CN214800426U - Low-power consumption device heat radiation structure - Google Patents

Abstract

The utility model provides a low-power device heat radiation structure, which comprises a substrate, a low-power device, a first heat radiation structure, a second heat radiation structure and a third heat radiation structure; the low-power-consumption device is arranged on the substrate, the first heat dissipation structure is covered outside the low-power-consumption device, a heat-conducting medium is filled between the first heat dissipation structure and the low-power-consumption device, and the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are sequentially connected; the utility model provides a low-power device heat radiation structure, which is designed with a first heat radiation structure corresponding to the low-power device, the first heat radiation structure has small volume and occupies small space of the substrate; the low-power-consumption device is connected with the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure to transmit heat and dissipate heat through the radiator, and the heat dissipation effect is good.

Description

Low-power consumption device heat radiation structure

Technical Field

The utility model belongs to the technical field of the heat dissipation, a low-power consumption device heat radiation structure is related to.

Background

In a switching power supply, low power consumption devices are widely used, such as fuses for overcurrent protection, cement resistors for discharge, patch devices LDO for voltage conversion, and CPUs.

In the low-power-consumption device of the above example, devices like fuses, cement resistors and the like generate heat by themselves, if long-time heat accumulation is performed, heat management is not performed, the service life of the device itself is greatly shortened, even potential safety hazards exist, and the service life of devices around the device is shortened after the temperature of the device is high. While other patch devices like LDO have low self-heating, but in a high-temperature environment, the performance indexes of the devices are affected, and even because of thermal stress failure, it is very necessary to dissipate heat of these low-power devices.

In the prior art, common heat dissipation modes include direct air cooling, isolated air duct air cooling, natural cooling, liquid cooling and the like, only direct air cooling facilitates air blowing heat dissipation, and other heat dissipation modes are not good for heat dissipation of low-power-consumption devices.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the utility model provides a low-power consumption device heat radiation structure through indirect heat transfer, realizes the radiating effect with the help of the radiator that the configuration was given other devices, can use on keeping apart heat radiation modes such as wind channel forced air cooling, natural cooling, liquid cooling, the radiating effect is good, and the structure occupies that the space is little.

In order to solve the technical problem, the utility model discloses a technical scheme be:

the utility model provides a low-power-consumption device heat dissipation structure, which comprises a substrate, a first heat dissipation structure, a second heat dissipation structure and a third heat dissipation structure; the substrate is provided with a low-power-consumption device, the first heat dissipation structure cover is arranged outside the low-power-consumption device, a heat conduction medium is filled between the first heat dissipation structure and the low-power-consumption device, and the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are sequentially connected.

Preferably, the first heat dissipation structure is a cavity structure with a hollow interior.

Preferably, the first heat dissipation structure is provided with a heat conduction surface, and the area of the heat conduction surface is larger than that of the other surfaces of the first heat dissipation structure.

Preferably, the first heat dissipation structure is attached to the second heat dissipation structure through the heat conduction surface.

Preferably, the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are connected through screws, and heat-conducting silicone grease is coated among the heat dissipation structures.

Preferably, the second heat dissipation structure includes one of an output reverse blocking diode heat sink, an output differential mode inductance heat sink, an output common mode inductance heat sink, an output rectifying diode heat sink, and an output rectifying MOSFET heat sink.

Preferably, the third heat dissipation structure is one of a water-cooling plate and an air-cooling radiator.

Preferably, the heat-conducting medium is a heat-conducting gel.

Preferably, an insulator is disposed between the first heat dissipation structure and the low power consumption device.

Preferably, the substrate is a PCB main board.

Compared with the prior art, the beneficial effects of the utility model reside in that: the utility model provides a low-power device heat radiation structure, which is designed with a first heat radiation structure corresponding to the low-power device, the first heat radiation structure has small volume and occupies small space of the substrate; the low-power-consumption device is connected with the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure to transmit heat and dissipate heat through the radiator, and the heat dissipation effect is good.

Drawings

The following detailed description of the specific structure of the present invention with reference to the accompanying drawings

Fig. 1 is a schematic view of the heat dissipation structure of the low power device of the present invention;

fig. 2 is a schematic view of a first heat dissipation structure of the present invention;

FIG. 3 is a schematic view of the heat conduction direction of the heat dissipation structure of the low power device of the present invention;

FIG. 4 is a histogram of experimental data of the present invention;

wherein: 10-a substrate; 20-low power devices; 30-a first heat dissipation structure; 301-a heat conducting surface; and 40-a second heat dissipation structure.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

Referring to fig. 1, a heat dissipation structure of a low power device includes a substrate 10, a first heat dissipation structure 30, a second heat dissipation structure 40, and a third heat dissipation structure; wherein the third heat dissipation structure is a connected external heat sink, which is not labeled in the figure; the substrate 10 is provided with a low-power device 20, the first heat dissipation structure 30 is covered outside the low-power device 20, a heat conduction medium is filled between the first heat dissipation structure 30 and the low-power device 20, and the first heat dissipation structure 30, the second heat dissipation structure 40 and the third heat dissipation structure are sequentially connected.

The utility model provides a low-power device heat radiation structure, which is designed with a first heat radiation structure corresponding to the low-power device, the first heat radiation structure has small volume and occupies small space of the substrate; the low-power-consumption device is connected with the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure to transmit heat and dissipate heat through the radiator, and the heat dissipation effect is good.

Referring to fig. 2, a schematic diagram of the first heat dissipation structure is shown, the first heat dissipation structure 30 is a hollow cavity structure, the periphery of the cavity structure is enclosed to form a seal, and an opening is formed on a surface attached to the substrate to cover the first heat dissipation structure 30 outside the low power device 20.

Further, the first heat dissipation structure 30 is provided with a heat conduction surface 301, the heat conduction surface 301 is a side surface adjacent to the opening, wherein the heat conduction surface 301 extends to the outside of the first heat dissipation main body, so that the area of the heat conduction surface 301 is larger than that of other surfaces of the first heat dissipation structure; on one hand, a screw hole may be formed in the extended section for screwing with the second heat dissipation structure, and on the other hand, the contact area with the second heat dissipation structure 40 is increased, so that the heat conduction area is increased and the heat dissipation efficiency is improved.

Further, the first heat dissipation structure 30, the second heat dissipation structure 40 and the third heat dissipation structure are all connected by screw fastening, the first heat dissipation structure 30, the second heat dissipation structure 40 and the third heat dissipation structure are attached, and heat conduction silicone grease is coated between the heat dissipation structures for conduction. In the present embodiment, in order to realize the heat dissipation of the low power device 20, the first heat dissipation structure 30 is connected to the second heat dissipation structure 40 for indirect heat transfer; the second heat dissipation structure 40 comprises an output reverse blocking diode radiator, an output differential mode inductance radiator, an output common mode inductance radiator, an output rectifier diode radiator, an output rectifier MOSFET radiator and other high-power-consumption device radiators; the third heat dissipation structure is used for dissipating heat from the outside, such as a water cooling plate, an air cooling radiator and the like.

The utility model discloses a heat dissipation principle does: the low-power-consumption device 20 is electrified to generate heat, the heat is conducted to the first heat dissipation structure through the heat of the heat-conducting medium, meanwhile, the first heat dissipation structure and the heat dissipation structure are fixed and closely contacted to conduct heat in a mode of coating silicon grease through the locking screw, and the heat is conducted to the second heat dissipation structure; in a similar way, the second heat dissipation structure is in close contact with the third heat dissipation structure in a mode of coating silicon grease through the lock screw, heat is transferred to the third heat dissipation structure, and finally the heat of the third heat dissipation structure is conducted to the external environment in a mode of liquid medium or air cooling, natural cooling and the like.

As shown in fig. 3, which is a schematic diagram of a heat dissipation process of the low power device, the low power device 20, the first heat dissipation structure 30, the second heat dissipation structure 40, and the third heat dissipation structure can dissipate heat actively by dissipating heat passively by themselves and by transferring heat to the third heat dissipation structure 40.

Fig. 4 is the data that use under the normal atmospheric temperature environment, and liquid medium heat conduction can be known by experimental data, the utility model provides a heat radiation structure has good radiating effect.

Further, the heat-conducting medium is heat-conducting gel.

Further, an insulator is disposed between the first heat dissipation structure 30 and the low power device 20, for example, an insulating tape is wrapped outside the low power device 20.

In this embodiment, the heat dissipation structure of the low power device may be applied to a PCB board, and the substrate 10 is a PCB motherboard, and may also be applied to other structures that need to dissipate heat of the low power device, which is not specifically limited herein.

From the above description, the beneficial effects of the present invention are: the utility model provides a low-power device heat radiation structure, which is designed with a first heat radiation structure corresponding to the low-power device, the first heat radiation structure has small volume and occupies small space of the substrate; the low-power-consumption device is connected with the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure to transmit heat and dissipate heat through the radiator, and the heat dissipation effect is good.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. A heat dissipation structure of a low-power-consumption device is characterized by comprising a substrate, a first heat dissipation structure, a second heat dissipation structure and a third heat dissipation structure; the substrate is provided with a low-power-consumption device, the first heat dissipation structure cover is arranged outside the low-power-consumption device, a heat conduction medium is filled between the first heat dissipation structure and the low-power-consumption device, and the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are sequentially connected.

2. The heat dissipating structure of claim 1, wherein the first heat dissipating structure is a cavity structure having a hollow interior.

3. The heat dissipation structure of claim 1, wherein the first heat dissipation structure comprises a heat conduction surface, and the area of the heat conduction surface is larger than the area of the other surfaces of the first heat dissipation structure.

4. The heat dissipation structure of claim 3, wherein the first heat dissipation structure is attached to the second heat dissipation structure by the thermally conductive surface.

5. The heat dissipation structure of claim 1, wherein the first heat dissipation structure, the second heat dissipation structure and the third heat dissipation structure are connected by screws, and heat conductive silicone grease is coated between the heat dissipation structures.

6. The heat dissipating structure of claim 5, wherein the second heat dissipating structure comprises one of an output anti-blocking diode heat sink, an output differential mode inductor heat sink, an output common mode inductor heat sink, an output rectifier diode heat sink, and an output rectifier MOSFET heat sink.

7. The heat dissipating structure of claim 6, wherein the third heat dissipating structure is one of a water-cooled plate and an air-cooled heat sink.

8. The heat dissipation structure of claim 1, wherein the heat transfer medium is a heat transfer gel.

9. The heat dissipation structure of claim 1, wherein an insulator is disposed between the first heat dissipation structure and the low power device.

10. The heat dissipation structure of claim 1, wherein the substrate is a PCB motherboard.

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