CN214895666U

CN214895666U - Electronic equipment mainboard conduction testing device

Info

Publication number: CN214895666U
Application number: CN202121613942.9U
Authority: CN
Inventors: 邓晓斌; 廖灿; 邓秋艳; 李本亮
Original assignee: Huaying Yingsheng Electronics Co ltd
Current assignee: Huaying Yingsheng Electronics Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-11-26
Anticipated expiration: 2031-07-14

Abstract

The utility model provides an electronic equipment mainboard conduction testing device, which comprises a bearing component and a compressing component distributed above the bearing component; the bearing assembly at least comprises an object stage, wherein an embedding hole is formed in the object stage in a penetrating mode, a limiting table is embedded in the embedding hole, a limiting groove used for containing a mainboard is arranged on the upper surface of the limiting table, and a testing hole is formed in the bottom of the limiting groove in a penetrating mode; a flange is arranged on the outer edge of the upper side of the limiting table, and a shifting plate is arranged on the flange; when the limiting table is embedded in the nesting hole, the flange is arranged on the upper surface of the object stage in a lapping mode. The utility model discloses a with the structural design of spacing platform nestification in the nested hole that inlays, the flange that sets up on the spacing platform of cooperation and dial the board, the mainboard that the staff of being convenient for will test the completion takes out from the spacing groove, has improved work efficiency to spacing platform is removable, can test the mainboard of different specifications, has saved the test cost.

Description

Electronic equipment mainboard conduction testing device

Technical Field

The utility model relates to an electronic equipment tests technical field, particularly, relates to an electronic equipment mainboard conduction testing device.

Background

A motherboard is one of the most basic and important components of an electronic device. Before assembling the mainboard with other parts, need carry out the conduction test to the mainboard, traditional test adopts artificial mode to go on more, and inefficiency on the one hand, and on the other hand test result error is big.

Chinese patent publication No. CN205280865U discloses an electronic device motherboard conduction testing apparatus, which includes: the upper module is provided with a mounting position for bearing a mainboard to be tested, and the mounting position is provided with a through hole for exposing a mainboard test point from the through hole; the lower module is arranged below the upper module and is away from the mainboard bearing structure by a certain distance, a metal probe is arranged on the lower module, and the metal probe is arranged right below the through hole; and the driving structure is used for applying downward pressure to the upper module and driving the upper module to be switched between a pressing state and a resetting state. The utility model discloses a can realize the short-term test of electronic equipment mainboard, can improve the test yield.

However, the above patent needs to put the mainboard into the groove for spacing back test when in operation, but because the mainboard inlays and establishes in the groove after the test is accomplished, leads to it to be difficult to take out to lead to work efficiency to reduce. In view of this, the present application is specifically made.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model aims to provide an electronic equipment mainboard conduction testing device, its getting of being convenient for mainboard is put, can test the mainboard of different specifications, and the practicality is strong.

The embodiment of the utility model discloses a realize through following technical scheme:

a mainboard conduction testing device of electronic equipment comprises a bearing component and a pressing component distributed above the bearing component; the bearing assembly at least comprises an object stage, wherein an embedding hole is formed in the object stage in a penetrating mode, a limiting table is embedded in the embedding hole, a limiting groove used for containing a mainboard is arranged on the upper surface of the limiting table, and a testing hole is formed in the bottom of the limiting groove in a penetrating mode; a flange is arranged on the outer edge of the upper side of the limiting table, and a shifting plate is arranged on the flange; when the limiting table is embedded in the nesting hole, the flange is arranged on the upper surface of the object stage in a lapping mode.

According to a preferred embodiment, the bearing assembly further comprises a base and a probe plate, wherein a test slot is configured on the upper surface of the base, the object stage and the probe plate are embedded in the test slot, and the probe plate is distributed between the object stage and the inner side surface of the bottom of the test slot; and probes corresponding to the test holes are arranged on the upper surface of the probe board.

According to a preferred embodiment, the lower surface of the object stage is provided with at least one guide post, the bottom of the test slot is provided with telescopic holes which correspond to the guide posts one by one, springs are embedded in the telescopic holes, and the lower ends of the springs are connected to the bottoms of the telescopic holes; the lower end of the guide column penetrates through the probe board and is embedded in the corresponding telescopic hole, and the guide column is abutted to the upper end of the spring.

According to a preferred embodiment, the probe card is provided with guide holes corresponding to the guide posts one by one, and the guide posts are provided with corresponding guide holes.

According to a preferred embodiment, the upper surface of the probe card is provided with an extension block corresponding to the test hole, and the probe is disposed on the upper surface of the extension block.

According to a preferred embodiment, the pressing assembly comprises an expansion member arranged above the limiting table, and a pressing plate is arranged at the lower end of the expansion member.

According to a preferred embodiment, the lower surface of the pressure plate is provided with a cushioning pad.

The utility model discloses technical scheme has following advantage and beneficial effect at least:

(1) the utility model discloses a with the structural design of spacing platform nestification in the nested hole that inlays, the flange that sets up on the spacing bench of cooperation and dial the board, the mainboard that the staff of being convenient for will test the completion is taken out from the spacing groove, has improved work efficiency.

(2) The utility model discloses the spacing platform that sets up is removable, can test the mainboard of different specifications, has saved the test cost.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic front view of the present invention;

fig. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic top view of the bearing assembly of the present invention;

FIG. 4 is a cross-sectional view of section A-A of FIG. 3;

fig. 5 is a schematic top view of the probe card according to the present invention.

Icon: 1-base, 2-objective table, 3-flange, 4-shifting plate, 5-buffer pad, 6-pressing plate, 7-telescopic piece, 8-limiting groove, 9-testing hole, 10-limiting table, 11-probe, 12-extending block, 13-probe plate, 14-nesting hole, 15-testing groove, 16-guide column, 17-telescopic hole, 18-spring and 19-guide hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, the description is only for convenience of description and simplification, but the indication or suggestion that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus, cannot be understood as a limitation of the present invention.

In the description of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 5, an apparatus for testing a motherboard conduction of an electronic device includes a carrier assembly and a pressing assembly disposed above the carrier assembly. The bearing component at least comprises an object stage 2, an embedding hole 14 is formed in the object stage 2 in a penetrating mode, a limiting table 10 is embedded in the embedding hole 14, a limiting groove 8 used for containing a main board is configured on the upper surface of the limiting table 10, and a testing hole 9 is formed in the bottom of the limiting groove 8 in a penetrating mode. The upper outer edge of the stopper 10 is provided with a flange 3, and a dial plate 4 is arranged on the flange 3. When the position limiting table 10 is embedded in the embedding hole 14, the flange 3 is erected on the upper surface of the object stage 2. Specifically, as shown in fig. 3 and 4, when the test tool is used, a worker places the main board in the limiting groove 8, a detection point of the main board penetrates through the test hole 9, the main board is pressed tightly under the action of the pressing component to complete related tests, then the pressing component is separated from the main board, the worker takes out the limiting table 10 from the nesting hole 14 through the shifting plate 4, and the main board is poured out of the limiting groove 8 by turning the limiting table 10. In this embodiment, the limiting table 10 is replaceable, so that the motherboards with different specifications can be tested, and the requirement is that the outlines of the limiting grooves 8 formed in the different limiting tables 10 correspond to the to-be-tested motherboards with different specifications, so that the testing cost is saved.

As shown in fig. 4, the bearing assembly further includes a base 1 and a probe 11 plate, a test slot 15 is configured on the upper surface of the base 1, the object stage 2 and the probe 11 plate are both embedded in the test slot 15, and the probe 11 plate is distributed between the inner side surfaces of the bottom of the object stage 2 and the test slot 15. Probes 11 corresponding to test wells 9 are disposed on the upper surface of the probe 11 plate. The test slot 15 here limits the position of the object stage 2, so that it ensures that the probes 11 correspond to the positions of the test points on the motherboard during testing. Further, the lower surface of the object stage 2 is provided with at least one guide post 16, the bottom of the test slot 15 is provided with telescopic holes 17 corresponding to the guide posts 16 one by one, a spring 18 is embedded in the telescopic holes 17, and the lower end of the spring 18 is connected to the bottom of the telescopic holes 17. The lower end of the guide post 16 penetrates the probe 11 plate and is embedded in the telescopic hole 17 corresponding thereto, and abuts against the upper end of the spring 18. When using, compress tightly the subassembly and exert pressure to the mainboard for the mainboard is close to probe 11 board at vertical together with objective table 2, and probe 11 is close to each other with the test point promptly, and meanwhile, guide post 16 compression spring 18, objective table 2 under the cooperation of guide post 16 and telescopic hole 17, do not have the displacement in the horizontal, can guarantee the mainboard test point and the correspondence of probe 11 position, have improved the reliability of test result. After the test is completed, the hold-down assembly is disengaged from the main plate, the stage 2 is reset by the action of the spring 18, and the main plate is disengaged from the probe 11. Preferably, the number of guide posts 16 is two.

As shown in fig. 5, guide holes 19 corresponding to the guide posts 16 are formed through the probe 11, and the guide posts 16 are formed through the corresponding guide holes 19. In this embodiment, the probe 11 board and the limiting table 10 are used in a matching manner, and only the corresponding probe 11 board and the limiting table 10 need to be replaced for the main boards of different specifications.

In this embodiment, an extension block 12 corresponding to the test hole 9 is disposed on the upper surface of the probe 11 plate, and the probe 11 is disposed on the upper surface of the extension block 12. The extension block 12 is fitted to the test well 9.

As shown in fig. 1, the pressing assembly includes an extensible member 7 disposed above the limit table 10, and a pressing plate 6 is disposed at a lower end of the extensible member 7. Further, a cushion pad 5 is disposed on the lower surface of the platen 6. In this embodiment, the expansion member 7 is a hydraulic cylinder, and the cushion pad 5 is made of soft rubber to prevent the main board from being damaged by pressure injury. In this embodiment, the extensible member 7 and the base 1 are both disposed on the frame.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an electronic equipment mainboard conduction testing arrangement which characterized in that: the device comprises a bearing component and a pressing component distributed above the bearing component;

the bearing assembly at least comprises an object stage (2), an embedding hole (14) penetrates through the object stage (2), a limiting table (10) is embedded in the embedding hole (14), a limiting groove (8) used for containing a main board is arranged on the upper surface of the limiting table (10), and a testing hole (9) penetrates through the bottom of the limiting groove (8); a flange (3) is arranged on the outer edge of the upper side of the limiting table (10), and a shifting plate (4) is arranged on the flange (3);

when the limiting table (10) is embedded in the embedding hole (14), the flange (3) is erected on the upper surface of the object stage (2).

2. The electronic device motherboard conduction test apparatus of claim 1, wherein: the bearing assembly further comprises a base (1) and a probe (11) plate, a test slot (15) is configured on the upper surface of the base (1), the objective table (2) and the probe (11) plate are embedded in the test slot (15), and the probe (11) plate is distributed between the objective table (2) and the inner side surface of the bottom of the test slot (15);

and the upper surface of the probe (11) plate is provided with a probe (11) corresponding to the test hole (9).

3. The electronic device motherboard conduction test apparatus of claim 2, wherein: the lower surface of the object stage (2) is provided with at least one guide post (16), the bottom of the test slot (15) is provided with telescopic holes (17) which correspond to the guide posts (16) one by one, a spring (18) is embedded in each telescopic hole (17), and the lower end of each spring (18) is connected to the bottom of each telescopic hole (17);

the lower end of the guide column (16) penetrates through the probe (11) plate and is embedded in a telescopic hole (17) corresponding to the guide column, and the lower end of the guide column is abutted to the upper end of the spring (18).

4. The electronic device motherboard conduction test apparatus of claim 3, wherein: the probe (11) plate is provided with guide holes (19) which are in one-to-one correspondence with the guide posts (16) in a penetrating mode, and the guide posts (16) penetrate through the guide holes (19) which are in correspondence with the guide posts.

5. The electronic device motherboard conduction test apparatus of claim 2, wherein: the upper surface of probe (11) board dispose with test hole (9) correspond extension piece (12), probe (11) set up in the upper surface of extension piece (12).

6. The electronic device motherboard conduction test apparatus of claim 1, wherein: the compressing assembly comprises an expansion piece (7) arranged above the limiting table (10), and a pressing plate (6) is arranged at the lower end of the expansion piece (7).

7. The electronic device motherboard conduction test apparatus of claim 6, wherein: the lower surface of the pressure plate (6) is provided with a cushion pad (5).