CN213818364U

CN213818364U - Circuit board, display module assembly and display screen

Info

Publication number: CN213818364U
Application number: CN202022638417.4U
Authority: CN
Inventors: 张旗; 陈晓强; 徐勋明; 夏建平
Original assignee: Huizhou Absen Optoelectronic Co Ltd
Current assignee: Huizhou Absen Optoelectronic Co Ltd
Priority date: 2020-11-13
Filing date: 2020-11-13
Publication date: 2021-07-27
Anticipated expiration: 2030-11-13

Abstract

The application provides a circuit board, display module assembly and display screen. The circuit board comprises a bonding pad and a base material, wherein the bonding pad is arranged on the base material, the base material is provided with a first through hole, the first through hole is used for accommodating the bonding pad, the bonding pad is provided with a second through hole and a diversion trench which are communicated, the diversion trench is formed by being formed along the side wall of the second through hole, the second through hole and the diversion trench are both used for accommodating welding flux, and the second through hole is also used for accommodating a pin of an electronic element. The circuit board provided by the application can ensure the positioning precision of the electronic element while improving the transmittance of the solder.

Description

Circuit board, display module assembly and display screen

Technical Field

The application relates to the technical field of display, concretely relates to circuit board, display module assembly and display screen.

Background

With the rapid development of display technology, Light Emitting Diode (LED) display screens have been rapidly grown as mainstream products of flat panel displays with the characteristics of high reliability, long service life, strong environmental adaptability, etc., and are widely used in the field of information display. The LED display screen is an electronic display screen composed of LED dot matrixes, the display content forms of the screen, such as timely conversion of characters, animations, pictures and videos, are changed through the on-off of lamp beads, and the display control of components is carried out through a modular structure. The LED display screen mainly comprises a display module, a control system and a power supply system. The display module is composed of an LED lamp dot array and is responsible for screen luminous display; the control system is responsible for regulating and controlling the on-off condition of lamp beads in the specified area so as to realize conversion of the content displayed on the screen; the power supply system is responsible for converting input voltage and current, so that the requirements of a display screen can be met.

A Printed Circuit Board (PCB) is one of the important components of an LED display screen, and is used for mounting electronic components, so that the electronic components are electrically connected to the PCB. The PCB is subjected to Surface Mounted Technology (SMT) to form a PCBA (Printed Circuit Board + Assembly). In the PCBA, a part of electronic components are soldered on a PCB board by a plug-in process, and specifically, a pad is provided on the PCB board, the pad has a through hole, a pin of the electronic component is inserted into the through hole, and the pin of the electronic component is soldered on the pad by using solder paste, thereby realizing electrical connection between the electronic component and the PCB board. For the welding of a pin and a bonding pad of an electronic element, the tin penetration rate is an important index for measuring the welding quality of the electronic element, and the measurement of the welding quality by the tin penetration rate is important for the service life and the reliability of the electronic element. The size of the tin penetration rate is influenced by various factors, such as equipment, tin bar components, soldering flux, wave height, clamping tools, diameter of through holes and the like, wherein the diameter of the through holes of the bonding pads is a main influence factor. In the prior art, the diameter of the through hole of the bonding pad is increased to improve the tin penetration rate, and it can be understood that the diameter of the through hole is increased, so that more tin paste can be contained in the through hole, and the tin penetration rate is improved.

However, in the above-mentioned prior art, the diameter of the through hole on the pad is increased to increase the tin penetration, and the increase of the diameter of the through hole is not favorable for fixing the pin of the electronic component in the through hole. Because, the increase of the diameter of the through hole means that the gap between the pin of the electronic component and the side wall of the through hole becomes larger, and the positioning capability of the pin relative to the bonding pad becomes worse along with the increase of the gap in the process of inserting and welding the pin of the electronic component into the through hole, that is, the swinging space of the electronic component relative to the PCB board is larger, and after welding is completed, the electronic component is easily displaced relative to the PCB board, and other problems are easily caused.

SUMMERY OF THE UTILITY MODEL

The application provides a circuit board, display module assembly and display screen, the circuit board that this application provided can guarantee electronic component's positioning accuracy when promoting the solder transmissivity.

The application provides a circuit board, circuit board includes pad and substrate, and the pad sets up on the substrate, and the substrate has first through-hole, and first through-hole is used for acceping the pad, and the pad has second through-hole and guiding gutter that are linked together, and the guiding gutter is seted up along the lateral wall of second through-hole and is formed, and second through-hole and guiding gutter all are used for holding the solder, and the second through-hole still is used for holding electronic component's pin.

According to the circuit board, the flow guide groove communicated with the second through hole is formed in the side wall of the second through hole, on one hand, liquid solder in the welding process can enter the second through hole and the flow guide groove at the same time, so that the solder penetrating through the through hole can be increased, and the transmittance of the solder is improved; on the other hand, the aperture of the second through hole cannot be enlarged by the formed diversion trench, so that the positioning accuracy of the pin relative to the circuit board can be ensured in the process of welding the electronic element on the circuit board, the welding is facilitated, and the electronic element is not easy to deviate and the like.

The pad is provided with a first surface and a second surface which are arranged in an opposite mode, the second through hole penetrates through the first surface and the second surface, and the diversion trench penetrates through the first surface and the second surface.

The pad is provided with a first surface and a second surface which are arranged in an opposite mode, the second through hole penetrates through the first surface and the second surface, and the diversion trench only penetrates through any one of the first surface and the second surface.

The distance from the flow guide groove to the central axis of the second through hole is less than or equal to 20% of the diameter of the bonding pad.

The extending direction of the flow guide groove is parallel to the central axis direction of the second through hole.

The extending direction of the flow guide groove is inclined to the direction of the central axis of the second through hole.

Wherein, the quantity of guiding gutter is one or more.

When the number of the flow guide grooves is multiple, the flow guide grooves are uniformly distributed at intervals along the circumference of the second through hole.

The application also provides a display module, which comprises an electronic element and a circuit board, wherein the electronic element is arranged on the circuit board, and a pin of the electronic element is accommodated in the second through hole on the circuit board.

The application still provides a display screen, and the display screen includes the box, reaches display module assembly, and display module assembly connects in the box.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram illustrating the misalignment of an electronic component with respect to a circuit board according to the prior art;

fig. 2 is a schematic view of a display module according to an embodiment of the present disclosure;

fig. 3 is a schematic view of a display module according to another embodiment of the present disclosure;

fig. 4 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram (top view) of a circuit board provided in another embodiment of the present application;

fig. 6 is a schematic diagram (top view) of a circuit board provided in another embodiment of the present application;

FIG. 7 is a schematic diagram of a circuit board provided in accordance with yet another embodiment of the present application;

FIG. 8 is a schematic diagram of a circuit board provided in accordance with yet another embodiment of the present application;

fig. 9 is a schematic diagram (top view) of a circuit board provided in another embodiment of the present application;

FIG. 10 is a schematic view (side view) of a display screen provided in accordance with an embodiment of the present application;

fig. 11 is a schematic view (front view) of a display screen provided in another embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments, in case at least two embodiments are combined together without contradiction.

Referring to fig. 1, fig. 1 is a schematic diagram illustrating an electronic component being offset from a PCB in the prior art. In the prior art, the diameter of the through hole K of the pad 111 is increased to improve the tin penetration rate, and it can be understood that the diameter of the through hole K is increased, so that more solder paste 130 can be contained in the through hole K, and the tin penetration rate is improved. However, in the above-mentioned prior art, the diameter of the through hole K on the pad 111 is increased to increase the tin penetration amount, and the increase of the diameter of the through hole K is not favorable for fixing the pin 121 of the electronic component 120 in the through hole K. Since the increase of the diameter of the through hole K means that the gap between the pin 121 of the electronic component 120 and the sidewall of the through hole K becomes larger, the positioning ability of the pin 121 with respect to the pad 111 becomes worse as the gap increases during the process of inserting the pin 121 of the electronic component 120 into the through hole K and soldering, that is, the swing space of the electronic component 120 with respect to the PCB 110 becomes larger, and after the soldering is completed, the electronic component 120 is easily displaced with respect to the PCB 110, as shown in fig. 1.

In an embodiment, please refer to fig. 2 to 5, and fig. 2 is a schematic view of a display module according to an embodiment of the present disclosure. Fig. 3 is a schematic view of a display module according to another embodiment of the present disclosure. Fig. 4 is a schematic diagram of a circuit board according to an embodiment of the present disclosure. Fig. 5 is a schematic diagram (top view) of a circuit board according to another embodiment of the present disclosure. The present application provides a circuit board 110, the circuit board 110 including a pad 111 and a substrate 112. The pad 111 is disposed on the substrate 112. The substrate 112 has a first through hole a 1. The first through hole a1 is for receiving the pad 111. The pad 111 has a second through hole a2 and a flow guide groove A3 communicating with each other. The flow guide groove A3 is formed along the side wall of the pad 111 forming the second through hole a 2. The second through hole a2 and the channel A3 are used to accommodate the solder 130. The second through hole a2 is also used to receive a pin 121 of the electronic component 120.

Specifically, the circuit board 110 is a printed circuit board. The circuit board 110 includes a substrate 112, a pad 111, and a circuit, wherein the substrate 112 serves as a carrier to carry the pad 111 and the circuit. The pads 111 are connected to the circuit to make electrical connection. The substrate 112 is a non-conductive material. The material of the bonding pad 111 may be, but is not limited to, copper.

The substrate 112 has a first through hole a1, the first through hole a1 penetrates through two opposite sides of the substrate 112, and the pad 111 penetrates through the first through hole a 1.

The pad 111 has a second through hole a2 and a flow guide groove A3. The second via a2 penetrates through two opposite sides of the pad 111, and extends in the same direction as the first via a 1. The guiding groove A3 is formed on the side wall forming the second through hole a2 and is communicated with the second through hole a2, in other words, the guiding groove A3 is disposed on the side wall of the second through hole a2 in a groove shape. The shape of the diversion trench a3 may be, but is not limited to, rectangular (as shown in fig. 5), arcuate (as shown in fig. 6), semicircular, etc.

The aperture of the second through hole A2 is larger than that of the diversion trench A3. The second through holes a2 are used to receive the pins 121 of the electronic component 120 and the solder 130, and the channels A3 are used to receive the solder 130. The electronic component 120 may be, but is not limited to, a light emitting diode, and the solder 130 may be, but is not limited to, a solder paste. The pins 121 of the electronic component 120 occupy a part of the space of the second through hole a2, and the solder 130 fills the remaining space of the second through hole a2 and the guiding groove A3, so that the electronic component 120 is firmly connected to the circuit board 110.

According to the solder flux feeding device, the flow guide groove A3 communicated with the second through hole A2 is formed in the side wall forming the second through hole A2, on one hand, liquid solder 130 in the welding process can enter the second through hole A2 and the flow guide groove A3 at the same time, so that the solder 130 penetrating through the through holes can be increased, and the transmittance of the solder 130 is improved; on the other hand, the formed diversion trench A3 does not enlarge the aperture of the second through hole a2, so that the positioning accuracy of the pin 121 relative to the circuit board 110 can be ensured in the process of soldering the electronic component 120 on the circuit board 110, which is beneficial to soldering and also prevents the electronic component 120 from deviating easily.

Please continue to refer to fig. 4. Further, the pad 111 has a first surface 1111 and a second surface 1112 opposite to each other. The second through hole a2 penetrates the first surface 1111 and the second surface 1112.

Optionally, the diversion trench A3 penetrates through the first surface 1111 and the second surface 1112, that is, the diversion trench A3 penetrates through two opposite sides of the pad 111. With such an arrangement, the channels penetrating the solder 130 can be increased, the transmittance of the solder 130 can be improved, and the liquid solder 130 can flow more smoothly in the soldering process.

Optionally, the flow guide groove A3 only penetrates through any one of the first surface 1111 and the second surface 1112, that is, the flow guide groove A3 only penetrates through one side of the pad 111, and does not penetrate through to the opposite side. The arrangement is such that the aperture of the pad 111 of the non-penetrating part is completely the aperture of the second through hole a2, thereby being beneficial to ensuring the positioning accuracy of the pin 121 of the electronic component 120.

Optionally, the distance from the wall surface of the diversion trench A3 far away from the central axis of the second through hole a2 to the central axis of the second through hole a2 is less than or equal to 20% of the diameter of the pad 111. That is, the wall surface of the flow guide groove A3 farthest from the central axis of the second through hole a2 is less than or equal to 20% of the diameter of the land 111 from the central axis of the second through hole a 2. Wherein the diameter of the pad 111 is the diameter of the outer edge of the pad 111.

Alternatively, the extending direction of the guide grooves A3 is parallel to the central axis direction of the second through hole a2, as shown in fig. 4. For example, the flow guide groove A3 penetrates through the pad 111, the penetrating direction of the flow guide groove A3 is the same as the central axis direction of the second through hole a2, the extending direction of the flow guide groove A3 is the penetrating direction of the flow guide groove A3, in other words, the extending direction of the flow guide groove A3 is parallel to the central axis direction of the second through hole a 2. It will be appreciated that this arrangement is more advantageous for the formation of channel a 3.

Optionally, please refer to fig. 7, and fig. 7 is a schematic diagram of a circuit board according to another embodiment of the present application. The extending direction of the guiding groove A3 is inclined to the central axis direction of the second through hole a2, that is, the guiding groove A3 is obliquely opened on the side wall forming the second through hole a2 and obliquely surrounds the side wall forming the second through hole a2, it can be understood that the inclined guiding groove A3 can increase more passages through the solder 130.

Optionally, please refer to fig. 8, and fig. 8 is a schematic diagram of a circuit board according to another embodiment of the present application. The flow guide groove A3 has a certain slope in the direction toward the second through hole a2, in other words, the flow guide groove A3 is inclined toward the second through hole a2, so that the inclined flow guide groove A3 is more favorable for guiding the liquid solder 130 into the second through hole a 2. Further alternatively, the guide grooves A3 may be inclined toward the central axis of the second through hole a 2. Note that the inclination direction of trench A3 described in this embodiment is a direction in which the top of trench A3 faces the bottom of trench A3, where the top of inclined trench A3 is trench A3 near the surface of pad 111.

Further, the number of the flow guide grooves a3 is one or more. When the number is a plurality, the plurality of flow guide grooves A3 are arranged at intervals around the second through hole a 2. The number of the flow guide grooves a3 is at least one, and may be, but is not limited to, 1, 3, 4 (as shown in fig. 5), 5, 6 (as shown in fig. 9), 8, 9, 10, etc., which is determined by actual requirements and is not limited herein. It can be understood that the guiding grooves A3 are arranged at intervals in the circumferential direction of the second through hole a2, which is beneficial to ensure that the aperture of the second through hole a2 is not increased, thereby ensuring the positioning accuracy of the pins 121 of the electronic component 120.

Optionally, when the number of the flow guide grooves A3 is multiple, the flow guide grooves A3 are uniformly spaced around the second through hole a2, as shown in fig. 5, 6 and 9. It can be understood that the flow guide grooves A3 are uniformly spaced around the second through hole a2, which is beneficial for uniform tin penetration, so that the pins 121 of the electronic component 120 can be well soldered on the circuit board 110.

Optionally, the number of the flow guide grooves A3 is multiple, and the shape and size of the flow guide grooves A3 are the same, as shown in fig. 5, 6 and 9. It will be appreciated that the same shape and dimensions will contribute to saving processing time and thus efficiency.

Please refer to fig. 2 to fig. 3 for a second embodiment. The present application further provides a display module 10, wherein the display module 10 includes an electronic component 120 and a circuit board 110 described in any of the above embodiments. The electronic component 120 is disposed on the circuit board 110. The pins 121 of the electronic component 120 are received in the second through holes a2 on the circuit board 110. The electronic component 120 may be, but is not limited to, an LED, a processor, a capacitor, an inductor, etc. The circuit board 110 refers to the description and drawings of any of the above embodiments.

Referring to fig. 10 to 11, fig. 10 is a schematic view (side view) of a display screen according to an embodiment of the present application, and fig. 11 is a schematic view (front view) of a display screen according to another embodiment of the present application. The application still provides a display screen 1, and display screen 1 includes box 20 and above-mentioned display module assembly 10, and display module assembly 10 connects in box 20, and this box 20 is used for protecting display module assembly 10. The display module 10 is described with reference to the drawings in any of the above embodiments.

Further, the orthographic projection of the display module 10 on the box body 20 at least partially falls within the range of the box body 20. The display module 10 has a display surface AA for displaying text, images, and video contents.

Referring to fig. 10, in an embodiment, the orthographic projection of the box body 20 on the display surface AA all falls within the range of the display surface AA, that is, the frame of the box body 20 does not exceed the edge of the display surface AA, and it can be understood that the box body 20 is configured so as not to block the display surface AA, thereby having a better viewing experience.

Referring to fig. 11, in another embodiment, the orthographic projection of the display surface AA on the box body 20 all falls within the range of the box body 20, and the border of the box body 20 wraps the edge of the display module 10, and it can be understood that the border of the box body 20 can protect the edge of the display module 10, so as to reduce the probability that the display module 10 is damaged.

Of course, the connection between the display module 10 and the box 20 may be other types, which are not described herein.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims

1. The circuit board is characterized by comprising a pad and a substrate, wherein the pad is arranged on the substrate, the substrate is provided with a first through hole, the first through hole is used for accommodating the pad, the pad is provided with a second through hole and a diversion trench, the second through hole and the diversion trench are communicated, the diversion trench is formed along the side wall of the second through hole, the second through hole and the diversion trench are used for accommodating solder, and the second through hole is also used for accommodating a pin of an electronic element.

2. The circuit board of claim 1, wherein the pad has a first surface and a second surface opposite to each other, the second via hole penetrates the first surface and the second surface, and the guiding trench penetrates the first surface and the second surface.

3. The circuit board of claim 1, wherein the pad has a first surface and a second surface opposite to each other, the second via hole penetrates through the first surface and the second surface, and the guiding trench penetrates through only one of the first surface and the second surface.

4. The circuit board of claim 2, wherein the flow guide groove is away from the wall surface of the central axis of the second through hole, and the distance from the wall surface of the central axis of the second through hole to the central axis of the second through hole is less than or equal to 20% of the diameter of the pad.

5. The circuit board of claim 1, wherein the flow guide groove extends in a direction parallel to a central axis direction of the second through hole.

6. The circuit board of claim 1, wherein the extending direction of the flow guide groove is inclined to the central axis direction of the second through hole.

7. The circuit board of claim 1, wherein the number of the flow guide grooves is one or more.

8. The circuit board of claim 7, wherein when the number of the flow guide grooves is plural, the flow guide grooves are uniformly arranged at intervals along the circumference of the second through hole.

9. A display module, wherein the display module comprises an electronic component and the circuit board according to any one of claims 1 to 8, the electronic component is disposed on the circuit board, and the pins of the electronic component are received in the second through holes of the circuit board.

10. A display screen, characterized in that, the display screen includes the box, reaches the display module assembly of claim 9, the display module assembly connect in the box.