CN218957332U

CN218957332U - LED transparent display screen

Info

Publication number: CN218957332U
Application number: CN202121965445.5U
Authority: CN
Inventors: 林谊
Original assignee: Shenzhen Jinghong Technology Co ltd
Current assignee: Shenzhen Jinghong Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2023-05-02
Anticipated expiration: 2031-08-19

Abstract

In order to solve the problem of low transparency of an LED transparent display screen in the prior art, the utility model provides the LED transparent display screen, which can effectively improve the transparency of the LED transparent display screen. The LED transparent display screen provided by the utility model comprises a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the circuit pattern comprises a power supply bonding pad, a signal bonding pad and a lamp bead bonding area which is arranged in an array and is used for installing LED lamp beads; at least part of first electrode pin pads on the LED lamp beads are directly or indirectly bound and connected to the first power supply line through power jumpers; and at least part of second electrode pin pads on the LED lamp beads are directly or indirectly bound and connected to the second power supply line through power jumpers. The LED transparent display screen provided by the utility model adopts a binding connection mode, is simple in process and easy to implement, and greatly improves the transparency of the LED transparent display screen.

Description

LED transparent display screen

Technical Field

The utility model relates to the field of LEDs, in particular to the field of transparent LED displays.

Background

Transparent LED displays are increasingly being used in the marketplace and various product forms have evolved. An LED transparent display technology for distributing LED lamp beads on a transparent substrate in an array mode is started to appear.

For example, as shown in fig. 1, an improved LED transparent display screen is provided, which includes a transparent substrate 1', a printed circuit layer 3' is disposed on the transparent substrate 1', and an array of LED lamp beads 2' with chips packaged therein is mounted on the transparent substrate 1 '; then, glue is filled on the surface of the transparent substrate 1' provided with the LED lamp beads 2' to form a glue filling layer 5'; then covering a protective cover plate 4' on the surface of the glue filling layer; as shown in fig. 2, specifically, the printed circuit layer 3 'includes a bead bonding area 31', a power bonding pad 32', a signal bonding pad 33', and the like, wherein two signal bonding pads and two electrode bonding pads are disposed in each bead bonding area 31', the signal bonding pads are connected in series through a printed signal line, and the two electrode bonding pads with opposite polarities are respectively connected with the power bonding pad 32' through a metal grid 30 'printed on the transparent substrate 1'. Pins of the LED lamp beads 2' are welded on the signal pin bonding pad and the electrode pin bonding pad.

The method has the advantages that the metal grid 30 'for supplying power can be directly formed on the transparent substrate 1' through a printing process to serve as a power supply circuit; however, since the thickness of the printed pattern layer 3' is only about 35 micrometers, the current carried by each metal wire on the formed metal grid 30' is very small, so that the area of the metal grid 30' has to be widened to meet the power supply requirement of the LED lamp beads 2', the spacing between the LED lamp beads 2' cannot be made small, and the resolution of the LED transparent display screen cannot be improved; and the metal grid 30 'may reduce the transparency of the transparent substrate 1' to some extent.

As shown in fig. 3, there is another LED transparent display screen, in which LED beads 2' are directly connected to electrode pin pads of a bead bonding area by using a power line 6' as shown, and LED beads are connected in series by a signal line 7' as shown. Wherein the power supply line 6' is divided into a positive power supply line 6a ' and a negative power supply line 6b '. Two sides of each row of LED lamp beads 2' are respectively provided with a positive power line 6a ' and a negative power line 6b '. This way, the gap between the LED beads 2' can be reduced to some extent, but the transparency of the LED display screen is still low.

Disclosure of Invention

In order to solve the problem of low transparency of an LED transparent display screen in the prior art, the utility model provides the LED transparent display screen, which can effectively improve the transparency of the LED transparent display screen.

The utility model provides an LED transparent display screen, which comprises a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the circuit pattern comprises a power supply bonding pad, a signal bonding pad and lamp bead bonding areas which are arranged in an array, and the LED lamp beads are welded on the lamp bead bonding areas;

wherein, each bead welding area is provided with a pin welding disc corresponding to the pins of the LED beads; the pin pads include a signal pin pad and an electrode pin pad; the electrode pin pads comprise a first electrode pin pad and a second electrode pin pad which are opposite in polarity;

the circuit pattern also comprises a plurality of power supply lines and signal lines; the power supply circuit comprises a first power supply circuit and a second power supply circuit with opposite polarities;

the signal bonding pad is electrically connected with the signal pin bonding pad on the bead bonding area through the signal line so as to realize the serial connection of the LED beads, so that control signals for controlling the on and off of each LED bead can be sequentially transmitted through each serial connected LED bead after being input from the signal bonding pad through the signal line;

at least part of first electrode pin pads on the LED lamp beads are directly or indirectly bound and connected to the first power supply circuit through power jumpers; and at least part of second electrode pin pads on the LED lamp beads are directly or indirectly bound and connected to the second power supply line through power jumpers.

According to the LED transparent display screen provided by the utility model, at least part of LED lamp beads are directly or indirectly electrically connected with a power supply circuit in a power jumper manner, the diameter of the power jumper is generally 20-100 mu m, the power jumper is hardly visible to naked eyes, the influence on the vision is extremely low, the bonding connection manner is adopted, the process is simple and easy to implement, and the transparency of the LED transparent display screen is greatly improved.

Further, the circuit pattern is provided with N rows by M columns of lamp bead welding areas;

m signal pads are arranged on the circuit pattern; the M signal pads are sequentially connected in series with the signal pin pads in the N lamp bead welding areas on the same column through signal lines;

alternatively, the circuit pattern is provided with N signal pads; the N signal pads are sequentially connected in series with the signal pin pads in the M lamp bead welding areas on the same row through signal lines.

Further, the circuit pattern is arranged with m+1 power supply pads or n+1 power supply pads;

the M+1 power supply pads or the N+1 power supply pads comprise first power supply pads and second power supply pads which are arranged at intervals and have opposite polarities;

the power supply circuit comprises a plurality of first power supply circuits and second power supply circuits which are arranged in columns or rows at intervals; each first power supply pad is electrically connected with the first power supply line, and each second power supply pad is electrically connected with the second power supply line;

the first power supply circuit and the second power supply circuit which are arranged in rows are arranged with the LED lamp beads in each row at intervals; or the first power supply circuit and the second power supply circuit which are arranged in rows are arranged at intervals with the LED lamp beads in each row side by side;

the first electrode pin bonding pad on the lamp bead bonding area is connected to a nearby first power supply line through power jumper wire binding; and a second electrode pin bonding pad on the lamp bead bonding area is connected to a nearby second power supply line through power jumper wire binding.

By adopting the mode, the transparency of the LED transparent display screen can be improved to a certain extent, meanwhile, each LED lamp bead can be closely bound and connected to an adjacent power supply line, and the binding and connecting process is simpler and the efficiency is higher.

Further, the first power supply circuit, the second power supply circuit and the lamp bead welding area which are arranged at intervals are all metal layers printed on the transparent substrate;

the first electrode pin bonding pads on part of the lamp bead welding areas are integrally printed with the adjacent first power supply circuits, and the first electrode pin bonding pads on the part of the lamp bead welding areas are connected with the first electrode pin bonding pads on the adjacent lamp bead welding areas in a binding mode by adopting power jumpers;

and the second electrode pin bonding pad on the part of the lamp bead bonding area and the adjacent second power supply circuit are integrally printed, and the second electrode pin bonding pad on the part of the lamp bead bonding area is in binding connection with the second electrode pin bonding pad on the adjacent lamp bead bonding area by adopting a power jumper wire.

The structure is adopted to integrally design part of the lamp bead welding area and the power supply circuit, so that the transparency is ensured, and the number of power jumpers is reduced.

Further, the positions of the first electrode pin pad and the second electrode pin pad on the lamp bead welding area in the adjacent row or the adjacent column are opposite;

the LED lamp beads on the lamp bead welding areas on adjacent rows or adjacent columns are 180 degrees different in installation angle. In this way, the first power supply line and the second power supply line can be arranged at intervals more uniformly.

wherein, the first lamp bead and the second lamp bead which are oppositely arranged with the electrode pins are respectively arranged on the lamp bead welding areas of the adjacent rows or the adjacent columns. The structure can enable the positions of the light-emitting wafers in the first lamp bead and the second lamp bead which are specially designed to be relatively fixed, and chromatic aberration of each LED lamp bead cannot occur due to the change of pins.

Further, the power supply lines include one row or one column of the first power supply lines, and one row or one column of the second power supply lines;

at least part of the first electrode pin pads on the lamp bead welding area are connected to a first power supply line through power jumper wire binding, and the first electrode pin pads on part of the lamp bead welding area are connected to the first electrode pin pads on the adjacent lamp bead welding area through power jumper wire binding;

at least part of the second electrode pin pads on the lamp bead welding area are connected to a second power supply circuit through power jumper wire binding, and part of the second electrode pin pads on the lamp bead welding area are connected to second electrode pin pads on adjacent lamp bead welding areas through power jumper wire binding.

By adopting the optimized structure, the number of power supply lines can be reduced as much as possible, and the power supply jumper is increased to realize the power supply to the LED lamp beads, so that the transparency of the LED lamp beads can be further improved.

Further, the LED lamp bead comprises a shell, a driving chip and a light-emitting wafer; the light-emitting wafer comprises a first light-emitting wafer, a second light-emitting wafer and a third light-emitting wafer;

a chip mounting surface is formed on the shell, and pins are led out from the chip mounting surface; the driving chip is arranged on the shell; the first light-emitting wafer, the second light-emitting wafer and the third light-emitting wafer are mounted on the driving chip;

the first electrode pin and the second electrode pin are welded to an electrode pin welding disc on the lamp bead welding area; the input signal pins and the output signal pins are respectively welded to the signal pin bonding pads on the lamp bead bonding areas.

Further, the signal pin pads include an input signal pin pad and an output signal pin pad;

wherein, the input signal pin pad of the first lamp bead welding area is connected to the signal pad through a signal line; the input signal pin bonding pad on the subsequent lamp bead bonding region of the adjacent series-connected lamp bead bonding regions is connected with the output signal pin bonding pad on the previous lamp bead bonding region.

Further, binding connection between the signal pin pad and each LED lamp bead is achieved through the signal jumper wire. By adopting the mode, the transparency of the signal line can be further improved by adopting the jumper mode.

Further, a glue filling layer is arranged on the transparent substrate on which the LED lamp beads are mounted, and the glue filling layer is used for solidifying the transparent LED lamp beads; the upper surface of the glue filling layer is provided with a protective cover plate.

Drawings

FIG. 1 is a schematic cross-sectional view of an LED transparent display provided in the prior art;

FIG. 2 is a schematic top view of an LED transparent display provided in the prior art;

FIG. 3 is a schematic top view of a second LED transparent display provided in the prior art;

FIG. 4 is a schematic cross-sectional view of an LED transparent display provided in an embodiment of the present utility model;

FIG. 5 is a schematic top view of an LED transparent display (before LED beads are mounted) according to an embodiment of the present utility model;

FIG. 6 is a schematic top view of an LED transparent display (after mounting LED beads) according to an embodiment of the present utility model;

FIG. 7 is a schematic top view of a second LED transparent display screen (after LED beads are mounted) provided in an embodiment of the utility model;

fig. 8 is a schematic perspective view of an LED light bulb provided in an embodiment of the present utility model;

FIG. 9a is a schematic top view of a first lamp bead provided in an embodiment of the present utility model;

FIG. 9b is a schematic top view of a second lamp bead provided in an embodiment of the present utility model;

FIG. 10 is a schematic top view of a third LED transparent display provided in an embodiment of the present utility model;

FIG. 11 is a schematic top view of a fourth LED transparent display provided in an embodiment of the present utility model;

fig. 12 is a schematic top view of a fifth LED transparent display provided in an embodiment of the present utility model.

Wherein, the reference numerals in the background art are as follows:

1', a transparent substrate; 2', LED lamp beads; 3', a printed circuit layer; 4', a protective cover plate; 5', a glue filling layer; 6', a power supply line; 7', signal lines; 6a', positive power supply line; 6b', positive power supply lines;

30', a metal mesh; 31', a lamp bead land; 32', power pads; 33', signal pads;

in the specific embodiments, the reference numerals are as follows:

1. a transparent substrate; 2. LED lamp beads; 3. a circuit pattern; 4. a protective cover plate; 5. filling an adhesive layer; 2a, a first lamp bead; 2b, second lamp beads; 20. a light emitting chip; 21. a driving chip; 22. a housing; 23. pins; a 20r, red light emitting wafer; 20g, green light emitting wafer; 20b, blue light emitting wafer; 231. an input signal pin; 232. an output signal pin; 233. a first electrode pin; 234. a second electrode pin; 30. a bead welding area; 31. a power supply line; 31a, a first power supply line; 31b, a second power supply line; 32. a signal line; 33. a signal pad; 311. a power jumper; 321. and (5) signal jumper wires.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships that are based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Examples

The LED transparent display screen disclosed in the present utility model will be specifically explained with reference to the accompanying drawings, as shown in fig. 4, comprising a transparent substrate 1 and LED lamp beads 2; a circuit pattern 3 is arranged on the transparent substrate 1; the circuit pattern 3 includes a power supply pad (not identified in the figure, known to the public), a signal pad 33, and a bead land 30 in which the LED beads 2 are mounted in an array arrangement;

a glue filling layer 5 is arranged on the transparent substrate 1 provided with the LED lamp beads 2, and each transparent LED lamp bead 2 is solidified in the glue filling layer 5; the upper surface of the glue filling layer 5 is provided with a protective cover plate 4. The above-mentioned glue-pouring encapsulation forms the glue-pouring layer 5, and the structure of the protective cover plate 4 is known to the public and will not be described in detail.

Wherein, each bead welding area 30 is provided with a pin welding pad corresponding to the pin 23 of the LED bead 2; the pin pads include a signal pin pad and an electrode pin pad; the electrode pin pads comprise a first electrode pin pad and a second electrode pin pad which are opposite in polarity;

the circuit pattern 3 also comprises a plurality of power supply lines 31 and signal lines 32; the power supply pads are also divided into a first power supply pad and a second power supply pad according to the polarity division; the power supply line 31 includes a first power supply line 31a and a second power supply line 31b with opposite polarities; the first power supply line 31a is connected to the first power supply pad; the second power supply line 31b is connected to the second power supply pad. That is, the first power supply line 31a and the first power supply pad have the same polarity, and the second power supply line 31b and the second power supply pad have the same polarity. If the first power supply line 31a and the first power supply pad have positive polarities, the second power supply line 31b and the second power supply pad have negative polarities. Conversely, the first power supply line 31a and the first power supply pad have negative polarities, and the second power supply line 31b and the second power supply pad have positive polarities.

The number of the first power supply lines 31a and the second power supply lines 31b may be only one, or may be plural, and the number of the first power supply lines 31a and the second power supply lines 31b may be the same or different. The number of the specific first power supply lines 31a and the second power supply lines 31b may also be determined according to the specific number of the LED lamp beads 2. The power supply line 31 may be linear, curved, or serpentine. As a preferred manner, each power supply line 31 is generally provided in a row or column manner, and the manner of implementation is not limited as long as it can supply power. For example, it may be realized by a metal layer etched on the transparent substrate 1, or a metal mesh, or a metal wire, or a metal sheet embedded in the transparent substrate 1, for example.

The signal bonding pad 33 is connected in series with the signal pin bonding pad on the bead bonding area 30 through the signal line 32 to realize the series connection of the LED beads 2, so that control signals for controlling the on and off of each LED bead 2 can be sequentially transmitted through each series-connected LED bead 2 after being input from the signal bonding pad 33 through the signal line 32;

in this example, specifically, the signal lines 32 are disposed between the signal pads 33 and the signal pin pads in the bead welding area 30, and between the signal pin pads in the adjacent bead welding areas 30 in the same row or the same column, and the serial connection of the LED beads 2 is implemented through the signal lines 32, so that the control signals for controlling the on/off of each LED bead 2 can be sequentially transmitted through each serial connection of the LED beads 2 after being input from the signal pads 33 through the signal lines 32;

in this example, the arrangement of the signal line 32 may be implemented in a publicly known manner, and the most central concept in this application is to optimize the connection manner of the power supply line 31 of the LED lamp bead 2, that is, the manner of using the power jumper 311 is optimized as follows, and the implementation of the signal line 32 is not limited. Regarding the manner of adopting the jumper to realize the binding connection, the binding connection can be realized by referring to the manner of adopting the jumper binding connection in the LED lamp beads 2, and no further creative labor is required for the person skilled in the art. Jumpers, which may also be generally referred to as bond wires or bond wires, typically include gold wires, copper wires, palladium-plated copper wires, and alloy wires, among others.

Wherein, at least part of the first electrode pin pads on the LED lamp beads 2 are directly or indirectly bound and connected to the first power supply line 31a through the power jumper 311; at least part of the second electrode pin pads on the LED lamp beads 2 are directly or indirectly connected to the second power supply line 31b through the power jumper 311.

As shown in fig. 5 to fig. 7, the circuit pattern 3 is provided with N rows by M columns of lamp beads 30; in this example, let n=4, m=4. Of course, the present application is not limited to the regular arrangement manner of the LED lamp beads 2, and may be an irregular LED transparent display screen, as long as the core concept is that at least part of the LED lamp beads 2 are powered by the power jumper 311, so that the improvement of the transparency falls within the protection scope of the present application. This example is merely illustrative thereof.

M signal pads 33 are arranged on the circuit pattern 3; the M signal pads 33 are sequentially connected in series with the signal pin pads in the N bead welding areas 30 on the same column thereof through the signal lines 32;

alternatively, the circuit pattern 3 has N signal pads 33 arranged thereon; the N signal pads 33 are serially connected with the signal pin pads in the M bead lands 30 on the same row in sequence through the signal lines 32.

In the above manner, one signal pad 33 is applied to each row or each column, but one signal pad 33 may be applied to a plurality of rows or a plurality of columns, and the LED lamp beads 2 on the rows or columns may be connected in series in a serpentine manner, for example.

As shown in fig. 5, as an embodiment, the power supply line 31 includes a row of the first power supply lines 31a and a row of the second power supply lines 31b;

at least part of the first electrode pin pads on the lamp bead welding area 30 are connected to the first power supply line 31a in a binding mode through a power jumper 311, and the other part of the first electrode pin pads on the lamp bead welding area 30 are connected to the first electrode pin pads on the adjacent lamp bead welding area 30 in a binding mode through the power jumper 311; for example, the first electrode pin pads on the 1 st column of the 4-column lamp bead lands 30 shown in the figure are connected to the first power supply line 31a in a binding manner by the power jumper 311, and the remaining 2-4-column lamp bead lands 30 are respectively connected with the first electrode pin pads on the previous column of the lamp bead lands 30 in a binding manner by the power jumper 311.

At least part of the second electrode pin pads on the lamp bead bond pad 30 are connected to the second power supply line 31b in a binding manner through a power jumper 311, and part of the second electrode pin pads on the lamp bead bond pad 30 are connected to the second electrode pin pads on the adjacent lamp bead bond pad 30 in a binding manner through the power jumper 311. For example, the second electrode pin pads on the 4 th column of the lamp bead lands 30 shown in the drawing are connected to the second power supply line 31b by binding via the power jumper 311, and the remaining 1 st to 3 rd columns of the lamp bead lands 30 are respectively connected with the second electrode pin pads on the subsequent column of the lamp bead lands 30 by binding via the power jumper 311.

By adopting the optimized structure, the number of the power supply lines 31 can be reduced as much as possible, and the power supply jumper 311 is increased to supply power to the LED lamp beads 2, so that the transparency of the LED lamp beads can be further improved.

Fig. 6 is a schematic view of the mounting of the LED lamp beads 2 on the bead lands 30. When the binding connection of the power patch cord 311 is performed, the binding of the power patch cord 311 may be performed first, and then the fixing installation of the LED lamp bead 2 may be performed. Preferably, after the LED lamp beads 2 are installed, the binding connection of the power jumper 311 is better. When the power jumper 311 performs binding wire bonding, the binding point is on the power supply line 31. Meanwhile, the binding points on the electrode pin bonding pad cannot overlap with the projection of the LED lamp bead 2, and the binding falling points are exposed out of the electrode pin bonding pad, so that the binding welding can be realized by a machine in the area with the side length ranging from 0.1 mm to 0.5 mm.

As a preferred manner, the power supply lines 31 may be arranged in consideration of a spaced arrangement. Such as a plurality of columns or rows of light bead lands 30 (i.e., a plurality of columns or rows of LED light beads 2) share a common power line 31. Which is determined according to the number of the LED lamp beads 2 which can be driven by the power supply line 31.

As a preferred manner, as shown in fig. 7, m+1 power supply pads or n+1 power supply pads (not identified in the figure) are arranged on the circuit pattern 3; in this example, m=4, and a total of 5 columns of power pads are arranged as an example.

The M+1 power supply pads or the N+1 power supply pads comprise a first power supply pad (not identified in the figure) and a second power supply pad (not identified in the figure) which are arranged at intervals and have opposite polarities; in this example, 3 first power supply pads and two second power supply pads are provided.

The power supply line 31 includes a plurality of first power supply lines 31a (for example, 3 columns) and second power supply lines 31b (for example, 2 columns) arranged at intervals; each first power supply pad is electrically connected with the first power supply line 31a, and each second power supply pad is electrically connected with the second power supply line 31b;

the first power supply circuit 31a and the second power supply circuit 31b which are arranged in rows are arranged at intervals side by side with the LED lamp beads 2 in each row; (the first power supply line 31a and the second power supply line 31b may be arranged in a row and arranged at intervals side by side with each row of LED beads 2).

The first electrode pin pad on the bead welding area 30 is connected to the nearby first power supply line 31a in a binding way through a power jumper 311; the second electrode pin pad on the bead bond area 30 is connected to the nearby second power supply line 31b by a power jumper 311.

By adopting the mode, the transparency of the LED transparent display screen can be improved to a certain extent, meanwhile, each LED lamp bead 2 can be closely bound and connected to the adjacent power supply line 31, and the binding and connecting process is simpler and the efficiency is higher. Taking an LED transparent display screen with a pixel pitch of 10mm as an example, the line width of the power supply line 31 is 1mm, if the original two power supply lines 31 (shown in fig. 3) with opposite polarities of the LED lamp beads 2 in the original row are reduced to one power supply line 31, the transparency will be improved by 1/10, i.e. 10%, and if the pixel pitch is smaller, such as 5mm, the transparency will be improved by 1/5, i.e. 20%, so that the effect is very obvious.

As shown in fig. 7, the first power supply line 31a and the second power supply line 31b, which are disposed at intervals, and the bead welding area 30 are both metal layers printed on the transparent substrate 1;

wherein, the first electrode pin pad on part of the lamp bead welding area 30 is integrally printed with the adjacent first power supply line 31a, and the first electrode pin pad on part of the lamp bead welding area 30 is connected with the first electrode pin pad in a binding way by adopting a power jumper 311;

the second electrode pin pad on part of the bead welding area 30 and the adjacent second power supply line 31b are integrally printed, and the second electrode pin pad on part of the bead welding area 30 is connected with the second electrode pin pad in a binding way by adopting a power jumper 311.

The first electrode pin pad on the first row of bead bond pads 30 is integrally formed with the first power supply line 31a of the first row, the second electrode pin pad on the second row of bead bond pads 30 is integrally formed with the second power supply line 31b of the second row, the first electrode pin pad on the third row of bead bond pads 30 is integrally formed with the first power supply line 31a of the third row, the second electrode pin pad on the fourth row of bead bond pads 30 is integrally formed with the second power supply line 31b of the fourth row, and the first electrode pin pad on the fourth row of bead bond pads 30 is integrally formed with the first power supply line 31a of the fifth row. Wherein, the second electrode pin pad on the first column of lamp bead welding area 30 is connected to the second power supply line 31b of the second column in a binding way through the power jumper 311; the first electrode pin pads on the second column of lamp bead lands 30 are connected to the first power supply line 31a of the third column in a binding manner through the power jumper 311; the second electrode pin pads on the third column of bead bond pads 30 are tied to the second power supply line 31b of the fourth column by power jumpers 311.

By adopting the structure to integrally design part of the lamp bead welding area 30 and the power supply circuit 31, the number of the power jumpers 311 can be reduced while the transparency is ensured. The number of the power jumpers 311 is related to the distance and the power supply requirement, if the distance between the LED lamp beads 2 is large, for example, the distance is 10mm, the current required by power supply of each row of LED lamp beads 2 is large, and the preferred mode is that one power supply line 31 (shown in fig. 7) of one row of LED lamp beads 2 supplies current with the same polarity to the adjacent two rows of LED lamp beads 2; if the LED lamp beads 2 have a small pitch, such as 6mm, two power supply lines 31 with opposite polarities can supply more than one row of LED lamp beads 2, such as 4 rows of LED lamp beads 2 (as shown in fig. 10 and 11), electrode pin pads with the same polarity between the 4 rows can be connected with each other by using a power jumper 311, so that the transparency is also higher.

In order to make the thread as short as possible, the first electrode lead pad and the second electrode lead pad on the bead bond region 30 on the adjacent columns are preferably arranged in opposite positions; and when the same LED lamp beads 2 are mounted, it is necessary that the mounting angles of the LED lamp beads 2 on the bead lands 30 on adjacent columns differ by 180 °. I.e. each LED lamp bead 2 is mounted rotated 180 degrees. In this way, the first power supply line 31a and the second power supply line 31b can be arranged at a more uniform interval. However, this approach has minor drawbacks.

As shown in fig. 8, the LED lamp bead 2 generally includes a housing 22, a driving chip 21, and a light emitting wafer 20; wherein the light emitting wafer 20 includes a first light emitting wafer, a second light emitting wafer, and a third light emitting wafer;

a chip mounting surface is formed on the shell 22, and pins 23 are led out from the chip mounting surface; the driving chip 21 is mounted on the housing 22; the first, second and third light emitting chips are mounted on the driving chip 21; the first electrode pin 233 and the second electrode pin 234 are soldered to electrode pin pads on the lamp bead lands 30; the input signal pins 231 and the output signal pins 232 are soldered to the signal pin pads on the lamp bead lands 30, respectively.

For example, in this example, the first light emitting wafer is a red light emitting wafer 20r, the second light emitting wafer is a green light emitting wafer 20g, and the third light emitting wafer is a blue light emitting wafer 20b. As shown in the drawing, a red light emitting wafer 20r, a green light emitting wafer 20g, and a blue light emitting wafer 20b are sequentially mounted on a driving chip 21. At this time, if the LED lamp beads 2 are rotated 180 degrees, the order of the light emitting chips in the LED lamp beads 2 thereof will be changed into: a blue light emitting wafer 20b, a green light emitting wafer 20g, and a red light emitting wafer 20r. This way it will be possible to make it with a slight chromatic aberration.

The LED lamp beads 2 in this example are TOP-type structures, so-called TOP-type structures, which means structures using PLCC (chinese full name: plastic chip carrier with leads; english full name: plastic Leaded Chip Carrier) plastic holders as a housing (english name housing, chinese also called holder or base) 22, and the pins 23 of the PLCC plastic holder package structure are bent inward at the bottom. The technology is known to the public and generally comprises the procedures of metal material strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional ink jet and the like. The core is that a chip mounting surface (not marked in the figure) is formed on the surface of a plastic bracket through a metal material belt; and pins 23 extend out of the chip mounting surface and are stuck to the bottom of the plastic bracket after the bottom is bent inwards so as to facilitate subsequent chip bonding.

In this example, the chip mounting surface is used for mounting the driving chip 21 and the light emitting wafer; the device comprises an isolation river and bonding pads isolated from each other through the isolation river, wherein pins 23 are led out of the bonding pads; in this example, the bonding pads are actually metal sheets made of the same material as the pins 23, the metal sheets are punched and formed, and the empty places are filled by injection molding, so that an isolation river is formed, the isolation river is actually made of insulating plastic materials, the pins 23 are respectively separated, and the effect of fixing the shell 22 is achieved. Specifically, the bonding pads include electrode pads and input-output pads; the electrode pad includes a cathode pad and an anode pad; the input/output pads comprise an input pad and an output pad; the pins 23 comprise electrode pins and signal pins, wherein the electrode pins comprise positive electrode pins and negative electrode pins; the signal pins comprise signal input pins and signal output pins; leading out an anode pin from the cathode bonding pad; and a negative electrode pin is led out from the anode bonding pad. And a signal input pin is led out from the input bonding pad, and a signal output pin is led out from the output bonding pad. The electrode pins are soldered to the electrode pin pads and the signal pins are soldered to the signal pin pads, so that the LED lamp beads 2 are soldered to the bead lands 30.

The driving chip 21 is known, and generally, a driving circuit is integrated in the driving chip 21, and a passivation layer is provided on the driving chip 21, wherein the passivation layer is a surface insulation layer formed when the driving chip 21 is manufactured. The driving chip 21 is provided with a plurality of pins (or called terminals), and the pins on the driving chip 21 are electrically connected with the chip mounting surface and the light emitting wafer through direct welding or bonding wires. Pins (english name: PAD) are typically provided on the passivation layer, the pins being terminals inside the chip.

The TOP type package structure in this example may be replaced by a CHIP type package structure, in which the housing 22 is formed by a circuit board (PCB), the copper foil on the front surface of the circuit board is etched to form a CHIP mounting surface, that is, after the circuit board is etched, an isolation channel is formed in the etched place, and a bonding pad is formed in the unetched place. The back of which is formed with pins 23; the pins 23 are electrically connected to the chip mounting surface (i.e., the pads thereon) through conductive vias. The circuit board generally uses an insulating material such as glass epoxy or polyimide as a substrate, and conductive patterns, printed wiring, and the like are formed on the surface and the underside of the circuit board. CHIP-type packages are well known and will not be described in detail.

The applicant has devised a way to solve the chromatic aberration of the LED lamp beads 2 by making the positions of the first electrode pin pads and the second electrode pin pads on the lamp bead lands 30 in adjacent rows or adjacent columns opposite; meanwhile, the first lamp beads 2a and the second lamp beads 2b with opposite electrode pins are respectively arranged on the lamp bead welding areas 30 of the adjacent rows or the adjacent columns. As shown in fig. 9a and 9b, two kinds of LED beads 2 are provided, and the two kinds of LED beads 2 are different in that electrode pins thereof are disposed opposite to each other, but positions of the first light emitting wafer, the second light emitting wafer, and the third light emitting wafer thereon are unchanged. As shown in fig. 9a, an input signal pin 231 and an output signal pin 232 are disposed up and down on the paper surface, a first electrode pin 233 is disposed on the left side, and a second electrode pin 234 is disposed on the right side; wherein the red light emitting chip 20r, the green light emitting chip 20g and the blue light emitting chip 20b are arranged in this order from top to bottom. As shown in fig. 9b, the input signal pin 231 and the output signal pin 232 are disposed up and down on the paper surface, the second electrode pin 234 is disposed on the left side, and the first electrode pin 233 is disposed on the right side; wherein the red light emitting chip 20r, the green light emitting chip 20g and the blue light emitting chip 20b are arranged in this order from top to bottom. The structure can enable the positions of the light-emitting wafers in the first lamp bead 2a and the second lamp bead 2b which are specially designed to be relatively fixed, and chromatic aberration of each LED lamp bead 2 can not occur due to the change of pins.

As shown in fig. 10, the signal pin pads include an input signal pin pad and an output signal pin pad;

wherein the input signal pin pad of the first bead bond pad 30 is connected to the signal pad 33 by a signal line 32; the input signal pin pads on the subsequent lamp bead bond pad 30 of the adjacent tandem lamp bead bond pad 30 are connected to the output signal pin pads on the previous lamp bead bond pad 30.

As a further preferred option, the connection of the signal lines 32 may also be achieved by means of jumper binding as shown in fig. 10. For the sake of distinction, the jumper wire implementing the signal line 32 is referred to as a signal jumper 321, that is, the bonding connection between the signal pin pad and each LED lamp bead 2 is implemented by using the signal jumper 321. In this way, the signal line 32 is also jumped, so that the transparency of the signal line can be further improved.

As shown in fig. 11, as a preferred mode, the above procedure is repeated on the basis of fig. 5, and a plurality of columns of LED lamp beads 2 share the same polarity of power supply line 31, and thus are circularly arranged, so that a large-area LED transparent display screen can be manufactured.

In addition to the above-described metal layer etched on the transparent substrate 1 as the power supply line 31, as an example, as shown in fig. 12, a mesh type may be employed as the power supply line 31. The grid can be a metal grid or an ITO (English name: indium Tin Oxides; chinese name: indium tin oxide) grid, and in the figure, dots are binding lines and binding points (electrical connection points) of the metal grid or the ITO. The conductivity of a metal grid or ITO grid is relatively small, so a large area is required to meet the current demand.

The transparent LED display screen provided by the embodiment is characterized in that at least part of the LED lamp beads 2 are directly or indirectly electrically connected with the power supply circuit 31 by adopting the mode of the power jumper 311, the diameter of the power jumper 311 is generally 10-100 mu m, the influence on the vision is almost invisible to naked eyes, and the influence on the transparency is very low because the area occupied by the power jumper 311 is very small, and the technology is simple and easy to implement by adopting the mode of binding connection, so that the transparency of the transparent LED display screen is greatly improved.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. An LED transparent display screen comprises a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the circuit pattern comprises a power supply bonding pad, a signal bonding pad and lamp bead bonding areas which are arranged in an array, and the LED lamp beads are welded on the lamp bead bonding areas;

the LED lamp bead welding device is characterized in that each lamp bead welding area is provided with a pin welding disc corresponding to a pin of the LED lamp bead; the pin pads include a signal pin pad and an electrode pin pad; the electrode pin pads comprise a first electrode pin pad and a second electrode pin pad which are opposite in polarity;

the circuit pattern also comprises a plurality of power supply lines and signal lines; the power supply line is connected to the power supply pad and comprises a first power supply line and a second power supply line which are opposite in polarity; the first power supply line is connected with the first electrode pin bonding pad, and the second power supply line is connected with the second electrode pin bonding pad;

the signal bonding pad is connected with the signal pin bonding pad on the bead bonding area through the signal line so as to realize the serial connection of the LED beads, so that control signals for controlling the on and off of the LED beads can be sequentially transmitted through the LED beads which are connected in series after being input from the signal bonding pad through the signal line;

2. The LED transparent display screen of claim 1, wherein N rows by M columns of light bead lands are provided on the circuit pattern;

3. The LED transparent display screen according to claim 2, wherein m+1 power supply pads or n+1 power supply pads are arranged on the circuit pattern;

4. The LED transparent display of claim 3, wherein the first power supply line and the second power supply line, which are disposed at intervals, and the bead welding area are both metal layers printed on a transparent substrate;

and the second electrode pin bonding pad on part of the lamp bead bonding area is integrally printed with the second power supply circuit adjacent to the second electrode pin bonding pad, and the second electrode pin bonding pad on part of the lamp bead bonding area is in binding connection with the second electrode pin bonding pad on the adjacent lamp bead bonding area by adopting a power jumper wire.

5. The LED transparent display of claim 4, wherein the first electrode pin pad and the second electrode pin pad on the light bead bond area in adjacent rows or adjacent columns are in opposite positions;

the LED lamp beads on the lamp bead welding areas on adjacent rows or adjacent columns are 180 degrees different in installation angle.

6. The LED transparent display of claim 4, wherein the first electrode pin pad and the second electrode pin pad on the light bead bond area in adjacent rows or adjacent columns are in opposite positions;

wherein, the first lamp bead and the second lamp bead which are oppositely arranged with the electrode pins are respectively arranged on the lamp bead welding areas of the adjacent rows or the adjacent columns.

7. The LED transparent display of claim 2, wherein the power supply lines comprise one row or column of the first power supply lines and one row or column of the second power supply lines;

8. The LED transparent display of claim 2, wherein the LED light beads comprise a housing, a driver chip, and a light emitting die; the light-emitting wafer comprises a first light-emitting wafer, a second light-emitting wafer and a third light-emitting wafer;

the pins comprise electrode pins and signal pins; the electrode pins comprise a first electrode pin and a second electrode pin; the signal pins comprise an input signal pin and an output signal pin;

9. The LED transparent display of claim 1, wherein the signal pin pads comprise an input signal pin pad and an output signal pin pad;

10. The LED transparent display screen of claim 9, wherein the signal lines are signal jumpers through which the bonding connection between the signal pin pads and the LED beads is achieved.

11. The LED transparent display screen of claim 10, wherein a glue layer is provided on the transparent substrate on which the LED beads are disposed, the glue layer curing each transparent LED bead therein; the upper surface of the glue filling layer is provided with a protective cover plate.