CN218445819U

CN218445819U - Accurate embedded semiconductor chip test seat

Info

Publication number: CN218445819U
Application number: CN202222016777.XU
Authority: CN
Inventors: 卢彦; 卢朝; 卢小品; 栗帅
Original assignee: Kunshan Jieyuxing Precision Machinery Co ltd
Current assignee: Kunshan Jieyuxing Precision Machinery Co ltd
Priority date: 2022-08-02
Filing date: 2022-08-02
Publication date: 2023-02-03
Anticipated expiration: 2032-08-02

Abstract

The utility model relates to a test seat technical field especially relates to an accurate embedded semiconductor chip test seat, the on-line screen storage device comprises a base, base top both ends are connected with the pedestal, and embedded groove has been seted up to pedestal top center department inner wall, and embedded groove inner wall is connected with places the board, places inboard wall both ends and all is connected with the perforation, places inboard wall connection of board top center department and surveys test panel, the utility model discloses in through setting up the perforation, not only play the effect of protection semiconductor chip metal foot, also play spacing effect simultaneously to realize that semiconductor chip's steady and accurate placing, through setting up second spring post, not only can let the clamp plate reciprocate, also play the effect of restriction clamp plate moving direction simultaneously, make the embedded piece can fall into the embedded groove accurately, through setting up the embedded piece, can press semiconductor chip downwards, thereby let semiconductor chip and survey the better contact of test panel, be favorable to improving test effect.

Description

Accurate embedded semiconductor chip test seat

Technical Field

The utility model relates to a test seat technical field especially relates to a accurate embedded semiconductor chip test seat.

Background

The test socket is standard test equipment for testing the electrical performance and electrical connection of on-line components to check defects in production and manufacture and poor components, is mainly used for checking the on-line single components and the open and short circuit conditions of each circuit network, and has the characteristics of simple operation, rapidness, accurate fault location and the like.

There are the following problems: the test socket need place the chip at the chip inslot at test socket top earlier before testing the chip, because the chip bottom has many metal feet, if the chip can't accurately and put into the chip inslot steadily, can lead to the condition that metal foot extrusion deformation appears in the in-process of chip at the test.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an accurate embedded semiconductor chip test seat.

In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a precise embedded semiconductor chip test seat, includes the base, base top both ends are connected with the pedestal, the embedded groove has been seted up to pedestal top center department inner wall, the embedded groove inner wall is connected with places the board, it all is connected with the perforation to place inboard wall both ends, it has survey test panel to place inboard wall connection of board top center department, survey test panel bottom center department and be connected with the sensor, sensor outer wall bottom is connected with first spring post, sensor bottom center department is connected with the data line, the data line bottom is connected with the circuit board, circuit board one side outer wall center department fixedly connected with pilot lamp, the horizontal symmetry axis both ends in pedestal top all are connected with second spring post, second spring post outer wall top is connected with the clamp plate, clamp plate bottom center department fixedly connected with embedded block, the vertical symmetry axis both ends in clamp plate top are connected with the handle, clamp plate outer wall connection has dustproof shell, dustproof shell inner wall one side center department is connected with the toughened glass board.

As a further description of the above technical solution:

the two ends of the top of the base are welded with the two ends of the bottom of the base body, the outer wall of the placing plate is sleeved on the inner wall of the embedded groove, the two groups of the perforations are arranged, and the two ends of the inner wall of the placing plate are provided with the perforations; through setting up the perforation, not only play the effect of protection semiconductor chip metal foot, also play spacing effect simultaneously to realize semiconductor chip's steady and accurate placing.

As a further description of the above technical solution:

the outer wall of the test board is embedded and bonded on the inner wall of the center of the top of the placing board, the center of the bottom of the test board is fixedly connected with the top of the sensor, and the bottom end of the outer wall of the sensor is embedded and bonded on the inner wall of the first spring column; through setting up the sensor, can transmit the information of surveying the board.

As a further description of the above technical solution:

the top end of the outer wall of the sensor is embedded and bonded to the inner wall of the center of the bottom of the placing plate, the bottom of the placing plate is fixedly connected with the top of the first spring column, and the bottom end of the outer wall of the first spring column is sleeved on the inner wall of the center of the bottom of the base body; through setting up first spring post, can let place the board and can reciprocate in the embedded groove.

As a further description of the above technical solution:

the center of the bottom of the sensor is fixedly connected with the top of the data line, the bottom of the data line is fixedly connected with the center of the top of the circuit board, and the outer wall of the circuit board is embedded and bonded on the inner wall of the center of the bottom of the base; through setting up the circuit board, mainly play the effect of control pilot lamp.

As a further description of the above technical solution:

the two groups of second spring columns are arranged, the bottoms of the second spring columns are welded with two ends of a transverse symmetrical shaft at the top of the seat body, and the top ends of the outer walls of the second spring columns are sleeved on two ends of the inner wall of the pressing plate; through setting up the second spring post, not only can let the clamp plate reciprocate, also play the effect of restriction clamp plate moving direction simultaneously for the embedded piece can fall into the embedded groove accurately.

As a further description of the above technical solution:

both ends of the bottom of the handle are welded with both ends of a vertical symmetric shaft at the top of the pressing plate, the top end of the inner wall of the dustproof shell is sleeved with the outer wall of the pressing plate, the bottom end of the inner wall of the dustproof shell is sleeved with the outer wall of the base body, and the outer wall of the toughened glass plate is embedded and bonded at the center of one side of the inner wall of the dustproof shell; through setting up the dust cover, can play protection and dustproof effect to the test seat, through setting up the toughened glass board, can let the tester clearly know the inside condition of dust cover.

The utility model discloses following beneficial effect has:

1. through setting up the perforation, not only play the effect of protection semiconductor chip metal foot, also play spacing effect simultaneously, thereby realize semiconductor chip's steady and accurate placing, through setting up second spring post, not only can let the clamp plate reciprocate, also play the effect of restriction clamp plate moving direction simultaneously, make the embedding piece can fall into the embedded groove accurately, through setting up the embedding piece, can press semiconductor chip down, thereby let semiconductor chip and survey the better contact of test panel, be favorable to improving test effect.

2. Through setting up the dust cover, can play protection and dustproof effect to the test seat, through setting up the toughened glass board, can let the tester clearly know the inside condition of dust cover.

Drawings

Fig. 1 is a three-dimensional view of a precisely embedded semiconductor chip test socket according to the present invention;

fig. 2 is a front view of a precisely embedded semiconductor chip test socket according to the present invention;

fig. 3 is a front sectional view of the accurate embedded semiconductor chip testing seat of the present invention.

Illustration of the drawings:

1. a base; 2. a base body; 3. embedding the groove; 4. placing a plate; 5. perforating; 6. a test board; 7. a sensor; 8. a first spring post; 9. a data line; 10. a circuit board; 11. an indicator light; 12. a second spring post; 13. pressing a plate; 14. embedding a block; 15. a handle; 16. a dust-proof shell; 17. a tempered glass plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a precise embedded semiconductor chip test seat, the on-line screen storage device comprises a

base

1, 1 top both ends of base are connected with

pedestal

2, 2 top center department inner walls of pedestal have seted up embedded

groove

3, 3 inner wall connections of embedded groove have place board 4, place 4 inner wall both ends of board and all be connected with perforation 5, place 4 top center department inner wall connections of board and survey test panel 6, survey test panel 6 bottom center department and be connected with

sensor

7, 7 outer wall bottom of sensor is connected with

first spring post

8, 7 bottom center department of sensor is connected with

data line

9, 9 bottom of data line are connected with

circuit board

10, 10 one side outer wall center department fixedly connected with pilot lamp 11 of circuit board, 2 top horizontal symmetry axis both ends in pedestal all are connected with

second spring post

12, 12 outer wall top of second spring post is connected with

clamp plate

13, 13 bottom center department fixedly connected with embedded piece 14 of clamp plate, 13 top vertical symmetry axis both ends in clamp plate top are connected with

handle

15, 13 outer wall connection has

dustproof shell

16, 16 inner wall one side center department of dustproof shell department is connected with toughened glass board 17.

Two ends of the top of a base 1 are welded with two ends of the bottom of a base body 2, a board 4 outer wall is placed and is sleeved on a 3 inner wall of an embedded groove, two sets of through holes 5 are arranged together, two ends of a board 4 inner wall are placed and are provided with through holes 5, a board 6 outer wall is tested and is embedded and bonded on the inner wall of the board 4 top center, a board 6 bottom center and a sensor 7 top fixed connection are tested and are embedded and bonded on the bottom of the board 7 outer wall, the top of the sensor 7 outer wall is embedded and bonded on the inner wall of the board 4 bottom center, a board 4 bottom and a first spring column 8 top fixed connection are placed and are connected with the bottom of the board 4 bottom center, the bottom of the first spring column 8 outer wall is sleeved and bonded on the inner wall of the base body 2 bottom center, the bottom of the sensor 7 bottom center and the top of the data line 9 are fixedly connected with the top of the circuit board 10, the outer wall is embedded and is bonded on the inner wall of the center of the bottom of the base 1, two sets of a second spring column 12 are arranged together, the bottom of the second spring column 12 is welded and is welded on two ends of a horizontal symmetrical shaft of a base body, two sets of the outer wall of a dust-proof shell 16, the outer wall is sleeved and welded on one side of a toughened glass shell 16, and is welded on the inner wall of the base body 2 top of the inner wall of the bottom of the base body, and is welded on the flat shell.

The working principle and the process are as follows: handle 15 through clamp plate 13 top, can remove whole device to on the steady desktop, when test work begins, can be earlier with semiconductor chip vertically downwards on placing board 4, the metal foot of semiconductor chip bottom this moment can directly embolia in perforation 5, hold handle 15 afterwards, press whole clamp plate 13 downwards gently, clamp plate 13 can be along with the direction vertical downstream of second spring post 12 this moment, inlay 14 bottom surfaces slowly and can support at the semiconductor chip top surface, push it directly into embedded groove 3, semiconductor chip bottom surface can tightly contact with survey test panel 6 this moment, through sensor 7 and data line 9, can be with information transmission to circuit board 10 on, if the semiconductor chip is intact, pilot lamp 11 can directly light this moment, if the semiconductor chip has the flaw or damages, pilot lamp 11 just can not light this moment, when whole device need not use, can directly overlap on clamp plate 13 and pedestal 2 outer wall with dust cover 16, not only play good protective effect, also play dustproof effect simultaneously.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides an accurate embedded semiconductor chip test seat, includes base (1), its characterized in that: base (1) top both ends are connected with pedestal (2), embedded groove (3) have been seted up to pedestal (2) top center department inner wall, embedded groove (3) inner wall connection has places board (4), place board (4) inner wall both ends and all be connected with perforation (5), place board (4) top center department inner wall connection and survey test panel (6), survey test panel (6) bottom center department and be connected with sensor (7), sensor (7) outer wall bottom is connected with first spring post (8), sensor (7) bottom center department is connected with data line (9), data line (9) bottom is connected with circuit board (10), circuit board (10) one side outer wall center department fixedly connected with pilot lamp (11), pedestal (2) top horizontal symmetry axis both ends all are connected with second spring post (12), second spring post (12) outer wall top is connected with clamp plate (13), clamp plate (13) bottom center department fixedly connected with embedding piece (14), clamp plate (13) vertical symmetry axis both ends are connected with handle (15), clamp plate (13) outer wall connection has 16), dust-proof shell (16) center department glass shell (17).

2. The precisely embedded semiconductor chip test socket as claimed in claim 1, wherein: base (1) top both ends and pedestal (2) bottom both ends welding, place board (4) outer wall and cup joint in embedded groove (3) inner wall, it is equipped with two sets ofly altogether to perforate (5), it has all seted up perforation (5) to place board (4) inner wall both ends.

3. The precisely embedded semiconductor chip test socket as claimed in claim 1, wherein: survey test panel (6) outer wall and inlay and bond in placing board (4) top center department inner wall, survey test panel (6) bottom center department and sensor (7) top fixed connection, sensor (7) outer wall bottom is inlayed and is bonded in first spring post (8) inner wall.

4. The precisely embedded semiconductor chip test socket as claimed in claim 1, wherein: the sensor is characterized in that the top end of the outer wall of the sensor (7) is embedded and bonded on the inner wall of the center of the bottom of the placing plate (4), the bottom of the placing plate (4) is fixedly connected with the top of the first spring column (8), and the bottom end of the outer wall of the first spring column (8) is sleeved on the inner wall of the center of the bottom of the base body (2).

5. The precisely embedded semiconductor chip test socket as claimed in claim 1, wherein: the sensor (7) bottom center department and data line (9) top fixed connection, data line (9) bottom and circuit board (10) top center department fixed connection, circuit board (10) outer wall inlays to bond in base (1) bottom center department inner wall.

6. The precisely embedded semiconductor chip test socket as claimed in claim 1, wherein: the two groups of the second spring columns (12) are arranged, the bottoms of the second spring columns (12) are welded with the two ends of the transverse symmetrical shaft at the top of the seat body (2), and the top ends of the outer walls of the second spring columns (12) are sleeved at the two ends of the inner wall of the pressing plate (13).

7. The precision embedded semiconductor chip test socket according to claim 1, wherein: handle (15) bottom both ends all with the vertical symmetry axis both ends welding in clamp plate (13) top, dustproof shell (16) inner wall top cup joints with clamp plate (13) outer wall, dustproof shell (16) inner wall bottom cup joints with pedestal (2) outer wall, toughened glass board (17) outer wall is inlayed and is bonded in dustproof shell (16) inner wall one side center department.