspondingly inclined, and display color cast is also caused. In order to meet the consistency problem of the display angle, some mechanism researches and corresponding improvement verifications need to be carried out, so that the problem to be solved urgently for the LED display screen is solved.

In an embodiment, please refer to fig. 3, and fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure. The present application provides a display module 100, the display module 100 includes a circuit board 110, a light emitting device 120, and a solder 130. The circuit board 110 includes a substrate 111, a first pad 112, and a second pad 113. The first pad 112 and the second pad 113 are disposed at an interval and are disposed on the substrate 111. The light emitting device 120 includes a first lead 124 and a second lead 125. The first lead 124 is connected to the first pad 112 by solder 130. The second lead 125 is connected to the second pad 113 by solder 130. The minimum distance between the first pad 112 and the second pad 113 is the pad inner distance H1. The minimum distance between the first lead 124 and the second lead 125 is the lead-in distance H3. The pad inner distance H1 is smaller than the pin inner distance H3.

It should be noted that the Circuit Board 110 is a Printed Circuit Board 110 (PCB), a Circuit is disposed on the Circuit Board 110, the Circuit is used for connecting electronic components, and the Circuit Board 110 is a carrier for electrically connecting the electronic components, in this application, the electronic components at least include the light emitting element 120. The light emitting elements 120 may be, but are not limited to, LEDs. The solder 130 is used to solder the light emitting element 120 on the circuit board 110, so that the light emitting element 120 can be stably disposed on the circuit board 110, and the solder 130 may be, but is not limited to, a solder paste.

It should be noted that, in the embodiment of the present application, the number of the light emitting elements 120 on the circuit board 110 is not limited, and the number may be 10, 120, 3000, 1 ten thousand, 50 ten thousand, and the like, and may be determined according to the requirement.

The circuit board 110 includes a substrate 111, a first pad 112, and a second pad 113. The substrate 111 serves as a support to support the first pad 112 and the second pad 113. The first pad 112 and the second pad 113 are disposed at intervals. The substrate 111 is a non-conductive material. The material of the first pad 112 and the second pad 113 may be, but is not limited to, copper.

The light emitting device 120 includes a device body 121, a first connection portion 122, a second connection portion 123, a first lead 124, and a second lead 125. The element body 121 serves to emit light. Opposite ends of the first connection portion 122 are connected to the device body 121 and the first lead 124, respectively. Opposite ends of the second connection portion 123 are connected to the element body 121 and the second pin 125, respectively. The first pins 124 and the second pins 125 are spaced apart.

The first lead 124 is disposed on one side of the first pad 112 and soldered to the first pad 112 by solder 130, and the second lead 125 is disposed on one side of the second pad 113 and soldered to the second pad 113 by solder 130, so that the device body 121 is electrically connected to the circuit board 110.

Here, the pad pitch H1 is a minimum distance between the first pad 112 and the second pad 113, or a distance between the first pad 112 and the second pad 113 on the side facing each other. The pin-inside distance H3 is the minimum distance between the first pin 124 and the second pin 125, or the distance between the facing sides of the first pin 124 and the second pin 125.

In the embodiment of the present application, the pad inner distance H1 is smaller than the pin inner distance H3, in other words, the distance between the facing sides of the first pad 112 and the second pad 113 is smaller than the distance between the facing sides of the first pin 124 and the second pin 125, and compared to the case that the pad inner distance H1 is equal to the pin inner distance H3, the pad inner distance H1 is smaller than the pin inner distance H3, so that the facing end of the first pad 112 and the second pad 113 provides more positions for accommodating the solder 130, and the solder 130 in the offset portion can extend to the facing end of the first pad 112 and the second pad 113, so that the climbing phenomenon that the solder 130 climbs towards the inner side of the first pin 124 or the second pin 125 can be avoided or weakened, and the light emitting element 120 is not inclined or is inclined to a reduced degree, thereby eliminating or weakening the color cast phenomenon. Meanwhile, the light emitting element 120 is not inclined or the inclination degree is reduced, so that the welding thrust can be improved, and the connection of the light emitting element 120 with the first and second pads 112 and 113 is more stable.

Referring to fig. 4 to 5, fig. 4 is a schematic view of a display module when offset exists in solder printing under the condition that the inner pitch of a pad is smaller than that of a pin. Fig. 5 is a schematic view of the display module shown in fig. 4 after the solder is solidified. In fig. 4, the pad inner distance H1 is smaller than the lead inner distance H3, and the solder 130 is printed with an offset, and in fig. 5, the light emitting element 120 is not tilted after the solder 130 is cured.

Optionally, the pad inner distance H1 is 50% -80% of the pin inner distance H3.

Please continue to refer to fig. 5. The maximum distance between the first pad 112 and the second pad 113 is defined as the outer pad distance H2, or the distance between the opposite sides of the first pad 112 and the second pad 113 is defined as the outer pad distance H2. The direction of the first pad 112 toward the second pad 113 is defined as a predetermined direction, or the direction of the first lead 124 toward the second lead 125 is defined as a predetermined direction. The pad outer distance H2 may be smaller than, equal to, or larger than the outer dimension H4 of the light emitting element 120 in the predetermined direction.

It should be noted that, in some cases, the pad outer distance H2 is not suitable to be too large, because during the soldering process, the solder 130 is first in a liquid state, and the solder 130 is cooled and solidified to be in a solid state, so as to solder the first pin 124 and the second pin 125 onto the first pad 112 and the second pad 113. If the pad outer distance H2 is too large, the wettable area of the liquid solder 130 on the first pad 112 and the second pad 113 is also large, and the liquid solder 130 facilitates the sliding of the first lead 124 and the second lead 125 relative to the first pad 112 and the second pad 113, however, the characteristic of easy sliding is disadvantageous for fixing the light emitting element 120 at a predetermined position, and if the number of light emitting elements 120 on the circuit board 110 is large, the position of the light emitting element 120 is disordered, which may affect the use effect.

Optionally, the pad outer distance H2 is 85% to 110% of the external dimension H4 of the light emitting element 120 in the predetermined direction. Setting the lower limit of the pad outer distance H2 to 85% and the upper limit to 110% ensures that the first pad 112 and the second pad 113 have a space sufficient to accommodate the solder 130 and that the soldered light emitting element 120 does not deviate too far from the middle position of the first pad 112 and the second pad 113.

In one embodiment, the size of the first pad 112 is larger than that of the first lead 124, and the size of the second pad 113 is larger than that of the second lead 125 in the direction in which the first pad 112 faces the second pad 113, as shown in fig. 5. It is understood that, by doing so, it is easier to dispose the first lead 124 and the solder 130 within the range of the first pad 112 and the second lead 125 and the solder 130 within the range of the second pad 113, so that a climbing phenomenon in which the solder 130 climbs toward the inner side of the first lead 124 or the second lead 125 can be avoided or weakened, so that the light emitting element 120 is not inclined or the degree of inclination is reduced, thereby eliminating or weakening the color cast phenomenon.

In another embodiment, in a direction in which the first pad 112 faces the second pad 113, a size of the first pad 112 is smaller than or equal to a size of the first lead 124, and a size of the second pad 113 is smaller than or equal to a size of the second lead 125, as shown in fig. 6, where fig. 6 is a schematic structural diagram of a display module provided in another embodiment of the present application. It will be appreciated that this arrangement is advantageous to ensure that the light emitting element 120 does not deviate too far from the middle position of the first and second pads 112, 113.

Note that the first pad 112 and the second pad 113 may have a rectangular shape, a circular shape, an oval shape, or the like. The number of the pads on the circuit board 110 may be 60, 100, 520, 6000, 2, 90, etc., and the present application is only exemplified by two first pads 112 and two second pads 113. The dimensions of the first pin 124 and the second pin 125 may also be rectangular, circular, oval, etc. The number of pins on each light emitting element 120 may be 2, 3, 4, 5, 7, 9, 12, 20, etc., and this application is only exemplified by two first pins 124 and two second pins 125.

Optionally, referring to fig. 7, fig. 7 is a related parameter diagram of a pad according to an embodiment of the present disclosure. The first land 112 and the second land 113 were rectangular in shape, and the land size of the first land 112 and the second land 113 was 0.7 × 0.6mm, the land inner distance H1 was 0.6mm, and the land outer distance H2 was 2 mm. Here, the bonding surface refers to a surface on the first and second pads 112 and 113 on which the solder 130 is disposed to connect to the first and second leads 124 and 125 of the light emitting element 120.

Optionally, please refer to fig. 8, and fig. 8 is a related parameter diagram of a light emitting device according to an embodiment of the present disclosure. The first lead 124 and the second lead 125 are rectangular, the size of the bonding surface of the first lead 124 and the second lead 125 is 0.5 × 0.5mm, the lead inner distance H3 is 1.1mm, and the external dimension H4 of the light emitting element 120 is 2.1 mm. Here, the bonding surface refers to a surface of the first and second leads 124 and 125 for connecting the solder 130 to connect to the first and second pads 112 and 113.

Referring to fig. 9 to 12, fig. 9 is a schematic structural diagram of a display module according to another embodiment of the present disclosure. Fig. 10 is a schematic structural diagram of a display module according to still another embodiment of the present disclosure. Fig. 11 is a schematic structural diagram of a display module according to still another embodiment of the present application. Fig. 12 is a schematic structural diagram of a display module according to still another embodiment of the present disclosure. In one embodiment, the substrate 111 has a first groove 111a and a second groove 111b spaced apart from each other. The first pad 112 is disposed in the first groove 111 a. The second pad 113 is disposed in the second groove 111 b. In other words, the first pad 112 and the second pad 113 are embedded in the substrate 111, and it can be understood that such an arrangement is beneficial to make the connection between the first pad 112 and the substrate 111 and the connection between the second pad 113 and the substrate 111 more stable, so as to ensure that the first pad 112 and the second pad 113 do not fall off the substrate 111.

Please refer to fig. 9. Optionally, the first pad 112 is disposed in the first groove 111 a. The second pad 113 is disposed in the second groove 111 b. The first pad 112 and the second pad 113 protrude from the surface of the base 111 in a direction in which the first pad 112 or the second pad 113 faces the light emitting element 120. It is understood that such an arrangement is advantageous to more accurately align the solder 130 to the protruding first and second pads 112 and 113 during the process of printing or attaching the light emitting element 120.

Please refer to fig. 10. Optionally, the first pad 112 and the second pad 113 are flush with the surface of the substrate 111. It is understood that the arrangement is such that the surface of the circuit board 110 is flat, so that the first and second pads 112 and 113 are not easily damaged during the process of printing the solder 130 or attaching the light emitting element 120.

Please refer to fig. 11. Optionally, the thickness of the first pad 112 is smaller than the depth of the first groove 111a, and the solder 130 is at least partially accommodated in the first groove 111 a; the thickness of the second pad 113 is smaller than the depth of the second groove 111b, and the solder 130 is at least partially accommodated in the second groove 111 b. It is understood that such an arrangement is advantageous to allow the liquid solder 130 to flow into and gather in the first and second grooves 111a and 111b more in the case of the offset of the printed solder 130, and to reduce the offset to prevent most of the solder 130 from gathering inside the first and second leads 124 and 125, thereby preventing one side of the light emitting element 120 from being raised and inclined.

Please refer to fig. 12. Further optionally, the wall surfaces forming the first groove 111a include a first guiding inclined surface 1111, and the aperture of the corresponding first groove 111a at the first guiding inclined surface 1111 gradually decreases from top to bottom, that is, the aperture of the corresponding first groove 111a at the first guiding inclined surface 1111 gradually decreases from the light emitting element 120 to the substrate 111; accordingly, the wall surface forming the second groove 111b includes a second guiding inclined surface 1112, and the aperture of the corresponding second groove 111b at the second guiding inclined surface 1112 decreases gradually from top to bottom, that is, the aperture of the corresponding second groove 111b at the second guiding inclined surface 1112 decreases gradually from the light emitting element 120 to the direction of the substrate 111. It is understood that, in the case of the printed solder 130 having a deviation, the first guiding slope 1111 may introduce the deviated liquid solder 130 onto the first pad 112 located in the first recess 111a, so that the deviation phenomenon of the solder 130 may be automatically corrected to prevent most of the solder 130 from being gathered at the inner sides of the first and second leads 124 and 125, thereby preventing one side of the light emitting element 120 from being lifted up to be inclined. The function of the second guiding inclined plane 1112 is the same, and will not be described in detail herein.

In another embodiment, the first pad 112 and the second pad 113 may also be directly disposed on the surface of the substrate 111, that is, the first groove 111a and the second groove 111b do not exist, as shown in fig. 13, where fig. 13 is a schematic structural diagram of a display module provided in another embodiment of the present application. It is understood that, by such an arrangement, the molding time of the circuit board 110 can be reduced, and the protruding first pads 112 and the protruding second pads 113 are also beneficial to the alignment during the process of printing the solder 130 or attaching the light emitting element 120.

Referring to fig. 14 to 15, fig. 14 is a schematic view (side view) of a display screen according to an embodiment of the present application, and fig. 15 is a schematic view (front view) of a display screen according to another embodiment of the present application. The present application further provides a display screen 10, the display screen 10 includes a box 20 and a display module 100 as described in any of the above embodiments, the box 20 is connected to the display module 100, and the box 20 is used for protecting the display module 100. The display module 100 includes a light emitting element 120, the light emitting element 120 may be but is not limited to an LED, and correspondingly, the display screen 10 may be but is not limited to an LED display screen. The display module 100 refers to the drawings and the description of any of the above embodiments.

Further, the orthographic projection of the display module 100 on the box 20 at least partially falls within the range of the box 20. The display module 100 has a display surface AA for displaying text, images, and video contents.

Referring to fig. 14, in an embodiment, the orthographic projection of the casing 20 on the display surface AA all falls within the range of the display surface AA, that is, the frame of the casing 20 does not exceed the edge of the display surface AA, and it can be understood that the casing 20 is configured so as not to block the display surface AA, thereby having a better viewing experience.

Referring to fig. 15, in another embodiment, the orthographic projection of the display surface AA on the box body 20 all falls within the range of the box body 20, and the border of the box body 20 wraps the edge of the display module 100, and it can be understood that the border of the box body 20 can protect the edge of the display module 100, so as to reduce the probability that the display module 100 is damaged.

Of course, the connection between the display module 100 and the box 20 may be other types, which are not described herein.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims (10)

1. The utility model provides a display module assembly, its characterized in that, display module assembly includes circuit board, light emitting component and solder, the circuit board includes substrate, first pad, and second pad, first pad with second pad interval sets up, and set up in on the substrate, light emitting component includes first pin, and second pin, first pin passes through the solder connect in first pad, the second pin passes through the solder connect in the second pad, first pad with the minimum distance of second pad is the pad internal distance, first pin with the minimum distance of second pin is the pin internal distance, the pad internal distance is less than the pin internal distance.

2. The display module of claim 1, wherein a size of the first pad is larger than a size of the first pin and a size of the second pad is larger than a size of the second pin in a direction in which the first pad faces the second pad.

3. The display module of claim 1, wherein a size of the first pad is smaller than or equal to a size of the first pin and a size of the second pad is smaller than or equal to a size of the second pin in a direction in which the first pad faces the second pad.

4. The display module of claim 1, wherein the pad pitch is 50% -80% of the pin pitch.

5. The display module as claimed in claim 1, wherein the maximum distance between the first pad and the second pad is a pad outer distance, the direction of the first pad toward the second pad is a predetermined direction, and the pad outer distance is 85% to 110% of the external dimension of the light emitting element in the predetermined direction.

6. The display module of claim 1, wherein the first pad and the second pad are rectangular in shape.

7. The display module of claim 6, wherein the first pad and the second pad have a bonding surface dimension of 0.7 x 0.6mm, and the pad inner pitch is 0.6 mm.

8. The display module according to claim 7, wherein the first leads and the second leads are rectangular in shape, the bonding surface size of the first leads and the second leads is 0.5 x 0.5mm, and the lead inner pitch is 1.1 mm.

9. A display screen, characterized in that, the display screen includes a box body and the display module assembly of any one of claims 1-8, the box body is connected to the display module assembly.

10. The display screen of claim 9, wherein the orthographic projection of the display module on the box body at least partially falls within the range of the box body.

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