CN214800019U - Thickened copper-plated printed circuit board - Google Patents

Abstract

The utility model relates to a printed circuit board technical field, specifically speaking relates to a thickened type copper-plated printed circuit board, including copper-plated printed circuit board main substrate, be provided with the heating panel on the bottom surface of copper-plated printed circuit board main substrate, still be provided with waterproof protection device on the copper-plated printed circuit board main substrate, waterproof protection device is including setting up the outside waterproof heat dissipation shell at copper-plated printed circuit board, fixed mounting has waterproof top cap on the top surface of waterproof heat dissipation shell, be provided with a plurality of conducting strips that are linear equidistant range on the bottom surface of heating panel, be provided with cooling heat abstractor on the waterproof heat dissipation shell, cooling heat abstractor is including setting up the water storage heat exchange box on waterproof heat dissipation shell and setting up the miniature booster pump in waterproof heat dissipation shell one side. The utility model discloses have certain thickness, difficult pressurized damages, also have better radiating effect simultaneously, offer convenience for the user.

Description

Thickened copper-plated printed circuit board

Technical Field

The utility model relates to a printed circuit board technical field, specifically speaking relates to a thickened type copper facing printed wiring board.

Background

At present, the types of copper-plated printed circuit boards in the market are more, but most of the copper-plated printed circuit boards are relatively thin, and are easy to break or damage after being extruded, so that the normal use of the copper-plated printed circuit boards is affected, and inconvenience is brought to users.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a thickened type copper facing printed wiring board to solve the defect that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a thickened type copper-plating printed wiring board, includes copper-plating printed wiring main substrate, be provided with the heating panel on the bottom surface of copper-plating printed wiring main substrate, the heating panel with copper-plating printed wiring main substrate is the integrated into one piece structure, still be provided with water proof protection device on the copper-plating printed wiring main substrate, water proof protection device is including setting up the outside waterproof heat dissipation shell of copper-plating printed wiring main substrate, fixed mounting has waterproof top cap on the top surface of waterproof heat dissipation shell.

Preferably, a plurality of heat conducting fins which are linearly arranged at equal intervals are arranged on the bottom surface of the heat radiating plate, and the bottom plate body of each heat conducting fin penetrates through the bottom plate body of the waterproof heat radiating shell and is located outside the waterproof heat radiating shell, so that heat on the main substrate of the copper-plated printed circuit can be timely and outwards transferred by the heat conducting fins when the heat radiating plate is used, and the heat radiating effect is improved.

Preferably, the top surface of the waterproof heat dissipation shell is provided with a waterproof sealing gasket, so that the waterproof sealing effect between the waterproof top cover and the waterproof heat dissipation shell is improved.

Preferably, be provided with cooling heat abstractor on the waterproof heat dissipation shell, cooling heat abstractor is including setting up water storage heat exchange box on the waterproof heat dissipation shell is in with the setting the miniature booster pump of waterproof heat dissipation shell one side, be provided with the inlet tube on the end body of intaking of miniature booster pump, be provided with fixed mounting on the play water end body of miniature booster pump on the water storage heat exchange box and with the inside outlet pipe that is linked together of water storage heat exchange box, still be provided with the back flow on the water storage heat exchange box, be convenient for utilize miniature booster pump work, realize carrying the cooling water towards in the water storage heat exchange box, utilize the cooling water to carry out the thermal treatment to waterproof heat dissipation shell and copper-plated printed circuit main substrate.

Preferably, the water storage heat exchange box is of a hollow structure, so that cooling water can enter the water storage heat exchange box and perform heat exchange operation with the waterproof heat dissipation shell.

Preferably, the cooling heat abstractor is still including setting up the cooling box of water storage heat exchange box one side, be provided with the semiconductor refrigeration piece in the cooling box, the surface of semiconductor refrigeration piece is provided with the coiled pipe, inlet tube fixed mounting in one of them end of coiled pipe and with the coiled pipe is linked together, back flow fixed mounting in another end of coiled pipe and with the coiled pipe is linked together, is convenient for carry out the cooling operation to the cooling water after carrying out the heat exchange, reaches the effect that the water circulation utilized and cooled down, facilitates the use.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a heating panel that sets up on copper-plated printed circuit main substrate bottom surface can increase copper-plated printed circuit main substrate thickness to a certain extent, makes copper-plated printed circuit main substrate be difficult for appearing the condition of fracture or damage after receiving the extrusion, facilitates the use, has solved the thickness of most copper-plated printed circuit board and is relatively thinner, the condition of fracture or damage appears easily after receiving the extrusion, influences its normal use, the problem of inconvenience is brought for the user.

2. The utility model discloses a conducting strip and cooling heat abstractor that set up can realize carrying out the heat dissipation operation, facilitate the use to waterproof heat dissipation shell and copper facing printed circuit main substrate.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic diagram of the explosion structure of the present invention;

FIG. 3 is an enlarged view of the point A in FIG. 2 according to the present invention;

FIG. 4 is a schematic view of a part of the structure of the present invention;

fig. 5 is a cross-sectional view of the cooling box of the present invention.

In the figure: 1. a copper-plated printed wiring main substrate; 10. a heat dissipation plate; 11. a heat conductive sheet; 2. a waterproof protection device; 20. a waterproof heat dissipation housing; 201. a waterproof gasket; 21. a waterproof top cover; 3. a cooling heat sink; 30. a water storage heat exchange box; 31. a cooling box; 32. a semiconductor refrigeration sheet; 33. a serpentine tube; 34. a micro booster pump; 341. a water inlet pipe; 342. a water outlet pipe; 35. a return pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-5, the present invention provides a technical solution:

a thickened copper-plated printed circuit board comprises a copper-plated printed circuit main substrate 1, wherein a heat dissipation plate 10 is arranged on the bottom surface of the copper-plated printed circuit main substrate 1, the heat dissipation plate 10 and the copper-plated printed circuit main substrate 1 are of an integrally formed structure, so that the heat dissipation plate 10 and the copper-plated printed circuit main substrate 1 are more firm and stable in structure, and meanwhile, when the thickened copper-plated printed circuit board is used, the thickness of the copper-plated printed circuit main substrate 1 can be increased by using the heat dissipation plate 10, so that the copper-plated printed circuit main substrate 1 is not prone to fracture when being extruded, and the thickened copper-plated printed circuit board is convenient to use;

specifically, the copper-plated printed circuit main substrate 1 is further provided with a waterproof protection device 2, the waterproof protection device 2 comprises a waterproof heat dissipation shell 20 arranged outside the copper-plated printed circuit main substrate 1, and a waterproof top cover 21 is fixedly mounted on the top surface of the waterproof heat dissipation shell 20 through a plurality of fastening screws, so that when the copper-plated printed circuit main substrate 1 is used, the waterproof heat dissipation shell 20 and the waterproof top cover 21 are used for protecting the copper-plated printed circuit main substrate 1 inside, and a certain waterproof protection effect can be achieved; the top surface of the waterproof heat dissipation shell 20 is provided with a waterproof sealing gasket 201, so that the waterproof sealing effect between the waterproof top cover 21 and the waterproof heat dissipation shell 20 is improved.

In this embodiment, a plurality of heat conducting fins 11 arranged at equal intervals are integrally formed on the bottom surface of the heat dissipating plate 10, the bottom plate of the heat conducting fins 11 penetrates through the bottom plate of the waterproof heat dissipating housing 20 and is located outside the waterproof heat dissipating housing 20, and the heat conducting fins 11 are integrally formed on the waterproof heat dissipating housing 20, so that when the heat dissipating plate is used, the heat on the copper-plated printed circuit board main substrate 1 can be timely transferred outwards by the heat conducting fins 11, and the heat dissipating effect is improved.

Specifically, the waterproof heat dissipation shell 20 is provided with a cooling heat dissipation device 3, the cooling heat dissipation device 3 comprises a water storage heat exchange box 30 integrally formed on the waterproof heat dissipation shell 20 and a micro booster pump 34 arranged on one side of the waterproof heat dissipation shell 20, and the water storage heat exchange box 30 is of a hollow structure, so that cooling water can enter the water storage heat exchange box 30 and perform heat exchange operation with the waterproof heat dissipation shell 20; the water inlet end pipe body of the micro booster pump 34 is provided with a water inlet pipe 341, the water outlet end pipe body of the micro booster pump 34 is provided with a water outlet pipe 342 fixedly installed on the water storage heat exchange box 30 and communicated with the inside of the water storage heat exchange box 30, the water storage heat exchange box 30 is further provided with a return pipe 35, the micro booster pump 34 is convenient to work, cooling water is conveyed towards the inside of the water storage heat exchange box 30, and the cooling water is utilized to carry out heat dissipation treatment on the waterproof heat dissipation shell 20 and the main copper-plated printed circuit board 1.

Further, the cooling and heat dissipating device 3 further comprises a cooling box 31 disposed on one side of the water storage heat exchange box 30, a semiconductor refrigeration sheet 32 is disposed in the cooling box 31, a coiled pipe 33 is disposed on the surface of the semiconductor refrigeration sheet 32, the water inlet pipe 341 is fixedly disposed at one end of the coiled pipe 33 and is communicated with the coiled pipe 33, the return pipe 35 is fixedly disposed at the other end of the coiled pipe 33 and is communicated with the coiled pipe 33, the semiconductor refrigeration sheet 32 is convenient to work, the cooling operation of cooling water which is subjected to heat exchange and enters the coiled pipe 33 is realized, the effects of water circulation utilization and cooling are achieved, and the use is facilitated.

It should be noted that the micro-booster pump 34 and the semiconductor cooling plate 32 in this embodiment are conventional technologies, and are not described herein again.

When the thickened copper-plated printed circuit board is used, the waterproof top cover 21 is fixedly arranged on the waterproof heat-radiating shell 20, then the waterproof heat-radiating shell 20 is fixedly arranged on the corresponding case shell, the heat-radiating plate 10 can increase the thickness of the main substrate 1 of the copper-plated printed circuit board, so that the copper-plated printed circuit board 1 is not easy to break when being extruded, in addition, after the main substrate 1 of the copper-plated printed circuit board works, the micro booster pump 34 and the semiconductor refrigerating sheet 32 can be both connected with an external power supply and can work, the micro booster pump 34 works, the cooling water in the coiled pipe 33 is conveyed into the water-storage heat exchange box 30, the heat-radiating treatment of the waterproof heat-radiating shell 20 and the main substrate 1 of the copper-plated printed circuit board is realized, the semiconductor refrigerating sheet 32 can carry out the refrigerating operation after working, and the cooling operation of the cooling water flowing back into the coiled pipe 33 is realized, the copper-plated printed circuit board is convenient to use, and the problem that most of copper-plated printed circuit boards are thin relatively, and are easy to break or damage after being extruded, so that normal use of the copper-plated printed circuit boards is affected, and inconvenience is brought to users is solved.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a thickened type copper facing printed wiring board, includes copper facing printed wiring main substrate (1), its characterized in that: be provided with heating panel (10) on the bottom surface of copper-plating printed wiring main substrate (1), heating panel (10) with copper-plating printed wiring main substrate (1) is the integrated into one piece structure, still be provided with waterproof protection device (2) on copper-plating printed wiring main substrate (1), waterproof protection device (2) are including setting up the outside waterproof heat dissipation shell (20) of copper-plating printed wiring main substrate (1), fixed mounting has waterproof top cap (21) on the top surface of waterproof heat dissipation shell (20).

2. The thickened copper-plated printed wiring board according to claim 1, characterized in that: the bottom surface of the heat dissipation plate (10) is provided with a plurality of heat conduction sheets (11) which are linearly arranged at equal intervals, and the bottom plate body of each heat conduction sheet (11) penetrates through the bottom plate body of the waterproof heat dissipation shell (20) and is positioned outside the waterproof heat dissipation shell (20).

3. The thickened copper-plated printed wiring board according to claim 1, characterized in that: and a waterproof sealing gasket (201) is arranged on the top surface of the waterproof heat dissipation shell (20).

4. The thickened copper-plated printed wiring board according to claim 1, characterized in that: be provided with cooling heat abstractor (3) on waterproof heat dissipation shell (20), cooling heat abstractor (3) is including setting up water storage heat exchange box (30) on waterproof heat dissipation shell (20) is in with the setting micro booster pump (34) of waterproof heat dissipation shell (20) one side, be provided with inlet tube (341) on the end body of intaking of micro booster pump (34), be provided with fixed mounting on the play water end body of micro booster pump (34) on water storage heat exchange box (30) and with outlet pipe (342) that water storage heat exchange box (30) inside is linked together, still be provided with back flow (35) on water storage heat exchange box (30).

5. The thickened copper-plated printed wiring board according to claim 4, characterized in that: the water storage heat exchange box (30) is of a hollow structure.

6. The thickened copper-plated printed wiring board according to claim 4, characterized in that: the cooling heat dissipation device (3) is still including setting up cooling box (31) of water storage heat exchange box (30) one side, be provided with semiconductor refrigeration piece (32) in cooling box (31), the surface of semiconductor refrigeration piece (32) is provided with coiled pipe (33), inlet tube (341) fixed mounting be in one of them end of coiled pipe (33) and with coiled pipe (33) are linked together, back flow (35) fixed mounting be in the other end of coiled pipe (33) and with coiled pipe (33) are linked together.

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