CN215872004U - Micro/Mini LED chip and semi-embedded printed circuit board - Google Patents
Micro/Mini LED chip and semi-embedded printed circuit board Download PDFInfo
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- CN215872004U CN215872004U CN202120465778.5U CN202120465778U CN215872004U CN 215872004 U CN215872004 U CN 215872004U CN 202120465778 U CN202120465778 U CN 202120465778U CN 215872004 U CN215872004 U CN 215872004U
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims description 8
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- 239000000956 alloy Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 229910000831 Steel Inorganic materials 0.000 description 15
- 239000010959 steel Substances 0.000 description 15
- 239000012212 insulator Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model relates to a Micro/Mini LED chip and a semi-embedded printed circuit board; the semi-embedded printed circuit board comprises a first solder resist ink layer, a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, a second solder resist ink layer and a bonding pad; the bonding pad is used for fixing and electrically connecting the first circuit layer and the Micro/Mini LED chip and is positioned on the upper surface of the first circuit layer at two sides of the groove of the first circuit layer; at least one Micro/Mini LED chip is attached to the semi-embedded printed circuit board. One surface of the Micro/Mini LED chip is provided with a bulge, the bulge can be placed into the first circuit layer groove, and the upper surface of the first circuit layer at two sides of the first circuit layer groove is in close contact with one surface of the Micro/Mini LED chip where the bulge is located; the utility model can improve the reliability and the display effect of the LED display screen.
Description
Technical Field
The utility model relates to the field of printed circuit boards of LED light-emitting chips, in particular to a Micro/Mini LED chip and a semi-embedded printed circuit board.
Background
In the LED display screen industry, the fixing and electrical connection between the existing Micro/Mini LED chip and the PCB generally employs a plug-in welding technology: pins of the Micro/Mini LED chip are inserted into metallized holes on a PCB (printed Circuit Board) or the Micro/Mini LED chip is assembled on the surface of a printed circuit board or other substrates by surface mounting technology and is welded and assembled by methods such as reflow soldering or dip soldering. The Micro/Mini LED chip can be reliably and firmly welded through the plug-in, but a through hole needs to be designed, so that the technology cannot be applied to a lamp panel of an ultra-small-point-interval LED display screen or an LED display module, the existing ultra-small-point-interval LED display screen adopts a surface mounting technology, and the welding reliability is not high. The existing surface mounting technology has the following problems: the Micro/Mini LED chip bonding pad is unreliable in connection with the PCB bonding pad, and is easy to fall off when receiving left and right thrust: the pins of the Micro/Mini LED chip are exposed, so that the display effect is influenced; the connection area between the Micro/Mini LED chip and the PCB can be increased due to the all-in-one packaging, and the display performance is reduced due to the electrical property difference of the Micro/Mini LED chip; the surface is filled with glue, so that the maintenance is difficult; the pins of the device are exposed to reflect light, so that the display effect of the ultra-high-definition LED display screen is influenced.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a Micro/Mini LED chip and a semi-embedded printed circuit board for solving the problems of the conventional Micro/Mini LED chip and the semi-embedded printed circuit board.
An embodiment of the application provides a semi-embedded printed circuit board, which comprises a first solder resist ink layer, a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, a second solder resist ink layer and a bonding pad, wherein the first solder resist ink layer is arranged on the first circuit layer;
the first solder resist ink layer is used for preventing the insulating layer from being damaged in the welding process; the first solder resist ink layer is positioned on the upper surface of the printed circuit board and is attached to the upper surface of the first insulating layer;
the first insulating layer is used for insulating the first circuit layer from the surface of the Micro/Mini LED display module; the first insulating layer is positioned below the first solder resist ink layer and above the first circuit layer;
the first circuit layer is used for laying a circuit to supply power for the Micro/Mini LED chip; the first circuit layer is positioned below the first insulating layer and above the second insulating layer;
the second insulating layer is used for insulating the first circuit layer from the second circuit layer; the second insulating layer is positioned below the first circuit layer and above the second circuit layer;
the second circuit layer is used for laying a circuit to supply power for the Micro/Mini LED chip; the second circuit layer is positioned below the second insulating layer and above the second solder resist ink layer;
the second solder resist ink layer is used for preventing the insulating layer from being damaged in the welding process; the second solder resist ink layer is positioned below the second circuit layer and on the lower surface of the printed circuit board;
the bonding pad is used for fixing and electrically connecting the first circuit layer and the Micro/Mini LED chip; the bonding pads are positioned on the upper surface of the first circuit layer at two sides of the first circuit layer groove of the first circuit layer;
at least one Micro/Mini LED chip is attached to the semi-embedded printed circuit board.
Preferably, the second insulating layer has at least one second insulating layer via hole; and the second insulating layer is provided with a through hole for wiring or ventilation cooling.
Preferably, the second insulator via has at least one second insulator sidewall; and metal or alloy is attached to the side wall of the second insulating layer.
Preferably, a first insulating layer side wall is arranged at the connection part of the first insulating layer and the Micro/Mini LED chip; and metal or alloy is attached to the side wall of the first insulating layer.
Preferably, the bottom of the groove of the first circuit layer is also provided with a solder mask ink layer.
Another embodiment of the present application further provides a Micro/Mini LED chip for embedding the semi-embedded pcb of any one of claims 1 to 6 of the present application, wherein a plurality of the Micro/Mini LED chips are attached to the semi-embedded pcb; the Micro/Mini LED chip is used for providing pixel luminescence for the LED display screen to provide an RGB light source; one surface of the Micro/Mini LED chip is provided with a bulge, and the height of the bulge is equal to the sum of the height of the first insulating layer of the semi-embedded printed circuit board and the thickness of the first solder resist ink layer; the length and the width of the first circuit layer groove correspond to the length and the width of the bulge respectively; the bulges can be placed into the first circuit layer grooves, and the upper surfaces of the first circuit layers on the two sides of the first circuit layer grooves are in close contact with one surface of the Micro/Mini LED chip where the bulges are located; the first insulating layer is provided with a first insulating layer groove, and after the protrusion is placed in the first circuit layer groove of the first circuit layer, all or part of the Micro/Mini LED chip is placed in the first insulating layer groove.
Preferably, the shortest straight-line distance from the outer side wall of the bump to the outer side wall of the Micro/Mini LED chip is greater than the length of the bonding pad; the width of the Micro/Mini LED chip is larger than that of the bonding pad.
Preferably, after the protrusion is placed in the first circuit layer groove of the first circuit layer, the other surface of the Micro/Mini LED chip is flush with the first solder resist ink layer.
Preferably, after the protrusion is placed in the first circuit layer groove of the first circuit layer, the other surface of the Micro/Mini LED chip is higher than the first solder resist ink layer.
Preferably, the shortest straight-line distance from the outer side wall of the bump to the outer side wall of the Micro/Mini LED chip is equal to the length of the bonding pad; the width of the bump is equal to the width of the pad.
Preferably, the width of the bump is less than or equal to the width of the Micro/Mini LED chip.
The utility model further provides a Micro/Mini LED display module which comprises a plurality of Micro/Mini LED chips and at least one semi-embedded printed circuit board.
The application of the utility model improves the connection reliability of the Micro/Mini LED chip and the PCB; the welding reliability of the LED display screen with the ultra-small dot spacing is greatly improved. The bonding pad of the Micro/Mini LED chip is tightly connected with the bonding pad of the PCB, and is not easy to fall off when being subjected to left and right thrust; pins of the Micro/Mini LED chip cannot be exposed, and the problem of pin reflection cannot occur, so that the display effect of the ultra-high-definition LED display screen is greatly improved; the multi-in-one packaging can greatly reduce the connection area between the Micro/Mini LED chip and the PCB, reduce the influence of the heat dissipation of the Micro/Mini LED chip on the printed circuit board, improve the display precision, reduce the glue filling quantity and facilitate the maintenance; the electrical property difference of the Micro/Mini LED chip is correspondingly reduced, and the display effect of the ultra-high-definition LED display screen is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a semi-embedded PCB according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a Micro/Mini LED chip and a semi-embedded PCB thereof according to an embodiment of the present application;
fig. 3 is a schematic plan view of a four-in-one Mini LED according to an embodiment of the present application;
FIG. 4 is a top view of a steel mesh opening of a Mini LED chip according to one embodiment of the present application;
FIG. 5 is a side view of a steel mesh opening of a Mini LED chip according to one embodiment of the present application;
FIG. 6 is a side view of a steel mesh placed over the semi-embedded PCB according to one embodiment of the present application;
FIG. 7 is a schematic view of the position of solder paste after the removal of the steel mesh according to one embodiment of the present application.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the utility model, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
As shown in fig. 1 and 2, an embodiment of the present application discloses a semi-embedded printed circuit board for embedding Micro/Mini LED chips; the semi-embedded printed circuit board 90 comprises a first solder resist ink layer 14, a first insulating layer 15, a first circuit layer 16, a second insulating layer 17, a second circuit layer 19, a second solder resist ink layer 20 and a bonding pad 12 a; a plurality of Micro/Mini LED chips 80 are attached to the semi-embedded printed circuit board 90;
a first solder resist ink layer 14 for preventing damage to the insulating layer during soldering; first solder resist ink layer 14 is located on the upper surface of semi-embedded printed circuit board 90 and is attached to the upper surface of first insulating layer 15.
The first insulating layer 15 is used for insulating the first circuit layer 16 from the surface of the Micro/Mini LED display module; a first insulating layer 15 located below the first solder resist ink layer 14 and above the first circuit layer 16;
the first circuit layer 16 is used for laying a circuit to supply power for the Micro/Mini LED chip 80; the first circuit layer is located under the first insulating layer 15 and on the second insulating layer 17;
a second insulating layer 17 for insulating the first wiring layer 16 from the second wiring layer 19; the second insulating layer 17 is located below the first circuit layer 16 and above the second circuit layer 19;
the second circuit layer 19 is used for laying a circuit to supply power for the Micro/Mini LED chip; a second circuit layer 19 is located below the second insulating layer 17 and above the second solder resist ink layer 20;
a second solder resist ink layer 20 for preventing damage of the insulating layer during soldering; the second solder resist ink layer 20 is positioned below the second circuit layer 19 and is half-embedded into the lower surface of the printed circuit board 90;
a bonding pad 12a for fixing and electrically connecting the first circuit layer 16 and the Micro/Mini LED chip 80; the bonding pad 12a is positioned on the upper surface of the first circuit layer 16 at two sides of the first circuit layer groove 11 of the first circuit layer 16; the length of the bonding pad 12a is smaller than the shortest straight-line distance from the outer side wall 802 of the bump to the outer side wall 801 of the Micro/Mini LED chip; the width of the pad 12a is smaller than the width of the Micro/Mini LED chip 80.
Specifically, the Micro/Mini LED chip 80 is configured to provide an RGB light source for a pixel light emitting point of the LED display screen; for example, Micro LED chips are used as light sources, or Mini LED pixel lamps are used as light sources; a bulge 81 is arranged on one side of the Micro/Mini LED chip 80; the first circuit layer 16 is provided with a first circuit layer groove 11, and the length and the width of the first circuit layer groove 11 correspond to the length and the width of the protrusion 81 respectively; the protrusion 81 can be placed in the first circuit layer groove 11, and the upper surface of the first circuit layer 16 on both sides of the first circuit layer groove 11 is in close contact with one surface of the Micro/Mini LED chip 80 where the protrusion 81 is located; the first insulating layer 15 has a first insulating layer groove, and after the protrusion 81 is placed in the first wiring layer groove 11 of the first wiring layer 16, the Micro/Mini LED chip 80 is placed in the first insulating layer groove 22 in whole or in part.
According to the technical scheme, the pins of the Micro/Mini LED chip cannot be exposed, and the problem of pin reflection cannot occur, so that the display effect of the ultra-high-definition LED display screen is greatly improved.
In an alternative embodiment, the height of the bump 81 is equal to the sum of the height of the first insulating layer 15 and the thickness of the first solder resist ink layer 14.
In some alternative embodiments, after the bump 81 is placed in the first circuit layer groove 11 of the first circuit layer, the other surface of the Micro/Mini LED chip 80 is flush with the first solder resist ink layer 14, specifically, the upper surface is coincident with the upper surface.
In some alternative embodiments, after the bump is placed in the first circuit layer groove 11 of the first circuit layer 16, the other side of the Micro/Mini LED chip 80 is higher than the first solder resist ink layer 14.
In some alternative embodiments, the length of the pad 12a is equal to the shortest straight distance from the bump outer side wall 802 to the Micro/Mini LED chip outer side wall 801; the width of the pad 12a is equal to the width of the bump 81; the width of the bump 81 is less than or equal to the width of the Micro/Mini LED chip 80.
In some alternative embodiments, the second insulator layer 17 has at least one second insulator layer via 21; the second insulating layer via hole 21 is used for wiring or ventilating and cooling; specifically, the second insulating layer via hole 21 is hollowed out by punching, drilling, ablation, or the like.
In some alternative embodiments, the second insulator via 21 has at least one second insulator sidewall 18, and the second insulator sidewall 18 is attached to a metal or alloy.
In some alternative embodiments, the first insulating layer 15 has a first insulating layer sidewall 13 connected to the Micro/Mini LED chip 80, and the first insulating layer sidewall 13 is attached with a metal or an alloy.
In some optional embodiments, the bottom of the first circuit layer groove 11 is also provided with a solder resist ink layer 82; specifically, the bottom of the first circuit layer groove 11 is further provided with a gap 11, and the gap 11 is a gap generated after the first circuit layer 16 is etched and can be filled with solder resist ink or partially filled with solder resist ink, so that the solder resist ink layer 82 is formed; the solder resist ink layer 82 serves to protect the second insulating layer 17 during soldering.
The embodiment of the utility model also comprises a Micro/Mini LED chip 80; as shown in fig. 2 and 3, the Micro/Mini LED chip 80 is used to implement a semi-embedded printed circuit board 90 according to any embodiment of the present invention.
Specifically, a number of the Micro/Mini LED chips 80 are attached to the semi-embedded printed circuit board 90; the Micro/Mini LED chip 80 is used for providing an RGB light source for the LED display screen; one surface of the Micro/Mini LED chip 80 is provided with a bump 81, and the height of the bump 81 is equal to the sum of the height of the first insulating layer 15 of the semi-embedded printed circuit board 90 and the thickness of the first solder resist ink layer 14; the length and width of the first circuit layer groove 11 correspond to the length and width of the protrusion 81 respectively; the protrusion 81 can be placed in the first circuit layer groove 11, and the upper surface of the first circuit layer 16 on both sides of the first circuit layer groove 11 is in close contact with one surface of the Micro/Mini LED chip 80 where the protrusion 81 is located; the first insulating layer 15 has a first insulating layer groove 11, and after the protrusion 81 is placed in the first wiring layer groove 11 of the first wiring layer 16, the Micro/Mini LED chip 80 is placed in the first insulating layer groove 22 in whole or in part.
In some alternative embodiments, the shortest straight distance from the bump outer side wall 802 to the Micro/Mini LED chip outer side wall 801 is greater than the length of the pad; the width of the Micro/Mini LED chip 80 is greater than the width of the bonding pad.
In some alternative embodiments, after the protrusion 81 is placed in the first circuit layer groove 11 of the first circuit layer 16, the other surface of the Micro/Mini LED chip 80 is flush with the first solder resist ink layer 14, specifically, the upper surface.
In some alternative embodiments, after the bump 81 is placed in the first circuit layer groove 11 of the first circuit layer 16, the other side of the Micro/Mini LED chip 80 is higher than the first solder resist ink 14 layer;
in some alternative embodiments, the shortest straight distance from the bump outer side wall 802 to the Micro/Mini LED chip outer side wall 801 is equal to the length of the pad 12 a; the width of the bump 81 is equal to the width of the pad 12 a;
in some alternative embodiments, the width of the bump 81 is less than or equal to the width of the Micro/Mini LED chip 80.
As shown in fig. 3, in some alternative embodiments, the Mini LED employs a four-in-one pixel lamp, and the pad 12a, the pad 12b, the pad 12c, and the pad 12d respectively correspond to RGB pixel lamps.
In some optional embodiments, the Micro LED chips fix the corresponding Micro LED chips using at least one pad 12 a; the Micro LED chip is used for providing an RGB light source.
In some optional embodiments, the Micro/Mini LED chip may also adopt a two-in-one or other all-in-one package; for example: eight in one. The connection area of the Micro/Mini LED chip and the PCB can be greatly reduced through all-in-one packaging, the influence of heat dissipation of the Micro/Mini LED chip on the printed circuit board is reduced, the display precision is improved, the glue filling quantity is reduced, and the maintenance is convenient; the electrical property difference of the Micro/Mini LED chip is correspondingly reduced, and the display effect of the ultra-high-definition LED display screen is greatly improved.
The application further discloses a Micro/Mini LED display module, which comprises a plurality of Micro/Mini LED chips in any embodiment of the application and at least one semi-embedded printed circuit board in any embodiment of the application.
As shown in fig. 1-7, in an alternative embodiment of the present invention, a method for fixing a Mini LED chip on a semi-embedded pcb includes:
step 1, preparing a perforated steel mesh 62 for mounting a Mini LED chip 80; FIG. 4 is a top view of a steel mesh opening of a Mini LED chip; FIG. 5 is a side view of a steel mesh opening of a Mini LED chip; specifically, the steel mesh with openings comprises sections with the same thickness of the steel mesh on both sides, and a steel mesh thickening section 621 (shown in fig. 6);
step 2, placing the steel mesh above the semi-embedded printed circuit board; FIG. 6 is a side view of a steel mesh placed over the semi-embedded PCB;
step 3, removing the steel mesh after coating the tin scraping paste; FIG. 7 is a schematic view of the solder paste position after the steel mesh is removed; specifically, the solder paste 6a and the solder paste 6b are located in the first insulating layer groove 22; due to the obstruction of the steel mesh thickening section 621, the solder paste 6a and the solder paste 6b cannot fill the first circuit layer groove 11, and the filling of the protrusion 81 into the first circuit layer groove 11 is not affected;
and 4, transferring the Mini LED chip to the semi-embedded printed circuit board for heating and fixing.
In some alternative embodiments, the method can be used for fixing and transferring the Micro LED chip.
In the several embodiments provided in the present invention, it should be understood that the disclosed system and method may be implemented in other ways. For example, the system embodiments described above are merely illustrative, and for example, the division of the components is only one logical division, and other divisions may be realized in practice.
In addition, each functional module/component in each embodiment of the present invention may be integrated into the same processing module/component, or each module/component may exist alone physically, or two or more modules/components may be integrated into the same module/component. The integrated modules/components can be implemented in the form of hardware, or can be implemented in the form of hardware plus software functional modules/components.
It will be evident to those skilled in the art that the embodiments of the present invention are not limited to the details of the foregoing illustrative embodiments, and that the embodiments of the present invention are capable of being embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the embodiments being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. Several units, modules or means recited in the system, apparatus or terminal claims may also be implemented by one and the same unit, module or means in software or hardware. The terms first, second, etc. are used to denote names, but not any particular order.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. A semi-embedded printed circuit board is characterized by comprising a first solder resist ink layer, a first insulating layer, a first circuit layer, a second insulating layer, a second circuit layer, a second solder resist ink layer and a bonding pad;
the first solder resist ink layer is used for preventing the insulating layer from being damaged in the welding process; the first solder resist ink layer is positioned on the upper surface of the printed circuit board and is attached to the upper surface of the first insulating layer;
the first insulating layer is used for insulating the first circuit layer from the surface of the Micro/Mini LED display module; the first insulating layer is positioned below the first solder resist ink layer and above the first circuit layer;
the first circuit layer is used for laying a circuit to supply power for the Micro/Mini LED chip; the first circuit layer is positioned below the first insulating layer and above the second insulating layer;
the second insulating layer is used for insulating the first circuit layer from the second circuit layer; the second insulating layer is positioned below the first circuit layer and above the second circuit layer;
the second circuit layer is used for laying a circuit to supply power for the Micro/Mini LED chip; the second circuit layer is positioned below the second insulating layer and above the second solder resist ink layer;
the second solder resist ink layer is used for preventing the insulating layer from being damaged in the welding process; the second solder resist ink layer is positioned below the second circuit layer and on the lower surface of the printed circuit board;
the bonding pad is used for fixing and electrically connecting the first circuit layer and the Micro/Mini LED chip; the bonding pads are positioned on the upper surface of the first circuit layer at two sides of the first circuit layer groove;
at least one Micro/Mini LED chip is attached to the semi-embedded printed circuit board.
2. The semi-embedded printed circuit board of claim 1, wherein the second insulating layer has at least one of the second insulating layer vias; and the second insulating layer is provided with a through hole for wiring or ventilation cooling.
3. The semi-embedded printed circuit board of claim 1, wherein the second insulating layer via has at least one of the second insulating layer sidewalls; and metal or alloy is attached to the side wall of the second insulating layer.
4. The semi-embedded printed circuit board of claim 1, wherein the first insulating layer has a first insulating layer sidewall where the first insulating layer is connected to the Micro/Mini LED chip; and metal or alloy is attached to the side wall of the first insulating layer.
5. The semi-embedded printed circuit board of claim 1, wherein the first trace layer groove bottom further comprises a solder resist ink layer.
6. A Micro/Mini LED chip for embedding the semi-embedded PCB of any claim 1-5 of the present application, wherein a plurality of the Micro/Mini LED chips are attached to the semi-embedded PCB; the Micro/Mini LED chip is used for providing an RGB light source for the LED display screen; one surface of the Micro/Mini LED chip is provided with a bulge; the length and the width of the first circuit layer groove correspond to the length and the width of the bulge respectively; the bulges can be placed into the first circuit layer grooves, and the upper surfaces of the first circuit layers on the two sides of the first circuit layer grooves are in close contact with one surface of the Micro/Mini LED chip where the bulges are located; the first insulating layer is provided with a first insulating layer groove, and after the first circuit layer groove of the first circuit layer is placed in the protrusion, the Micro/MiniLED chip is completely or partially placed in the first insulating layer groove.
7. The Micro/Mini LED chip of claim 6, wherein the shortest straight distance from the outer side wall of the bump to the outer side wall of the Micro/Mini LED chip is greater than the length of the bonding pad; the width of the Micro/Mini LED chip is larger than that of the bonding pad.
8. The Micro/Mini LED chip of claim 7, wherein after the bumps are placed in the first trace layer grooves of the first trace layer, the other side of the Micro/Mini LED chip is flush with the first solder resist ink layer.
9. The Micro/Mini LED chip of claim 7, wherein after the bump is placed in the first trace layer groove of the first trace layer, the other side of the Micro/Mini LED chip is higher than the first solder resist ink layer.
10. The Micro/Mini LED chip of claim 6, wherein the shortest straight distance from the outer side wall of the bump to the outer side wall of the Micro/Mini LED chip is equal to the length of the pad; the width of the bump is equal to the width of the pad.
11. The Micro/Mini LED chip of claim 6, wherein the bumps have a width less than or equal to the width of the Micro/Mini LED chip.
12. A Micro/Mini LED display module is characterized by comprising a plurality of Micro/Mini LED chips according to any one of claims 6 to 11 and at least one semi-embedded printed circuit board according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120465778.5U CN215872004U (en) | 2021-03-03 | 2021-03-03 | Micro/Mini LED chip and semi-embedded printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120465778.5U CN215872004U (en) | 2021-03-03 | 2021-03-03 | Micro/Mini LED chip and semi-embedded printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215872004U true CN215872004U (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120465778.5U Expired - Fee Related CN215872004U (en) | 2021-03-03 | 2021-03-03 | Micro/Mini LED chip and semi-embedded printed circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN215872004U (en) |
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- 2021-03-03 CN CN202120465778.5U patent/CN215872004U/en not_active Expired - Fee Related
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