CN214845921U

CN214845921U - Multichannel parallel optical signal transmission module

Info

Publication number: CN214845921U
Application number: CN202121306174.2U
Authority: CN
Inventors: 孙全意; 周四海; 齐鹏远
Original assignee: Sunus Photoelectronic Wuxi Co ltd
Current assignee: Sunus Photoelectronic Wuxi Co ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2021-11-23
Anticipated expiration: 2031-06-10

Abstract

A multi-path parallel optical signal transmission module relates to the field of optical modules. The optical transmission device comprises an optical transmission assembly, a circuit board, a flexible board and a connector; the circuit board comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are vertically and symmetrically arranged and are connected through a flexible board; a bonding pad is arranged on the first circuit board, and the connector is connected with the bonding pad; the first circuit board is provided with a substrate, the optical transmission assembly is electrically connected with the optical transmission assembly, the substrate is provided with a connecting contact, and the connector is connected with the connecting contact. The device has the advantages that: the flexible board is connected to the two circuit boards, so that the size of the device is reduced, and more complex circuits can be realized in a smaller space. With the adoption of the micro contact connector, higher-density I/O electric connection is realized. The optical transmission component is separated from the circuit part and made into an independent light emitting or receiving component, so that the coupling and testing process of the light emitting component can be greatly simplified, and the yield can be effectively improved.

Description

Multichannel parallel optical signal transmission module

Technical Field

The utility model relates to an optical module field especially relates to a parallelly light signal transmission module of multichannel.

Background

In industrial internet and power network control, a large amount of control or sensing signals need to be transmitted, and in order to reduce system interference, optimize signal transmission quality and extend signal transmission distance, optical fibers are used to replace cables to transmit signals in many occasions. However, the format of such signals is usually signals without "0" and "1" balanced encoding, even direct current control signals. This signal format is not suitable for a conventional photoelectric conversion module (requiring dc balanced encoding), so an optical fiber terminal module for low-speed signal transmission is generally designed and developed by AVAGO corporation or Toshiba corporation to solve the above problem, and the optical fiber terminal module is: the HFBR1444 single-transmitting module and the HFBR2412 single-receiving module are used for signal transmission within the range of DC to 5 Mbps. The module is internally and completely coupled by direct current, has no alternating current coupling or alternating current feedback control link, is used for transmitting digital signals with any format within the range of DC-5 Mbps, and can directly replace the original cable transmission system without additional coding. However, in many occasions of industrial internet or power control, a large number of signals need to be transmitted in a limited space, and the solution of the optical fiber terminal can only provide 1 to 1 single-path transmission, so that the transmission needs to be realized by using transmitting and receiving optical fiber terminals and optical fibers with the number equal to that of the required signals. This has a number of detrimental effects on system complexity, size, power consumption, etc.

Disclosure of Invention

In order to realize the advantages of reducing the complexity of a system, small occupied volume, low power loss, good transmission performance and the like when an optical signal transmission module device runs, the invention adopts the following technical scheme:

a multi-path parallel optical signal transmission module comprises an optical transmission assembly, a circuit board, a flexible board and a connector; the circuit board comprises a first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are vertically and symmetrically arranged and are connected through a flexible board; a bonding pad is arranged on the first circuit board, and the connector is connected with the bonding pad; the first circuit board is provided with a substrate, the optical transmission assembly is electrically connected with the optical transmission assembly, the substrate is provided with a connecting contact, and the connector is connected with the connecting contact.

Specifically, the optical transmission component is a 48-channel transmitting module, a 48-channel receiving module or a 24-channel transceiver module. By means of optical transmission elements

Specifically, the base plate includes upper substrate and infrabasal plate, infrabasal plate fixed mounting is on first circuit board, and light transmission unit fixed mounting passes through screw fixed connection on the upper substrate with the infrabasal plate, and the upper substrate bottom surface is equipped with the connection contact, and the shell fragment array is connected with the connection contact. The optical transmission assembly is arranged on the substrate, the substrate is connected with the first circuit board through screws, and communication between the optical transmission assembly and the circuit board is achieved through the connecting contacts. The coupling and testing process of the light emitting component can be greatly simplified, and the yield is effectively improved.

Specifically, the upper top surface and the lower bottom surface of the connector are respectively provided with an elastic sheet array and a welding ball array, the welding ball array is connected with a welding pad, and the elastic sheet array is connected with the upper substrate.

Specifically, the circuit board further comprises a second connector, wherein a bonding pad is arranged at the bottom of the second circuit board and connected with the welding ball array of the second connector. Through setting up the second connector, can be connected with other devices through the second connector, alright carry out next step transmission with the data that optical transmission assembly received or transmitted, the transmission data is convenient.

Specifically, a communication interface is arranged on the substrate and used for being connected with an external transmission line. Through setting up communication interface, can carry out next step transmission with the data that alright received or transmitted optical transmission subassembly, it is convenient to transmit data.

The second circuit board is provided with a fixing hole, and the fixing guide pillar penetrates through the fixing hole and is connected with the second circuit board; the upper housing is connected to the lower housing. The outer shell is fixedly arranged on the whole outer portion of the device, and the device can be protected from being damaged by external impact.

To sum up, the utility model discloses the device has following advantage:

(1) the flexible board is connected to the two circuit boards, so that the size of the device is reduced, and more complex circuits can be realized in a smaller space.

(2) The connector with the micro contacts realizes higher-density I/O electric connection and improves transmission performance.

(3) The optical transmission component is separated from the circuit part and made into an independent light emitting or receiving component, so that the coupling and testing process of the light emitting component can be greatly simplified, and the yield can be effectively improved.

Drawings

Fig. 1 is an external structural diagram of a multi-path parallel optical signal transmission module;

fig. 2 is a front view 1 of an internal structure in a multi-path parallel optical signal transmission module;

FIG. 3 is a bottom view of the internal structure of a multiple parallel optical signal transmission module;

fig. 4 is a front view 2 of an internal structure in a multi-path parallel optical signal transmission module;

FIG. 5 is a schematic structural diagram of an upper substrate of a multi-channel parallel optical signal transmission module;

fig. 6 is a schematic structural diagram of a first circuit board in a multi-path parallel optical signal transmission module;

FIG. 7 is a schematic structural diagram of a lower housing of a multi-channel parallel optical signal transmission module;

reference numerals: 1 an upper housing; 2 a transmission line; 348 a receiving module; 4 a first connector; 5, lower substrate; 6 a first circuit board; 7 a second circuit board; 8 a flexible board; 9 a second connector; 10 an upper substrate; 11 connecting the contacts; 12 bonding pads; 13 a fixed cavity; 14 connecting the socket; 15 a lower housing; 16, fixing a column; 17 fixing the hole.

Detailed Description

The present invention will be further described with reference to fig. 1 to 7.

A multi-path parallel optical signal transmission module comprises an optical transmission assembly, a circuit board, a flexible board and a connector; in order to realize signal transmission, the circuit board is arranged to realize signal transmission of the optical transmission assembly. The circuit boards comprise a first circuit board 6 and a second circuit board 7, and in order to save the space occupied by the circuit boards and enable communication between the circuit boards, the first circuit board 6 and the second circuit board 7 are vertically and symmetrically arranged up and down and are connected through a flexible board 8. In order to separate the optical transmission module from the circuit part and make an independent optical transmission module, which greatly simplifies the coupling and testing process of the optical transmission module and effectively improves the yield, a bonding pad 12 is arranged on the first circuit board 6, and a connector with a micro contact is connected and fixed with the bonding pad 12. The upper top surface and the lower bottom surface of the connector are respectively provided with an elastic sheet array and a welding ball array, the number of the connectors is two, the connectors are respectively a first connector 4 and a second connector 9, and the welding ball array of the first connector 4 is welded and fixed with the welding pad 12. In order to realize the connection between the first connector 4 and the optical transmission component, a substrate is disposed on the first circuit board 6, the substrate includes an upper substrate 10 and a lower substrate 5, the lower substrate 5 is fixedly mounted on the first circuit board 6, and a fixing cavity 13 is disposed on the lower substrate 5, the first connector 4 is located in the fixing cavity 13, the upper substrate 10 is vertically disposed on the lower substrate 5, the optical transmission component is fixedly mounted on the upper substrate 10, the optical transmission component can be a 48-channel transmitting module, a 48-channel receiving module, or a 24-channel receiving-transmitting integrated module, and the transmission or the reception of optical signals is realized through the optical transmission component. The light receiving module is either 48 receiving modules 3 in this embodiment. In order to connect the 48 receiving module 3 and the first transmission module 4 in communication, a point connection socket 14 is formed on the top surface of the upper substrate 10, and then the bottom surface of the upper substrate 10 is formed with the connection contacts 11, when the upper substrate 10 and the lower substrate 5 are connected by screws, the elastic sheet array of the first connector 4 is connected with the connection contacts 11, and the 48 receiving module 3 is inserted into the connection socket 14, so that the 48 receiving module 3 and the first transmission module 4 are connected in communication. The base plate, the first circuit board 6 and the second circuit board 7 are fixedly connected through screws. In addition, in order to transmit the information received by the 48 receiving module 3 to the next step, a communication interface is formed at the side of the upper substrate 10, the communication interface is connected to an external transmission line, a pad is formed at the bottom of the second circuit board, and the ball array of the second connector is connected to the pad to realize the next step of data information transmission. In order to protect the device from being damaged by external impact, a shell is fixedly mounted on the whole external of the device for protection, the shell comprises an upper shell and a lower shell, a fixing guide pillar is arranged on the lower shell, a fixing hole is formed in the second circuit board, and the fixing guide pillar penetrates through the fixing hole to be connected with the second circuit board. After the upper shell and the lower shell are fixedly connected through screws, circuit components such as the upper substrate 10, the lower substrate 5, the first circuit board 6 and the second circuit board 7 are wrapped and fixed by the shells, and the damage of the external environment to the circuit components is avoided.

When the device is used, the receiving module 3 is inserted 48 into the connection jack 14 and can then receive the optical information. However, when the device is damaged and needs to be maintained, only the fixed screws need to be dismounted, the 48 receiving module 3 is pulled out of the connecting socket 14, the upper substrate 10 is taken down, so that the 48 receiving module 3 can be separated from the first connector 4, namely the 48 receiving module 3 is separated from the circuit board, if the first circuit board 6, the second circuit board 7 or the 48 receiving module 3 have problems, the detection can be respectively carried out, the inspection is convenient, components and parts can be replaced independently, and the maintenance cost is reduced.

The device has the advantages that:

1. the flexible board is connected to the two circuit boards, so that the size of the device is reduced, and more complex circuits can be realized in a smaller space.

2. By adopting the micro contact connector, the I/O electric connection with higher density is realized, and the transmission performance is improved.

3. The optical transmission component is separated from the circuit part and made into an independent light emitting or receiving component, so that the coupling and testing process of the light emitting component can be greatly simplified, and the yield can be effectively improved.

It should be understood that the above detailed description of the present invention is only for illustrative purposes and is not limited to the technical solutions described in the embodiments of the present invention. It will be understood by those skilled in the art that the present invention may be modified and equivalents may be substituted to achieve the same technical effects; as long as the use requirement is satisfied, the utility model is within the protection scope.

Claims

1. A multi-path parallel optical signal transmission module is characterized by comprising an optical transmission assembly, a circuit board, a flexible board and a connector; the circuit board comprises a first circuit board and a second circuit board, and the first circuit board and the second circuit board are vertically and symmetrically arranged and connected through the flexible board; a bonding pad is arranged on the first circuit board, and one end of the connector is connected with the bonding pad; the optical transmission device comprises a first circuit board, a light transmission assembly, a connector and a second circuit board, wherein a substrate is arranged on the first circuit board, the light transmission assembly is arranged on the substrate, a connecting contact is arranged on the substrate, and the other end of the connector is connected with the connecting contact.

2. The multi-channel parallel optical signal transmission module of claim 1, wherein the optical transmission module is a 48-channel transmitter module, a 48-channel receiver module, or a 24-channel transceiver module.

3. The module of claim 1, wherein the substrate comprises an upper substrate and a lower substrate, the lower substrate is fixedly mounted on the first circuit board, the connecting contacts are disposed on a bottom surface of the upper substrate, the optical transmission assembly is disposed on the upper substrate, and the upper substrate is correspondingly connected to the lower substrate.

4. The module of claim 3, wherein the top and bottom surfaces of the connector are respectively provided with a spring array and a solder ball array, the solder ball array is connected to the bonding pad, and the spring array is connected to the connecting contact.

5. The module of claim 4, further comprising a second connector, wherein the second circuit board has a pad on a bottom thereof, and the pad is connected to the solder ball array of the second connector.

6. The module of claim 1, wherein the substrate is provided with a communication interface, and the communication interface is configured to be connected to an external transmission line.

7. The module of claim 1, further comprising a housing, wherein the housing comprises an upper housing and a lower housing, the lower housing is provided with a fixing guide post, the second circuit board is provided with a fixing hole, and the fixing guide post passes through the fixing hole and is connected to the second circuit board; the upper housing is connected to the lower housing.