WO2023020476A1

WO2023020476A1 - Transparent led display screen

Info

Publication number: WO2023020476A1
Application number: PCT/CN2022/112734
Authority: WO
Inventors: 林谊
Original assignee: 深圳市晶泓科技有限公司
Priority date: 2021-08-19
Filing date: 2022-08-16
Publication date: 2023-02-23
Also published as: CN115713898A

Abstract

In order to overcome the problems in the existing technology that achieving the printing of a lamp bead welding area on a transparent substrate is difficult and the lamp bead welding area easily falling off, the present application provides a transparent LED display screen, which comprises a transparent substrate and LED lamp beads. A circuit pattern is arranged on the transparent substrate; the LED lamp beads are pasted on the transparent substrate; the LED lamp beads each comprise a housing, a driving chip, and a light-emitting chip; and a chip mounting surface is formed on the housing. In the transparent LED display screen provided in the present application, the LED lamp beads are fixed on the transparent substrate by using a pasting means, then the LED lamp beads are directly or indirectly electrically connected to a power supply circuit by using a power jumper wire, and series connection of the LED lamp beads is implemented by using a signal jumper wire. In this way, existing methods for welding an LED lamp bead welding area on a lamp bead welding area is replaced with the foregoing method. The method is easy to implement, and the LED lamp beads are firmly fixed and do not easily fall off.

Description

A transparent LED display

This application claims the priority of the Chinese patent application with the application number 202110955655.4 and the title of the invention "a transparent LED display" submitted to the China Patent Office on August 19, 2021, the entire contents of which are incorporated by reference in this application.

technical field

The application relates to the field of LED displays, in particular to transparent LED display screens.

Background technique

Transparent LED displays have gradually been widely used in the market, and various product forms have been developed. A transparent LED display technology that distributes LED lamp beads in an array on a transparent substrate has begun to appear. At present, a transparent LED display screen has been proposed as shown in Figure 1 and Figure 2, which includes a transparent substrate 1', a printed circuit layer 3' is provided on the transparent substrate 1', and an LED lamp bead with a driver chip is packaged. The 2' array is installed on the transparent substrate 1'; then the glue layer 5' is formed by pouring glue on the surface of the transparent substrate 1' on which the LED lamp beads 2' are arranged; then the protective cover is covered on the surface of the glue layer 5' 4'.

As shown in Figure 2, specifically, the printed circuit layer 3' includes a lamp bead welding area 31', a power supply pad 32' and a signal pad 33', etc., and each lamp bead welding area 31' is provided with two The signal pin pads and the two electrode pin pads are connected in series through printed signal lines, and the two electrode pin pads with opposite polarities are respectively printed on the transparent substrate 1'. The metal grid 30' is connected to the power pad 32' for power supply. The pins of the LED lamp bead 2' are welded on the above-mentioned signal pin pads and electrode pin pads.

This method has a certain advantage that the metal grid 30' for power supply can be directly formed on the transparent substrate 1' as a power supply circuit through the printing process; the lamp bead welding area needs to be printed on it, and then the LED lamp bead 2' is welded on the lamp bead. The electrical connection is made on the bead bonding area 31 ′. However, it is difficult to realize the process to form the lamp bead bonding area 31 ′ on the transparent substrate 1 ′, and at the same time, the lamp bead bonding area 31 ′ is easy to fall off. If the transparent substrate 1' is a PET (polyethylene terephthalate) substrate, then the prior art needs to find a way to electrically connect the pins of the lamp bead 2' to the pad on the lamp bead welding area 31' , the usual practice is to overheat the tin furnace or use silver paste to connect, both of which need to be processed under high temperature conditions, and high temperature will deform or even melt PET.

application content

In order to overcome the problems in the prior art that it is difficult to print the lamp bead welding area on the transparent substrate, and the lamp bead welding area is easy to fall off, the application provides a transparent LED display screen.

The application discloses a transparent LED display screen, which includes a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp beads are pasted on the transparent substrate; the LED lamp beads include a shell, Driver chips and light-emitting chips;

A chip mounting surface is formed on the housing, the driving chip is mounted on the chip mounting surface, and the light-emitting chip is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip;

The chip mounting surface includes an isolation channel and bonding pads isolated from each other by the isolation channel, and the bonding pad includes electrode pads and input and output pads; the electrode pads include first electrode pads with opposite polarities. pad and a second electrode pad; the input and output pads include signal input pads and signal output pads;

The circuit pattern includes a power supply pad, a signal pad and a power supply line; the power supply line includes a number of first power supply lines and second power supply lines with opposite polarities; the power supply pad connects the first power supply line and the the second power supply line;

The first electrode pad is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pad is directly or indirectly bound to the second power supply line through a power jumper;

Each of the LED lamp beads is bound and connected by a signal jumper to form a lamp bead string, wherein the signal input pad of each of the LED lamp beads in the lamp bead string is connected to the signal pad or the previous one through a signal jumper. The signal output pad of the LED lamp bead; the signal output pad of each LED lamp bead is bound and connected to the signal input pad of the next LED lamp bead through a signal jumper.

The transparent LED display disclosed in this application only needs to form a power supply circuit on the transparent substrate, and does not need to print and form the lamp bead welding area as in the prior art. It adopts the method of pasting to fix the LED lamp beads on the transparent substrate, and then Use the power jumper to directly or indirectly connect each LED lamp bead to the power supply line, use the signal jumper to realize the serial connection of the LED lamp bead, and use the above method to replace the existing welding area of the LED lamp bead on the lamp bead welding area The way. It is easy to implement by using the above-mentioned method of pasting and fixing the LED lamp beads, and the LED lamp beads are fixed firmly and not easy to fall off. The power jumper is used to realize the power supply of each lamp bead and the signal jumper is used to realize the signal transmission, which is also easy to implement in terms of technology. . At the same time, the adoption of this method greatly improves the transparency of the transparent LED display.

In the above-mentioned transparent LED display screen of the present application, binding pins are drawn from the binding pad; the binding pins include electrode pins and input and output pins; The first electrode pin and the second electrode pin; the input and output pins include signal input pins and signal output pins;

The first electrode pin is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power jumper;

The signal input pins of each of the LED lamp beads in the lamp bead string are bound and connected to the signal pad or the signal output pin of the previous LED lamp bead through a signal jumper; the signal output pins of each of the LED lamp beads The pins are connected to the signal input pins of the latter LED bead through binding of signal jumpers.

In the above-mentioned transparent LED display screen of the present application, the first electrode pads or first electrode pins on each of the LED lamp beads are bound and connected to the first power supply line or its adjacent LED lamp beads through a power jumper. The first electrode pads or first electrode pins on each LED lamp bead; the second electrode pads or second electrode pins on each LED lamp bead are bound and connected to the second power supply line, or its Adjacent to the second electrode pad or the second electrode pin on the LED lamp bead; so that each LED lamp bead can directly obtain power from the power supply line, or obtain power from its adjacent LED lamp bead.

In the above-mentioned transparent LED display screen of the present application, the LED lamp bead is a CHIP type LED lamp bead, the shell of the CHIP type LED lamp bead is a circuit board, and the copper foil on the front of the circuit board is etched to form the Chip mounting surface.

In the above-mentioned transparent LED display screen of the present application, a driver chip is provided on the chip mounting surface of the CHIP type LED lamp bead, and the light-emitting chip is installed on the driver chip; the driver chip is packaged in a transparent sealing layer , the chip mounting surface exposes the bonding pad.

In the above-mentioned transparent LED display screen of the present application, the LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a shell using a plastic bracket; On the surface, binding pins extend from the chip mounting surface and bend towards the bottom of the plastic bracket.

In the above-mentioned transparent LED display screen of the present application, the LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a shell using a plastic bracket; On the surface, binding pins extend from the chip mounting surface and bend toward the top of the plastic bracket.

In the above-mentioned transparent LED display screen of the present application, the light-emitting chip is installed on the driving chip by means of CSP or COC.

In the above-mentioned transparent LED display screen of the present application, the power supply lines include a plurality of the first power supply lines and the second power supply lines arranged at intervals in rows or columns; the first power supply lines and the second power supply lines Several rows or columns of the LED lamp beads are arranged between the circuits; the above-mentioned LED lamp beads share the first power supply circuit and the second power supply circuit.

In the above-mentioned transparent LED display screen of the present application, the power supply line is a conductive grid or an ITO conductive film or a nano-silver film.

In the above-mentioned transparent LED display screen of the present application, a glue filling layer is provided on the transparent substrate on which the LED lamp beads are arranged, and the glue filling layer encapsulates each of the LED lamp beads; the upper surface of the glue filling layer The surface is provided with a protective cover.

In the above-mentioned transparent LED display screen of the present application, several transparent unit boards are arranged on the transparent substrate; A power supply line; the LED lamp beads on each of the transparent unit boards are connected to the power supply line.

Description of drawings

Fig. 1 is a schematic cross-sectional view of a transparent LED display disclosed in the prior art;

Fig. 2 is a schematic top view of a transparent LED display disclosed in the prior art;

Fig. 3 is a partial cross-sectional schematic diagram of a transparent LED display screen using CHIP type LED lamp beads provided in the specific embodiment of the present application;

Fig. 4 is a schematic top view of a transparent LED display using CHIP-type LED lamp beads provided in the specific embodiment of the present application;

Fig. 5a is a three-dimensional schematic diagram of a CHIP-type LED lamp bead provided in the specific method of the present application;

Fig. 5b is a three-dimensional schematic diagram of the CHIP type LED lamp bead in Fig. 5a after further adding transparent encapsulation;

Fig. 6 is a schematic top view after the further expansion of the transparent LED display using CHIP type LED lamp beads provided in the specific embodiment of the application;

Fig. 7 is a schematic top view of another transparent LED display using CHIP LED lamp beads provided in the specific embodiment of the present application;

Fig. 8 is a schematic diagram of further deformation of the transparent LED display in Fig. 7;

Fig. 9 is a schematic partial cross-sectional view of the transparent LED display in Fig. 8;

Fig. 10 is a further expanded transparent LED display provided in the specific embodiment of the application;

Fig. 11 is a schematic cross-sectional view of a transparent display screen using a TOP type LED lamp bead in a specific embodiment of the present application;

Fig. 12a is a partial cross-sectional stereoscopic schematic diagram of the TOP type LED lamp bead in Fig. 10 and Fig. 11;

Fig. 12b is a three-dimensional schematic diagram of a TOP type LED lamp bead in Fig. 10 and Fig. 11;

Fig. 13 is a partial cross-sectional schematic diagram of a transparent LED display using another TOP type LED lamp bead provided in the specific embodiment of the present application;

Fig. 14a is a partial sectional stereoscopic schematic diagram of the TOP type LED lamp bead in Fig. 13;

Fig. 14b is a schematic perspective view of the TOP type LED lamp bead in Fig. 13 .

Reference signs in the background technology are as follows: 1', transparent substrate; 2', LED lamp bead; 3', printed circuit layer; 4', protective cover plate; 5', glue filling layer; 31', lamp bead welding area ; 32', power pad; 33, signal pad; 30', metal grid;

Reference signs in the specific implementation manner: 1. Transparent substrate; 2. LED lamp bead; 3. Circuit pattern; 4. Protective cover plate; 5. Glue filling layer; 6. Transparent unit board; 20. Light-emitting chip; Chip; 22, shell; 23, chip mounting surface; 231, bonding pad; 232, isolation channel; 31, power supply line; 31a, first power supply line; 31b, second power supply line; 32, signal jumper; 33 , signal pad; 311, power jumper; 2311, binding pin.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

In the description of the present application, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", The orientation or positional relationship indicated by "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" etc. is based on the orientation or positional relationship shown in the drawings, It is only for the purpose of describing the present application and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, unless otherwise specified, "plurality" means two or more.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

Example

This example will specifically explain the transparent LED display disclosed in the present application as follows, as shown in Figure 1, it includes a transparent substrate 1 and LED lamp beads 2; a circuit pattern 3 is arranged on the transparent substrate 1; the LED lamp beads 2 paste on the transparent substrate 1; the so-called paste refers to fixing with glue, and the glue can be various glues known to those skilled in the art, such as instant glue, epoxy resin bonding class, anaerobic glue, UV Glue hot melt adhesive, pressure sensitive adhesive, etc.

Generally, a glue-filling layer 5 is also provided on the transparent substrate 1 on which the LED lamp beads 2 are arranged, and the glue-filling layer 5 encapsulates each of the LED lamp beads 2 therein; the upper surface of the glue-filling layer 5 A protective cover 4 is provided. This is well known to those skilled in the art.

As shown in Fig. 5a, Fig. 5b, Fig. 12a, Fig. 12b, Fig. 14a, and Fig. 14b in several ways, the LED lamp bead 2 includes a housing 22, a driver chip 21 and a light emitting chip 20; its types usually include CHIP type and TOP type. kind of structure. Wherein, the LED lamp bead 2 shown in Fig. 5a and Fig. 5b is a CHIP type LED lamp bead, and Fig. 12a, Fig. 12b, Fig. 14a, and Fig. 14b are two different types of TOP type LED lamp beads.

Taking the CHIP type LED lamp bead as an example, as shown in FIG. On the above-mentioned driving chip 21 (or also can be that light-emitting chip 20 is installed on the described chip installation surface 23), be controlled by described driving chip 21;

Wherein, the chip mounting surface 23 includes an isolation channel 232 and a bonding pad 231 isolated from each other by the isolation channel 232, and the bonding pad 231 includes an electrode pad (not marked in the figure) and an input/output pad (in the figure). The electrode pads include a first electrode pad (not marked in the figure) and a second electrode pad (not marked in the figure) with opposite polarities; the input and output pads include signal input pads (not marked in the figure) and signal output pad (not marked in the figure);

As shown in Figures 3-4, the circuit pattern 3 includes a power pad (not shown), a signal pad 33 and a power supply line 31; the power supply line 31 includes a number of first power supply lines with opposite polarities 31a and the second power supply line 31b; the power pad is connected to the first power supply line 31a and the second power supply line 31b;

The first electrode pad is directly or indirectly bound to the first power supply line 31a through the power jumper 311, and the second electrode pad is directly or indirectly bound to the second power supply line through the power jumper 311 31b;

Each of the LED lamp beads 2 is bound and connected by a signal jumper 32 to form a lamp bead string, wherein the signal input pad of each of the LED lamp beads 2 in the lamp bead string is connected to the signal soldering pad by a signal jumper 32 . plate 33 or the signal output pad of the previous LED bead 2; the signal output pads of each LED bead 2 are bound and connected to the signal input pads of the next LED bead 2 through the signal jumper 32. If there is no other LED bead 2 behind the current LED bead 2, the signal output pad is empty or connected back to the signal pad.

Generally, pins are led out from the traditional LED lamp bead, and the pins are used to electrically connect with pads arranged on the substrate, for example, on the soldering area of the lamp bead. However, in this application, since the welding action is not required, but the power jumper 311 and the signal jumper 32 are directly used on the LED lamp bead 2 to realize electrical connection and signal transmission, therefore, the pin is not necessary of. However, it is also possible to add pins in this application, but the pins in this application are not used for welding connection with pads. For the sake of distinction, the pins in this example are named binding pins 2311 .

As a preferred manner, a binding pin 2311 is drawn out from the binding pad 231; the binding pin 2311 includes electrode pins and input and output pins; An electrode pin and a second electrode pin; the input and output pins include signal input pins and signal output pins;

The first electrode pin is directly or indirectly bound to the first power supply line 31a through the power jumper 311, and the second electrode pin is directly or indirectly bound to the second power supply line through the power jumper 311 31b;

The signal input pins of each of the LED lamp beads 2 in the lamp bead string are bound and connected to the signal pad 33 or the signal output pin of the previous LED lamp bead 2 through the signal jumper 32; The signal output pin of the bead 2 is bound and connected to the signal input pin of the next LED lamp bead 2 through the signal jumper 32 .

Regarding the direct or indirect connection between the binding pad 231 or the binding pin 2311 and the power supply line 31, the following specific explanations are as follows. As shown in FIG. 3 and FIG. The plate or the first electrode pin is bound and connected to the first power supply line 31a, or the first electrode pad or the first electrode pin on its adjacent LED lamp bead 2 through the power jumper 311; The second electrode pad or the second electrode pin on the bead 2 is bound and connected to the second power supply line 31b through the power jumper 311, or it is adjacent to the second electrode pad or the second electrode on the LED lamp bead 2 Pins; so that each LED lamp bead 2 can directly obtain power from the power supply line 31, or obtain power from its adjacent LED lamp bead 2.

The power jumper 311 , the signal jumper 32 , and the transfer jumper 313 in this example are binding wires or bonding wires understood by those skilled in the art. Here, they are only used to distinguish devices, and they are named respectively. The above-mentioned power jumper 311 and signal jumper 32 preferably have a diameter of 15 μm-70 μm and are made of gold wire, copper wire or alloy wire. Because of its small diameter, it is almost invisible to the naked eye. While the lamp bead 2 is working with current, it reduces the obstruction to the line of sight and improves the transparency of the product.

Although the power jumper 311 and the signal jumper 32 cross each other in the schematic diagram, they are bonded at different heights in the actual production process, and then fixed by glue filling, so there will be no collapse and short circuit Case.

The shell 22 in the CHIP type LED lamp bead is a circuit board, and the copper foil on the front of the circuit board is etched to form the chip mounting surface 23, that is, after the circuit board is etched, the etched place forms an isolation channel 232 , the bonding pad 231 is formed at the unetched part. The difference between the CHIP type LED lamp bead in this example and the traditional CHIP type LED lamp bead is that there is no need to form pins on the back, and pins 23 are formed on the back; the circuit board generally uses such as glass epoxy resin or polyamide The insulating material of imide is known to the public as the base CHIP package structure. In this example, it is emphasized that there is no need to have pins, and details will not be repeated. As a preferred manner, as shown in FIG. 5b, the light-emitting chip 20 is installed on the driving chip 21; the driving chip 21 is packaged in a transparent sealing layer, and the chip mounting surface 23 exposes the bonding pad 231 . In this way, the light-emitting chip 20 and the driving chip 21 can be packaged and protected through a transparent sealing layer.

In this example, regarding the installation method of the light emitting chip 20, preferably the light emitting chip 20 is installed on the driving chip 21 by way of CSP (English full name: Chip Scale Package, Chinese full name: Chip Scale Package). It can also be installed on the driver chip 21 by means of COC (full name in English: Chip On Chip, full name in Chinese: chip on chip). The light-emitting chips 20 generally include light-emitting chips 20 of three colors: red, green and blue.

As a preferred manner, the power supply line 31 includes a plurality of the first power supply line 31a and the second power supply line 31b arranged at intervals in rows or columns; the first power supply line 31a and the second power supply line Several rows or columns of the LED lamp beads 2 are arranged between 31b; the above-mentioned LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b. As shown in Figure 6, the first power supply line 31a, the second power supply line 31b and the first power supply line 31a are arranged at intervals; wherein, there are 4 rows between the first power supply line 31a and the second power supply line 31b on the left side. Columns of LED lamp beads 2; the above-mentioned 4 rows and 4 columns of LED lamp beads 2 share the first power supply line 31a and the second power supply line 31b. There are also 4 rows and 4 columns of LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b on the right; the above-mentioned 4 rows and 4 columns of LED lamp beads 2 share the first power supply line 31a and the second power supply line on the right Line 31b.

By adopting the above method, several columns or rows of LED lamp beads 2 share the power supply line 31 of the same polarity, and such circular arrangement can make a large-area transparent LED display screen. Several LED lamp beads 2 sharing the power supply line 31 can reduce the number of power supply lines 31, reduce the obstruction to the line of sight, and help to improve the transparency of the display screen.

The present application is not limited to the implementation manner of the power supply line 31, which is not the core innovation content of the present application, and implementations known to those skilled in the art can be adopted. The number of the first power supply line 31a and the second power supply line 31b can be There may be only one of them, or there may be a plurality of them, and the numbers of the first power supply lines 31a and the second power supply lines 31b may be the same or different. The specific number depends on the power supply capacity of the power supply line 31 and the current demand of the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b. Generally, the number of LED lamp beads 2 is 3 Up to 8 columns is an ideal number.

The form of the power supply line 31 may be straight, curved, or serpentine. As a preferred manner, generally, each power supply line 31 is arranged in a row or a column, and its implementation is not limited, as long as it can provide power supply. For example, it can be a metal layer etched on the transparent substrate 1, or a metal grid, it can also be a nano-silver coating or an ITO coating, or it can be a metal wire laid out in the applicant's previous patent application, or buried in Metal sheet in the transparent substrate 1 etc. realizes.

As a preferred manner, as shown in FIG. 7 , preferably, the power supply line 31 is a conductive grid. The conductive grid can be a metal grid or ITO, and the dots in the figure are the binding points (electrical connection points) between the bonding wire and the metal grid or ITO. Metal mesh or ITO has a large square resistance and relatively small conductivity, so a large area is required to meet the current demand. In this figure, the conductive grid is arranged on both sides of several rows of LED lamp beads 2, and the LED lamp beads 2 between the first power supply line 31a and the second power supply line 31b in the form of conductive grid share the above-mentioned first power supply line 31a and the second power supply line 31b. The second power supply line 31b. At this time, it is only necessary to paste the LED lamp bead 2 on the glass substrate.

As shown in FIG. 8 and FIG. 9 , in order to enhance the conductivity of the conductive grid and expand the area of the conductive grid, the LED lamp bead 2 can be insulated and pasted on the conductive grid. For example, the left two rows of LED lamp beads 2 in the figure are arranged on the conductive grid of the first power supply line 31a, and the right two rows of LED lamp beads 2 in the figure are arranged on the conductive grid of the second power supply line 31b.

As for the design of the power supply line 31, other forms of deformation are also possible. For example, as shown in FIG. 10, several transparent unit boards 6 are arranged on the transparent substrate 1; On the board 6 ; both sides of each transparent unit board 6 are provided with metal strips as power supply lines 31 ; The power supply lines 31 on both sides are respectively a first power supply line 31a and a second power supply line 31b. In this way, there is no power supply line 31 on the surface of the transparent substrate 1 , but it is embedded between two transparent unit boards 6 . The transparent unit panels 6 are mutually independent glass plates, and each transparent unit panel 6 is fixed on the whole transparent substrate 1 below. The advantage of this method is that the cross-section of the metal strip is extremely small in the viewing direction of the screen, which can ensure sufficient current supply to several LED lamp beads 2 between the two power supply lines 31 with opposite polarities, which greatly reduces the impact of conductive materials on the screen. The blocking of the line of sight improves the transparency of the screen.

As shown in Figure 11, as an alternative, TOP-type LED lamp beads can also be pasted on the transparent substrate 1 to achieve, as shown in Figures 12a and 12b, the so-called TOP-type structure refers to the use of PLCC (full name in Chinese: with lead wires) Plastic chip carrier; English full name: Plastic Leaded Chip Carrier) plastic support is used as the structure of shell 22 (English name housing, some in Chinese also claim base or support). The process is well known to the public, and generally includes metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional inkjet and other processes. Its core is to form a chip mounting surface 23 through metal strips on the surface of the plastic bracket; and binding pins 2311 extend from the chip mounting surface 23 . The bonding pin 2311 in this example is no longer used for soldering, but for bonding connection. It binds the pin 2311 and bends towards the bottom of the plastic bracket. A binding pin 2311 in a zigzag structure is formed. The bonding pad 231 is actually a metal sheet of the same material as the bonding pin 2311. The metal sheet is stamped and formed, and the vacant place is filled with injection molding to form the isolation channel 232. The isolation channel 232 is actually an insulating plastic material. The binding pins 2311 are spaced apart and function to fix the shell 22 at the same time. Specifically, the bonding pads 231 include electrode pads and input/output pads.

The driver chip 21 is known to the public. Generally, the driver chip 21 is internally integrated with a driver circuit, and a passivation layer is provided on the driver chip 21 . The passivation layer is a surface insulating layer formed when the driver chip 21 is manufactured. The driving chip 21 is provided with several pins (or called terminals), and the pins on the driving chip 21 are electrically connected to the chip mounting surface 23 and the light-emitting chip 20 through direct welding or through bonding wires. The pin (English name: PAD) is generally arranged on the passivation layer, and the pin is a terminal inside the chip.

As another implementation manner, as shown in FIG. 13 , the TOP type LED lamp bead 2 shown in the figure may also be pasted on the transparent substrate 1 . As shown in Figure 14a and Figure 14b of this TOP type LED lamp bead, binding pins 2311 extend from the chip mounting surface 23, and the binding pins 2311 can also be bent toward the top of the plastic bracket .

The transparent LED display disclosed in this application only needs to form a power supply circuit on the transparent substrate 1, and does not need to be printed to form a lamp bead welding area as in the prior art, and the LED lamp bead 2 is fixed on the transparent substrate 1 by pasting. Then use the power jumper 311 to directly or indirectly connect each LED lamp bead 2 to the power supply line 31, use the signal jumper 32 to realize the serial connection of the LED lamp bead 2, and use the above method to replace the existing LED lamp bead 2 The way the lamp bead welding area is welded on the lamp bead welding area. The method of pasting and fixing the above-mentioned LED lamp beads 2 is easy to implement, and avoids the disadvantage that the lamp bead welding area is difficult to make on the transparent substrate, and the LED lamp beads 2 are fixed firmly and are not easy to fall off. The power supply of the beads and the signal transmission using the signal jumper 32 are also easy to implement in terms of technology. With this technical means, the LED lamp bead 2 can be firmly bonded at room temperature, and the bonding and wiring are also carried out at room temperature, thus avoiding the high temperature environment and providing a very good solution for the production of flexible transparent screens with PET as the substrate. technical means. At the same time, the adoption of this method greatly improves the transparency of the transparent LED display.

The above descriptions are only preferred embodiments of the application, and are not intended to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the application should be included in the protection of the application. within range.

Claims

A transparent LED display screen, which includes a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp beads are pasted on the transparent substrate; the LED lamp beads include a shell, a driving chip and light-emitting chips;

A chip mounting surface is formed on the housing, the driving chip is mounted on the chip mounting surface, and the light-emitting chip is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip;

The chip mounting surface includes an isolation channel and bonding pads isolated from each other by the isolation channel, and the bonding pad includes electrode pads and input and output pads; the electrode pads include first electrode pads with opposite polarities. pad and a second electrode pad; the input and output pads include signal input pads and signal output pads;

The circuit pattern includes a power supply pad, a signal pad and a power supply line; the power supply line includes a number of first power supply lines and second power supply lines with opposite polarities; the power supply pad connects the first power supply line and the the second power supply line;

The first electrode pad is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pad is directly or indirectly bound to the second power supply line through a power jumper;

Each of the LED lamp beads is bound and connected by a signal jumper to form a lamp bead string, wherein the signal input pad of each of the LED lamp beads in the lamp bead string is connected to the signal pad or the previous one through a signal jumper. The signal output pad of the LED lamp bead; the signal output pad of each LED lamp bead is bound and connected to the signal input pad of the next LED lamp bead through a signal jumper.
The transparent LED display according to claim 1, wherein binding pins are drawn from the binding pad; the binding pins include electrode pins and input and output pins; the electrode pins include a first electrode pin and a second electrode pin with opposite polarities; the input and output pins include signal input pins and signal output pins;

The first electrode pin is directly or indirectly bound to the first power supply line through a power jumper, and the second electrode pin is directly or indirectly bound to the second power supply line through a power jumper;

The signal input pins of each of the LED lamp beads in the lamp bead string are bound and connected to the signal pad or the signal output pin of the previous LED lamp bead through a signal jumper; the signal output pins of each of the LED lamp beads The pins are connected to the signal input pins of the latter LED bead through binding of signal jumpers.
The transparent LED display screen according to claim 1 or 2, wherein the first electrode pads or first electrode pins on each of the LED lamp beads are bound and connected to the first power supply line, Or it is adjacent to the first electrode pad or the first electrode pin on the LED lamp bead; the second electrode pad or the second electrode pin on each LED lamp bead is bound and connected to the first electrode pin through the power jumper. Two power supply lines, or the second electrode pads or second electrode pins on its adjacent LED lamp beads; so that each LED lamp bead can directly take power from the power supply line, or take power from its adjacent LED lamp beads .
The transparent LED display screen according to claim 1, wherein the LED lamp bead is a CHIP type LED lamp bead, the shell of the CHIP type LED lamp bead is a circuit board, and the copper foil on the front of the circuit board is etched Afterwards, the chip mounting surface is formed.
The transparent LED display screen according to claim 4, wherein a driver chip is provided on the chip mounting surface of the CHIP type LED lamp bead, and the light-emitting chip is installed on the driver chip; the driver chip is packaged in a transparent In the sealant layer, the chip mounting surface exposes the bonding pad.
The transparent LED display screen according to claim 2, wherein the LED lamp bead is a TOP-type LED lamp bead; the TOP-type LED lamp bead includes a shell using a plastic bracket; the surface of the plastic bracket is passed through a metal material The strip forms a chip mounting surface, binding pins extend from the chip mounting surface, and are bent toward the bottom of the plastic support.
The transparent LED display screen according to claim 2, wherein, the LED lamp bead is a TOP type LED lamp bead; the TOP type LED lamp bead includes a shell adopting a plastic bracket; the surface of the plastic bracket is passed through a metal material The ribbon forms a chip mounting surface from which binding pins extend and are bent towards the top of the plastic support.
The transparent LED display screen according to claim 1, wherein the light-emitting chip is mounted on the driving chip by means of CSP or COC.
The transparent LED display screen according to claim 1, wherein, the power supply lines include a plurality of the first power supply lines and the second power supply lines arranged at intervals in rows or columns; the first power supply lines and the Several rows or columns of the LED lamp beads are arranged between the second power supply lines; the above-mentioned LED lamp beads share the first power supply line and the second power supply line.
The transparent LED display screen according to claim 1, wherein the power supply line is a conductive grid or an ITO conductive film or a nano-silver film.
The transparent LED display screen according to claim 1, wherein the transparent substrate on which the LED lamp beads are arranged is provided with a glue filling layer, and the glue filling layer encapsulates each of the LED lamp beads; The upper surface of the adhesive layer is provided with a protective cover plate.
The transparent LED display screen according to claim 11, wherein a plurality of transparent unit boards are arranged on the transparent substrate; the LED lamp beads are pasted on the transparent unit boards; There are metal strips as power supply lines; the LED lamp beads on each transparent unit board are connected to the power supply lines.